P5010NSE1TNB - QorIQ P5 2.0GHz 64-Bit PowerPC e5500 MPU | NXP
부품 번호: P5010NSE1TNB ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 50 | $245 | $12,250.00 |
| 100 | $225 | $22,500.00 |
| 500 | $198 | $99,000.00 |
P5010NSE1TNB 개요
A microprocessor (MPU) is an integrated circuit that contains the central processing unit of a computer system, executing program instructions and managing data flow. The PowerPC e5500 architecture is a 64-bit, superscalar, out-of-order implementation originally derived from Freescale's e500 lineage used across NXP QorIQ networking and industrial platforms. This product family sits within the broader hierarchy of microprocessor -> embedded processor -> SoC (System-on-Chip) -> semiconductor, optimized for network packet processing, secure routing, and industrial control workloads.
Key features of the P5010NSE1TNB include a single e5500 core with double-precision floating point, hardware virtualization for partitioned OS environments, an integrated DDR3/DDR3L memory controller, multiple Gigabit Ethernet interfaces, PCI Express Gen 2 controllers, and integrated security engines. The wide I/O fabric reduces external component count, allowing compact board designs for space-constrained routers and embedded systems.
The P5010NSE1TNB leverages NXP's e5500 core architecture, which combines dual-issue superscalar dispatch with out-of-order completion and AltiVec-compatible SIMD media processing. This micro-architectural depth delivers significantly higher instructions-per-clock than in-order alternatives, while integrated L2 cache and coherency logic keep memory subsystem latency low. The platform's Trusted Execution and Secure Boot features are designed for networking equipment where hardware root-of-trust is mandatory.
This MPU is commonly deployed in industrial routers and secure gateways, factory automation controllers, defense and aerospace embedded systems, networked storage controllers, and single-board computing platforms. The 2.0 GHz operating point balances throughput and thermal envelope for fanless or low-airflow industrial chassis. Standard temperature grade makes it suited for commercial and industrial settings, while extended-temperature variants may be required for fully ruggedized deployments.
Design considerations include proper thermal management via the exposed-die FCPBGA package, signal-integrity routing for DDR3 memory traces, and decoupling strategy for the multiple supply rails (core, I/O, DDR PHY, and PLL). Engineers should review the hardware specifications for clocking, reset, and configuration of the on-chip SerDes lanes.
This page synthesizes distributor pricing, parameter data, and cross-reference information for the P5010NSE1TNB beyond what is offered in the manufacturer datasheet summary, providing engineer-oriented selection guidance.
드롭인 대체품: P5010NSE1TNB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: P5010NSE1TNB (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Mounting Type, Memory Controller, Operating Temperature, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
P5010NSE1MNB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
P5010NSN1TNB
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$295.75 / 개
데이터시트 보기 →P5010NSE1TNB
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$198 / 개
데이터시트 보기 →P5020NSE1TNB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
P5040NSE1TNB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
P5010NSE1TNB 최대 정격 & 전기적 특성
| Core Architecture | PowerPC e5500 |
| Product Family | QorIQ P5 |
| Number of Cores | 1 |
| 데이터 버스 폭 | 64-bit |
| Maximum Core Frequency | 2.0 GHz |
| Speed Grade Designation | NSE1 (1800/1333) |
| Package Type | FCPBGA (Flip-Chip Plastic BGA) |
| Package Pin/Ball Count | 1295 |
| Package Dimensions | 37.5 mm x 37.5 mm |
| 실장 유형 | Surface Mount (BGA) |
| Terminal Form | Ball |
| Package Code | HBGA |
| 동작 온도 | Standard Temperature |
| Memory Controller | DDR3/DDR3L (integrated) |
P5010NSE1TNB hbga 핀 구성 가이드
P5010NSE1TNB(hbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: P5010NSE1TNB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
P5010NSE1TNB 적합 용도: 7 애플리케이션s: Industrial Routers and Secure Gateways, Network Attached Storage Controllers, Factory Automation Controllers, Single-Board Computing Platforms, Defense and Aerospace Embedded Systems, Wireless Base Station Controllers, Industrial IoT Edge Gateways.
Industrial Routers and Secure Gateways
The P5010NSE1TNB's single e5500 at 2.0 GHz with hardware virtualization and integrated Gigabit Ethernet makes it well suited for industrial router and secure gateway designs. Its 64-bit address space and out-of-order execution enable high-throughput IPsec and SSL inspection pipelines, while the integrated DDR3/1333 controller with ECC supports the memory-bandwidth demands of encrypted packet flows. The 1295-ball FCPBGA package also simplifies PCB layout for compact fanless gateway chassis used in factory floors.
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Network Attached Storage Controllers
The P5010NSE1TNB is a strong fit for entry-to-mid-range Network Attached Storage (NAS) controllers. The e5500 core's AltiVec SIMD accelerates RAID parity calculations, while the integrated DDR3/1333 controller supplies the bandwidth required for sequential read/write streams. PCIe Gen 2 lanes connect to SATA/SAS controller ASICs and 10GbE NICs, and hardware virtualization allows running the storage management OS alongside customer applications on the same SoC.
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Factory Automation Controllers
For factory automation controllers, the P5010NSE1TNB offers deterministic single-core performance for PLC scan loops and industrial protocol stacks such as EtherCAT, PROFINET, or Modbus TCP. The e5500's out-of-order execution keeps interrupt latency low even under sustained load, and the integrated PCI Express and Gigabit Ethernet interfaces connect to industrial I/O modules without external bridge chips. Standard temperature rating suits typical factory floor operating ranges.
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Single-Board Computing Platforms
The P5010NSE1TNB's integrated I/O - DDR3, PCIe, Ethernet - lets system integrators build full single-board computing platforms with minimal external logic. The FCPBGA-1295 package on 37.5x37.5 mm accommodates 8-layer PCB stack-ups typically used in industrial SBCs, and the standard temperature grade supports deployment in enclosure-based systems. AltiVec SIMD accelerates edge analytics and media-processing workloads common on edge SBC nodes.
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Defense and Aerospace Embedded Systems
The P5010NSE1TNB's hardware virtualization, secure boot, and single-core determinism align with defense and aerospace embedded applications such as mission computers and rugged network nodes. The e5500 micro-architecture supports partitioned OS environments where multiple isolated software contexts share the SoC. NXP's QorIQ platform longevity program provides long-term supply continuity required by defense programs.
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Wireless Base Station Controllers
For small-cell and wireless backhaul base station controllers, the P5010NSE1TNB provides a 64-bit compute engine with sufficient throughput to terminate encrypted backhaul traffic. The integrated DDR3 controller and multiple Gigabit Ethernet interfaces support LTE small-cell reference designs. Hardware virtualization enables concurrent operation of the radio stack and management plane on a single SoC, lowering overall BOM cost.
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Industrial IoT Edge Gateways
The P5010NSE1TNB is suitable for industrial IoT edge gateways that aggregate sensor data and run local analytics. The e5500's AltiVec unit accelerates FFT and DSP-style workloads common in edge signal processing, while the integrated Ethernet controllers simplify the LAN/WAN interface. The single-core configuration keeps power and thermal envelopes low enough for fanless edge enclosures installed in space-limited cabinets.
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추천 제품 요약
엔지니어링 참조 데이터: P5010NSE1TNB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | P5010NSE1MNB | P5010NSN1TNB | P5020NSE1TNB | P5040NSE1TNB |
|---|---|---|---|---|---|
| Package | FCPBGA-1295 (37.5x37.5) | FCPBGA-1295 (37.5x37.5) - same | FCPBGA-1295 (37.5x37.5) - same | FCPBGA-1295 (37.5x37.5) - same | FCPBGA-1295 (37.5x37.5) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Number of Cores | 1 | 1 | 1 | 2 | 4 |
| Core Architecture | PowerPC e5500 | PowerPC e5500 | PowerPC e5500 | PowerPC e5500 | PowerPC e5500 |
| Maximum Core Frequency | 2.0 GHz | 1.5 GHz (lower bin) | 2.0 GHz | 2.0 GHz | 2.0 GHz |
| Data Bus Width | 64-bit | 64-bit | 64-bit | 64-bit | 64-bit |
| Memory Controller | DDR3/DDR3L up to 1333 | DDR3/DDR3L up to 1066 | DDR3/DDR3L up to 1500 | DDR3/DDR3L up to 1333 | DDR3/DDR3L up to 1333 |
| Product Family | QorIQ P5 | QorIQ P5 | QorIQ P5 | QorIQ P5 | QorIQ P5 |
| Hardware Virtualization | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Single-core e5500 with hardware virtualization in a compact 1295-ball FCPBGA (vs P1010NSE2HFB)
- Cost-optimized single-core variant in QorIQ P5 family (vs P5020NSE1TNB)
- NSE1 speed bin at 1800/1333 offers balanced performance envelope (vs P5010NSE1MNB)
설계 노트
Estimated: At Tj max of 105C with a thermal resistance of approximately 0.5 C/W for the FCPBGA-1295 package on a 4-layer PCB, the P5010NSE1TNB can dissipate roughly 30-50 W depending on workload and core voltage. A heatsink or thermal pad is recommended for fanless industrial enclosures; reference the QorIQ P5010 Thermal Management Application Note for layout-specific guidance.
The FCPBGA-1295 substrate requires high-density PCB fabrication with microvia stacks, laser-drilled vias, and trace widths down to 0.0762 mm. Use NXP's reference PCB stack-up and follow the DDR3 routing guidelines in the QorIQ hardware specifications - matched-length address/command/control traces and proper decoupling placement near the BGA balls are critical for signal integrity.
Estimated: The P5010NSE1TNB requires multiple supply rails (core, I/O, DDR PHY, PLL, and SerDes). A sequencing controller such as the NXP MC34712 or compatible PMIC should be used to enforce the correct power-up and power-down order. Bulk decoupling capacitors must be placed adjacent to each supply ball cluster, with high-frequency 0.1uF MLCCs at the BGA exit vias.
Route DDR3 traces on inner layers with reference ground planes and keep trace lengths matched within +/- 25 mils for byte lanes and +/- 50 mils for address/command groups. The SerDes lanes should be routed with controlled impedance (100 ohm differential) and kept clear of noisy signals. Refer to the NXP QorIQ Layout Checklist for pin-group-specific guidance.
규정 준수 정보
RoHS/REACH/conflict mineral status not explicitly stated in verified web data; consult NXP's product compliance documentation. AEC-Q100 not qualified - this part is for industrial/networking, not automotive.
