PEF20525FV1.3 - Serial Comm Controller SEROCCO-H | Infineon
부품 번호: PEF20525FV1.3 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.75 | $18.75 |
| 10 | $16.92 | $169.20 |
| 100 | $14.55 | $1,455.00 |
| 500 | $12.8 | $6,400.00 |
| 1,000 | $11.2 | $11,200.00 |
PEF20525FV1.3 개요
A Telecom IC (also called a network controller or serial communications controller) is a specialized integrated circuit that offloads data link layer protocol processing from a host CPU. It sits between the physical layer transceiver and the host processor, implementing framing, CRC, and channel management for synchronous serial links. In the system hierarchy, it belongs to the interface IC / network controller & processor category of integrated circuits, enabling deterministic serial data flow in equipment such as ISDN terminal adapters, xDSL modems, and T/E-carrier interface cards.
Key features of the PEF20525FV1.3 include two independent serial channels with full-duplex operation, integrated PPP/HDLC framing support, hardware-assisted bit processing for low host CPU overhead, and flexible clocking for T-carrier and E-carrier telecom standards. The device also offers DMA-friendly host interface options and comprehensive interrupt/status reporting, allowing tight integration with embedded host processors.
The SEROCCO-H architecture combines dedicated hardware engines for HDLC/PPP framing, CRC generation and checking, and serial channel arbitration. This offloads heavy protocol processing from the host CPU, allowing the host to focus on higher-layer networking tasks. The dual-channel design enables simultaneous handling of two independent serial links, which is valuable for routers, gateways, and multi-port communication equipment.
Typical applications include ISDN terminal adapters, xDSL modems, T1/E1 interface cards, frame relay equipment, and embedded telecom modules for factory or industrial networking. The wide protocol support and dual-channel capability make it suitable for any application requiring deterministic serial data link processing.
When designing with the PEF20525FV1.3, ensure proper decoupling near the supply pins and follow Infineon's reference layout for the PG-TQFP-100-3 package. The host interface should be configured according to the chosen bus width and endianness to minimize glue complexity. Designers should also verify the latest firmware/driver support matrix from Infineon for their specific host processor family.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: PEF20525FV1.3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PEF20525FV1.1
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
PEF20525FV1.2
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
PEF20525FV1.3 사양
| Product Type | Telecom IC / Serial Communication Controller |
| Series | SEROCCO-H |
| 기능 | Serial Optimized Communications Controller |
| Number of Serial Channels | 2 (independent, full-duplex) |
| Protocol Support | PPP / HDLC |
| 패키지 | PG-TQFP-100-3 (100-pin TQFP) |
| 실장 유형 | Surface Mount |
| 인터페이스 | Parallel host bus (DMA-friendly) |
| Operating Mode | Full-duplex serial data link |
| Application Domain | Telecom / Networking |
| Architecture | Dedicated HDLC/PPP hardware engines |
| 핀 수 | 100 |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
PEF20525FV1.3 pg-tqfp-100-3 (100-pin tqfp) 핀 구성 가이드
PEF20525FV1.3(pg-tqfp-100-3 (100-pin tqfp) 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: PEF20525FV1.3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PEF20525FV1.3 적합 용도: 7 애플리케이션s: ISDN Terminal Adapter, xDSL Modem / CPE, T1/E1 Interface Card, Frame Relay Router, Industrial Serial Gateway, Embedded Telecom Module, VoIP Gateway / Media Gateway.
ISDN Terminal Adapter
The PEF20525FV1.3's dual independent serial channels and integrated PPP/HDLC hardware engines make it well suited for ISDN terminal adapters that must terminate two B-channels simultaneously. Placing the device between the ISDN transceiver and the host CPU offloads bit-level framing and CRC computation, freeing the host for higher-layer PPP and IP processing. Compared with a software stack, the hardware offload reduces interrupt load and improves sustained throughput on both B-channels.
추천
xDSL Modem / CPE
In xDSL customer premises equipment, the PEF20525FV1.3 handles the PPP/HDLC link layer required by PPPoE and PPPoA framing between the DSL modem chipset and the host processor. Its dual-channel capability allows the device to terminate both a primary data channel and a secondary management channel concurrently. The PG-TQFP-100-3 surface-mount package integrates cleanly into the dense PCB layout typical of xDSL CPE designs.
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T1/E1 Interface Card
For T1/E1 interface cards used in enterprise routers and PBXs, the PEF20525FV1.3 provides two independent serial channels aligned with T1/E1 framing requirements. Its hardware HDLC engine handles bit stuffing and CRC with deterministic latency, critical for telecom timing budgets. The PG-TQFP-100-3 package supports the thermal and mechanical requirements of multi-port line cards where several instances can populate a single board.
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Frame Relay Router
The PEF20525FV1.3's PPP/HDLC support is also applicable to legacy frame relay equipment and routers that require HDLC-based link layer termination. The device's dual channels permit termination of two frame relay PVCs on a single IC, reducing board area and BOM cost. Its DMA-friendly host interface integrates with embedded networking processors to deliver deterministic throughput under heavy PVC load.
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Industrial Serial Gateway
Industrial serial gateways that bridge legacy synchronous serial equipment into modern Ethernet networks benefit from the PEF20525FV1.3's hardware HDLC/PPP offload and dual-channel design. The device provides reliable, deterministic serial link termination that is immune to host CPU loading variations, important in industrial automation environments where timing jitter is unacceptable.
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Embedded Telecom Module
Embedded telecom modules (router-on-a-module, mezzanine route cards) leverage the PEF20525FV1.3 to provide two independent serial data link terminations in a small footprint. The PG-TQFP-100-3 package supports the compact module dimensions while exposing parallel host bus pins for direct attachment to a host carrier board. The hardware PPP/HDLC acceleration enables consistent throughput regardless of host processor capability.
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VoIP Gateway / Media Gateway
In VoIP gateway and media gateway designs, the PEF20525FV1.3 terminates the PSTN-side serial link (T1/E1 or BRI) while the host processor handles VoIP packetization and signaling. The device's hardware HDLC engine supports PRI/BRI link-layer channels, while the dual-channel capability accommodates primary rate T1/E1 or multiple BRI interfaces. This separation of concerns simplifies firmware development and improves voice quality by offloading critical real-time tasks.
추천
추천 제품 요약
엔지니어링 참조 데이터: PEF20525FV1.3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PEF20525FV1.1 | PEF20525FV1.2 |
|---|---|---|---|
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies |
| Package | PG-TQFP-100-3 | PG-TQFP-100-3 - same | PG-TQFP-100-3 - same |
| Firmware Revision | V1.3 | V1.1 (earlier) | V1.2 (earlier) |
| Number of Serial Channels | 2 | 2 | 2 |
| Protocol Support | PPP / HDLC | PPP / HDLC | PPP / HDLC |
| Host Interface | Parallel host bus (DMA-friendly) | Parallel host bus (DMA-friendly) | Parallel host bus (DMA-friendly) |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount |
| RoHS Compliance | Compliant | Compliant | Compliant |
| Series | SEROCCO-H | SEROCCO-H | SEROCCO-H |
주요 차별점
- Dual-channel hardware PPP/HDLC offload in a single IC (vs PEF20525FV1.1)
- SEROCCO-H family with mature Infineon telecom ecosystem (vs Generic software PPP on host CPU)
- DMA-friendly parallel host interface (vs Serial-controlled serial comm ICs)
설계 노트
The PEF20525FV1.3 requires a clean 3.3 V supply rail for its core and I/O. Place a 100 nF decoupling capacitor close to each supply pin group, plus a 10 uF bulk capacitor near the IC. Avoid sharing the supply with high-current switching regulators - use a ferrite bead or LDO to isolate the telecom IC from noisy digital rails. Ground returns should be low-impedance to prevent logic noise coupling into the serial channels.
The PG-TQFP-100-3 package requires a 0.50 mm pitch footprint with proper thermal pad soldering per JEDEC J-STD-020 reflow guidelines. Route serial channel differential pairs with matched lengths and 100 ohm differential impedance if applicable. Keep clock traces short and isolated from the host bus to minimize crosstalk. Provide a continuous ground plane beneath the device to reduce EMI radiation.
Do not assume any cross-brand drop-in equivalent exists for the PEF20525FV1.3 - the SEROCCO-H architecture is unique to Infineon. If you must replace this part, evaluate within-family variants (PEF20525FV1.1, PEF20525FV1.2) or migrate to the next-generation SEROCCO family with a host-side software update. Verify firmware revision compatibility with your host driver before swapping revisions in production.
규정 준수 정보
RoHS compliant per Infineon product declaration and distributor listings. Not AEC-Q100 qualified - this is a commercial/industrial telecom IC. Lead-free assembly supported.