PIC12LF1501-I/MF - 8-bit MCU, 1.75KB Flash, 20MHz, 8-DFN | Microchip
부품 번호: PIC12LF1501-I/MF ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1.18 | $1.18 |
| 10 | $1.06 | $10.60 |
| 100 | $0.94 | $94.00 |
| 500 | $0.82 | $410.00 |
| 1,000 | $0.71 | $710.00 |
PIC12LF1501-I/MF 개요
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, program memory (Flash), data memory (RAM), and peripherals on one die. The PIC12LF1501 belongs to the RISC-based PIC family and is positioned as a low-pin-count, low-power MCU within the broader PIC microcontroller taxonomy (8-bit PIC -> PIC12F family -> PIC12LF1501 sub-family). It is widely used as a 'system supervisor' or small task controller that augments larger processors in mixed-signal systems.
Key features include a 20 MHz internal oscillator (16 MHz internal RC with PLL to 32 MHz/divide options per family data), 6 I/O pins, an integrated 10-bit ADC, a configurable logic cell (CLC), complementary waveform generator (CWG) and numerically controlled oscillator (NCO) peripherals, brown-out reset, power-on reset, and wide operating voltage support suited to battery-powered applications. The XLP technology label indicates sub-microamp sleep currents typical of Microchip's nanoWatt XLP family.
The 'LF' suffix denotes the low-voltage (2.5V to 3.6V) variant; the 'F' (non-L) PIC12F1501 operates up to 5.5V. Architecture is 14-bit instruction word, modified Harvard, with separate program and data buses, allowing instruction fetch and data read to occur in the same cycle - the architectural feature that gives the PIC family its deterministic interrupt and instruction throughput.
Typical applications include LED lighting controllers, sensor signal conditioning, small appliance control, battery chargers, IoT edge nodes, and general-purpose 'glue logic' replacement. The 8-pin DFN footprint makes it a strong choice when PCB area is at a premium and the design only needs 4-6 I/O pins.
When designing with this MCU, choose the LF variant (2.5V to 3.6V) for direct Li-ion or 3V coin-cell operation, and verify programming tool compatibility (PICkit 3, MPLAB ICD 3/4, MPLAB X IDE) before locking the BOM. The 8-DFN package has a thermal pad that should be soldered to the PCB ground plane for thermal dissipation and mechanical robustness.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not consolidated in the manufacturer datasheet alone.
드롭인 대체품: PIC12LF1501-I/MF — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC12LF1501-I/MF (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Mounting Type, Operating Temperature, Package, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC12LF1501-E/MF
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC12LF1552-I/MF
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC12LF1612-I/MF
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC12F1501-I/MF
✅ 드롭인✓ 재고 있음
$0.59 / 개
데이터시트 보기 →PIC12LF1501T-I/MF
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC12LF1501-I/MF 최대 정격 & 전기적 특성
| Family | PIC12 (8-bit PIC MCU) |
| Core Processor | PIC |
| Core Size | 8-bit |
| Max CPU Speed | 20 MHz |
| Program Memory (Flash) | 1.75 KB (1K x 14) |
| RAM | 64 bytes |
| EEPROM | 0 bytes |
| I/O Pins | 6 |
| ADC | 10-bit, 4 channels |
| Supply Voltage (LF) | 2.5 V to 3.6 V |
| 동작 온도 | -40 C to +85 C (Industrial, 'I') |
| 패키지 | 8-pin DFN (3x3 mm), 'MF' suffix |
| 실장 유형 | Surface Mount (no-lead DFN) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| Low-Power Technology | XLP (nanoWatt XLP) |
PIC12LF1501-I/MF 핀 구성
| 핀 1 | VDD — Positive power supply (2.5 V to 3.6 V) |
| 핀 2 | RA5 — Bidirectional I/O pin; analog-capable |
| 핀 3 | RA4 — Bidirectional I/O pin; analog-capable |
| 핀 4 | RA3/MCLR/VPP — I/O / Master Clear (reset) / programming voltage |
| 핀 5 | RC5 — Bidirectional I/O pin |
| 핀 6 | RC4 — Bidirectional I/O pin |
| 핀 7 | RC3 — Bidirectional I/O pin |
| 핀 8 | VSS — Ground reference |
일반적인 애플리케이션
PIC12LF1501-I/MF 적합 용도: 6 애플리케이션s: LED Lighting Controllers, Battery-Powered IoT Sensor Nodes, Small Appliance Control, Sensor Signal Conditioning Front-End, Wearable and Portable Devices, General-Purpose Glue Logic Replacement.
LED Lighting Controllers
The PIC12LF1501-I/MF is well suited for LED lighting controllers in decorative strips, architectural fixtures and small driver boards. The 10-bit ADC with 4 channels reads photodiodes or current-sense shunts for closed-loop brightness regulation, while the Complementary Waveform Generator (CWG) peripheral directly drives MOSFET half-bridges for dimming and color mixing without CPU overhead. The 6 I/O pins are sufficient for RGB or single-channel PWM, and XLP sleep current below 1 uA makes battery-powered accent lighting feasible. At 20 MHz the MCU has plenty of headroom for smooth logarithmic dimming curves and DMX-512 reception via the EUSART. Use the 8-DFN package to fit compact driver PCBAs behind LED panels.
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Battery-Powered IoT Sensor Nodes
The PIC12LF1501-I/MF is engineered for battery-powered IoT edge nodes thanks to its 2.5 V to 3.6 V VDD range (single Li-ion or 3 V coin cell) and sub-microamp XLP sleep currents. The 10-bit ADC handles temperature, humidity, gas or analog sensor conditioning; the MSSP peripheral supports I2C/SPI for digital sensors and radio modules; the EUSART serves low-power UART links. With 1.75 KB Flash and 64 B RAM, the firmware footprint is sized for periodic wake-and-transmit schemes where the MCU spends >99% of its life in sleep. The 8-DFN (3x3 mm) footprint is small enough to fit inside sensor housings, and the industrial -40 to +85 C temperature range covers outdoor deployments.
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Small Appliance Control
The PIC12LF1501-I/MF is a cost-effective controller for small appliances such as coffee machines, fans, hair dryers, and kitchen timers where 4-6 I/O pins are sufficient. The CLC peripheral implements combinatorial logic without software, freeing the CPU for timing-critical tasks; the NCO can synthesize precise frequency outputs for motor control or tone generation; the ADC reads thermistors or potentiometers for user input. Brown-out reset and power-on reset ensure clean startup from a discharged battery or brown-out condition. Pair with the 5 V variant (PIC12F1501) when the appliance runs from a USB or 5 V wall adapter.
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Sensor Signal Conditioning Front-End
The PIC12LF1501-I/MF serves as a low-cost analog front-end conditioning MCU between a transducer and a host processor. Its 10-bit ADC digitizes thermocouple, thermistor, RTD, or strain-gauge outputs; its 6 I/O pins can drive a load cell bridge, calibration EEPROM, and an I2C/SPI uplink to the main controller. Running from 3.3 V, the LF variant shares a rail directly with most modern SoCs and ASICs, eliminating level shifters. The XLP sleep current is critical for always-on sensor modules that must consume minimal standby power. Use the CWG to generate excitation pulses for resistive bridges, offloading timing from the CPU.
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Wearable and Portable Devices
The PIC12LF1501-I/MF is a strong fit for wearables and portable devices where PCB area and battery life dominate. The 3x3 mm DFN package leaves room for coin-cell batteries and small displays, while the 2.5-3.6 V supply range matches primary lithium chemistries directly. The CLC, CWG and NCO peripherals enable tactile haptics, LED indicators and tone alerts without taxing the CPU; the 20 MHz instruction rate ensures responsive user input handling. With XLP sleep currents below 1 uA, devices can sleep between button presses for years on a single coin cell. The PIC12LF1501-E/MF extended-temperature variant supports fitness wearables that see elevated skin/body temperatures.
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General-Purpose Glue Logic Replacement
The PIC12LF1501-I/MF is increasingly used to replace discrete 74-series glue logic with software-defined state machines, freeing board area and improving testability. The CLC peripheral can be configured as AND/OR/XOR gates, flip-flops or multiplexers; combined with the NCO for timing and the ADC for analog thresholds, a single 8-DFN PIC12LF1501 can replace several logic ICs, RC timers and analog comparators. This reduces BOM cost, eliminates timing drift across discrete components, and enables firmware-only feature changes. Industrial -40 to +85 C operation covers most factory and automotive cabin environments; choose PIC12LF1501-E/MF for under-hood automotive designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC12LF1501-I/MF — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC12LF1501-E/MF | PIC12LF1552-I/MF | PIC12LF1612-I/MF | PIC12F1501-I/MF | PIC12LF1501T-I/MF |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 8-DFN (3x3 mm) | 8-DFN (3x3 mm) - same | 8-DFN (3x3 mm) - same | 8-DFN (3x3 mm) - same | 8-DFN (3x3 mm) - same | 8-DFN (3x3 mm) - same |
| Program Memory (Flash) | 1.75 KB | 1.75 KB | 2 KB | 3.5 KB | 1.75 KB | 1.75 KB |
| RAM | 64 bytes | 64 bytes | 128 bytes | 128 bytes | 64 bytes | 64 bytes |
| Max CPU Speed | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| Supply Voltage (VDD max) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 5.5 V | 3.6 V |
| Operating Temperature | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Temperature Grade | Industrial | Extended | Industrial | Industrial | Industrial | Industrial |
주요 차별점
- Pin-to-pin upgrade path with 2x Flash and RAM in the same 8-DFN package (vs PIC12LF1552-I/MF)
- Higher supply voltage headroom via F variant (vs PIC12F1501-I/MF)
- Extended temperature grade for harsh environments (vs PIC12LF1501-E/MF)
설계 노트
The 8-pin DFN package has an exposed thermal pad (EP) on the underside that MUST be soldered to a PCB ground pour for both thermal dissipation and mechanical reliability. Stitch vias from the EP to an internal ground plane in a 3x3 via array. Without proper EP soldering, the DFN can delaminate under thermal cycling and the device's electrical ground will float relative to the PCB. Decoupling: place a 100 nF X7R ceramic between VDD (pin 1) and VSS (pin 8) within 2 mm of the IC, plus a 10 uF bulk cap on the same rail within 10 mm.
Estimated: at VDD=3.3 V and active current ~1.5 mA @ 4 MHz, the PIC12LF1501-I/MF draws ~5 mW active. In sleep mode with peripherals off, XLP technology reduces this to under 1 uA (per Microchip XLP family data), enabling multi-year coin-cell operation. Always enable the ADC and BOR explicitly in firmware; leaving them on default-on wastes ~10 uA. Use the FVR (Fixed Voltage Reference) only when ADC measurements require it - otherwise disable to save ~20 uA.
Three common pitfalls: (1) Configuring RA3/MCLR as a regular GPIO without disabling the MCLR function in CONFIG1 - this silently drives the reset line low and bricks the MCU; (2) forgetting the ICD unlock sequence before re-programming a code-protected part, which can lock out debug access; (3) using LF (3.6 V max) parts on a 5 V rail - over-voltage will permanently damage the LF variant; use PIC12F1501 (5.5 V max) instead. Also, the LF variant's brown-out reset threshold (~2.0 V typical) is closer to VDD than the F variant, so Li-ion designs should size for the lower cutoff.
Keep the ICP/ICSP programming traces (PGD/PGC on RA4/RA5) short and isolated from switching signals. The PIC12LF1501's internal 16 MHz oscillator accuracy is +/-2% typical over the industrial range; if the application requires accurate UART baud rates above 9600 bps, configure the FVR and use the AUSART auto-baud feature, or switch to the PLL-aided 32 MHz internal oscillator. For noise-sensitive ADC readings, average at least 16 samples and use the ADC dedicated channel rather than the shared analog pins when possible.
규정 준수 정보
RoHS compliant per Microchip product page; lead-free 8-DFN package. AEC-Q100 not applicable for industrial-grade 'I' suffix. Not automotive-qualified (no 'F' or 'E' automotive part number exists for PIC12LF1501).
