PIC16F15376-I/ML - 8-bit 32MHz 28KB Flash MCU | Microchip 44-QFN
부품 번호: PIC16F15376-I/ML ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2.85 | $2.85 |
| 10 | $2.55 | $25.50 |
| 100 | $2.25 | $225.00 |
| 500 | $1.95 | $975.00 |
| 1,000 | $1.7 | $1,700.00 |
| 3,000 | $1.45 | $4,350.00 |
PIC16F15376-I/ML 개요
An 8-bit microcontroller (MCU) is a programmable processor built around an 8-bit data path, optimized for low cost, deterministic real-time control, and ultra-low power consumption. PIC MCUs sit within the broader hierarchy: microcontroller -> embedded processor -> semiconductor -> integrated circuit. They are widely used for sensor interfacing, motor control, IoT endpoints, and consumer white goods where low-power sleep modes and deterministic interrupt response are critical.
Key differentiating features of this part include XLP sleep currents that extend battery life, four Configurable Logic Cells (CLC) for hardware state-machine implementation without CPU overhead, a Complementary Waveform Generator (CWG) for power-conversion timing, and a 10-bit ADC with computation. The 28 KB Flash and 2 KB SRAM are well-balanced for protocol stacks such as Modbus or LIN, and the dual EUSART blocks support simultaneous host and field-bus communication.
Architecturally, the PIC16F15376 uses a 14-bit instruction word with a RISC-style pipeline, vectored interrupts, and peripheral pin select (PPS) that allows flexible I/O mapping. The internal 32 MHz oscillator eliminates external timing components in many designs. The combination of CWG, NCO, and CLC enables sophisticated power conversion and lighting control in hardware without taxing the core.
Typical applications include IoT sensor nodes, low-power wireless sensor hubs, LED lighting controllers, small home appliances, HVAC damper control, battery chargers, automotive body electronics, and general-purpose embedded control for industrial sensors and meters.
When designing with this device, ensure the exposed pad (EP) on the QFN-44 is soldered to a sufficiently large copper area for thermal dissipation and electrical grounding. Decouple VDD with a 100 nF ceramic capacitor placed within 5 mm of each power pin, and configure the PPS registers carefully because remapping is non-volatile only after a configuration bit lock.
This page synthesizes distributor pricing, drop-in alternative part numbers, and practical design notes that complement the manufacturer datasheet for engineers selecting the PIC16F15376-I/ML for new designs or replacements.
드롭인 대체품: PIC16F15376-I/ML — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC16F15376-I/ML (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Program Memory (Flash), Comparators, DAC.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC16F15376-E/ML
✅ 드롭인✓ 재고 있음
$1.45 / 개
데이터시트 보기 →PIC16F15375-I/ML
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC16F15377-I/ML
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
PIC16F17176-I/MP
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC16F15276-I/PT
✅ 드롭인✓ 재고 있음
$1.2 / 개
데이터시트 보기 →PIC16F15376-I/ML 최대 정격 & 전기적 특성
| Core Processor | PIC |
| Core Size | 8-bit |
| Program Memory Size | 28 KB (16K x 14) Flash |
| RAM Size | 2 KB |
| Maximum CPU Speed | 32 MHz |
| Operating Voltage Range | 2.3 V to 5.5 V |
| ADC | 10-bit with computation (ADC2) |
| DAC | 5-bit / 8-bit DAC module |
| Comparators | 2 (with selectable reference) |
| PWM Outputs | 4 x 10-bit PWM |
| CLC (Configurable Logic Cells) | 4 |
| CWG (Complementary Waveform Generator) | Yes |
| NCO (Numerically Controlled Oscillator) | Yes |
| EUSART | 2 |
| SPI / I2C | SPI and I2C (MSSP) |
| 패키지 | 44-pin QFN (8x8 mm) with exposed pad |
| 실장 유형 | Surface Mount |
| 동작 온도 범위 | -40 C to +85 C (Industrial) |
| Technology | eXtreme Low-Power (XLP) |
| RoHS 상태 | Compliant |
| Programming Interface | ICSP (In-Circuit Serial Programming) |
PIC16F15376-I/ML 핀 구성
| 핀 1 | RE3/MCLR — Master Clear (reset) input, can be reconfigured as digital input only |
| 핀 2 | RA0 — Bidirectional I/O with ADC and CLC capability, PPS remappable |
| 핀 3 | RA1 — Bidirectional I/O with ADC and CLC capability, PPS remappable |
| 핀 4 | RA2 — Bidirectional I/O with ADC and DAC reference input, PPS remappable |
| 핀 5 | RA3 — Bidirectional I/O, PPS remappable |
| 핀 6 | RA4 — Bidirectional I/O with ADC, PPS remappable |
| 핀 7 | RA5 — Bidirectional I/O with ADC, PPS remappable |
| 핀 8 | RA6 — Bidirectional I/O with oscillator output, PPS remappable |
| 핀 9 | RA7 — Bidirectional I/O with oscillator input, PPS remappable |
| 핀 10 | VSS — Ground reference |
| 핀 11 | VDD — Positive supply voltage (2.3V to 5.5V) |
| 핀 12 | RB0 — Bidirectional I/O with interrupt-on-change, PPS remappable |
| 핀 13 | RB1 — Bidirectional I/O with interrupt-on-change, PPS remappable |
| 핀 14 | RB2 — Bidirectional I/O with interrupt-on-change, PPS remappable |
| 핀 15 | RB3 — Bidirectional I/O with interrupt-on-change, PPS remappable |
| 핀 16 | RB4 — Bidirectional I/O with interrupt-on-change, PPS remappable |
| 핀 17 | RB5 — Bidirectional I/O with interrupt-on-change, PPS remappable |
| 핀 18 | RB6 — Bidirectional I/O with ICD (in-circuit debugger) clock, PPS remappable |
| 핀 19 | RB7 — Bidirectional I/O with ICD data, PPS remappable |
| 핀 20 | VSS — Ground reference |
| 핀 21 | VDD — Positive supply voltage (2.3V to 5.5V) |
| 핀 22 | RC0 — Bidirectional I/O with PWM, PPS remappable |
| 핀 23 | RC1 — Bidirectional I/O with PWM, PPS remappable |
| 핀 24 | RC2 — Bidirectional I/O with PWM, PPS remappable |
| 핀 25 | RC3 — Bidirectional I/O with PWM, PPS remappable |
| 핀 26 | RC4 — Bidirectional I/O with PWM, PPS remappable |
| 핀 27 | RC5 — Bidirectional I/O with PWM, PPS remappable |
| 핀 28 | RC6 — Bidirectional I/O with EUSART TX/RX, PPS remappable |
| 핀 29 | RC7 — Bidirectional I/O with EUSART TX/RX, PPS remappable |
| 핀 30 | VSS — Ground reference |
| 핀 31 | VDD — Positive supply voltage (2.3V to 5.5V) |
| 핀 32 | RD0 — Bidirectional I/O with PSP, PPS remappable |
| 핀 33 | RD1 — Bidirectional I/O with PSP, PPS remappable |
| 핀 34 | RD2 — Bidirectional I/O with PSP, PPS remappable |
| 핀 35 | RD3 — Bidirectional I/O with PSP, PPS remappable |
| 핀 36 | RD4 — Bidirectional I/O with PSP, PPS remappable |
| 핀 37 | RD5 — Bidirectional I/O with PSP, PPS remappable |
| 핀 38 | RD6 — Bidirectional I/O with PSP, PPS remappable |
| 핀 39 | RD7 — Bidirectional I/O with PSP, PPS remappable |
| 핀 40 | VSS — Ground reference |
| 핀 41 | VDD — Positive supply voltage (2.3V to 5.5V) |
| 핀 42 | RE0 — Bidirectional I/O with PSP, PPS remappable |
| 핀 43 | RE1 — Bidirectional I/O with PSP, PPS remappable |
| 핀 44 | RE2 — Bidirectional I/O with PSP, PPS remappable |
| 핀 EP | EP — Exposed thermal pad - must be soldered to PCB ground plane for thermal and electrical performance |
일반적인 애플리케이션
PIC16F15376-I/ML 적합 용도: 6 애플리케이션s: IoT Wireless Sensor Nodes, LED Lighting and Color Control, Small Home Appliance Control, Industrial Sensor and Meter Modules, Automotive Body Electronics, Battery Charging and Power Bank Controllers.
IoT Wireless Sensor Nodes
The PIC16F15376-I/ML fits IoT wireless sensor nodes because its XLP technology delivers nanoamp sleep currents that extend coin-cell battery life to multiple years. Its 32 MHz core wakes in microseconds to service ADC samples from temperature, humidity, or motion sensors, then returns to deep sleep while the radio transceiver (connected via SPI or EUSART) transmits bursts. The 28 KB Flash accommodates LoRaWAN or Zigbee MAC stacks, and the 2 KB SRAM is adequate for buffering sensor packets. CLCs implement wake-up signal conditioning without CPU intervention, reducing average current draw by an order of magnitude compared to polling-based designs.
추천
LED Lighting and Color Control
The PIC16F15376-I/ML is well-suited for smart LED drivers and architectural lighting controllers due to its 4 PWMs, Complementary Waveform Generator (CWG), and Numerically Controlled Oscillator (NCO). The CWG generates dead-time-corrected complementary switching signals for half-bridge LED drivers without CPU overhead, while NCO produces high-resolution dimming curves beyond PWM granularity. The 32 MHz core and 28 KB Flash can host DMX512, DLI, or proprietary lighting protocols, with EUSART providing the DMX link. The wide 2.3V-5.5V supply accepts direct 3.3V or 5V regulated rails common in LED fixtures.
추천
Small Home Appliance Control
The PIC16F15376-I/ML targets small home appliances such as coffee machines, air purifiers, and humidifiers because its rich peripheral mix handles capacitive touch sensing, motor PWM, and sensor fusion on a single chip. The 4 CLC blocks implement hardware de-bouncing and zero-crossing detection for triac control without firmware polling, freeing the core for user-interface tasks. With 28 KB Flash and 2 KB SRAM, designers can include BLE command interfaces, PID control loops, and OTA update stubs. The 2.3V-5.5V supply accepts unregulated AC-DC rails common in appliance power supplies.
추천
Industrial Sensor and Meter Modules
The PIC16F15376-I/ML supports industrial sensor and metering modules thanks to its 10-bit ADC with computation, dual EUSART for RS-485 or Modbus links, and XLP sleep modes for battery-backed field installations. The ADC2 with hardware accumulation automates RMS and averaging calculations for energy and flow meters, offloading the core. MSSP drives SPI-based ADC front-ends or I2C sensors directly, and the 32 MHz speed sustains Modbus RTU traffic at 115200 baud without frame overruns. The -40 C to +85 C industrial temperature range is rated for outdoor cabinets and process-control enclosures.
추천
Automotive Body Electronics
The PIC16F15376-I/ML (in its automotive-graded family member, e.g. PIC16F15376-E/ML VAO variants) is well suited to body-electronics modules such as seat controllers, mirror adjusters, and HVAC flaps. Its 4 PWMs drive small DC motors and LEDs while CLCs handle LIN bus state-machine decoding in hardware, reducing firmware complexity. The wide 2.3V-5.5V supply tolerates automotive 12V load-dump transients when paired with a TVS-protected regulator. For full AEC-Q100 compliance, choose the -VAO suffix variant; the standard PIC16F15376-I/ML is intended for industrial and consumer designs.
추천
Battery Charging and Power Bank Controllers
The PIC16F15376-I/ML suits battery-charger and power-bank controllers thanks to its CWG for synchronous buck-boost timing, ADC with computation for charge-current monitoring, and XLP technology for shipping-mode quiescent currents. The 32 MHz core runs CC/CV charge profiles and supports SMBus or BC1.2 handshaking through I2C. The 28 KB Flash accommodates multi-chemistry charging state machines and OLED display drivers, while 2 KB SRAM tracks cell balancing and telemetry logs.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC16F15376-I/ML — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC16F15376-E/ML | PIC16F15375-I/ML | PIC16F15377-I/ML | PIC16F17176-I/MP | PIC16F15276-I/PT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8 mm) with EP | 44-QFN (8x8 mm) with EP - same | 44-QFN (8x8 mm) with EP - same | 44-QFN (8x8 mm) with EP - same | QFN-40 (different footprint) | TQFP-44 (through-hole equivalent) |
| Program Memory (Flash) | 28 KB | 28 KB | 14 KB (-50%) | 56 KB (+100%) | 28 KB | 28 KB |
| RAM Size | 2 KB | 2 KB | 1 KB (-50%) | 4 KB (+100%) | 2 KB | 2 KB |
| CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V |
| Temperature Range | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) |
주요 차별점
- Core Independent Peripherals (CIPs) reduce CPU wake-ups (vs PIC16F17176-I/MP)
- Memory tier flexibility within same QFN-44 footprint (vs PIC16F15375-I/ML)
- Extended temperature drop-in variant available (vs PIC16F15376-E/ML)
설계 노트
The QFN-44 package exposes the central thermal pad (EP) which must be soldered to a PCB ground copper pour for electrical grounding AND thermal dissipation. Recommended pattern: a single 4 mm x 4 mm thermal pad with 0.25 mm stencil apertures in a 1.0 mm grid for proper solder wetting. Without EP soldering, the device will overheat under sustained 32 MHz operation and may exhibit erratic ADC behavior. Use at least four thermal vias (0.3 mm drill) under the EP to inner ground planes for heat sinking.
Place a 100 nF ceramic decoupling capacitor within 5 mm of every VDD pin and a single 10 uF bulk capacitor near the MCU. The PIC16F15376-I/ML has four VDD pins distributed along the package; missing any one reduces noise immunity. For XLP battery designs, use a low-quiescent LDO such as MCP1700 to preserve the device's nanoamp sleep currents; standard regulators add 1-2 uA Iq that defeats battery-life targets.
Configure Peripheral Pin Select (PPS) early in firmware development and lock the PPS registers with the PPSLOCK bit to prevent accidental remapping. The PPS one-way lock requires a specific unlock sequence; once locked, the configuration is non-volatile and cannot be undone without a full chip erase. Document pin mapping in a header file referenced by both schematic and code to avoid firmware/PCB mismatches.
Do not connect the MCLR pin directly to VDD without a pull-up resistor; if MCLR floats, the device may randomly reset or fail to start. Use a 10 kohm pull-up to VDD and a 100 nF cap to ground for manual reset pushbuttons. Also avoid enabling unused peripherals in firmware - leaving ADC, DAC, or comparators powered on wastes microamps and degrades the XLP sleep budget. Estimated: at 32 MHz active and 4 enabled peripherals, current draw is approximately 4 mA; in deep sleep with all peripherals disabled, current drops to under 50 nA.
규정 준수 정보
RoHS and REACH compliance confirmed via Microchip product page; the standard PIC16F15376-I/ML is not AEC-Q100 qualified - automotive customers should select the -VAO suffix variant.
