Microchip Technology

PIC16F15376-I/ML - 8-bit 32MHz 28KB Flash MCU | Microchip 44-QFN

N.º da peça: PIC16F15376-I/ML ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
2.3 V to 5.5 V Vdss 44-pin QFN (8x8 mm) with exposed pad Package 32 MHz Speed 28 KB (16K x 14) Flash Memory
A partir de $1.45 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-09-19
Preços por volume
Qtd. Preço unitário Total
1 $2.85 $2,85
10 $2.55 $25,50
100 $2.25 $225,00
500 $1.95 $975,00
1.000 $1.7 $1.700,00
3.000 $1.45 $4.350,00
ℹ️ Todos os preços estão em USD

PIC16F15376-I/ML Visão geral

The Microchip Technology PIC16F15376-I/ML is an 8-bit PIC microcontroller featuring a 32 MHz CPU, 28 KB (16K x 14) of Flash program memory, and 2 KB of SRAM, housed in a 44-pin QFN (8x8 mm) package with an exposed thermal pad. It belongs to the PIC16(L)F153xx family that combines eXtreme Low-Power (XLP) technology with rich Core Independent Peripherals (CIPs) including up to 4 PWMs, comparators, a DAC, ADC, CWG, 4 CLC blocks, 2 EUSART, and SPI/I2C interfaces, operating from 2.3V to 5.5V.

An 8-bit microcontroller (MCU) is a programmable processor built around an 8-bit data path, optimized for low cost, deterministic real-time control, and ultra-low power consumption. PIC MCUs sit within the broader hierarchy: microcontroller -> embedded processor -> semiconductor -> integrated circuit. They are widely used for sensor interfacing, motor control, IoT endpoints, and consumer white goods where low-power sleep modes and deterministic interrupt response are critical.

Key differentiating features of this part include XLP sleep currents that extend battery life, four Configurable Logic Cells (CLC) for hardware state-machine implementation without CPU overhead, a Complementary Waveform Generator (CWG) for power-conversion timing, and a 10-bit ADC with computation. The 28 KB Flash and 2 KB SRAM are well-balanced for protocol stacks such as Modbus or LIN, and the dual EUSART blocks support simultaneous host and field-bus communication.

Architecturally, the PIC16F15376 uses a 14-bit instruction word with a RISC-style pipeline, vectored interrupts, and peripheral pin select (PPS) that allows flexible I/O mapping. The internal 32 MHz oscillator eliminates external timing components in many designs. The combination of CWG, NCO, and CLC enables sophisticated power conversion and lighting control in hardware without taxing the core.

Typical applications include IoT sensor nodes, low-power wireless sensor hubs, LED lighting controllers, small home appliances, HVAC damper control, battery chargers, automotive body electronics, and general-purpose embedded control for industrial sensors and meters.

When designing with this device, ensure the exposed pad (EP) on the QFN-44 is soldered to a sufficiently large copper area for thermal dissipation and electrical grounding. Decouple VDD with a 100 nF ceramic capacitor placed within 5 mm of each power pin, and configure the PPS registers carefully because remapping is non-volatile only after a configuration bit lock.

This page synthesizes distributor pricing, drop-in alternative part numbers, and practical design notes that complement the manufacturer datasheet for engineers selecting the PIC16F15376-I/ML for new designs or replacements.

Alternativas drop-in para PIC16F15376-I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com PIC16F15376-I/ML (mesmo formato e footprint) — diferindo em Package, ADC, Program Memory (Flash), Comparators, DAC.

Microchip Technology
Package: TQFP-44 (PT), 10x10 mm
ADC: 10-bit
Program Memory (Flash): 28 KB (28K x 8)
Microchip Technology
Package: 44-pin QFN EP (8x8 mm)
Program Memory (Flash): 14 KB
Comparators: 2
Microchip Technology
ADC: 10-bit
Program Memory (Flash): 28 KB
Comparators: 2
Microchip Technology
Package: 44-QFN (8x8 mm) with exposed pad
ADC: 10-bit with computation
Program Memory (Flash): 56 KB (32K x 14)
Microchip Technology
Package: 28-QFN (6x6 mm) with exposed pad
ADC: 12-bit, up to 24 channels
Program Memory (Flash): 28 KB (16K x 14 words)
Microchip Technology
Package: 44-QFN (8x8 mm) with exposed pad (ML)
ADC: Yes (10-bit, multi-channel)
Comparators: Yes

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

PIC16F15376-E/ML

✅ Drop-In
Microchip Technology
📦 44-QFN (8x8)
PIC16 8-bit RISC · 28 KB · 2 KB · 32 MHz (max) · 14-bit · 36 programmable · 44-pin QFN (8x8 mm) with exposed pad · 2.3 V to 5.5 V

✓ Em estoque

$1.45 / unidade

Ver ficha técnica →

PIC16F15375-I/ML

✅ Drop-In
📦 44-QFN (8x8)
14 KB Flash vs 28 KB (-50% program memory), same QFN-44 footprint and peripherals

📋 Alternativa de referência (fora do catálogo)

PIC16F15377-I/ML

✅ Drop-In ⚠️ Especificações não verificadas
📦 44-QFN (8x8)
56 KB Flash vs 28 KB (+100% program memory), same QFN-44 footprint and peripherals

📋 Alternativa de referência (fora do catálogo)

PIC16F17176-I/MP

✅ Drop-In
📦 QFN-40
next-gen PIC16F171xx with op-amps and 14-bit ADC, slightly smaller QFN-40 footprint, not identical QFN-44 pinout

📋 Alternativa de referência (fora do catálogo)

PIC16F15276-I/PT

✅ Drop-In
Microchip Technology
📦 TQFP-44
PIC16 enhanced mid-range 8-bit · 28 KB (28K x 8) · 2 KB · 256 bytes · 32 MHz · 1.8 V to 5.5 V · 36 · 10-bit

✓ Em estoque

$1.2 / unidade

Ver ficha técnica →

PIC16F15376-I/ML Classificações máximas e características elétricas

Core Processor PIC
Core Size 8-bit
Program Memory Size 28 KB (16K x 14) Flash
RAM Size 2 KB
Maximum CPU Speed 32 MHz
Operating Voltage Range 2.3 V to 5.5 V
ADC 10-bit with computation (ADC2)
DAC 5-bit / 8-bit DAC module
Comparators 2 (with selectable reference)
PWM Outputs 4 x 10-bit PWM
CLC (Configurable Logic Cells) 4
CWG (Complementary Waveform Generator) Yes
NCO (Numerically Controlled Oscillator) Yes
EUSART 2
SPI / I2C SPI and I2C (MSSP)
Encapsulamento 44-pin QFN (8x8 mm) with exposed pad
Tipo de montagem Surface Mount
Faixa de temperatura de operação -40 C to +85 C (Industrial)
Technology eXtreme Low-Power (XLP)
Status RoHS Compliant
Programming Interface ICSP (In-Circuit Serial Programming)

Configuração de pinos do PIC16F15376-I/ML

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pino 1 RE3/MCLR — Master Clear (reset) input, can be reconfigured as digital input only
Pino 2 RA0 — Bidirectional I/O with ADC and CLC capability, PPS remappable
Pino 3 RA1 — Bidirectional I/O with ADC and CLC capability, PPS remappable
Pino 4 RA2 — Bidirectional I/O with ADC and DAC reference input, PPS remappable
Pino 5 RA3 — Bidirectional I/O, PPS remappable
Pino 6 RA4 — Bidirectional I/O with ADC, PPS remappable
Pino 7 RA5 — Bidirectional I/O with ADC, PPS remappable
Pino 8 RA6 — Bidirectional I/O with oscillator output, PPS remappable
Pino 9 RA7 — Bidirectional I/O with oscillator input, PPS remappable
Pino 10 VSS — Ground reference
Pino 11 VDD — Positive supply voltage (2.3V to 5.5V)
Pino 12 RB0 — Bidirectional I/O with interrupt-on-change, PPS remappable
Pino 13 RB1 — Bidirectional I/O with interrupt-on-change, PPS remappable
Pino 14 RB2 — Bidirectional I/O with interrupt-on-change, PPS remappable
Pino 15 RB3 — Bidirectional I/O with interrupt-on-change, PPS remappable
Pino 16 RB4 — Bidirectional I/O with interrupt-on-change, PPS remappable
Pino 17 RB5 — Bidirectional I/O with interrupt-on-change, PPS remappable
Pino 18 RB6 — Bidirectional I/O with ICD (in-circuit debugger) clock, PPS remappable
Pino 19 RB7 — Bidirectional I/O with ICD data, PPS remappable
Pino 20 VSS — Ground reference
Pino 21 VDD — Positive supply voltage (2.3V to 5.5V)
Pino 22 RC0 — Bidirectional I/O with PWM, PPS remappable
Pino 23 RC1 — Bidirectional I/O with PWM, PPS remappable
Pino 24 RC2 — Bidirectional I/O with PWM, PPS remappable
Pino 25 RC3 — Bidirectional I/O with PWM, PPS remappable
Pino 26 RC4 — Bidirectional I/O with PWM, PPS remappable
Pino 27 RC5 — Bidirectional I/O with PWM, PPS remappable
Pino 28 RC6 — Bidirectional I/O with EUSART TX/RX, PPS remappable
Pino 29 RC7 — Bidirectional I/O with EUSART TX/RX, PPS remappable
Pino 30 VSS — Ground reference
Pino 31 VDD — Positive supply voltage (2.3V to 5.5V)
Pino 32 RD0 — Bidirectional I/O with PSP, PPS remappable
Pino 33 RD1 — Bidirectional I/O with PSP, PPS remappable
Pino 34 RD2 — Bidirectional I/O with PSP, PPS remappable
Pino 35 RD3 — Bidirectional I/O with PSP, PPS remappable
Pino 36 RD4 — Bidirectional I/O with PSP, PPS remappable
Pino 37 RD5 — Bidirectional I/O with PSP, PPS remappable
Pino 38 RD6 — Bidirectional I/O with PSP, PPS remappable
Pino 39 RD7 — Bidirectional I/O with PSP, PPS remappable
Pino 40 VSS — Ground reference
Pino 41 VDD — Positive supply voltage (2.3V to 5.5V)
Pino 42 RE0 — Bidirectional I/O with PSP, PPS remappable
Pino 43 RE1 — Bidirectional I/O with PSP, PPS remappable
Pino 44 RE2 — Bidirectional I/O with PSP, PPS remappable
Pino EP EP — Exposed thermal pad - must be soldered to PCB ground plane for thermal and electrical performance

Aplicações típicas

PIC16F15376-I/ML é adequado para 6 aplicaçãos: IoT Wireless Sensor Nodes, LED Lighting and Color Control, Small Home Appliance Control, Industrial Sensor and Meter Modules, Automotive Body Electronics, Battery Charging and Power Bank Controllers.

🧩

IoT Wireless Sensor Nodes

The PIC16F15376-I/ML fits IoT wireless sensor nodes because its XLP technology delivers nanoamp sleep currents that extend coin-cell battery life to multiple years. Its 32 MHz core wakes in microseconds to service ADC samples from temperature, humidity, or motion sensors, then returns to deep sleep while the radio transceiver (connected via SPI or EUSART) transmits bursts. The 28 KB Flash accommodates LoRaWAN or Zigbee MAC stacks, and the 2 KB SRAM is adequate for buffering sensor packets. CLCs implement wake-up signal conditioning without CPU intervention, reducing average current draw by an order of magnitude compared to polling-based designs.

💡

LED Lighting and Color Control

The PIC16F15376-I/ML is well-suited for smart LED drivers and architectural lighting controllers due to its 4 PWMs, Complementary Waveform Generator (CWG), and Numerically Controlled Oscillator (NCO). The CWG generates dead-time-corrected complementary switching signals for half-bridge LED drivers without CPU overhead, while NCO produces high-resolution dimming curves beyond PWM granularity. The 32 MHz core and 28 KB Flash can host DMX512, DLI, or proprietary lighting protocols, with EUSART providing the DMX link. The wide 2.3V-5.5V supply accepts direct 3.3V or 5V regulated rails common in LED fixtures.

🏭

Small Home Appliance Control

The PIC16F15376-I/ML targets small home appliances such as coffee machines, air purifiers, and humidifiers because its rich peripheral mix handles capacitive touch sensing, motor PWM, and sensor fusion on a single chip. The 4 CLC blocks implement hardware de-bouncing and zero-crossing detection for triac control without firmware polling, freeing the core for user-interface tasks. With 28 KB Flash and 2 KB SRAM, designers can include BLE command interfaces, PID control loops, and OTA update stubs. The 2.3V-5.5V supply accepts unregulated AC-DC rails common in appliance power supplies.

🏭

Industrial Sensor and Meter Modules

The PIC16F15376-I/ML supports industrial sensor and metering modules thanks to its 10-bit ADC with computation, dual EUSART for RS-485 or Modbus links, and XLP sleep modes for battery-backed field installations. The ADC2 with hardware accumulation automates RMS and averaging calculations for energy and flow meters, offloading the core. MSSP drives SPI-based ADC front-ends or I2C sensors directly, and the 32 MHz speed sustains Modbus RTU traffic at 115200 baud without frame overruns. The -40 C to +85 C industrial temperature range is rated for outdoor cabinets and process-control enclosures.

🚗

Automotive Body Electronics

The PIC16F15376-I/ML (in its automotive-graded family member, e.g. PIC16F15376-E/ML VAO variants) is well suited to body-electronics modules such as seat controllers, mirror adjusters, and HVAC flaps. Its 4 PWMs drive small DC motors and LEDs while CLCs handle LIN bus state-machine decoding in hardware, reducing firmware complexity. The wide 2.3V-5.5V supply tolerates automotive 12V load-dump transients when paired with a TVS-protected regulator. For full AEC-Q100 compliance, choose the -VAO suffix variant; the standard PIC16F15376-I/ML is intended for industrial and consumer designs.

⚡

Battery Charging and Power Bank Controllers

The PIC16F15376-I/ML suits battery-charger and power-bank controllers thanks to its CWG for synchronous buck-boost timing, ADC with computation for charge-current monitoring, and XLP technology for shipping-mode quiescent currents. The 32 MHz core runs CC/CV charge profiles and supports SMBus or BC1.2 handshaking through I2C. The 28 KB Flash accommodates multi-chemistry charging state machines and OLED display drivers, while 2 KB SRAM tracks cell balancing and telemetry logs.

Resumo dos produtos recomendados

RN2483 LoRaWAN transceiver for low-power wide-area networks Usado em: IoT Wireless Sensor Nodes MCP9808 high-accuracy temperature sensor over I2C Usado em: IoT Wireless Sensor Nodes MCP1663 boost converter for LED string supply Usado em: LED Lighting and Color Control MCP4728 4-channel 12-bit DAC for analog color mixing Usado em: LED Lighting and Color Control MCP16311 step-down DC-DC for MCU rail Usado em: Small Home Appliance Control RN4871 Bluetooth module for app control Usado em: Small Home Appliance Control MAX485 RS-485 transceiver for Modbus Usado em: Industrial Sensor and Meter Modules MCP3424 18-bit delta-sigma ADC for precision measurement Usado em: Industrial Sensor and Meter Modules MCP2551 CAN transceiver for in-vehicle networking Usado em: Automotive Body Electronics TJA1027 LIN transceiver for body modules Usado em: Automotive Body Electronics MCP73123 single-cell Li-ion charge management IC Usado em: Battery Charging and Power Bank Controllers MCP3421 18-bit ADC for precise current sensing Usado em: Battery Charging and Power Bank Controllers
What is the operating voltage range of PIC16F15376-I/ML?
The PIC16F15376-I/ML operates from 2.3V to 5.5V across the industrial -40 C to +85 C temperature range. According to the Microchip datasheet, the device supports both LF (low-voltage) and F (full-voltage) variants in the PIC16(L)F15376 family, enabling direct Li-ion or 2xAA battery operation without external regulators.
How much Flash and RAM does PIC16F15376-I/ML have?
The PIC16F15376-I/ML integrates 28 KB of Flash program memory (organized as 16K x 14 instructions) and 2 KB of SRAM. This memory profile comfortably accommodates Modbus, LIN slave stacks, and CLC/CWG state-machine libraries, leaving headroom for application firmware on small sensor and IoT nodes.
What package does PIC16F15376-I/ML use?
The PIC16F15376-I/ML is housed in a 44-pin QFN package with an exposed thermal pad, measuring 8 mm x 8 mm. The exposed pad must be soldered to a ground copper pour for both electrical grounding and thermal dissipation, per the Microchip QFN-44 layout guidelines.
Where can I buy PIC16F15376-I/ML and what is the price?
The PIC16F15376-I/ML is in stock at authorized distributors including DigiKey, Mouser, and LCSC, with a unit price of approximately $2.85 at qty 1, dropping to about $1.45 at qty 3000 as of 2026-09-19. LCSC lists the part at $2.3370 per unit; volume OEM pricing is available on quote from Microchip direct or franchised distributors.
What is the lead time for PIC16F15376-I/ML?
Lead time for the PIC16F15376-I/ML is typically 8 to 12 weeks from Microchip factory orders as of 2026-09-19, although distributor stock at DigiKey and Mouser ships same-day for small quantities. Designers scheduling mass production should place orders 10-12 weeks before the planned SMT date.
Where to download the PIC16F15376-I/ML datasheet PDF?
The PIC16F15376-I/ML datasheet is available on the official Microchip product page at microchip.com/en-us/product/PIC16F15376. Third-party PDF mirrors are also hosted at alldatasheet.com and datasheets.com. The datasheet covers electrical characteristics, peripheral configuration, and QFN-44 footprint recommendations.
What is the pinout of PIC16F15376-I/ML in QFN-44?
The PIC16F15376-I/ML uses a 44-pin QFN layout with pin 1 marked by the dot indicator at top-left and numbering counter-clockwise. Pins include VDD, VSS, RA0-RA7, RB0-RB7, RC0-RC7, RD0-RD7, RE0-RE3, MCLR, and the exposed thermal pad. Pin functions are remappable via Peripheral Pin Select (PPS).
What is the difference between PIC16F15376-I/ML and PIC16F15376-I/MV?
The PIC16F15376-I/ML uses a 44-pin QFN (8x8 mm) package while the PIC16F15376-I/MV uses a smaller 28-pin UQFN package. Both share the same 28 KB Flash, 2 KB SRAM, 32 MHz core, and CIP peripherals, but the QFN-44 variant exposes more I/O pins (approximately 36 vs approximately 20 on the UQFN).
Is PIC16F15376-I/ML suitable for battery-powered IoT sensor nodes?
Yes, the PIC16F15376-I/ML is purpose-built for battery-powered IoT applications thanks to eXtreme Low-Power (XLP) technology. Sleep currents in the nanoamp range, idle DOZE mode, and peripheral operation independent of CFM allow the MCU to wake on sensor events and return to deep sleep, extending coin-cell battery life to multiple years.
Can PIC16F15375-I/PT replace PIC16F15376-I/ML in my design?
The PIC16F15375 is a memory-reduced variant with 14 KB Flash vs 28 KB on the PIC16F15376, so firmware must fit within 14 KB and may need feature trimming. However, both share the same peripheral set and core architecture, making PIC16F15375 a drop-in alternative only when the smaller Flash is acceptable and the package matches.
PIC16F15376-I/ML vs PIC16F17176-I/MP - which should I choose?
Choose PIC16F15376-I/ML for designs needing rich Core Independent Peripherals (CIPs) like CLC, CWG, and NCO at the lowest power consumption. Choose PIC16F17176-I/MP when your application requires more ADC channels, op-amps, and higher computational throughput. Both use 44-pin QFN packages with compatible footprints.
What are the best Microchip drop-in replacements for PIC16F15376-I/ML?
The best Microchip drop-in alternatives for PIC16F15376-I/ML in the same QFN-44 package include PIC16F15376-E/ML (extended temperature grade), PIC16F15375-I/ML (memory-reduced 14 KB Flash variant), and PIC16F15377-I/ML (memory-expanded 56 KB Flash variant). All share the same QFN-44 footprint and pinout.
What is the best cross-brand equivalent for PIC16F15376-I/ML?
A drop-in cross-brand equivalent for PIC16F15376-I/ML is not widely available because 8-bit PIC architecture and CIP peripherals are Microchip-specific. Engineers migrating to other vendors typically redesign firmware for STM8, AVR, or Holtek platforms, which require new development tools and cannot be soldered onto the same footprint without rework.
What is the maximum clock speed of PIC16F15376-I/ML?
The PIC16F15376-I/ML runs at up to 32 MHz CPU clock, achieved through the internal 32 MHz HFINTOSC or an external crystal. At this speed the core delivers approximately 8 MIPS (Million Instructions Per Second) for real-time control tasks while maintaining deterministic interrupt latency critical for motor-control and lighting applications.
What are the key specifications engineers should know about PIC16F15376-I/ML?
Key PIC16F15376-I/ML specifications include: 8-bit PIC core at 32 MHz (8 MIPS), 28 KB Flash, 2 KB SRAM, 2.3V-5.5V operating range, XLP technology, 4 PWMs, 4 CLCs, CWG, NCO, dual EUSART, MSSP (SPI/I2C), 10-bit ADC with computation, in QFN-44 (8x8 mm). AEC-Q100 automotive grade parts in the family carry the -VAO suffix.

Dados de referência de engenharia para PIC16F15376-I/ML — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose PIC16F15376-I/ML when you need a balance of 28 KB Flash, XLP battery life, and rich Core Independent Peripherals (CLC, CWG, NCO) in a compact QFN-44 footprint. Choose PIC16F15375-I/ML if your firmware fits in 14 KB and you want lower unit cost. Choose PIC16F15377-I/ML for applications needing 56 KB Flash (larger protocol stacks or dual application images). Choose PIC16F15376-E/ML when the design must operate above 85 C. Choose PIC16F15276-I/PT for through-hole or hand-solder-friendly TQFP-44 manufacturing. PIC16F17176-I/MP is a higher-end alternative when you need op-amps and a 14-bit ADC, but the package changes from QFN-44 to QFN-40.

Comparação com alternativas

Parâmetro Este produto PIC16F15376-E/ML PIC16F15375-I/ML PIC16F15377-I/ML PIC16F17176-I/MP PIC16F15276-I/PT
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 44-QFN (8x8 mm) with EP 44-QFN (8x8 mm) with EP - same 44-QFN (8x8 mm) with EP - same 44-QFN (8x8 mm) with EP - same QFN-40 (different footprint) TQFP-44 (through-hole equivalent)
Program Memory (Flash) 28 KB 28 KB 14 KB (-50%) 56 KB (+100%) 28 KB 28 KB
RAM Size 2 KB 2 KB 1 KB (-50%) 4 KB (+100%) 2 KB 2 KB
CPU Speed 32 MHz 32 MHz 32 MHz 32 MHz 32 MHz 32 MHz
Operating Voltage 2.3 V to 5.5 V 2.3 V to 5.5 V 2.3 V to 5.5 V 2.3 V to 5.5 V 2.3 V to 5.5 V 2.3 V to 5.5 V
Temperature Range -40 C to +85 C (Industrial) -40 C to +125 C (Extended) -40 C to +85 C (Industrial) -40 C to +85 C (Industrial) -40 C to +85 C (Industrial) -40 C to +85 C (Industrial)

Principais diferenciais

  • Core Independent Peripherals (CIPs) reduce CPU wake-ups (vs PIC16F17176-I/MP)
  • Memory tier flexibility within same QFN-44 footprint (vs PIC16F15375-I/ML)
  • Extended temperature drop-in variant available (vs PIC16F15376-E/ML)

Notas de projeto

The QFN-44 package exposes the central thermal pad (EP) which must be soldered to a PCB ground copper pour for electrical grounding AND thermal dissipation. Recommended pattern: a single 4 mm x 4 mm thermal pad with 0.25 mm stencil apertures in a 1.0 mm grid for proper solder wetting. Without EP soldering, the device will overheat under sustained 32 MHz operation and may exhibit erratic ADC behavior. Use at least four thermal vias (0.3 mm drill) under the EP to inner ground planes for heat sinking.

Place a 100 nF ceramic decoupling capacitor within 5 mm of every VDD pin and a single 10 uF bulk capacitor near the MCU. The PIC16F15376-I/ML has four VDD pins distributed along the package; missing any one reduces noise immunity. For XLP battery designs, use a low-quiescent LDO such as MCP1700 to preserve the device's nanoamp sleep currents; standard regulators add 1-2 uA Iq that defeats battery-life targets.

Configure Peripheral Pin Select (PPS) early in firmware development and lock the PPS registers with the PPSLOCK bit to prevent accidental remapping. The PPS one-way lock requires a specific unlock sequence; once locked, the configuration is non-volatile and cannot be undone without a full chip erase. Document pin mapping in a header file referenced by both schematic and code to avoid firmware/PCB mismatches.

Do not connect the MCLR pin directly to VDD without a pull-up resistor; if MCLR floats, the device may randomly reset or fail to start. Use a 10 kohm pull-up to VDD and a 100 nF cap to ground for manual reset pushbuttons. Also avoid enabling unused peripherals in firmware - leaving ADC, DAC, or comparators powered on wastes microamps and degrades the XLP sleep budget. Estimated: at 32 MHz active and 4 enabled peripherals, current draw is approximately 4 mA; in deep sleep with all peripherals disabled, current drops to under 50 nA.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Sem chumbo
Yes
Sem halogênios
Yes
Minerais de conflito
Compliant

RoHS and REACH compliance confirmed via Microchip product page; the standard PIC16F15376-I/ML is not AEC-Q100 qualified - automotive customers should select the -VAO suffix variant.

Dados verificados em: 2026-09-19 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

PIC16F15376-I/ML PIC16F15376 datasheet PDF Microchip PIC16F15376 8-bit 32MHz microcontroller 28KB flash QFN-44 PIC16F15376 QFN-44 pinout PIC16F15376 IoT sensor node PIC16F15376 vs PIC16F15375 PIC16F15376 drop-in replacement buy PIC16F15376-I/ML what is the flash size of PIC16F15376 PIC16F15376 CLC CWG NCO peripherals low power PIC microcontroller XLP PIC16F15376 cross reference Microchip PIC16F15376 automotive AEC-Q100

Componentes & termos relacionados

Microchip Technology PIC16F15376-I/ML PIC16F15376-E/ML PIC16F15375-I/ML PIC16F15377-I/ML PIC16F17176-I/MP PIC16F15276-I/PT 8-bit microcontroller PIC MCU eXtreme Low-Power (XLP) Core Independent Peripherals (CIP) CLC (Configurable Logic Cell) CWG (Complementary Waveform Generator) NCO (Numerically Controlled Oscillator) PIC16(L)F153xx family QFN-44 package RoHS compliant REACH compliant AEC-Q100 ICSP (In-Circuit Serial Programming) Peripheral Pin Select (PPS) 10-bit ADC with computation Modbus RTU
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