PIC16F18326T-E/7NVAO - 8-Bit 32MHz 28KB Flash MCU | Microchip
부품 번호: PIC16F18326T-E/7NVAO ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1.85 | $1.85 |
| 10 | $1.66 | $16.60 |
| 100 | $1.48 | $148.00 |
| 500 | $1.32 | $660.00 |
| 1,000 | $1.18 | $1,180.00 |
PIC16F18326T-E/7NVAO 개요
An 8-bit microcontroller is a single-chip computer built around an 8-bit data bus and CPU core, optimized for deterministic real-time control with low pin count and minimal power consumption. PIC16F183xx parts sit within the broader PIC microcontroller family and the wider category of microcontrollers and integrated circuits, serving as the central logic unit in embedded systems ranging from sensor nodes to automotive control modules.
Key features include a maximum CPU clock of 32 MHz, operation from 2.3 V to 5.5 V across the industrial temperature range, integrated 10-bit ADC, configurable logic cells (CLC), complementary waveform generator (CWG), multiple PWM modules, and CIPs that offload tasks from the CPU. The PPS block reassigns digital peripheral signals to any I/O pin, simplifying PCB layout when peripherals move between designs.
The device is qualified to AEC-Q100 standards for automotive applications and includes Functional Safety (FuSa) documentation, making it suitable for safety-critical subsystems. The XLP technology with low-power sleep modes, IDLE and DOZE modes, and nanoWatt XLP sleep currents as low as low as low as low as approximately 30 nA typical allow the part to extend battery life in always-on sensor applications.
Typical applications include automotive body and lighting controllers, sensor signal conditioning, low-power IoT edge nodes, and battery-powered portable instrumentation. The combination of 32 MHz throughput and CIP offload makes it well-suited to closed-loop control and digital signal pre-processing on the same chip.
When designing with this part, validate the VQFN thermal pad connection for power dissipation and route PPS-mapped signals with short, direct paths. Confirm supply decoupling meets the 100 nF / 1 uF / 10 uF bulk/ceramic stack near the VDD pin, and review the FuSa package contents for ISO 26262-relevant subsystems.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, and consolidates cross-brand and same-brand substitutes for sourcing and redesign decisions.
드롭인 대체품: PIC16F18326T-E/7NVAO — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC16F18326T-E/7NVAO (동일 폼 팩터 및 풋프린트) — 차이점: Automotive Qualification, Operating Temperature, Program Memory (Flash), Supply Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC16F18325T-E/7NVAO
✅ 드롭인✓ 재고 있음
$1.08 / 개
데이터시트 보기 →PIC16F18324T-E/7NVAO
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC16F18323T-E/7NVAO
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC16F18326T-E/7NVAO 최대 정격 & 전기적 특성
| Core | PIC16F 8-bit RISC |
| Program Memory (Flash) | 28 KB (16K x 14) |
| RAM | 2 KB |
| Data EEPROM | 256 bytes |
| Maximum CPU Speed | 32 MHz |
| 공급 전압 | 2.3 V to 5.5 V |
| 동작 온도 | -40 C to +125 C (Extended) |
| 패키지 | 16-VQFN (4x4 mm) with exposed pad |
| 실장 유형 | Surface Mount |
| A/D Converter | 10-bit |
| Automotive Qualification | AEC-Q100 (VAO suffix) |
| Functional Safety | FuSa documentation available |
| Peripheral Pin Select | Yes |
| eXtreme Low Power (XLP) | Yes (nanoWatt XLP) |
| RoHS 상태 | Compliant |
PIC16F18326T-E/7NVAO 핀 구성
| 핀 1 | RA0 — Bidirectional I/O / analog input |
| 핀 2 | RA1 — Bidirectional I/O / analog input |
| 핀 3 | RA2 — Bidirectional I/O / analog input |
| 핀 4 | RA3 — Bidirectional I/O / MCLR |
| 핀 5 | RA4 — Bidirectional I/O |
| 핀 6 | RA5 — Bidirectional I/O / analog input |
| 핀 7 | VSS — Ground reference |
| 핀 8 | RA6 — Bidirectional I/O |
| 핀 9 | RA7 — Bidirectional I/O |
| 핀 10 | RB0 — Bidirectional I/O / analog input |
| 핀 11 | RB1 — Bidirectional I/O / analog input |
| 핀 12 | RB2 — Bidirectional I/O |
| 핀 13 | RB3 — Bidirectional I/O |
| 핀 14 | RB4 — Bidirectional I/O |
| 핀 15 | RB5 — Bidirectional I/O |
| 핀 16 | VDD — Positive supply voltage |
일반적인 애플리케이션
PIC16F18326T-E/7NVAO 적합 용도: 6 애플리케이션s: Automotive Body Control Modules, Automotive LED Lighting Drivers, Battery-Powered IoT Sensor Nodes, Industrial Sensor Signal Conditioning, Wearable Health and Fitness Devices, Smart Home Edge Controllers.
Automotive Body Control Modules
The PIC16F18326T-E/7NVAO is well suited for automotive body control modules including door lock controllers, mirror adjusters, and seat position memories. Its 32 MHz CPU, 28 KB Flash, and AEC-Q100 qualification with -40 C to +125 C operation match the thermal and reliability demands of in-cabin ECUs. The PPS module reassigns I/O for flexible PCB layout, while the CWG and PWM peripherals drive MOSFET gate signals for window lift and wiper control without CPU overhead. Functional Safety documentation supports ISO 26262-relevant subsystem integration. Compared with discrete logic, this part consolidates timing, sensing, and actuation into one chip.
추천
Automotive LED Lighting Drivers
The PIC16F18326T-E/7NVAO drives automotive interior and exterior LED lighting by combining its 10-bit ADC for current sensing, complementary waveform generator for half-bridge drive, and PPS for flexible LED string mapping. Its XLP nanoWatt sleep currents allow always-on accent LEDs without draining the battery, and the 32 MHz throughput handles sequential turn signals and animated indicators with deterministic latency. AEC-Q100 qualification and FuSa documentation ease integration into exterior tail lamp and signature lighting modules. The 16-VQFN package supports compact, thermally-constrained headlamp PCBs.
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Battery-Powered IoT Sensor Nodes
The PIC16F18326T-E/7NVAO anchors battery-powered IoT sensor nodes thanks to its XLP nanoWatt sleep mode and IDLE/DOZE run modes that drop quiescent current to approximately 30 nA in deep sleep. The 28 KB Flash accommodates a LoRaWAN or BLE stack plus sensor fusion, while CIPs let the ADC and CWG wake the CPU only on threshold events. The 10-bit ADC at up to 100 ksps is adequate for temperature, humidity, and gas sensor digitization. Compared with a discrete wake-up timer, this part reduces BOM count and PCB area in coin-cell sensor designs.
추천
Industrial Sensor Signal Conditioning
The PIC16F18326T-E/7NVAO conditions analog and digital signals in industrial sensors by exploiting its 10-bit ADC, configurable logic cells for digital filtering, and PPS for flexible pin assignment in mixed-signal transducer designs. Its 32 MHz CPU and 8 MIPS throughput handle FIR/IIR filters on strain gauge, thermocouple, or flow sensor outputs in real time. The 16-VQFN exposed pad eases thermal coupling when driving 4-20 mA loops, and the extended -40 C to +125 C temperature range meets IEC 60068 industrial environment stress. CIP offload allows filtering to run without CPU intervention.
추천
Wearable Health and Fitness Devices
The PIC16F18326T-E/7NVAO drives wearable health and fitness devices by combining its XLP sleep mode, 10-bit ADC, and PPS-mappable CLC for flexible sensor input multiplexing. It can wake on heart rate sensor thresholds, drive an OLED display via SPI, and log steps with its CWG-driven haptic feedback, all while sipping battery current in sleep. The 28 KB Flash accommodates BLE stack fragments and motion compensation algorithms. The 16-VQFN package measures 4x4 mm and fits inside wristband form factors, while 2 KB RAM handles buffering of biometric data between transmissions.
추천
Smart Home Edge Controllers
The PIC16F18326T-E/7NVAO is well suited to smart home edge controllers that bridge sensors to cloud gateways. Its 28 KB Flash and 2 KB RAM run lightweight MQTT or Matter-adjacent stacks while CIPs handle local actuator timing. PPS reassigns UART, SPI, and I2C peripherals to any pin, simplifying PCB routing across multiple sensor connector variants. The XLP sleep mode allows battery-backed door and window sensors to last years on a single cell. Compared with wireless-only SoCs, this part adds deterministic local control alongside the radio.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC16F18326T-E/7NVAO — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC16F18325T-E/7NVAO | PIC16F18324T-E/7NVAO | PIC16F18323T-E/7NVAO |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 16-VQFN (4x4) | 16-VQFN (4x4) - same | 16-VQFN (4x4) - same | 16-VQFN (4x4) - same |
| Flash Memory | 28 KB | 16 KB (-43%) | 14 KB (-50%) | 8 KB (-71%) |
| RAM | 2 KB | 2 KB | 2 KB | 1 KB (-50%) |
| EEPROM | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| Maximum CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| AEC-Q100 Grade | Yes (VAO) | Yes (VAO) | Yes (VAO) | Yes (VAO) |
| Unit Price (qty 1) | $1.85 | $1.65 (-11%) | $1.55 (-16%) | $1.40 (-24%) |
주요 차별점
- Largest Flash in 16-VQFN automotive PIC16F183xx family (vs PIC16F18325T-E/7NVAO)
- Same 16-VQFN footprint as smaller siblings for PCB reuse (vs PIC16F18323T-E/7NVAO)
- Functional Safety documentation for ISO 26262 subsystems (vs PIC16F18326-I/JQ (industrial version))
설계 노트
Estimated: The 16-VQFN-EP package relies on the exposed pad for primary heat dissipation. At 32 MHz and 5 V supply with all peripherals active, internal power is below 50 mW, but sustained high-current GPIO drive can raise junction temperature. Solder the exposed pad to a continuous copper pour of at least 25 mm^2 on the top layer with thermal vias to an internal ground plane for reliable operation at +125 C ambient. Keep the copper pad void-free under the EP per IPC-7093.
Place a 100 nF decoupling capacitor within 3 mm of the VDD pin and a bulk 1 uF to 10 uF ceramic on the same supply trace. Keep the MCLR/RA3 trace short and add a 10 kohm pull-up to VDD with a 100 nF to ground if the MCLR function is used. Route PPS-mapped peripherals to nearby I/O to avoid crossing high-current traces. Maintain at least 0.2 mm clearance between the VQFN pad edge and adjacent signal traces to comply with IPC-2221 for high-density QFN layouts.
Do not exceed 5.5 V on VDD or apply voltage on any I/O above VDD + 0.3 V or below VSS -0.3 V to avoid latch-up. The PPS module cannot reassign analog peripherals to all pins - consult the datasheet RPIN/RPOR tables before PCB layout. When migrating from PIC16F18325 to PIC16F18326 verify that the 16 KB Flash limit is not exceeded, and check the CLC instance count when porting designs from PIC16F18346 (more CLCs than 18326). Always validate firmware against the errata list for the specific silicon revision.
규정 준수 정보
AEC-Q100 qualified per VAO suffix; Functional Safety (FuSa) documentation available; RoHS and REACH compliant per Microchip product declarations; lead-free 16-VQFN package with Matte Tin finish per JEDEC J-STD-020.
