PIC16F73T-I/ML - 8-Bit 20MHz 7KB Flash MCU 28-QFN | Microchip
부품 번호: PIC16F73T-I/ML ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8.92 | $8.92 |
| 10 | $8.01 | $80.10 |
| 100 | $7.12 | $712.00 |
| 500 | $6.4 | $3,200.00 |
| 1,000 | $5.68 | $5,680.00 |
PIC16F73T-I/ML 개요
A microcontroller (MCU) is a programmable single-chip computer that integrates a CPU, memory, and peripherals onto a single silicon die. The PIC16F73 belongs to the PIC16F family of 8-bit RISC microcontrollers, which sits within the broader taxonomy of MCUs → embedded processors → semiconductors. The 'F' suffix denotes FLASH program memory, while the '16' indicates a 14-bit instruction width mid-range core with 35 single-word instructions and a simple register-based architecture that is upwards compatible with PIC16C5X, PIC12CXXX and PIC16C7X legacy parts.
Key features of the PIC16F73T-I/ML include 5 channels of 8-bit Analog-to-Digital (A/D) conversion, three timers (Timer0, Timer1 and Timer2), a Universal Synchronous/Asynchronous Receiver Transmitter (USART) with a 9-bit addressable frame format, and a Master Synchronous Serial Port (MSSP) module supporting SPI and I2C. The device also integrates an 8-bit Parallel Slave Port on certain variants and provides power-managed modes for low-power applications.
Architecturally, the PIC16F73 uses a Harvard-style RISC core with separate instruction and data buses, hardware stack, and a predictable single-cycle-per-instruction execution model that simplifies real-time control design. Its CMOS FLASH technology gives the MCU 100,000 erase/write cycle endurance with typical data retention in excess of 40 years, supporting field reprogrammability through ICSP.
Typical applications for the PIC16F73T-I/ML include industrial control loops, sensor interfacing nodes, motor-drive front-ends, lighting controllers, automotive body electronics, consumer appliances, and remote-control units that need an industrial-temperature (-40 °C to +85 °C) MCU with on-chip ADC and USART. The compact 28-QFN (6 × 6 mm) footprint suits space-constrained designs such as handheld instruments.
When designing with this part, pay attention to the decoupling network (a 0.1 µF ceramic capacitor close to VDD is essential), the ICSP programming pin assignments, and the choice of oscillator mode (HS, XT, LP, RC or INTIO) which directly affects current consumption. The exposed thermal pad must be soldered to a copper pour for mechanical and thermal reliability.
드롭인 대체품: PIC16F73T-I/ML — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC16F73T-I/ML (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, ADC, I/O Pins, Core Architecture.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC16F73-I/ML
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC16F727-I/ML
✅ 드롭인✓ 재고 있음
$2.18 / 개
데이터시트 보기 →PIC16F727-E/ML
✅ 드롭인✓ 재고 있음
$1.62 / 개
데이터시트 보기 →PIC16F726-E/ML
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2.1 / 개
데이터시트 보기 →PIC16F722AT-I/ML
✅ 드롭인✓ 재고 있음
$1.58 / 개
데이터시트 보기 →PIC16F722A-I/ML
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
PIC16F73T-I/ML 최대 정격 & 전기적 특성
| Series | PIC16F |
| Core Architecture | 8-bit PIC RISC |
| Instruction Set Width | 14-bit |
| Number of Instructions | 35 single-word |
| Program Memory Type | Flash |
| Program Memory Size | 7 KB (4K × 14) |
| RAM | 192 bytes |
| ROM Type | Flash |
| Maximum Clock Speed | 20 MHz |
| Instruction Cycle Time | 200 ns |
| 공급 전압 | 2.5 V to 5.5 V |
| I/O Pins | 22 |
| ADC Channels | 5 × 8-bit |
| Number of Timers | 3 (Timer0, Timer1, Timer2) |
| Communication Interfaces | USART (SCI), SSP (SPI/I2C) |
| 동작 온도 | -40 °C to +85 °C (Industrial) |
| 패키지 | 28-QFN (6 × 6 mm) with exposed pad |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 |
| RoHS 상태 | Compliant (Pb-free) |
PIC16F73T-I/ML 핀 구성
| 핀 1 | MCLR/VPP — Master Clear (reset) input / ICSP programming voltage |
| 핀 2 | RA0/AN0 — Bidirectional I/O / Analog input channel 0 |
| 핀 3 | RA1/AN1 — Bidirectional I/O / Analog input channel 1 |
| 핀 4 | RA2/AN2/CVREF — Bidirectional I/O / Analog input channel 2 / CVREF output |
| 핀 5 | RA3/AN3/VREF+ — Bidirectional I/O / Analog input channel 3 / ADC VREF+ reference |
| 핀 6 | RA4/T0CKI — Bidirectional I/O / Timer0 clock input |
| 핀 7 | RA5/AN4/SS — Bidirectional I/O / Analog input channel 4 / SPI slave-select |
| 핀 8 | VSS — Ground reference |
| 핀 9 | OSC1/CLKIN — Crystal/oscillator input or external clock input |
| 핀 10 | OSC2/CLKOUT — Crystal/oscillator output or clock output |
| 핀 11 | RC0/T1OSO/T1CKI — Bidirectional I/O / Timer1 oscillator output / Timer1 clock input |
| 핀 12 | RC1/T1OSI/CCP2 — Bidirectional I/O / Timer1 oscillator input / CCP2 PWM output |
| 핀 13 | RC2/CCP1 — Bidirectional I/O / CCP1 PWM output |
| 핀 14 | RC3/SCK/SCL — Bidirectional I/O / SPI clock / I2C clock |
| 핀 15 | RC4/SDI/SDA — Bidirectional I/O / SPI data in / I2C data |
| 핀 16 | RC5/SDO — Bidirectional I/O / SPI data out |
| 핀 17 | RC6/TX/CK — Bidirectional I/O / USART asynchronous transmit / synchronous clock |
| 핀 18 | RC7/RX/DT — Bidirectional I/O / USART asynchronous receive / synchronous data |
| 핀 19 | VSS — Ground reference (second VSS connection) |
| 핀 20 | VDD — Positive supply voltage |
| 핀 21 | RB0/INT — Bidirectional I/O / External interrupt input |
| 핀 22 | RB1 — Bidirectional I/O |
| 핀 23 | RB2 — Bidirectional I/O |
| 핀 24 | RB3/PGM — Bidirectional I/O / ICSP programming pin |
| 핀 25 | RB4 — Bidirectional I/O |
| 핀 26 | RB5 — Bidirectional I/O |
| 핀 27 | RB6/PGC — Bidirectional I/O / ICSP clock input |
| 핀 28 | RB7/PGD — Bidirectional I/O / ICSP data |
| 핀 29 | EP — Exposed thermal pad (recommended to be soldered to ground plane) |
일반적인 애플리케이션
PIC16F73T-I/ML 적합 용도: 7 애플리케이션s: Industrial Sensor Interface Node, Motor Control Front-End, Consumer Appliance Controller, Automotive Body Electronics, Lighting & LED Driver Control, Remote Control & Wireless Front-End, Test & Measurement Front-End.
Industrial Sensor Interface Node
The PIC16F73T-I/ML's 5-channel 8-bit SAR ADC and 22 digital I/O make it a strong fit for industrial sensor-hub nodes where thermocouples, RTDs, or potentiometers need sampling on a single chip. Its industrial -40 °C to +85 °C range supports factory-floor use, while the 2.5 V–5.5 V supply tolerance accepts both 3.3 V and 5 V backplanes. Designers typically route one UART to a host PLC and use I2C/SPI MSSP for digital sensor expansion. The exposed thermal pad on the QFN package helps handle mild self-heating during continuous ADC conversions.
추천
Motor Control Front-End
The PIC16F73T-I/ML supports small DC and stepper motor control loops with Timer2/CCP PWM for switch-mode drivers and its ADC for closed-loop current sensing via shunt resistors. The 200 ns instruction cycle at 20 MHz keeps PWM resolution around 10 bits at 20 kHz, which is suitable for BLDC tool drivers and hobby-grade servo amplifiers. Its MIPs budget also leaves enough headroom for incremental-encoder quadrature decoding on INT pins. The same 28-QFN footprint as the PIC16F726-E/ML enables code reuse between 7 KB and 16 KB flash variants during motor-portfolio roll-outs.
추천
Consumer Appliance Controller
The PIC16F73T-I/ML's 35-instruction mid-range core and abundant I/O let designers build cost-optimized appliance control boards for coffee machines, hand-mixers, thermostats, and washing-machine sub-modules. The wide 2.5 V–5.5 V input tolerates unregulated mains-derived DC rails, and the 22 I/O pins drive 7-segment displays, keypads, buzzer PWM and triac optocouplers without external muxing. Its compact 28-QFN (6 × 6 mm) keeps the PCB small enough for handheld devices. Industrial temperature grade and 40-year data retention ensure long product lifecycles.
추천
Automotive Body Electronics
While the PIC16F73T-I/ML is industrial-grade (-40 °C to +85 °C) rather than AEC-Q100 qualified, it still serves well in cabin-electronic sub-modules such as window-lift controllers, central-locking receivers, and HVAC flap actuators, where underhood temperatures are not in scope. The on-chip USART enables LIN-bus-like communication with the body control module, and the MSSP module drives SPI-controlled motor drivers or 7-segment indicators. The 6 × 6 mm 28-QFN leaves room for relay footprints and protection circuitry on the same PCB. For AEC-Q100 projects, migrate to a qualified variant.
추천
Lighting & LED Driver Control
The PIC16F73T-I/ML's PWM-driven CCP modules and ADC channels deliver precise LED dimming loops for commercial-grade task lighting, RGB strip drivers, and architectural controllers. Its 200 ns instruction cycle supports smooth logarithmic dimming curves while the 2.5 V–5.5 V supply can be derived from constant-current driver stages. The 22 I/O pins handle multi-channel LED strings, user touch interfaces, and DMX-style UART input. Industrial temperature rating ensures long-term stability in luminaires where ambient heats up the surrounding air.
추천
Remote Control & Wireless Front-End
The PIC16F73T-I/ML pairs naturally with sub-GHz transceivers as a packet-routing MCU in remote controls, smart-home bridges, and wireless sensor endpoints. Its MSSP module drives SPI radio ICs such as the Microchip MRF24J40, while the USART links to Bluetooth or Wi-Fi co-processors for hybrid applications. With 7 KB Flash, the device can hold small RF protocol stacks or custom command interfaces for multi-button remote controls. The 28-QFN package fits inside CR2032-powered enclosure form factors.
추천
Test & Measurement Front-End
The PIC16F73T-I/ML's 5-channel ADC, USART and small footprint make it an inexpensive front-end MCU for portable handheld test instruments, hand-held multimeter add-ons, calibration jigs, and discrete data-acquisition loggers. Its industrial temperature range supports lab and field deployments, and the 22 I/O accept multiple rotary encoder, button, and LCD-interface requirements. The exposed thermal pad helps dissipate heat generated by continuous ADC scans in long-logging sessions. The compact 28-QFN saves board area for analog front-end stages and isolation barriers.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC16F73T-I/ML — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC16F73-I/ML | PIC16F727-I/ML | PIC16F727-E/ML | PIC16F726-E/ML | PIC16F722AT-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6 x 6 mm) | 28-QFN (6 x 6 mm) - same | 28-QFN (6 x 6 mm) - same | 28-QFN (6 x 6 mm) - same | 28-QFN (6 x 6 mm) - same | 28-QFN (6 x 6 mm) - same |
| Program Memory | 7 KB Flash | 7 KB Flash - same | 14 KB Flash | 14 KB Flash | 16 KB Flash | 7 KB Flash |
| RAM | 192 bytes | 192 bytes - same | 368 bytes | 368 bytes | 368 bytes | 192 bytes |
| Maximum Clock Speed | 20 MHz | 20 MHz - same | 20 MHz - same | 20 MHz - same | 20 MHz - same | 20 MHz - same |
| Operating Voltage | 2.5 V to 5.5 V | 2.5 V to 5.5 V - same | 2.0 V to 5.5 V | 2.0 V to 5.5 V | 2.0 V to 5.5 V | 2.0 V to 5.5 V |
| Temperature Grade | Industrial (-40 to +85 °C) | Industrial (-40 to +85 °C) | Industrial (-40 to +85 °C) | Extended (-40 to +125 °C) | Extended (-40 to +125 °C) | Industrial (-40 to +85 °C) |
| ADC Channels | 5 x 8-bit | 5 x 8-bit | 14 x 8-bit | 14 x 8-bit | 11 x 8-bit | 11 x 8-bit |
주요 차별점
- Pin-identical drop-in on 28-QFN with 7 KB Flash and full legacy PIC16C7X software compatibility (vs PIC16F727-I/ML)
- Industrial temperature grade (-40 to +85 °C) instead of extended temperature grade (-40 to +125 °C) (vs PIC16F727-E/ML)
- Highest Flash/RAM density among drop-in 28-QFN variants selected (vs PIC16F726-E/ML)
설계 노트
Place a 0.1 µF ceramic bypass capacitor within 5 mm of the VDD pin (pin 20) and a bulk 10 µF tantalum or electrolytic capacitor close to the regulator output. Because the PIC16F73T-I/ML runs from 2.5 V to 5.5 V, designers should hold VDD ramp time under 50 ms and avoid regulator collapse when the MCU enters a high-current ADC burst — a Schottky clamp on the reset/MCLR pin protects against power-down brownouts.
Estimated: the 28-QFN exposed pad (EP) thermal resistance (θJA) on a 1 oz 2-layer board is roughly 35 °C/W, dropping to ~18 °C/W with a 4-layer stackup and 16 thermal vias in the EP pattern. When the device is sourcing heavy current on PORTA/PORTB at 5 V, the additional self-heating (~10-15 mW) is negligible, but continuous ADC sampling at 5 V raises the junction slightly; ensure ambient operating temperature stays 10 °C below the 85 °C industrial ceiling as a margin.
Solder the exposed thermal pad (pin 29) to a copper ground pour connected through an array of stitched vias; this both improves heat dissipation and reduces ground bounce for accurate ADC readings. Route the crystal traces (OSC1/OSC2) short, symmetric, and guard-trace them with a ground hatch; keep high-current traces (>50 mA) away from the ADC reference pins (RA3/VREF+ and RA2/CVREF). Reserve a dedicated test pad for ICSP PGC/PGD lines to enable in-circuit firmware updates.
Verify the configuration-word bits: leave the MCLRE bit set for an external reset unless the internal MCLR is intentional, and never leave the oscillator mode at the default HS if the design drives a low-frequency crystal, as this causes instruction timing errors. Ensure ICSP pins RB6/RB7 are not loaded with strong pull-ups during programming, and select the WDT bits to match the application rather than leaving them at factory-default disabled — a disabled WDT in a noisy industrial environment can mask firmware crashes.
규정 준수 정보
RoHS compliance per Microchip product page; REACH statement per Microchip compliance letter; AEC-Q100 not qualified — choose an automotive-grade PIC16F variant for AEC-Q100 applications.
