PIC18F47K42-E/ML - 128KB Flash 8-bit MCU 44-QFN | Microchip
부품 번호: PIC18F47K42-E/ML ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.32 | $4.32 |
| 10 | $3.78 | $37.80 |
| 100 | $3.21 | $321.00 |
| 500 | $2.86 | $1,430.00 |
| 1,000 | $2.54 | $2,540.00 |
PIC18F47K42-E/ML 개요
What is a PIC18F microcontroller? The PIC18F is Microchip's 8-bit MCU family using a modified Harvard RISC architecture, evolved into a high-performance low-power platform (XLP) for applications that mix digital control with on-chip analog. Within the broader taxonomy: PIC18F -> 8-bit MCU -> microcontroller -> embedded processor -> semiconductor. The K42 sub-family specifically adds Core Independent Peripherals (CIPs) such as the 12-bit ADC2 with computation, 5-/8-bit DAC, op-amps, comparators, PWM, DMA, vector interrupts and configurable logic cells, letting many functions run without CPU involvement.
Key features of the PIC18F47K42-E/ML include 128 KB self-programmable Flash program memory, 8 KB SRAM data memory, 1 KB data EEPROM, a 64 MHz internal oscillator (1% accuracy), and the high-performance 14 MIPS core at 64 MHz (4x PLL). The 12-bit ADC2 with Automated Accumulation and Computation supports touch and sensor averaging offloaded from the CPU, while dedicated DMA channels move data between peripherals and memory without core intervention.
The device integrates up to 36 I/O, four 16-bit timers, two I2C/SPI/I2S peripherals, two UARTs, two op-amps, three comparators with DAC references, up to four 10-bit PWM channels and the DMA controller. The MAP (Memory Access Partitioning) and DIA (Device Information Area) features add bootloader and serialization support for security and field upgrades. CIPs combined with the XLP idle/doze/PMD modes allow parts of the chip to remain active while others sleep.
Typical applications include consumer and industrial control panels, IoT sensor nodes with battery life targets, low-power touch interfaces, motor control via integrated PWM and op-amps, and USB or BLE-hosted accessories that pair a PIC18F47K42 with an external transceiver. The wide memory headroom supports a real-time OS-style scheduler, USB stack, or a touch-sensing library in firmware.
When designing with this MCU, note the 1.8-5.5V VDD range, the 44-QFN thermal pad (must be soldered to the ground plane for power dissipation and signal integrity) and the MSSP/CCP routing for the chosen peripheral mix. Use the MPLAB X IDE with the XC8 compiler and the PIC18F47K42 Curiosity Nano (DM182028) evaluation board for fastest bring-up.
This page synthesizes distributor pricing, drop-in same-package alternatives and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: PIC18F47K42-E/ML — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC18F47K42-E/ML (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, ADC, Program Memory (Flash), Communication.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC18F46K42-E/ML
✅ 드롭인✓ 재고 있음
$1.95 / 개
데이터시트 보기 →PIC18F47K42-I/ML
✅ 드롭인✓ 재고 있음
$3.32 / 개
데이터시트 보기 →PIC18F47K40-I/ML
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC18F46K40-I/ML
✅ 드롭인✓ 재고 있음
$2.55 / 개
데이터시트 보기 →PIC18F47J53-I/ML
✅ 드롭인✓ 재고 있음
$5.2 / 개
데이터시트 보기 →PIC18F46Q84-E/P
✅ 드롭인✓ 재고 있음
$2.18 / 개
데이터시트 보기 →PIC18F47K42-E/ML 최대 정격 & 전기적 특성
| Core Architecture | PIC 8-bit, modified Harvard RISC |
| Family | PIC18FxxK42 (XLP family) |
| CPU Speed (MIPS) | 14 MIPS at 64 MHz |
| Max Core Frequency | 64 MHz |
| Program Memory (Flash) | 128 KB |
| Data SRAM | 8 KB |
| Data EEPROM | 1 KB |
| Supply Voltage (VDD) | 1.8 V to 5.5 V |
| 동작 온도 | -40C to +125C (E = extended) |
| I/O Pins | 36 |
| ADC | 12-bit ADC2 with Computation and Accumulation |
| DAC | 5-bit and 8-bit on-chip DAC |
| Comparators | 3 with selectable references |
| Op-Amps | 2 on-chip operational amplifiers |
| Timers | 4 x 16-bit timers |
| PWM Channels | Up to 4 x 10-bit PWM |
| Communication | 2 x UART, 2 x I2C/SPI/I2S (MSSP), DMA, Vector Interrupts |
| DMA Controller | Yes (Core Independent Peripheral) |
| 패키지 | 44-QFN (8x8 mm) |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 |
| RoHS 상태 | Compliant |
| XLP Low-Power Modes | Idle, Doze, Peripheral Module Disable (PMD), Deep Sleep |
| Programming Interface | ICSP (In-Circuit Serial Programming) |
| Debug Support | MPLAB ICD, PICkit, Curiosity Nano (DM182028) |
PIC18F47K42-E/ML 핀 구성
| 핀 1 | RA0 — Analog/Digital I/O, ADC2 channel |
| 핀 2 | RA1 — Analog/Digital I/O, ADC2 channel |
| 핀 3 | RA2 — Analog/Digital I/O, ADC2 channel |
| 핀 4 | RA3 — Analog/Digital I/O, ADC2 channel |
| 핀 5 | RA4 — Analog/Digital I/O, ADC2 channel |
| 핀 6 | RA5 — Analog/Digital I/O, ADC2 channel |
| 핀 7 | RA6 — Digital I/O, oscillator |
| 핀 8 | RA7 — Digital I/O, oscillator |
| 핀 9 | VSS — Ground |
| 핀 10 | VDD — Positive supply voltage |
| 핀 11 | RB0 — Digital I/O, IOC, PWM |
| 핀 12 | RB1 — Digital I/O, IOC, PWM |
| 핀 13 | RB2 — Digital I/O, IOC, PWM |
| 핀 14 | RB3 — Digital I/O, IOC, PWM |
| 핀 15 | RB4 — Digital I/O, IOC, PWM |
| 핀 16 | RB5 — Digital I/O, IOC, PWM |
| 핀 17 | RB6 — Digital I/O, IOC, ICSPCLK |
| 핀 18 | RB7 — Digital I/O, IOC, ICSPDAT |
| 핀 19 | RC0 — Digital I/O, PWM |
| 핀 20 | RC1 — Digital I/O, PWM |
| 핀 21 | RC2 — Digital I/O, PWM |
| 핀 22 | RC3 — Digital I/O, PWM, SCL/MSSP |
| 핀 23 | RC4 — Digital I/O, SDA/MSSP |
| 핀 24 | RC5 — Digital I/O, SDO/MSSP |
| 핀 25 | RC6 — Digital I/O, UART TX |
| 핀 26 | RC7 — Digital I/O, UART RX |
| 핀 27 | RD0 — Digital I/O, CCP |
| 핀 28 | RD1 — Digital I/O, CCP |
| 핀 29 | RD2 — Digital I/O, CCP |
| 핀 30 | RD3 — Digital I/O, CCP |
| 핀 31 | RD4 — Digital I/O, CCP |
| 핀 32 | RD5 — Digital I/O, CCP |
| 핀 33 | RD6 — Digital I/O, CCP |
| 핀 34 | RD7 — Digital I/O, CCP |
| 핀 35 | RE0 — Digital I/O, ADC2 channel |
| 핀 36 | RE1 — Digital I/O, ADC2 channel |
| 핀 37 | RE2 — Digital I/O, ADC2 channel |
| 핀 38 | RE3 — Digital I/O, ADC2 channel |
| 핀 39 | AVDD — Analog positive supply |
| 핀 40 | AVSS — Analog ground |
| 핀 41 | RF0 — Digital I/O |
| 핀 42 | RF1 — Digital I/O |
| 핀 43 | RF2 — Digital I/O |
| 핀 44 | RF3 — Digital I/O |
| 핀 EP | EP — Exposed thermal pad - internally bonded to VSS, solder to PCB ground |
일반적인 애플리케이션
PIC18F47K42-E/ML 적합 용도: 8 애플리케이션s: Battery-Powered IoT Sensor Nodes, Industrial Control Panels and HMI, Low-Power Touch and Capacitive Sensing, Small Motor Control (BLDC / Stepper), USB Consumer Accessories, Automotive Body and Interior Modules, Smart Home and Building Automation, Medical and Wellness Devices.
Battery-Powered IoT Sensor Nodes
The PIC18F47K42-E/ML fits battery-powered IoT sensor nodes thanks to the XLP platform with deep-sleep currents below 100 nA typical (RTC running). Its 12-bit ADC2 with DMA lets the MCU sample sensors and accumulate readings without waking the core, while the 2.4-3.6V operating range matches coin-cell and Li-SOCl2 primaries. The 128 KB Flash holds protocol stacks such as LoRaWAN or BLE software stacks paired with an external transceiver.
추천
Industrial Control Panels and HMI
The PIC18F47K42-E/ML is well suited for industrial control panels and HMI front ends, where it can drive 4-wire resistive touch via the integrated 12-bit ADC2 with automated averaging, plus a segment LCD or TFT via SPI. Its 64 MHz / 16 MIPS performance is enough to run a UI library, while the 36 I/O pins give headroom for keys, LEDs, encoder inputs and a backlight PWM. The E temperature grade handles -40C to +125C cabinet environments.
추천
Low-Power Touch and Capacitive Sensing
The PIC18F47K42-E/ML's 12-bit ADC2 with computation (ADC2C), DMA and dedicated touch peripheral enable mTouch capacitive-sensing designs. The DMA engine moves channel scans directly into RAM, freeing the core and letting the device stay in idle while scanning up to 36 touch channels. Combined with XLP idle currents around 50 uA/MIPS, the device delivers long battery life in white goods, remote controls and wearable touch interfaces.
추천
Small Motor Control (BLDC / Stepper)
With four 16-bit timers, up to four 10-bit PWM channels, two on-chip op-amps and three comparators, the PIC18F47K42-E/ML integrates the analog and timing resources needed for low-voltage BLDC, stepper or DC motor control. The op-amps can condition shunt currents while comparators implement hardware cycle-by-cycle current limiting. 128 KB Flash accommodates sensorless back-EMF or FOC reference firmware from Microchip's AN1078 family.
추천
USB Consumer Accessories
For consumer accessories that pair with a host PC, the PIC18F47K42-E/ML can act as a low-power co-MCU driving user-interface logic while a separate USB transceiver handles physical USB. With 8 KB of SRAM it can buffer USB descriptors and HID reports, and the 2 x UART plus 2 x MSSP interfaces support SPI/I2C peripherals such as sensors or display controllers. XLP modes let it idle in microamps while the host is in suspend.
추천
Automotive Body and Interior Modules
While PIC18F47K42-E/ML is not AEC-Q100 qualified itself, its extended -40C to +125C temperature range suits non-safety automotive body and interior functions such as lighting controls, seat modules, HVAC panels and ambient controls. Its 36 I/O, multiple PWMs and CAN-friendly UART (paired with an external MCP2515) make it a flexible LIN/CAN node. For safety-critical applications, migrate to PIC18F47K42 Q-1 automotive qualified siblings.
추천
Smart Home and Building Automation
The PIC18F47K42-E/ML is a strong fit for smart-home devices such as connected thermostats, smart locks and sensor hubs where low standby power is critical. Its 128 KB Flash holds a full Wi-Fi/BLE stack integration via an ATWINC1500 or RN4871 companion, while the 12-bit ADC2 reads thermistors and photo sensors. Deep-sleep currents under 100 nA extend coin-cell battery life in wireless sensors to multiple years.
추천
Medical and Wellness Devices
The PIC18F47K42-E/ML supports medical and wellness devices (non-life-support) such as blood-pressure monitors, glucose meters, thermometers and pulse oximeters. The 12-bit ADC2 with computation is suitable for pulse-oximetry signal chains, the on-chip op-amps provide low-noise front-end gain, and the DMA engine streams ADC data into RAM while the core processes. Note that medical certification is the system integrator's responsibility; this part is not FDA-approved on its own.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC18F47K42-E/ML — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC18F46K42-E/ML | PIC18F47K42-I/ML | PIC18F47K40-I/ML | PIC18F47J53-I/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8) | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same |
| Flash Memory | 128 KB | 64 KB | 128 KB | 128 KB | 128 KB + USB |
| SRAM | 8 KB | 8 KB | 8 KB | 8 KB | 3.7 KB |
| Max CPU Speed | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 48 MHz |
| ADC | 12-bit ADC2 with computation | 12-bit ADC2 with computation | 12-bit ADC2 with computation | 12-bit ADC (legacy) | 12-bit ADC (legacy) |
| DMA Controller | Yes | Yes | Yes | No | No |
| USB 2.0 FS | No | No | No | No | Yes (integrated) |
| Operating Temperature | -40C to +125C (E) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
주요 차별점
- Integrated 12-bit ADC2 with computation, DMA and Core Independent Peripherals (vs PIC18F47K40-I/ML)
- Larger 128 KB Flash for protocol stacks and feature-rich firmware (vs PIC18F46K42-E/ML)
- Extended -40C to +125C temperature grade for harsh environments (vs PIC18F47K42-I/ML)
- XLP deep-sleep <100 nA and PMD mode (vs PIC18F47J53-I/ML)
설계 노트
The PIC18F47K42-E/ML operates from 1.8 V to 5.5 V on VDD and AVDD. Place a 100 nF decoupling capacitor as close as possible to each VDD pin and a bulk capacitor of at least 4.7 uF on the main supply. For noise-sensitive ADC readings, add a ferrite bead between VDD and AVDD and a 10 nF cap on AVDD to filter analog supply. Use the PMD (Peripheral Module Disable) register to switch off unused peripherals during sleep to achieve deep-sleep currents below 100 nA typical.
The 44-QFN package features an exposed thermal pad that must be soldered to the PCB ground plane. The thermal pad (EP) is internally bonded to VSS and serves as the primary heat-dissipation path. Use thermal vias under the EP to conduct heat to inner copper layers. Failure to solder the EP can result in code execution anomalies under high CPU load due to ground bounce and elevated junction temperature.
Keep the analog input traces (RA0-RA5, RE0-RE3) short and routed away from switching nodes such as PWM outputs (RDx) and high-speed digital lines. Provide a clean analog ground island around AVSS and tie it back to the main ground at a single point near the MCU. For ICSP debugging, route PGC/PGD (RB6/RB7) without stubs and avoid series resistors on these lines so a PICkit or ICD can connect reliably.
Do not confuse 'E' (Extended -40C to +125C) with 'I' (Industrial -40C to +85C) temperature grades - they have different datasheet limits and different pricing. When migrating from PIC18F46K42-E/ML to PIC18F47K42-E/ML, verify that the code size fits the lower 64 KB Flash variant before deploying. Also note the 44-QFN ('ML') is not pin-compatible with the 40-pin PDIP ('P') variant despite the same family name - PCB layout must be redone.
When driving signals from the MSSP (I2C/SPI) peripherals at high speeds above 10 MHz, add 22-33 ohm series resistors near the source to dampen reflections. For capacitive-touch sensing, keep the touch sensor PCB traces short and guarded by ground planes, and avoid routing them parallel to high-frequency digital lines. The DMA-driven ADC2 channels should sample with a settled acquisition time of at least 4 uS for 12-bit accuracy at 5V.
규정 준수 정보
RoHS and lead-free compliant per Microchip product page. Not AEC-Q100 qualified; for safety-critical automotive designs migrate to PIC18F47K42 Q-1 qualified variant.