PIC18F66K80-H/MR - 8-bit 64MHz MCU, 64KB Flash, ECAN, AEC-Q100 | Microchip
부품 번호: PIC18F66K80-H/MR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5.19 | $5.19 |
| 10 | $4.67 | $46.70 |
| 100 | $4.14 | $414.00 |
| 500 | $3.73 | $1,865.00 |
| 1,000 | $3.31 | $3,310.00 |
| 2,500 | $2.94 | $7,350.00 |
PIC18F66K80-H/MR 개요
A PIC microcontroller (MCU) is a compact single-chip computer built around a Harvard-architecture CPU with on-chip Flash, RAM, EEPROM, and a rich set of peripherals including timers, ADC, communication controllers, and PWM. PIC18F-series MCUs specifically target high-performance 8-bit embedded designs and belong to Microchip's eXtreme Low Power (XLP) family, occupying the hierarchical niche: microcontroller -> 8-bit MCU -> PIC18 family -> automotive-grade XLP line.
Key features include an integrated ECAN module for automotive networking, 11 channels of 12-bit ADC, nanoWatt XLP sleep modes, and a wide 1.8 V to 5.5 V operating range. Brown-out detect, low-voltage detect, power-on reset, PWM, and watchdog timer support robust embedded operation, while AEC-Q100 qualification confirms suitability for automotive under-hood and body electronics.
The PIC18F66K80-H/MR is built on Microchip's enhanced PIC18 Harvard architecture with a 16-bit instruction word, 8-bit data path, and 31-level hardware stack, achieving 16 MIPS throughput at 64 MHz. Integrated peripherals share internal buses via a bus matrix that allows simultaneous ADC sampling and ECAN message handling without CPU intervention, simplifying real-time control loops.
Typical applications include automotive body and chassis control modules, CAN-based sensor networks, building automation controllers, HVAC fan and damper drivers, industrial sensor hubs, and low-power telemetry endpoints. The combination of ECAN, XLP sleep, and 12-bit ADC positions this part for designs that bridge analog sensing and automotive bus communications.
Designers should pay attention to the 64-pin VQFN exposed pad, which must be soldered to a ground copper pour to meet the -40 C to +150 C automotive temperature range. Decoupling, ADC reference layout, and ECAN bus termination are the critical PCB topics; pairing this MCU with a 5 V CAN transceiver such as MCP2561 forms a typical node.
This page synthesizes XAIPART inventory data, AEC-Q100-compatible drop-in alternatives from Microchip's PIC18F66K80 family, application-specific design notes, and ECAN peripheral pairing guidance - information not assembled on the manufacturer's product page alone.
드롭인 대체품: PIC18F66K80-H/MR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC18F66K80-H/MR (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Core Architecture, Operating Temperature, CTMU.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC18F66K80-I/MR
✅ 드롭인✓ 재고 있음
$4.14 / 개
데이터시트 보기 →PIC18F66K80-E/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC18F66K80-H/MR
✅ 드롭인✓ 재고 있음
$2.94 / 개
데이터시트 보기 →PIC18F66K40T-I/MR
✅ 드롭인✓ 재고 있음
$2.46 / 개
데이터시트 보기 →PIC18F65K80T-I/PT
✅ 드롭인✓ 재고 있음
$3.33 / 개
데이터시트 보기 →PIC18F66K22-I/MRRSL
✅ 드롭인✓ 재고 있음
$3.55 / 개
데이터시트 보기 →PIC18F66K80-H/MR 최대 정격 & 전기적 특성
| Core Architecture | PIC18 (8-bit Harvard, 16-bit instruction word) |
| Maximum CPU Frequency | 64 MHz |
| Performance | 16 MIPS |
| Program Memory (Flash) | 64 KB (32K x 16) |
| Data RAM | 3.6 KB |
| Data EEPROM | 1 KB |
| Operating Voltage Range | 1.8 V to 5.5 V |
| 동작 온도 범위 | -40 C to +150 C (H temp grade) |
| ADC | 11 channels, 12-bit |
| CAN (ECAN) | 1 module |
| Communication Interfaces | ECAN, I2C, LIN, SPI, UART/USART |
| PWM | Yes |
| 패키지 | 64-pin VQFN (9x9 mm) with exposed pad |
| 실장 유형 | Surface Mount |
| AEC-Q100 Qualification | Qualified (automotive grade) |
| Low-Power Technology | nanoWatt XLP |
| Watchdog / Brown-out / LVD / POR | Yes (WDT, BOR, LVD, POR) |
PIC18F66K80-H/MR 64-pin vqfn (9x9 mm) with exposed pad 핀 구성 가이드
PIC18F66K80-H/MR(64-pin vqfn (9x9 mm) with exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC18F66K80-H/MR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC18F66K80-H/MR 적합 용도: 6 애플리케이션s: Automotive Body Control Modules, CAN-Based Industrial Sensor Hubs, HVAC Fan and Damper Drivers, Building Automation Controllers, Industrial Telemetry Endpoints, Power Conversion Digital Control Loops.
Automotive Body Control Modules
The PIC18F66K80-H/MR is widely deployed in automotive BCMs because its integrated ECAN 2.0B controller and 11 channels of 12-bit ADC satisfy typical BCM analog and networking requirements without external expansion. AEC-Q100 Grade 0 qualification to +150 C junction allows direct mounting near engine bay or HVAC ducts where ambient temperature regularly exceeds 100 C. At 16 MIPS, the core handles LIN master/slave tasks, switch debouncing, PWM lighting control, and CAN message arbitration concurrently. Pair with a Microchip MCP2561 high-speed CAN transceiver and a TLE7274 high-side driver to form a complete BCM node.
추천
CAN-Based Industrial Sensor Hubs
In industrial CAN sensor hubs, the PIC18F66K80-H/MR aggregates multiple analog and digital sensor inputs and forwards them over a CANopen or DeviceNet link. Its 12-bit ADC supports ratiometric measurements from pressure, flow, and temperature transducers, while nanoWatt XLP sleep currents below 1 uA extend battery life in remote nodes. The 64 MHz core rate plus ECAN hardware filtering eliminates the need for an external CAN controller IC, reducing BOM cost by approximately 1.50 USD. The VQFN-64 footprint is compatible with the Microchip MCP2515 stand-alone CAN designs when migration is needed.
추천
HVAC Fan and Damper Drivers
The PIC18F66K80-H/MR is a strong fit for automotive HVAC motor control because its PWM peripheral drives blower fans and blend doors while ECAN links the module to the body controller. The 150 C temperature rating handles plenum-chamber thermals, and the 12-bit ADC reads thermistor sensors with 0.1 C resolution after calibration. Closed-loop PID control of brushless DC actuators fits inside the 16 MIPS throughput budget with margin for LIN diagnostics. Designers typically add a Microchip TC4427 MOSFET driver and a 3-phase inverter stage downstream.
추천
Building Automation Controllers
The PIC18F66K80-H/MR suits building automation controllers because its ECAN, RS-485-capable UART, and 12-bit ADC cover HVAC, lighting, and access-control subsystems. The 64 KB Flash accommodates BACnet or Modbus application stacks plus bootloader space for field updates, while the 1 KB EEPROM stores configuration and calibration data without external memory. nanoWatt XLP sleep extends battery life in wireless sensor nodes that communicate via CAN or LIN. The 1.8 V to 5.5 V supply range simplifies designs that harvest energy from low-voltage sources.
추천
Industrial Telemetry Endpoints
Battery-powered industrial telemetry endpoints use the PIC18F66K80-H/MR for its nanoWatt XLP sleep currents (typically below 100 nA with RTCC running) and integrated 12-bit ADC for sensor digitization. The 64-pin VQFN footprint provides ample GPIO for status LEDs, user buttons, and external sensor interfaces without external I/O expanders. At 5 V supply, the 64 MHz core can compress and transmit packets between long sleep intervals. The AEC-Q100 rating is acceptable defense-in-depth for industrial installations even when not strictly required.
추천
Power Conversion Digital Control Loops
The PIC18F66K80-H/MR can serve as a digital controller for low-power DC/DC converters and battery management because its 64 MHz / 16 MIPS core sustains a 100 kHz control loop with margin for telemetry. The 12-bit ADC samples current and voltage with 0.5 mV resolution, while PWM peripherals generate phase-shifted gate-drive waveforms. AEC-Q100 qualification makes the part attractive for 12 V automotive rails where temperature stress is moderate. Adding a Microchip MCP16331 buck converter IC or MCP73123 Li-ion charger IC forms a complete digital power stage.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC18F66K80-H/MR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC18F66K80-I/MR | PIC18F66K80-E/MR | PIC18F66K40T-I/MR | PIC18F66K22-I/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin VQFN (9x9) with EP | 64-pin VQFN (9x9) with EP | 64-pin VQFN (9x9) with EP | 64-pin VQFN (9x9) with EP | 64-pin VQFN (9x9) with EP |
| Temperature Grade | -40 C to +150 C (H grade) | -40 C to +85 C (I grade) | -40 C to +125 C (E grade) | -40 C to +85 C (I grade) | -40 C to +85 C (I grade) |
| Flash Memory | 64 KB | 64 KB | 64 KB | 16 KB | 64 KB |
| RAM | 3.6 KB | 3.6 KB | 3.6 KB | 2 KB | 3.8 KB |
| ECAN Module | Yes | Yes | Yes | No | No |
| AEC-Q100 Grade | Grade 0 (150 C) | Not qualified (industrial) | Not qualified (extended) | Not qualified | Not qualified |
| Core Speed | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS |
주요 차별점
- AEC-Q100 Grade 0 high-temperature qualification at the same VQFN-64 footprint as the I and E grade siblings (vs PIC18F66K80-I/MR)
- Integrated ECAN 2.0B controller eliminates the need for an external MCP2515 stand-alone CAN IC (vs PIC18F66K40T-I/MR)
- Larger Flash and RAM than newer K40 successor family (vs PIC18F66K40T-I/MR)
설계 노트
Estimated: the 64-pin VQFN (9x9) exposed pad provides a primary thermal path with typical theta_JA around 22 C/W on a JEDEC EIA/JESD51 4-layer test board. At maximum 64 MHz operation across the 1.8 V to 5.5 V range, internal power dissipation stays under 250 mW, leaving ample margin to +150 C ambient when the EP is soldered to a continuous ground copper pour of at least 1 square inch. For +125 C environments, a 0.5 square inch copper pour is generally sufficient.
Decouple VDD with a 100 nF ceramic capacitor placed within 3 mm of each power pin, plus a bulk 4.7 uF tantalum or ceramic capacitor on the main VDD rail. The analog AVDD pin requires its own 100 nF + 10 uF LC filter network to keep ADC noise below 1 LSB at 12-bit resolution. Avoid routing high-speed digital signals under the analog ground island to minimize coupling into the 12-bit ADC measurements, per the Microchip PIC18F66K80 family datasheet layout recommendations.
Three common pitfalls: (1) Forgetting to solder the VQFN exposed pad to ground - this voids the thermal path and causes thermal shutdown at moderate loads. (2) Configuring the ECAN module without enabling the CAN clock, which silently disables CAN transmissions. (3) Using the internal HFINTOSC at 64 MHz without first tuning it via the OSCTUNE register, which can leave the baud rate generator off by 2 percent and break CAN arbitration. Reference Microchip application note AN1249 for ECAN clock setup.
규정 준수 정보
AEC-Q100 Grade 0 qualification confirmed by Microchip high-temperature datasheet DS30509A. RoHS and REACH compliance per Microchip product page.
