PIC24F08KL302-I/ML - 16-bit MCU, 8KB Flash, 32MHz | Microchip
부품 번호: PIC24F08KL302-I/ML ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2.2 | $2.20 |
| 10 | $1.99 | $19.90 |
| 100 | $1.78 | $178.00 |
| 500 | $1.62 | $810.00 |
| 1,000 | $1.45 | $1,450.00 |
PIC24F08KL302-I/ML 개요
Background knowledge: A PIC24F 16-bit microcontroller is a member of the 16-bit MCU family, sitting above 8-bit PIC18/PIC16 parts in performance and below 32-bit PIC32 devices in raw compute. PIC MCUs are RISC-based Harvard-architecture devices in the broader category of microcontrollers (MCU) -> embedded controllers -> semiconductors. The 24F sub-family is optimized for low power and cost-sensitive applications, with XLP variants adding ultra-low-power sleep modes for energy harvesting and battery applications.
Key features include 8KB Flash (2.75K instructions), 256 bytes EEPROM, 1KB SRAM, 23 I/O pins, 3 16-bit timers, 1 MSSP (I2C/SPI), 1 CCP/ECCP, 10-bit ADC with up to 9 channels, 2 comparators, and an internal 8MHz oscillator. The XLP features enable deep sleep currents down to ~20nA (per datasheet), making the part suitable for always-on IoT sensors. Wide operating voltage from 1.8V to 3.6V supports single-cell Li-ion or two-AA battery topologies.
The PIC24F08KL302 family is built on a 16-bit modified Harvard CPU with a 32MHz internal oscillator. It is supported by Microchip's MPLAB X IDE and XC16 compiler, with extensive peripheral libraries. The QFN-28 package offers a compact 6x6 mm footprint with an exposed thermal pad, easing PCB thermal dissipation in dense layouts.
Typical applications include IoT sensor nodes, wearable fitness/medical monitors, low-power wireless remote controls, consumer electronics like toys and small appliances, and battery-powered metering. The wide temperature range (-40C to +85C for the I-grade variant) supports indoor and outdoor industrial use, while the low sleep current extends battery life to years for periodic-sampling duty cycles.
When designing with this device, ensure adequate decoupling (100nF ceramic close to VDD) and follow Microchip's QFN PCB layout guidelines (thermal pad vias) for reliable operation. The small QFN footprint eliminates hand-rework capability, so plan assembly and inspection procedures accordingly.
This page synthesizes distributor pricing, drop-in alternatives drawn from Microchip's own KL/KA family, and practical design notes not consolidated in the manufacturer datasheet. (v3.9 answer-capsule + unique-value page)
드롭인 대체품: PIC24F08KL302-I/ML — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC24F08KL302-I/ML (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Operating Temperature, Package, Timers, Core Architecture.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC24F08KL301-I/ML
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC24F08KL302-E/ML
✅ 드롭인✓ 재고 있음
$1.45 / 개
데이터시트 보기 →PIC24F08KL201-I/MQ
✅ 드롭인✓ 재고 있음
$0.85 / 개
데이터시트 보기 →PIC24F08KA102-I/ML
✅ 드롭인✓ 재고 있음
$1.78 / 개
데이터시트 보기 →PIC24F04KL101-I/MQ
✅ 드롭인✓ 재고 있음
$0.098 / 개
데이터시트 보기 →PIC24F08KL302-I/ML 최대 정격 & 전기적 특성
| Series | PIC® XLP™ 24F |
| Core Processor | PIC24F (16-bit modified Harvard) |
| Core Size | 16-Bit |
| Speed (CPU Clock) | 32 MHz (16 MIPS) |
| Program Memory | 8 KB Flash (2.75K x 24 instructions) |
| RAM | 1 KB |
| EEPROM | 256 bytes |
| Number of I/O | 23 |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| 패키지 | 28-QFN (6x6 mm) |
| 동작 온도 | -40 °C to +85 °C (Industrial, -I suffix) |
| ADC | 10-bit, up to 9 channels |
| Communication | 1x MSSP (I2C/SPI), UART |
| Timers | 3x 16-bit Timer, 1x CCP/ECCP |
| Comparators | 2 |
| Low-Power Feature | nanoWatt XLP, ~20 nA sleep (per datasheet) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
PIC24F08KL302-I/ML 핀 구성
| 핀 1 | RA0 — GPIO / analog input |
| 핀 2 | RA1 — GPIO / analog input |
| 핀 3 | RA2 — GPIO / analog input |
| 핀 4 | RA3 — GPIO / analog input |
| 핀 5 | RA4 — GPIO |
| 핀 6 | VDD — Positive supply voltage (1.8V to 3.6V) |
| 핀 7 | VSS — Ground reference |
| 핀 8 | RA5 — GPIO / analog input |
| 핀 9 | RA6 — GPIO / oscillator |
| 핀 10 | RA7 — GPIO / oscillator |
| 핀 11 | RB0 — GPIO / programming |
| 핀 12 | RB1 — GPIO |
| 핀 13 | RB2 — GPIO |
| 핀 14 | RB3 — GPIO |
| 핀 15 | RB4 — GPIO |
| 핀 16 | RB5 — GPIO |
| 핀 17 | RB6 — GPIO / ICS PGC |
| 핀 18 | RB7 — GPIO / ICS PGD |
| 핀 19 | VSS — Ground reference |
| 핀 20 | VDD — Positive supply voltage |
| 핀 21 | RC0 — GPIO |
| 핀 22 | RC1 — GPIO |
| 핀 23 | RC2 — GPIO |
| 핀 24 | RC3 — GPIO |
| 핀 25 | RC4 — GPIO |
| 핀 26 | RC5 — GPIO |
| 핀 27 | RC6 — GPIO |
| 핀 28 | RC7 — GPIO |
일반적인 애플리케이션
PIC24F08KL302-I/ML 적합 용도: 6 애플리케이션s: Battery-Powered IoT Sensor Nodes, Wearable Fitness and Health Monitors, Low-Power Wireless Remote Controls, Consumer Electronics (Toys, Small Appliances), Industrial Sensor Modules, Battery-Powered Metering and Data Loggers.
Battery-Powered IoT Sensor Nodes
The PIC24F08KL302-I/ML is purpose-built for battery-powered IoT sensor nodes that demand multi-year battery life and minimal sleep current. Its nanoWatt XLP feature set drives deep-sleep current into the nanoamp range (per the Microchip datasheet DS39990), while the 1.8V to 3.6V VDD range supports single-cell Li-ion or two-AA battery topologies directly. The integrated MSSP enables SPI or I2C sensor interfaces without external glue logic, and the 10-bit ADC handles temperature, humidity, or battery-voltage monitoring. The 32MHz CPU clock (16 MIPS) wakes quickly from sleep, processes sensor data, and returns to deep sleep within microseconds. The 28-QFN (6x6) footprint fits inside small sensor housings used in smart-home and asset-tracking deployments, making this part a strong choice for periodic-sampling duty cycles where quiescent current dominates total energy budget.
추천
Wearable Fitness and Health Monitors
For wearable fitness bands, heart-rate monitors, and pedometers, the PIC24F08KL302-I/ML delivers the low-power and small-footprint advantages engineers need. The 28-QFN (6x6 mm) package fits beneath a coin-cell battery housing, while the XLP nanoWatt technology extends battery life to weeks or months between charges. The 23 GPIO pins handle multiple LED indicators, button inputs, and SPI peripherals for biometric sensors; the integrated 10-bit ADC with up to 9 channels monitors battery voltage and analog sensor signals without external mux ICs. The 32MHz CPU processes heart-rate algorithms and accelerometer step counts efficiently, returning to sub-microamp sleep between samples. Microchip's MPLAB X IDE with the XC16 compiler accelerates firmware development for wearable algorithms. Compared with 8-bit PIC18 parts, the 16-bit PIC24F core handles DSP-style filtering of biometric signals at higher throughput.
추천
Low-Power Wireless Remote Controls
Battery-powered remote controls for TVs, smart lighting, industrial cranes, and consumer electronics benefit from the PIC24F08KL302-I/ML's combination of low sleep current, fast wake time, and integrated ECCP/PWM. The nanoWatt XLP deep-sleep mode (typical ~20nA per datasheet) keeps standby drain negligible for years of shelf life, while the 16 MIPS CPU wakes within microseconds to decode IR or RF inputs and drive PWM outputs. The MSSP peripheral handles SPI communication with sub-GHz transceivers or BLE front-ends; the ECCP module generates IR carrier frequencies and modulates PWM for indicator LEDs. The wide 1.8V to 3.6V operating range accommodates single CR2032 coin cells (3.0V nominal) directly. Compared with discrete timer+remote-control ASICs, this part offers reconfigurable firmware and pin-compatible migration to higher-memory variants.
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Consumer Electronics (Toys, Small Appliances)
Cost-sensitive consumer products such as electronic toys, small kitchen appliances, and personal care devices benefit from the PIC24F08KL302-I/ML's low unit cost, small footprint, and rich peripheral mix. The 28-QFN (6x6 mm) package drops into dense PCB layouts alongside motor drivers and LED arrays; the 32MHz core processes user-interface state machines and motor-control PWM loops in real time. The 8KB Flash holds sophisticated menu/feature firmware, while the 256-byte EEPROM stores user preferences (volume, mode, presets) across power cycles. The integrated MSSP drives SPI displays and I2C sensors without glue logic, and the comparators handle battery low-voltage detection and analog feedback for closed-loop control. The nanoWatt XLP modes are valuable for battery-operated appliances where standby current must remain minimal between uses.
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Industrial Sensor Modules
Industrial sensor modules for pressure, flow, level, and gas detection often run from 24V industrial rails or 3.3V regulated supplies, both of which are supported by the PIC24F08KL302-I/ML. The wide 1.8V to 3.6V VDD range plus -40C to +85C industrial temperature grade ('I' suffix) qualify the part for factory-floor environments. The 10-bit ADC handles multiple 0-10V or 4-20mA sensor inputs via external signal conditioning, while the comparators detect threshold crossings for alarm outputs. The 23 GPIO pins drive status LEDs, relays, and HMI displays directly; the MSSP interfaces with digital sensors over SPI or I2C. The 32MHz CPU processes filtering, linearization, and Modbus-like communication protocols in real time. Migration to -E temperature grade (PIC24F08KL302-E/ML) supports -40C to +125C outdoor or under-hood use.
추천
Battery-Powered Metering and Data Loggers
The PIC24F08KL302-I/ML is well-suited to battery-powered metering applications, including water/gas utility meters, environmental data loggers, and parking sensors. The 1.8V to 3.6V operating range accommodates 3.6V Li-SOCl2 primary cells, while the nanoWatt XLP feature set enables multi-year battery life on periodic-sampling duty cycles. The 10-bit ADC captures analog sensor signals (temperature, humidity, flow, vibration), while the 23 GPIO pins drive LCD segments or LED indicators. The 256-byte EEPROM retains calibration constants and accumulated counts across battery replacements, and the MSSP interfaces with digital sensors or external EEPROM for extended data storage. Compared with 8-bit PIC16/18 parts, the 16-bit core accelerates FFT-style vibration analysis and complex metering math.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC24F08KL302-I/ML — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC24F08KL301-I/ML | PIC24F08KL302-E/ML | PIC24F08KL201-I/MQ | PIC24F08KA102-I/ML | PIC24F04KL101-I/MQ |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Flash Memory | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | 4 KB (-50%) |
| RAM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB | 0.5 KB (-50%) |
| CPU Speed | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Temperature Grade | -40C to +85C (Industrial, -I) | -40C to +85C | -40C to +125C (Extended, -E) | -40C to +85C | -40C to +85C | -40C to +85C |
| MSSP/CCP | 1x MSSP + 1x ECCP | 1x MSSP + 1x ECCP | 1x MSSP + 1x ECCP | 1x MSSP + 1x CCP | 1x MSSP (analog-emphasis family) | 1x MSSP + 1x CCP |
| Unit Price @ 1k (approx) | $1.45 | ~$1.45 (same) | ~$1.55 (extended temp premium) | ~$1.35 (CCP vs ECCP) | ~$1.40 | ~$1.20 (smaller Flash) |
주요 차별점
- Larger Flash in same QFN footprint (vs PIC24F04KL101-I/MQ)
- ECCP for enhanced PWM control (vs PIC24F08KL201-I/MQ)
- nanoWatt XLP deep-sleep current (vs PIC24F08KA102-I/ML)
설계 노트
Place a 100 nF ceramic decoupling capacitor as close as physically possible to each VDD pin (pins 6 and 20) and a bulk 1 uF to 10 uF tantalum or ceramic capacitor on the VDD rail. For battery applications operating below 2.0 V, add a 4.7 uF bulk cap to ride out RF transmission bursts. Per Microchip's PIC24F KL family datasheet (DS39990), inadequate decoupling is the most common cause of erratic ADC readings and brown-out resets in low-voltage designs. Use low-ESR ceramics (X7R or X5R) to maintain low impedance across the full 1.8V-3.6V range.
The 28-QFN (6x6 mm) package has an exposed thermal pad (EP) on the bottom that MUST be soldered to the PCB's ground plane for both electrical reference and thermal dissipation. Per Microchip QFN layout guidelines, the EP should have at least 4 thermal vias (0.3 mm drill, 0.5 mm pitch) connecting to internal ground planes. Inadequate EP soldering causes pin-level temperature rise above 25C/W theta_JA, leading to thermal stress and reduced reliability. For QFN inspection, AOI or X-ray is recommended since hidden solder joints under the EP cannot be visually verified.
Route the ICSP clock (PGC, RB6) and data (PGD, RB7) signals away from high-frequency switching nodes and analog sensor traces to minimize programming noise. The MSSP and ECCP pins should have short, ground-referenced traces - keep SPI traces under 50 mm total length for clean 10 MHz operation. Per Microchip's PCB layout guidelines, isolate the analog AVSS/AVDD pair (when used) from digital switching signals with a ground guard ring. For QFN assembly, use a PCB land pattern with a 0.5 mm pitch that matches the JEDEC MS-026 standard.
Do not exceed 3.6 V on any VDD pin - this absolute-maximum parameter will damage the MCU permanently per the datasheet. Always include reverse-polarity protection (Schottky diode or P-FET) when powered from batteries or external supplies. Avoid floating digital inputs - unused GPIO should be configured as outputs or pulled to defined logic levels to prevent shoot-through current. For low-power designs, configure unused peripherals to off-state in firmware and use the PIC24F's deep-sleep mode only after disabling all clocks; verify wake sources with the peripheral interrupt flag.
규정 준수 정보
RoHS and lead-free compliant per Microchip product page. Not AEC-Q100 qualified - for AEC-Q100 automotive, contact Microchip for PIC24F family automotive grade variants.
