PIC16F18857T-I/ML - 8-Bit 32MHz 56KB Flash MCU 28-QFN | Microchip
부품 번호: PIC16F18857T-I/ML ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3.08 | $3.08 |
| 10 | $2.78 | $27.80 |
| 100 | $2.45 | $245.00 |
| 500 | $2.15 | $1,075.00 |
| 1,000 | $1.88 | $1,880.00 |
PIC16F18857T-I/ML 개요
A microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile program memory (Flash), volatile working memory (RAM), data EEPROM, and a rich set of peripheral IP blocks (timers, ADC, communication controllers, GPIO). PIC16-family MCUs use a RISC-based 8-bit core optimized for deterministic interrupt response and low active/standby power. This category sits within the broader hierarchy: microcontroller -> embedded processor -> semiconductor device, and PIC16F18857 specifically targets applications where small footprint, low power, and integrated analog/communications reduce external component count.
Key features include 24 analog-capable pins, a 10-bit ADC with computation, multiple PWM/Capture/Compare modules, configurable logic cells (CLC), zero-cross detect (ZCD), complementary waveform generator (CWG), and serial interfaces including I2C, SPI, and EUSART with LIN support. Functional Safety features include hardware windowed watchdog, CRC/SCAN, and HLT (Hardware Limit Timer) for ASIL-ready applications. The eXtreme Low Power (XLP) technology achieves nanoWatt sleep currents with multiple IDLE and DOZE modes for battery-powered duty-cycled designs.
The device combines an enhanced mid-range 8-bit pipeline with hardware multiplier and a 14-bit instruction word. The 56KB Flash is mapped as 32K words of 14-bit instructions, and the memory architecture supports self-programmability, bootloader operation via UPDI, and table read/write. The 28-QFN (6x6 mm) package provides ample GPIO and a low thermal resistance path through the exposed pad.
Typical applications include industrial sensor nodes, home appliance user interfaces, LED lighting controllers, low-power IoT endpoints, automotive body electronics (LIN slaves), and battery-powered instrumentation. The combination of CIPs and integrated 10-bit ADC allows closed-loop control without external analog components.
When designing with this device, ensure the UPDI/debug pin has the correct pull-up configuration for in-circuit programming and that the exposed pad is soldered to the ground plane for thermal and electrical performance. The PIC16F18857T-E/MLVAO is the Extended Temp / VAO variant for harsh environments. This page combines distributor pricing, verified same-package drop-in alternatives, and practical design notes that complement the manufacturer datasheet.
드롭인 대체품: PIC16F18857T-I/ML — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC16F18857T-I/ML (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Program Memory (Flash), Operating Temperature, Communication.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC16F18855-I/ML
✅ 드롭인✓ 재고 있음
$1.38 / 개
데이터시트 보기 →PIC16F18856T-I/SSVAO
✅ 드롭인✓ 재고 있음
$2.05 / 개
데이터시트 보기 →PIC16F18857-I/ML
✅ 드롭인✓ 재고 있음
$1.39 / 개
데이터시트 보기 →PIC16F18855T-I/ML
✅ 드롭인✓ 재고 있음
$1.26 / 개
데이터시트 보기 →PIC16F18857T-I/ML 최대 정격 & 전기적 특성
| Core Architecture | PIC16 8-bit Enhanced Mid-Range |
| Program Memory (Flash) | 56 KB (32K x 14 words) |
| RAM | 4 KB |
| EEPROM | 256 B |
| Maximum CPU Frequency | 32 MHz |
| 패키지 | 28-QFN (6x6 mm) |
| Operating Voltage (VDD) | 1.8 V to 5.5 V |
| 동작 온도 | -40 C to +85 C (Industrial) |
| ADC | 10-bit with computation |
| Communication | I2C, SPI, EUSART (LIN) |
| Core Independent Peripherals | CLC, ZCD, CWG, CRC/SCAN, HLT |
| Low Power Feature | eXtreme Low Power (XLP) |
| Programming/Debug | UPDI (single-wire) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
PIC16F18857T-I/ML 핀 구성
| 핀 1 | RA5 — Bidirectional I/O, analog-capable, also ICSP/UPDI |
| 핀 2 | RA4 — Bidirectional I/O, analog-capable |
| 핀 3 | RA3 — Bidirectional I/O, analog-capable |
| 핀 4 | RA2 — Bidirectional I/O, analog-capable |
| 핀 5 | RA1 — Bidirectional I/O, analog-capable |
| 핀 6 | RA0 — Bidirectional I/O, analog-capable |
| 핀 7 | VSS — Ground reference |
| 핀 8 | VDD — Positive power supply |
| 핀 9 | RA7 — Bidirectional I/O, analog-capable |
| 핀 10 | RA6 — Bidirectional I/O, analog-capable |
| 핀 11 | RC0 — Bidirectional I/O, analog-capable |
| 핀 12 | RC1 — Bidirectional I/O, analog-capable |
| 핀 13 | RC2 — Bidirectional I/O, analog-capable |
| 핀 14 | RC3 — Bidirectional I/O, analog-capable |
| 핀 15 | RC4 — Bidirectional I/O, analog-capable |
| 핀 16 | RC5 — Bidirectional I/O, analog-capable |
| 핀 17 | RC6 — Bidirectional I/O, analog-capable |
| 핀 18 | RC7 — Bidirectional I/O, analog-capable |
| 핀 19 | VSS — Ground reference |
| 핀 20 | VDD — Positive power supply |
| 핀 21 | RB0 — Bidirectional I/O, analog-capable |
| 핀 22 | RB1 — Bidirectional I/O, analog-capable |
| 핀 23 | RB2 — Bidirectional I/O, analog-capable |
| 핀 24 | RB3 — Bidirectional I/O, analog-capable |
| 핀 25 | RB4 — Bidirectional I/O, analog-capable |
| 핀 26 | RB5 — Bidirectional I/O, analog-capable |
| 핀 27 | RB6 — Bidirectional I/O, analog-capable |
| 핀 28 | RB7 — Bidirectional I/O, analog-capable |
일반적인 애플리케이션
PIC16F18857T-I/ML 적합 용도: 6 애플리케이션s: Industrial Sensor Node with LIN Bus, Battery-Powered IoT Endpoint, LED Lighting Controller, Home Appliance User Interface, Automotive Body Electronics (LIN Slave), Portable Health / Wellness Device.
Industrial Sensor Node with LIN Bus
The PIC16F18857T-I/ML is well matched to industrial sensor nodes that aggregate analog inputs and report over LIN or UART. Its 10-bit ADC with computation offloads sensor linearization and averaging from the CPU, while the EUSART with LIN auto-baud handles the bus protocol in hardware. With 56 KB Flash it can host a Modbus/LIN slave stack plus calibration tables, and the XLP nanoWatt sleep keeps battery duty-cycled nodes alive for years on a single primary cell.
추천
Battery-Powered IoT Endpoint
For remote IoT endpoints that sleep most of the time, the PIC16F18857T-I/ML's eXtreme Low Power (XLP) technology delivers nanoAmpere-class sleep current, waking on an RTCC or interrupt to read a sensor and transmit. The 32 MHz core provides enough bandwidth for AES-128 firmware and small LoRa-/BLE-passthrough stacks. Its 1.8 V minimum VDD enables direct operation from a single alkaline or primary lithium cell without a boost converter.
추천
LED Lighting Controller
The PIC16F18857T-I/ML drives LED lighting strings with hardware PWM and the Complementary Waveform Generator (CWG), producing center-aligned, dead-band-controlled switching waveforms at frequencies that minimize audible noise. The configurable logic cells (CLC) combine PWM, ZCD, and comparator events in hardware to implement phase-angle dimming without CPU overhead, leaving firmware free for DMX-512 or DALI command parsing.
추천
Home Appliance User Interface
The PIC16F18857T-I/ML integrates the human-machine interface (HMI) of a white-good appliance: capacitive touch via the Peripheral Touch Controller (PTC), 10-bit ADC for thermistor sensing, PWM for buzzer/speaker feedback, and UART for the main controller link. With 4 KB RAM it can hold a full UI state machine and message buffers, and the industrial -40 C to +85 C temperature grade covers the appliance operating envelope.
추천
Automotive Body Electronics (LIN Slave)
For body-electronics modules such as seat controllers, mirror adjusters, or HVAC flaps, the PIC16F18857T-I/ML provides the LIN 2.x slave protocol with auto-baud detection, combined with 56 KB Flash for the LIN 2.x/SAE J2602 stack and application logic. The Functional Safety features (hardware windowed WDT, CRC/SCAN, HLT) support ASIL classification work, and the PIC16F18857-E/MLVAO automotive-qualified variant is the preferred part for under-hood or harsh-environment ECUs.
추천
Portable Health / Wellness Device
The PIC16F18857T-I/ML serves wearable or handheld health/wellness devices that combine a small battery, a single analog sensor (heart-rate, SpO2, temperature), and a low-power display or BLE link. Its nanoAmpere sleep current, fast wake-up from Sleep via peripheral interrupts, and 56 KB Flash let the firmware host a Bluetooth Low Energy GATT profile and a sensor-fusion state machine. The 1.8 V minimum VDD enables direct coin-cell operation.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC16F18857T-I/ML — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC16F18855-I/ML | PIC16F18856T-I/SSVAO | PIC16F18857-I/ML |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Flash | 56 KB | 32 KB | 28 KB | 56 KB |
| RAM | 4 KB | 2 KB | 2 KB | 4 KB |
| EEPROM | 256 B | 256 B | 256 B | 256 B |
| Maximum CPU Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V |
| Temperature Range | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C (VAO) | -40 C to +85 C |
| Core Independent Peripherals | CLC, ZCD, CWG, CRC/SCAN, HLT, NCO, PTC | Same CIPs | Same CIPs | Same CIPs |
주요 차별점
- Largest Flash memory in the 28-QFN PIC16F1885X/7X drop-in family (vs PIC16F18855-I/ML)
- Higher RAM headroom for protocol stacks (vs PIC16F18856T-I/SSVAO)
- Industrial grade on tape-and-reel for SMT production (vs PIC16F18857-I/ML)
설계 노트
Place a 0.1 µF ceramic decoupling capacitor on each VDD/VSS pin pair within 4 mm of the package, and a bulk 4.7–10 µF tantalum or ceramic capacitor on the main VDD rail. The PIC16F18857T-I/ML has two VDD pins (8 and 20) and two VSS pins (7 and 19) - both pairs must be decoupled. For battery applications, route the UPDI/RA5 programming pin to a test-point or header, and add a 10 kΩ pull-up to VDD to prevent unwanted reset during sleep.
Solder the 28-QFN exposed pad (EP) to a continuous copper ground pour to provide the lowest thermal resistance path. With typical XLP sleep currents in the nanoAmpere range and active currents under 5 mA at 32 MHz / 3.3 V, the die dissipates under 20 mW and thermal rise above ambient is negligible even in fully enclosed plastic enclosures. The exposed pad is the ground reference - avoid using a 'daisy-chain' via pattern that would create ground bounce.
Do not confuse the PIC16F18857T-I/ML (industrial -40 to +85 C, tape-and-reel) with the PIC16F18857T-E/MLVAO (extended -40 to +125 C, Very Automotive Quality). For automotive LIN-sensor applications the VAO variant is mandatory. Also note: PIC16F18855 ('55) has 32 KB Flash / 2 KB RAM and is pin-compatible but NOT firmware-compatible for memory size. Verify that your linker script and ICD file target the correct derivative before mass production.
Route the UPDI/ICSP pin (RA5 on PIC16F18857 in 28-QFN) away from switching signals and PWM outputs to prevent capacitive coupling that breaks in-circuit programming. Keep analog input traces (ADC, comparators) short and guarded with a ground polygon on both sides. The QFN package has an internal die-attached paddle - do not allow signal traces to pass under the package body unless they are part of the ground pour.
규정 준수 정보
RoHS and lead-free per Microchip product page and DigiKey/Mouser listing. The industrial 'I' grade is -40 C to +85 C - not AEC-Q100 qualified; use PIC16F18857-E/MLVAO for automotive.
