PIC24F32KA302-E/SP - 32MHz 16-Bit XLP Microcontroller | Microchip
부품 번호: PIC24F32KA302-E/SP ✓ 활성PIC24F32KA302-E/SP 개요
A microcontroller is a programmable semiconductor that integrates a processor core, memory, and peripherals into one device. The PIC24F32KA302 belongs to the PIC24F family and uses a modified PIC RISC architecture with up to 16 MIPS performance. It is designed for embedded control, low-power sensing, instrumentation, and products that require deterministic peripheral handling without a high-power discrete processor.
Microchip XLP technology is central to this device's positioning. The manufacturer identifies Deep Sleep Brown-Out Reset, Deep Sleep Watchdog Timer, and Real-Time Clock and Calendar operation in Deep Sleep mode as low-power features. These functions help a product remain responsive while reducing energy consumption during long idle periods, which is especially useful in battery-powered equipment.
The device provides 32 KB of program Flash organized as 11K by 24 bits, together with 2 KB of data RAM and 512 bytes of EEPROM. Its 12-bit ADC supports analog measurements, while the CTMU peripheral provides capacitive-touch measurement capability. The 28-pin SPDIP format also supports through-hole assembly and prototyping workflows that are less convenient with fine-pitch surface-mount packages.
Typical applications include low-power sensor nodes, industrial control modules, battery-operated instruments, capacitive-touch user interfaces, compact data-acquisition systems, and embedded products with real-time clock requirements. Designers can use the ADC for analog front ends, CTMU for touch electrodes, and Deep Sleep peripherals to coordinate power-aware operation.
Design planning should include the exact pin assignments, peripheral multiplexing, clock configuration, and decoupling requirements in the Microchip datasheet. Because the MCU combines several low-power functions, firmware should explicitly configure wake sources, watchdog behavior, brown-out thresholds, and peripheral shutdown states rather than assuming that Deep Sleep is entered automatically.
This product page consolidates the manufacturer specifications, distributor listings, package information, application guidance, and verified drop-in alternatives for PIC24F32KA302-E/SP. It also highlights the design trade-offs between automotive-grade and industrial-grade ordering codes, helping engineers select a part that matches the electrical, environmental, and sourcing requirements of the finished equipment.
드롭인 대체품: PIC24F32KA302-E/SP — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC24F32KA302-E/SP (동일 폼 팩터 및 풋프린트) — 차이점: Package.
PIC24F32KA302-I/SP
✅ 드롭인가격 문의
데이터시트 보기 →PIC24F32KA302-E/SP 최대 정격 & 전기적 특성
| Product Type | 16-bit Flash microcontroller |
| 최대 클록 주파수 | 32 MHz |
| Instruction Throughput | 16 MIPS |
| Program Memory | 32 KB Flash (11K x 24 bits) |
| Data Memory | 2 KB RAM |
| EEPROM | 512 bytes |
| ADC Resolution | 12 bits |
| Architecture | 16-bit modified PIC RISC |
| Low-Power Technology | PIC XLP |
| Deep Sleep Features | DSBOR, DSWDT, and RTCC operation |
| Capacitive Touch | CTMU peripheral |
| 패키지 | 28-pin SPDIP |
| 핀 수 | 28 pins |
| 실장 유형 | Through-hole |
| Product Family | PIC24F |
PIC24F32KA302-E/SP 28-pin spdip 핀 구성 가이드
PIC24F32KA302-E/SP(28-pin spdip 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC24F32KA302-E/SP.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC24F32KA302-E/SP 적합 용도: 6 애플리케이션s: Battery-Powered Sensor Node, Industrial Process Control Module, Capacitive-Touch Control Panel, Compact Data-Acquisition System, Low-Power Real-Time Clock Instrument, Embedded Control and Prototyping Board.
Battery-Powered Sensor Node
PIC24F32KA302-E/SP fits a battery-powered environmental sensor because its 16-bit core can run up to 32 MHz while the XLP design includes DSBOR, DSWDT, and RTCC operation in Deep Sleep mode. A sensor controller can periodically enable the 12-bit ADC, read the measurement, store configuration or calibration data in EEPROM, and return to a low-power state between samples. The 2 KB RAM is sufficient for short acquisition buffers, while 32 KB Flash accommodates firmware and tables. Design the wake schedule carefully so that the watchdog, real-time clock, and brown-out reset behavior support the product's operating profile.
Industrial Process Control Module
PIC24F32KA302-E/SP is suitable for compact industrial monitoring when a design needs deterministic control, analog measurement, and low-power standby behavior in one package. Its 12-bit ADC can digitize sensor signals, and the 16-bit architecture supports responsive control calculations at up to 16 MIPS. The automotive-grade -E ordering code is useful when the equipment is assigned to an automotive-oriented environment or temperature category. Engineers should isolate analog inputs appropriately, follow the recommended decoupling arrangement, and verify the selected package pin assignments before layout release. Deep Sleep should be enabled only after required control and communication tasks have completed.
Capacitive-Touch Control Panel
PIC24F32KA302-E/SP can implement a compact capacitive-touch interface through its CTMU peripheral while retaining program memory and general-purpose I/O for display or communication functions. The CTMU measures changes in capacitance and can support touch keys, sliders, or proximity sensing without requiring a separate touch controller in every design. At 32 MHz, the MCU has sufficient performance to scan channels and update a simple user interface, while its 2 KB RAM can hold scan state and short display buffers. The 28-pin SPDIP package also makes the device practical for through-hole prototypes and industrial control boards assembled with conventional DIP tooling.
Compact Data-Acquisition System
PIC24F32KA302-E/SP is useful for a small data-acquisition system that combines periodic analog sampling with embedded control. The 12-bit ADC supplies the measurement front end, while the 32-bit modified PIC RISC architecture operates at up to 32 MHz and up to 16 MIPS for scaling, filtering, calibration, and data formatting. Firmware can retain configuration in 512 bytes of EEPROM and use 2 KB of RAM for working buffers. For higher sample rates or storage requirements, pair the controller with an external serial memory or communications device. Validate input settling time, reference accuracy, and acquisition timing against the datasheet before treating the MCU as a precision measurement instrument.
Low-Power Real-Time Clock Instrument
PIC24F32KA302-E/SP fits instruments that need low standby consumption while retaining real-time clock and calendar functions. The manufacturer identifies RTCC operation in Deep Sleep mode, along with DSWDT and DSBOR, as features of the PIC24F32KA302 family. A product can maintain timekeeping and monitor its own supply condition while avoiding a separate always-on clock component. The 16-bit core remains available for measurement, display management, logging, and user input. Firmware should define Deep Sleep entry conditions, wake sources, oscillator behavior, and recovery logic so that a reset or brown-out event produces the intended system state.
Embedded Control and Prototyping Board
PIC24F32KA302-E/SP offers a practical development target for embedded-control experiments because it combines a 16-bit processor, 32 KB Flash, 2 KB RAM, EEPROM, ADC, CTMU, and real-time peripherals in a 28-pin SPDIP package. Through-hole construction permits straightforward breadboard prototyping, socket-based construction, and hand rework during firmware bring-up. The same through-hole format also helps teams migrate a prototype to a larger assembled control board without changing to a fine-pitch surface-mount footprint. Development work should include a programmer connection, reset circuit, clock arrangement, decoupling, and a defined test point strategy. Use the manufacturer pin-description table throughout board layout to avoid peripheral multiplexing conflicts.
엔지니어링 참조 데이터: PIC24F32KA302-E/SP — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC24F32KA302-I/SP |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Package | 28-pin SPDIP | 28-pin SPDIP - same package |
| Maximum Clock Frequency | 32 MHz | 32 MHz |
| Instruction Throughput | 16 MIPS | 16 MIPS |
| Program Memory | 32 KB Flash (11K x 24 bits) | 32 KB Flash |
| Data Memory | 2 KB RAM | 2 KB RAM |
| EEPROM | 512 bytes | 512 bytes |
| ADC Resolution | 12 bits | 12 bits |
| Capacitive Touch Support | CTMU peripheral | CTMU peripheral |
| Ordering-Code Grade | -E | -I |
주요 차별점
- Direct same-package ordering-code alternative (vs PIC24F32KA302-I/SP)
- Automotive-oriented grade selection (vs PIC24F32KA302-I/SP)
- Through-hole prototyping and serviceability (vs PIC24F32KA302-E/SO)
- Integrated low-power system functions (vs PIC24F32KA302-I/SP)
설계 노트
Configure Deep Sleep only after active and analog peripherals have reached a safe state. Retain the DSWDT and DSBOR functions where appropriate, and define which event may wake the MCU. Measure current in the complete product state because the 12-bit ADC, CTMU, oscillators, and communication circuitry can materially change standby consumption even when the controller is in its low-power mode.
Place the required decoupling capacitors close to the corresponding VDD and VSS pins, and route sensitive analog inputs away from switching nodes and high-current return paths. Follow the manufacturer package drawing for the exact 28-pin SPDIP pad positions. Because ADC and CTMU measurements can be affected by impedance and trace coupling, keep sensor connections short and provide a defined return path beneath or alongside sensitive traces where the board stack-up permits.
Do not substitute PIC24F32KA302-E/SO for the -SP device on an existing board: the package is the same 28-pin count but the lead geometry and mounting method differ. Likewise, verify the -E and -I temperature-grade limits before exchanging those ordering codes. Pin-to-pin mechanical compatibility alone does not establish that every electrical and environmental requirement is identical.
Use the through-hole SPDIP footprint for prototypes and serviceable assemblies, but confirm connector and board-edge clearance before layout release. Add accessible programming and reset access for bring-up. If the production design later moves to a surface-mount package, treat that as a new layout because pad geometry and assembly process change even when the device's peripheral resources are similar.
규정 준수 정보
No explicit compliance statements for the exact ordering code were identified. The -E ordering code is associated with an automotive-grade variant in distributor records, but this alone is not treated as an AEC-Q100 qualification statement.
