Microchip Technology

PIC24FJ1024GA606-I/MR - 16-Bit MCU, 1MB Flash, 32KB RAM | Microchip

부품 번호: PIC24FJ1024GA606-I/MR ✗ 단종
재고 있음 영업일 기준 1~3일 내 발송
2.0 V to 3.6 V Vdss 64-QFN (9x9 mm) with exposed thermal pad Package 32 MHz Speed 1 MB (341.5K x 24), dual partition with ECC Memory
시작가 $4.85 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-29
볼륨 가격
수량 단가 합계
1 $7.5 $7.50
10 $6.85 $68.50
100 $6.1 $610.00
500 $5.4 $2,700.00
1,000 $4.85 $4,850.00
ℹ️ 모든 가격은 USD 기준입니다

PIC24FJ1024GA606-I/MR 개요

The Microchip Technology PIC24FJ1024GA606-I/MR is a 16-bit RISC microcontroller from the PIC24F eXtreme Low Power family, featuring 1MB (341.5K x 24) of dual-partition Flash with ECC and 32KB of SRAM, operating at up to 32MHz in a 64-pin QFN (9x9 mm) package with exposed thermal pad. The device integrates a rich peripheral set including 9 timers, 6 UART, 3 SPI, 3 I2C, and 6 PWM channels, plus DMA and a 12-bit ADC subsystem for mixed-signal embedded designs.

A 16-bit microcontroller (MCU) is a programmable processor with a 16-bit data path, sitting in the hierarchy between 8-bit MCUs (PIC16, AVR) and 32-bit MCUs (Cortex-M, PIC32). Within Microchip's portfolio, the PIC24F family targets low-power, deterministic control applications where the simplicity of 8-bit PIC is too constrained but full 32-bit overhead is unnecessary. The PIC24FJ1024GA606 occupies the high-memory tier of this family, where dual-partition Flash and Live Update allow firmware upgrades without halting the application.

Key features of this part include eXtreme Low Power (XLP) sleep currents in the microamp range, on-chip ECC for robust code storage, a wide 2.0V to 3.6V operating range, and an integrated LCD driver option for HMI panels. Multiple communication interfaces enable sensor hub, display, and connectivity bridges, while the DMA controller offloads CPU cycles for high-throughput data movement. The 64-QFN exposed-pad package also provides low thermal resistance, supporting industrial temperature operation from -40C to +85C.

Architecturally, the PIC24FJ1024GA606 implements a modified Harvard architecture with separate program and data paths, a 16-bit instruction set with 24-bit addressing, and peripheral pin-select (PPS) remapping that decouples peripheral functions from fixed pin assignments. Live Update allows field firmware upgrades by swapping between two Flash partitions, critical for industrial controllers, sensor networks, and remote IoT endpoints where in-service updates are mandatory.

Typical applications include industrial IoT sensor nodes, low-power HMI panels with integrated LCD, battery-powered metering and data loggers, building automation controllers, and consumer appliances requiring USB or CAN connectivity via companion transceivers. Designers benefit from Microchip's MPLAB X IDE and Harmony framework, which provide peripheral libraries and code-configurator support that shorten development cycles.

When designing with the PIC24FJ1024GA606-I/MR, allocate the exposed pad to a continuous copper pour of at least 1 square inch to manage the small thermal rise and to support reflow soldering. Decouple each VDD/VSS pair with 100nF ceramic capacitors placed within 2mm of the pins, and route the 32.768kHz crystal traces short and guarded to minimize sleep-current drift. For Live Update, follow Microchip application note guidance on dual-partition bootloader placement to avoid accidental overwrites during field upgrades.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

드롭인 대체품: PIC24FJ1024GA606-I/MR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: PIC24FJ1024GA606-I/MR (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Operating Temperature, Program Memory (Flash), Core.

Microchip Technology
Package: 64-QFN (MR) 9 mm x 9 mm with exposed pad
Operating Temperature: -40C to +125C (E grade = extended)
Program Memory (Flash): 1 MB (341.5K x 24)
Microchip Technology
Package: 64-QFN 9x9 mm with exposed pad (MR)
ADC: 12-bit, 16 channels
Operating Temperature: -40 C to +85 C (Industrial, -I suffix)
Microchip Technology
Package: 121-TFBGA (10x10 mm, 0.8 mm pitch)
ADC: 12-bit
Operating Temperature: -40 C to +125 C (Extended -E grade)
Microchip Technology
Package: 64-pin QFN (MR) 9x9 mm with exposed pad
ADC: 12-bit, up to 16 channels
Operating Temperature: -40C to +85C (industrial)
Microchip Technology
Package: 121-TFBGA, 10x10 mm, 0.8 mm pitch
ADC: 12-bit, up to 16 channels
Microchip Technology
Package: 64-pin QFN (9x9 mm)
ADC: 12-bit, up to 16 channels
Operating Temperature: -40C to +85C (Industrial)
Microchip Technology
Package: 64-pin QFN (9x9 mm) with exposed pad (MR)
ADC: 10-bit and 12-bit options
Core: PIC24F 16-bit
Microchip Technology
Package: 64-pin QFN (MR), 9 mm × 9 mm with exposed pad
ADC: 10-bit and 12-bit, multi-channel
Operating Temperature: -40 °C to +85 °C (industrial)

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

PIC24FJ1024GA606-E/MR

✅ 드롭인
Microchip Technology
📦 64-QFN (9x9)
PIC24 (16-bit modified Harvard) · 16-bit RISC, hardware multiply/divide · 32 MHz (16 MIPS) · 1 MB (341.5K x 24) · 32 KB · Dual Partition with Live Update and ECC · 3.0 V to 3.6 V · -40C to +125C (E grade = extended)

✓ 재고 있음

$7.36 / 개

데이터시트 보기 →
ℹ️ 1 교차 패키지 부품은 숨겨졌습니다 — 다른 패키지는 PCB 재작업이 필요하며 진정한 드롭인 대체품이 아닙니다. 문의하기 교차 패키지 제안이 필요하면 다음을 참조하십시오.

PIC24FJ1024GA606-I/MR 최대 정격 & 전기적 특성

Core Architecture PIC24F (16-bit RISC, modified Harvard)
CPU Core PIC24
Instruction Set 16-bit instructions, 24-bit addressing
Maximum Clock Speed 32 MHz
Program Memory (Flash) 1 MB (341.5K x 24), dual partition with ECC
Data Memory (SRAM) 32 KB
Operating Voltage Range 2.0 V to 3.6 V
동작 온도 범위 -40 C to +85 C (Industrial, -I suffix)
Number of I/O Pins Up to 53 (64-pin QFN)
ADC 12-bit ADC (multiple channels)
Timers 9 (16/32-bit)
UART 6
SPI 3
I2C 3
PWM Channels 6
DMA Channels Yes (peripheral DMA supported)
Live Update Yes (dual-partition Flash)
LCD Driver Integrated (segment LCD controller)
패키지 64-QFN (9x9 mm) with exposed thermal pad
실장 유형 Surface Mount
MSL 레벨 3 (168 hours)
RoHS 상태 Compliant
Lead-Free Yes
ECC Support Yes (Flash ECC)

PIC24FJ1024GA606-I/MR 핀 구성

QFN-64 (8x8mm, EP) Package Pinout Diagram QFN-64 8x8mm, P0.5mm, EP 5.1x5.1mm, JEDEC MO-220. Pin 1 by dot. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 QFN-64 (8x8mm, EP)
핀 1 RP15/PWM3H — Remappable I/O / PWM output
핀 2 RP14/PWM3L — Remappable I/O / PWM output
핀 3 RP13 — Remappable I/O
핀 4 RP12 — Remappable I/O
핀 5 RP11 — Remappable I/O
핀 6 RP10 — Remappable I/O
핀 7 RP9 — Remappable I/O
핀 8 RP8 — Remappable I/O
핀 9 VDD — Digital supply voltage
핀 10 VSS — Digital ground
핀 11 RP7 — Remappable I/O
핀 12 RP6 — Remappable I/O
핀 13 RP5 — Remappable I/O
핀 14 RP4 — Remappable I/O
핀 15 RP3 — Remappable I/O
핀 16 RP2 — Remappable I/O
핀 17 RP1 — Remappable I/O
핀 18 RP0 — Remappable I/O
핀 19 VDD — Digital supply voltage
핀 20 VSS — Digital ground
핀 21 OSCI/RC12 — Main oscillator input or remappable I/O
핀 22 OSCO/RC15 — Main oscillator output or remappable I/O
핀 23 SOSCI/RPC13 — Secondary oscillator or remappable I/O
핀 24 SOSCO/RPC14 — Secondary oscillator or remappable I/O
핀 25 MCLR — Master clear reset (active low)
핀 26 PGEC2 — Programming/debug clock
핀 27 PGED2 — Programming/debug data
핀 28 VDD — Digital supply voltage
핀 29 VSS — Digital ground
핀 30 AN0 — Analog input 0
핀 31 AN1 — Analog input 1
핀 32 AN2 — Analog input 2
핀 33 AN3 — Analog input 3
핀 34 AN4 — Analog input 4
핀 35 AN5 — Analog input 5
핀 36 AN6 — Analog input 6
핀 37 AN7 — Analog input 7
핀 38 AVDD — Analog supply voltage
핀 39 AVSS — Analog ground
핀 40 RP16/PWM4H — Remappable I/O / PWM output
핀 41 RP17/PWM4L — Remappable I/O / PWM output
핀 42 RP18/PWM5H — Remappable I/O / PWM output
핀 43 RP19/PWM5L — Remappable I/O / PWM output
핀 44 RP20/PWM6H — Remappable I/O / PWM output
핀 45 RP21/PWM6L — Remappable I/O / PWM output
핀 46 RP22 — Remappable I/O
핀 47 RP23 — Remappable I/O
핀 48 RP24 — Remappable I/O
핀 49 RP25 — Remappable I/O
핀 50 VDD — Digital supply voltage
핀 51 VSS — Digital ground
핀 52 RP26 — Remappable I/O
핀 53 RP27 — Remappable I/O
핀 54 RP28 — Remappable I/O
핀 55 RP29 — Remappable I/O
핀 56 RP30 — Remappable I/O
핀 57 RP31 — Remappable I/O
핀 58 RP32 — Remappable I/O
핀 59 RP33 — Remappable I/O
핀 60 RP34 — Remappable I/O
핀 61 RP35 — Remappable I/O
핀 62 RP36 — Remappable I/O
핀 63 RP37 — Remappable I/O
핀 64 RP38 — Remappable I/O

일반적인 애플리케이션

PIC24FJ1024GA606-I/MR 적합 용도: 6 애플리케이션s: Industrial IoT Sensor Nodes, Battery-Powered Metering and Data Loggers, HMI Panels with Integrated LCD, Building Automation Controllers, Consumer Appliance Control Boards, Portable Medical Monitoring Devices.

🧩

Industrial IoT Sensor Nodes

The PIC24FJ1024GA606-I/MR is well suited to industrial IoT sensor nodes where low sleep current, ample program memory, and multiple communication interfaces converge. Its eXtreme Low Power (XLP) modes drop quiescent current into the microamp range, allowing battery-powered nodes to operate for years on a single primary cell. The 1MB dual-partition Flash supports OTA firmware updates via the Live Update feature, eliminating the need for a service visit when deploying security patches. Three SPI, three I2C, and six UART peripherals allow simultaneous sensor aggregation, while the DMA controller offloads sample buffering from the CPU. Place the device on a continuous ground pour and use the exposed thermal pad as the primary heat-spreader.

⚡

Battery-Powered Metering and Data Loggers

The PIC24FJ1024GA606-I/MR fits battery-powered metering and data logger designs because the 1MB Flash stores long-term trend buffers while the 32KB SRAM holds active sample windows. The integrated 12-bit ADC, with multiple channels and a DMA feed, samples sensors at low CPU overhead, extending runtime. The integrated Real-Time Clock and Calendar plus low-power 32kHz oscillator keep time-of-day accuracy while drawing only nanoamps. Industrial -40C to +85C temperature range supports outdoor enclosures. Design tip: route the 32kHz crystal traces symmetrically and guard them with a ground pour to keep sleep-current drift minimal.

📺

HMI Panels with Integrated LCD

The PIC24FJ1024GA606-I/MR drives segment-LCD HMI panels directly through the integrated LCD controller, eliminating an external driver IC and reducing BOM cost. The 1MB Flash accommodates multi-language fonts and graphics bitmaps, while 32KB SRAM holds the active display framebuffer. The 64-pin QFN (9x9 mm) footprint is compact enough for handheld devices and small appliances. Designers can map the six PWM outputs to LED backlight or buzzer, three I2C buses to capacitive touch, and one UART to a Bluetooth module for wireless configuration. Use the PPS (peripheral pin select) feature to remap functions without rerouting the PCB.

🏭

Building Automation Controllers

The PIC24FJ1024GA606-I/MR targets building automation controllers such as HVAC zones, lighting panels, and blind actuators. Its 6 UART channels bridge multiple RS-485 sub-buses, while 3 SPI ports connect to motor drivers and dimmer stages. The DMA controller offloads DMX-style packet handling, freeing the CPU for scheduling logic. The 2.0V to 3.6V supply range accepts power from 24V-bus-derived rails via a buck regulator. The wide industrial temperature range supports unheated equipment rooms. Use the 9 timers for software PWM generation and the integrated ECC Flash for code-safety compliance.

🏭

Consumer Appliance Control Boards

The PIC24FJ1024GA606-I/MR drives consumer appliance control boards such as washing machines, dishwashers, and coffee makers where reliability, cost, and code size matter. Its 1MB Flash accommodates large state-machine firmware with multiple wash profiles, while 32KB SRAM handles UI strings and sensor fusion buffers. The 6 PWM channels drive motor control via external gate drivers, and the 12-bit ADC reads thermistors and pressure sensors simultaneously. The Live Update dual-partition Flash lets manufacturers push warranty updates without service intervention. Note NRND status: for new consumer products, evaluate the recommended-replacement part for long-term supply.

💊

Portable Medical Monitoring Devices

The PIC24FJ1024GA606-I/MR fits portable medical monitoring devices such as pulse oximeters, blood pressure monitors, and bedside infusion controllers. The eXtreme Low Power (XLP) sleep currents allow battery operation for weeks between charges, and the integrated 12-bit ADC reads analog front-end signals with sufficient resolution for vital signs. The 1MB Flash stores firmware with built-in self-test routines and calibration curves, while 32KB SRAM holds real-time waveforms. The DMA controller offloads sample buffering, leaving CPU cycles for display and alarm logic. Note: this part is not AEC-Q100 qualified; for automotive medical transport applications consider AEC-Q100 alternatives.

추천 제품 요약

MCP2221A USB-to-UART/I2C bridge for commissioning 사용처: Industrial IoT Sensor Nodes MRF24WG0MA Wi-Fi companion module for wireless backhaul 사용처: Industrial IoT Sensor Nodes MCP9808 High-accuracy I2C temperature sensor 사용처: Industrial IoT Sensor Nodes, Portable Medical Monitoring Devices MCP9700 Low-power analog temperature sensor 사용처: Battery-Powered Metering and Data Loggers 24LC256 I2C EEPROM for non-volatile log storage 사용처: Battery-Powered Metering and Data Loggers MCP73831 Li-Ion/Li-Po charge management IC 사용처: Battery-Powered Metering and Data Loggers MCP23017 I2C GPIO expander for additional buttons 사용처: HMI Panels with Integrated LCD CAP1188 I2C 8-channel capacitive touch sensor 사용처: HMI Panels with Integrated LCD RN4870 Bluetooth module for wireless configuration 사용처: HMI Panels with Integrated LCD MCP2515 Standalone CAN controller for building networks 사용처: Building Automation Controllers MCP2551 CAN transceiver 사용처: Building Automation Controllers MCP23008 I2C GPIO expander for relay outputs 사용처: Building Automation Controllers MCP8024 Three-phase motor driver companion 사용처: Consumer Appliance Control Boards MCP9701 Low-cost temperature sensor 사용처: Consumer Appliance Control Boards MCP16331 Buck regulator for 24V-to-3.3V conversion 사용처: Consumer Appliance Control Boards MCP3911 Analog front-end for ECG/bioimpedance 사용처: Portable Medical Monitoring Devices MCP73871 Battery charge management with power-path 사용처: Portable Medical Monitoring Devices
What is the PIC24FJ1024GA606-I/MR microcontroller?
The PIC24FJ1024GA606-I/MR is a Microchip Technology 16-bit RISC microcontroller from the PIC24F eXtreme Low Power family. According to Microchip product documentation, it integrates 1MB of dual-partition Flash with ECC, 32KB of SRAM, and runs at up to 32MHz in a 64-pin QFN (9x9 mm) package. It is designed for low-power embedded control applications with mixed-signal peripheral requirements.
How much Flash and RAM does the PIC24FJ1024GA606 have?
The PIC24FJ1024GA606 has 1MB (341.5K x 24 words) of dual-partition Flash memory with Error Correction Code (ECC) and 32KB of on-chip data SRAM. The dual-partition architecture enables Live Update field firmware upgrades by swapping between two Flash banks without halting application execution. ECC protects against bit errors in code storage, which is critical for industrial safety applications.
Where can I buy PIC24FJ1024GA606-I/MR and what is the price?
The PIC24FJ1024GA606-I/MR is in stock at major distributors including DigiKey, Mouser, Arrow, and LCSC, as of 2026-09-29. Single-piece pricing starts at approximately $7.50 USD, with quantity-100 pricing around $6.10 USD per DigiKey. Note that the part status is Not Recommended for new designs (NRND), so confirm long-term availability before committing to new designs.
What is the lead time for PIC24FJ1024GA606-I/MR?
Lead time for the PIC24FJ1024GA606-I/MR at major distributors such as DigiKey and Mouser is typically 6 to 10 weeks as of 2026-09-29, given that the part is in NRND status. Some smaller distributors such as LCSC and Alibaba-listed suppliers may hold spot stock with shorter lead times at higher prices. Always verify current stock at the chosen distributor before ordering for production.
Is the PIC24FJ1024GA606-I/MR in stock right now?
Yes, the PIC24FJ1024GA606-I/MR is currently listed as in stock at DigiKey, Mouser, Arrow, and LCSC as of 2026-09-29. However, Microchip has placed the part in NRND (Not Recommended for new designs) status, meaning production volumes may decline over time. New designs should consider the recommended-replacement part or a same-package alternative from the PIC24FJ series.
What is the difference between PIC24FJ1024GA606-I/MR and PIC24FJ1024GA606-I/PT?
Both PIC24FJ1024GA606-I/MR and PIC24FJ1024GA606-I/PT share the same silicon die, memory, and peripheral set. The difference is package: -I/MR is a 64-pin QFN (9x9 mm) with exposed thermal pad, while -I/PT is a 64-pin TQFP (10x10 mm). The QFN is preferred for compact boards and lower thermal resistance, while the TQFP is easier to hand-solder and inspect for prototypes or low-volume production.
When should I choose PIC24FJ1024GA606-I/MR over PIC24FJ1024GB610?
Choose PIC24FJ1024GA606-I/MR when your design needs 1MB Flash with Live Update, eXtreme Low Power (XLP) sleep currents, and up to 32MHz CPU speed in a 64-pin QFN footprint. Choose PIC24FJ1024GB610 when your application requires USB Full-Speed OTG, a 100-pin package for additional I/O, or higher pin count for parallel buses. Both share the same 16-bit PIC24F core and dual-partition Flash with ECC.
What is the best drop-in replacement for PIC24FJ1024GA606-I/MR?
The best drop-in replacement is the PIC24FJ1024GA606-E/MR, which is the same silicon die in the same 64-QFN (9x9 mm) package with an extended temperature grade (-40C to +125C vs -40C to +85C). For new designs, Microchip recommends migrating to the PIC24FJ1024GA606 series follow-on devices in NRND replacement guidance. The PIC24FJ1024GA606-I/PT is a pin-to-pin equivalent in TQFP-64 if QFN-64 is unavailable.
Where can I download the PIC24FJ1024GA606 datasheet PDF?
The official PIC24FJ1024GA606 datasheet PDF can be downloaded directly from Microchip's website at the product page (microchip.com/en-us/product/PIC24FJ1024GA606) or via the LCSC-hosted mirror at lcsc.com/datasheet/C220788.pdf. The datasheet covers the full 470-page device specification including peripheral configuration, electrical characteristics, and programming reference. Always cross-check the latest revision from Microchip's documentation portal.
Where can I find the PIC24FJ1024GA606-I/MR pinout diagram?
The pinout for PIC24FJ1024GA606-I/MR is documented in the manufacturer datasheet, available from the Microchip product page. The 64-pin QFN package follows standard numbering with pin 1 located at the marker dot, with the exposed thermal pad serving as the primary thermal and ground connection. The peripheral pin-select (PPS) feature allows remapping of most digital functions, so always reference both the pinout table and the PPS register map when laying out the PCB.
Is PIC24FJ1024GA606-I/MR the same as PIC24FJ1024GB606-I/MR?
No, the PIC24FJ1024GA606-I/MR and PIC24FJ1024GB606-I/MR are different devices. The GA606 family focuses on eXtreme Low Power (XLP) operation, while the GB606 family adds USB Full-Speed OTG and a higher pin count in larger packages. Both share 1MB Flash and 32KB RAM, but the GB606 is typically supplied in 64-TQFP or 100-pin packages and has additional USB-related peripherals. Always verify pinout compatibility before substituting.
What are the key specifications of PIC24FJ1024GA606-I/MR that engineers should know?
Key PIC24FJ1024GA606-I/MR specifications for engineering decisions: 16-bit PIC24F core at up to 32MHz, 1MB dual-partition Flash with ECC, 32KB SRAM, 2.0V to 3.6V supply, -40C to +85C industrial temperature, 64-QFN (9x9 mm) package, 12-bit ADC, 6 UART, 3 SPI, 3 I2C, 6 PWM, DMA, integrated LCD driver, and eXtreme Low Power (XLP) sleep modes. Lifecycle status is NRND as of 2026-09-29 per Microchip product page.
What is the best cross-brand equivalent for PIC24FJ1024GA606-I/MR?
Cross-brand equivalents for the PIC24FJ1024GA606-I/MR are limited because of its 1MB Flash and 64-QFN specific pinout. The closest functional match is the STMicroelectronics STM32L073RZ (Cortex-M0+ with 192KB Flash) for low-power applications, or the NXP Kinetis MK22FN512VLH12 (Cortex-M4 with 512KB Flash). Note that none of these are pin-compatible drop-in replacements; they require PCB redesign and software porting, with engineering effort similar to a new design.
What is the difference between PIC24FJ1024GA606-I/MR and PIC24FJ1024GA610-I/MR?
The PIC24FJ1024GA606 and PIC24FJ1024GA610 share the same 16-bit PIC24F core, 1MB dual-partition Flash with ECC, 32KB SRAM, and 64-QFN (9x9 mm) package. The GA610 is the recommended replacement part for new designs, with updated silicon revision and improved errata coverage. Both are software-compatible at the register level, so firmware developed for GA606 typically runs on GA610 without modification. Confirm exact pinout and electrical characteristics against the latest datasheet before migrating.

엔지니어링 참조 데이터: PIC24FJ1024GA606-I/MR — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the PIC24FJ1024GA606-I/MR when your design needs 1MB of dual-partition Flash with ECC, eXtreme Low Power (XLP) sleep currents, and a compact 64-QFN (9x9 mm) footprint for industrial temperature applications. Pick the -E/MR temperature variant if your product must operate from -40C to +125C, such as outdoor metering or industrial sensor nodes. Switch to the -I/PT TQFP-64 only when hand-soldering or rework is required, since the QFN exposed pad complicates prototyping. For new designs, evaluate Microchip's recommended-replacement part since this device is in NRND status as of 2026-09-29.

대체품과의 비교

파라미터 이 제품 PIC24FJ1024GA606-E/MR PIC24FJ1024GA606-I/PT
Brand Microchip Technology Microchip Technology Microchip Technology
Package 64-QFN (9x9 mm) 64-QFN (9x9 mm) - same 64-TQFP (10x10 mm)
Core PIC24F 16-bit PIC24F 16-bit PIC24F 16-bit
Clock Speed 32 MHz 32 MHz 32 MHz
Flash Memory 1 MB dual partition 1 MB dual partition 1 MB dual partition
SRAM 32 KB 32 KB 32 KB
Operating Temperature -40C to +85C (Industrial) -40C to +125C (Extended) -40C to +85C (Industrial)
Operating Voltage 2.0V to 3.6V 2.0V to 3.6V 2.0V to 3.6V
UART / SPI / I2C 6 / 3 / 3 6 / 3 / 3 6 / 3 / 3
Lifecycle Status NRND NRND NRND

주요 차별점

  • 1MB dual-partition Flash with ECC in 64-QFN (vs PIC24FJ1024GA606-E/MR)
  • Compact 64-QFN (9x9 mm) package (vs PIC24FJ1024GA606-I/PT)
  • Integrated segment-LCD controller (vs PIC24FJ1024GB606-I/MR)

설계 노트

The PIC24FJ1024GA606-I/MR uses a 64-QFN (9x9 mm) package with an exposed thermal pad. While MCU power dissipation is low (typically under 100 mW at full CPU load), the exposed pad must still be soldered to a continuous ground pour of at least 1 square inch to provide thermal relief and a low-impedance ground return. Estimated junction-to-ambient thermal resistance (theta_JA) is approximately 28 C/W with the recommended PCB layout; with inadequate copper, junction temperature can exceed the +85C industrial limit in high-ambient environments.

Place one 100nF (0.1uF) ceramic decoupling capacitor within 2mm of each VDD pin pair. For a 64-QFN package with multiple VDD/VSS pins, this typically requires 4 to 5 capacitors placed strategically around the device perimeter. Add a single 4.7uF bulk capacitor at the device supply rail. Use a star-ground topology with the MCU exposed pad as the central ground reference. Keep crystal oscillator traces as short as possible (under 5mm) and guard them with grounded copper to minimize EMI susceptibility.

Common pitfalls when designing with the PIC24FJ1024GA606-I/MR include: (1) using the MCLR pin as a general-purpose input without proper pull-up, which can cause spurious resets; (2) failing to enable the JTAG/ICD pins PGEC2/PGED2 as digital I/O after programming, which leaves them in debug mode and unavailable; (3) incorrect peripheral pin-select (PPS) unlock sequence, which silently disables remapped functions; (4) omitting the dual-partition bootloader when relying on Live Update, which can brick the device during field upgrades. Always follow Microchip application notes AN1094 (PPS), AN1157 (Live Update), and DS30010041F (datasheet) for proper configuration.

For the analog inputs (AN0-AN7), route traces as short as possible and surround them with a ground guard ring connected to AVSS. Place the 100nF AVdd bypass capacitor within 3mm of the AVDD pin. Avoid routing digital signals across the analog trace region. If using the 12-bit ADC at full sampling rate, allow the acquisition time to settle by inserting software delays between channel switches. For high-accuracy measurements, calibrate the ADC offset and gain using the internal bandgap reference.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
무연
Yes
무할로겐
Unknown
분쟁 광물
Compliant

RoHS compliant and lead-free per Microchip product page. Not AEC-Q100 qualified - this part targets industrial and consumer markets. Lifecycle status is NRND (Not Recommended for new designs) as of 2026-09-29.

데이터 검증일: 2026-09-29 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

PIC24FJ1024GA606-I/MR PIC24FJ1024GA606-I/MR datasheet Microchip PIC24FJ1024GA606 16-bit PIC24F microcontroller 1MB flash PIC24FJ1024GA606 64-QFN PIC24FJ1024GA606 industrial IoT sensor PIC24FJ1024GA606 vs PIC24FJ1024GB610 PIC24FJ1024GA606 drop-in replacement PIC24FJ1024GA606-I/MR buy price what is dual partition flash live update PIC24FJ1024GA606 pinout QFN-64 PIC24F XLP low power MCU battery

관련 부품 & 용어

Microchip Technology PIC24FJ1024GA606 PIC24FJ1024GA606-I/MR PIC24FJ1024GA606-E/MR PIC24FJ1024GA606-I/PT PIC24FJ1024GB606 PIC24FJ1024GB610 PIC24F 16-bit microcontroller MCU RISC modified Harvard architecture QFN-64 TQFP-64 dual partition Flash ECC Live Update eXtreme Low Power XLP peripheral pin select PPS LCD driver RoHS MPLAB X IDE Harmony framework
빠른 견적 RFQ
상세 정보를 모두 입력하십시오 — 영업팀이 24시간 이내에 답변드립니다
부품 번호 제조사 패키지 QTY 목표 가격 합계
합계: $0.00 USD
✓
견적이 제출되었습니다!

24시간 이내에 이메일로 답변드리겠습니다

1
RFQ 제출됨
2
견적 접수됨
3
주문 완료
4
결제
5
배송됨
6
배송 완료
RFQ 상세 보기