PIC24FJ128GB610T-I/BG - 16-bit 32MHz 128KB Flash MCU | Microchip
부품 번호: PIC24FJ128GB610T-I/BG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $9.71 | $9.71 |
| 10 | $9.05 | $90.50 |
| 100 | $8.18 | $818.00 |
| 500 | $7.34 | $3,670.00 |
| 1,000 | $6.87 | $6,870.00 |
PIC24FJ128GB610T-I/BG 개요
A 16-bit microcontroller (MCU) is a microcontroller whose central processing unit operates on 16-bit data words and addresses, placing it above typical 8-bit MCUs (such as the PIC16 or AVR families) but below 32-bit Cortex-M parts in both arithmetic throughput and toolchain complexity. The PIC24F series in particular targets low-power applications with on-chip peripherals like USB, ADCs, and charge-time measurement units (CTMU), positioning it between simple 8-bit controllers and full 32-bit application processors. The 'F' suffix denotes Flash program memory with on-chip reprogrammability, supporting Microchip's Live Update dual-image boot mechanism.
Key features of the PIC24FJ128GB610T-I/BG include 16 MIPS CPU performance at 32 MHz, integrated USB-OTG with on-chip transceiver, 85 digital I/O pins, dual-bank Flash supporting field firmware updates without downtime, multiple 12-bit and 10-bit ADC configurations (up to 24 channels of 12-bit ADC), and the XLP ultra-low-power modes that deliver nanoWatt sleep currents suitable for battery-powered IoT nodes. The CTMU peripheral supports capacitive touch sensing, while the CLC (Configurable Logic Cell) and PPS (Peripheral Pin Select) blocks enable flexible signal routing.
The architecture combines a 16-bit modified Harvard CPU with a C-optimized instruction set, supporting peripheral operation through dedicated DMA channels and interrupt priority levels. The on-chip dual Flash design enables Live Update firmware upgrades - one bank runs application code while the other receives the new image, eliminating downtime in deployed products.
Typical applications include USB peripherals (HID, CDC, mass storage), industrial sensing nodes, home automation gateways, low-power portable medical devices, automotive body electronics, and human-interface products with capacitive touch buttons. The 121-TFBGA package is best suited for high-density boards where maximum I/O and small footprint matter more than easy hand-soldering.
Designers should note that the TFBGA package requires reflow soldering and X-ray or AOI inspection, making it unsuitable for hand assembly or low-volume prototyping. Decoupling follows Microchip's recommended 0.1 uF + bulk capacitor topology near each VDD/VDDCORE pair, and unused pins should be configured as outputs low to minimize leakage.
This page synthesizes distributor pricing from DigiKey, drop-in alternatives from Microchip's PIC24F family cross-reference, and practical design considerations for the 121-TFBGA footprint that are not consolidated in the manufacturer datasheet.
드롭인 대체품: PIC24FJ128GB610T-I/BG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC24FJ128GB610T-I/BG (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, Package, ADC, Core Architecture, MSL Level.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC24FJ128GB412T-I/BG
✅ 드롭인✓ 재고 있음
$3.31 / 개
데이터시트 보기 →PIC24FJ1024GB610-I/BG
✅ 드롭인✓ 재고 있음
$7.44 / 개
데이터시트 보기 →PIC24FJ128GB610T-I/BG 최대 정격 & 전기적 특성
| Core Processor | PIC24F |
| Core Size | 16-Bit |
| Core Architecture | Modified Harvard |
| Max CPU Speed | 32 MHz |
| Performance | 16 MIPS |
| Program Memory Size | 128 KB (43K x 24) |
| Program Memory Type | FLASH (Dual-bank, Live Update) |
| RAM Size | 32 KB |
| Number of I/O | 85 |
| 공급 전압 | 2.0 V to 3.6 V |
| 동작 온도 | -40 C to +85 C |
| ADC Resolution | 12-bit / 10-bit (configurable) |
| ADC Channels | Up to 24 channels (12-bit) |
| Connectivity | I2C, SPI, UART, USB-OTG |
| USB | USB-OTG with on-chip transceiver |
| Special Features | CTMU, CLC, PPS, XLP nanoWatt |
| 패키지 | 121-TFBGA (10x10 mm) |
| 실장 유형 | Surface Mount (reflow only) |
| MSL 레벨 | 3 |
| RoHS 상태 | Compliant |
PIC24FJ128GB610T-I/BG 121-tfbga (10x10 mm) 핀 구성 가이드
PIC24FJ128GB610T-I/BG(121-tfbga (10x10 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC24FJ128GB610T-I/BG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC24FJ128GB610T-I/BG 적합 용도: 6 애플리케이션s: USB Peripheral Devices, Low-Power IoT Sensor Nodes, Industrial Sensing and Control, Automotive Body Electronics, Capacitive Touch Human Interfaces, Portable Medical and Wellness Devices.
USB Peripheral Devices
The PIC24FJ128GB610T-I/BG is well-suited for USB peripherals such as HID input devices, CDC serial bridges, and USB mass storage controllers. The integrated USB-OTG controller with on-chip full-speed transceiver eliminates the need for an external PHY, reducing BOM cost and board area in HID game controllers, USB-to-UART bridges, and USB audio class peripherals. The 32 KB RAM supports HID report buffers plus CDC line-coding state without off-chip memory, while the 16 MIPS CPU easily handles USB polling and class protocol stacks. The 121-TFBGA package is ideal for compact dongles where a 10x10 mm footprint with maximum I/O is desired.
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Low-Power IoT Sensor Nodes
The PIC24FJ128GB610T-I/BG is engineered for battery-powered IoT sensor nodes through its XLP nanoWatt technology. Sleep currents in the deep-sleep with RTCC mode drop to roughly 20-60 nA, supporting multi-year coin-cell operation when the CPU wakes only briefly to read sensors over I2C/SPI and report over UART or USB. The 24-channel 12-bit ADC captures multiple analog sensors simultaneously, while the CTMU peripheral enables capacitive touch or simple impedance measurements. The Live Update dual-bank Flash permits OTA-style firmware upgrades without taking the node out of rotation.
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Industrial Sensing and Control
The PIC24FJ128GB610T-I/BG fits industrial sensing and control with its 16-bit CPU, 24-channel 12-bit ADC, and 85 I/O lines. Process-variable transmitters, multi-loop PID controllers, and panel-mount HMIs benefit from the 32 KB RAM for control loops plus the CLC/PPS peripherals for flexible signal routing without external glue logic. The 121-TFBGA package supports compact DIN-rail modules where every square millimeter of PCB matters. Operating from 2.0 V to 3.6 V with -40 C to +85 C industrial temperature range covers most factory-floor deployments.
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Automotive Body Electronics
The PIC24FJ128GB610T-I/BG family is recommended for automotive design according to Microchip product page guidance. Body controllers, HVAC control panels, mirror modules, and lighting controllers benefit from the wide supply range, 24-channel ADC for sensor multiplexing, and XLP sleep modes for quiescent-current-critical parked vehicles. Special ordering codes for automotive-grade (AEC-Q100 qualified) variants apply, so production automotive builds should request the -I/PT or automotive-qualified BGA variant through Microchip-direct. The 121-TFBGA supports space-constrained behind-dash modules where a 10x10 mm footprint with high I/O is required.
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Capacitive Touch Human Interfaces
The PIC24FJ128GB610T-I/BG supports capacitive touch sensing through its integrated CTMU peripheral, which provides hardware-timed charge measurement for reliable touch buttons, sliders, and proximity sensors. The mTouch reference firmware from Microchip accelerates touch keypad and trackpad development. The 24-channel 12-bit ADC plus CTMU captures up to ~24 touch electrodes directly, and the PPS peripheral routes the touch I/O to nearly any package pin. The 121-TFBGA package enables compact touch panels for appliances, industrial controls, and consumer products where mechanical buttons are being replaced.
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Portable Medical and Wellness Devices
The PIC24FJ128GB610T-I/BG fits portable medical and wellness devices such as blood-pressure monitors, glucose meters, and wearable health trackers. The XLP sleep modes extend battery life between measurements, and the 16 MIPS CPU handles filtering, display refresh, and USB data upload to a host PC. The 24-channel 12-bit ADC multiplexes multiple biosensors, while the USB-OTG peripheral simplifies charging-crate connectivity. The 121-TFBGA footprint supports slim, lightweight enclosures. Note that clinical/medical-grade certifications require additional compliance work beyond the MCU selection.
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추천 제품 요약
엔지니어링 참조 데이터: PIC24FJ128GB610T-I/BG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC24FJ128GB412T-I/BG | PIC24FJ1024GB610-I/BG | PIC24FJ1024GB606T-I/MR |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) | 64-QFN |
| Core / Architecture | PIC24F, 16-bit | PIC24F, 16-bit | PIC24F, 16-bit | PIC24F, 16-bit |
| Max CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Flash Memory | 128 KB | 128 KB | 1024 KB | 1024 KB |
| RAM | 32 KB | 32 KB | 32 KB | 32 KB |
| USB | USB-OTG | USB-OTG | USB-OTG | USB-OTG |
| ADC (max resolution/channels) | 12-bit / 24 channels | 12-bit / 24 channels | 12-bit / 24 channels | 12-bit / 16 channels |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
주요 차별점
- Highest-density PIC24F in TFBGA with USB-OTG (vs PIC24FJ128GA610-I/PT)
- Larger Flash option in same footprint for firmware growth (vs PIC24FJ128GB412T-I/BG)
- Dual-bank Flash with Live Update firmware upgrade (vs PIC24EP512GP806T-I/PT)
설계 노트
The 121-TFBGA package uses 0.8 mm ball pitch with a 10x10 mm body; route escape with micro-via-in-pad (uVia) on inner signal layers to break out the inner-row balls. Follow Microchip's recommended 4-layer stack-up with a continuous ground plane under the BGA and a 2 oz power pour above. Decouple each VDD/VDDCORE pin pair with a 0.1 uF X7R 0402 ceramic placed within 2 mm of the pin, plus a single 10 uF bulk tantalum or ceramic near the package. Reflow profile should follow JEDEC J-STD-020 MSL-3 handling - bake-and-dry-pack if sealed bag is opened beyond floor life.
Do not assume all 85 I/O pins are 5 V tolerant - the PIC24FJ family is a 3.3 V part, and applying 5 V to any I/O will damage the silicon. Unused pins should be configured as digital outputs driving low to minimize sleep-mode leakage. The CTMU peripheral needs the dedicated CTMU pin mapping; not every ADC channel can be used as a CTMU current source, so check the pinout table in the family data sheet before designing capacitive touch electrodes. Finally, when migrating from PIC24FJ128GA610 (no USB) to PIC24FJ128GB610 (with USB), reserve the D+/D- balls for the USB connector and add external ESD protection (e.g., USBLC6-2SC6) on those lines.
Place the 32.768 kHz watch crystal within 5 mm of SOSC0/SOSC1 pins, with a guard ring tied to analog ground if low-RTC drift matters. The USB D+/D- traces must be 90 ohm differential with length matching within 2 mm; route over a continuous ground plane and keep them clear of switching nodes. Use the PPS peripheral to remap peripheral functions to convenient package pins, but verify the pin assignment in the actual data sheet pinout table - not every function can be routed to every pin. Estimated: at 16 MIPS CPU, average current is roughly 7 mA active and 20-60 nA deep-sleep with RTCC, enabling multi-year battery life on a CR2032 with duty-cycled operation.
규정 준수 정보
RoHS compliant per Microchip product page. The PIC24FJ128GB610 family is recommended for automotive design, but special AEC-Q100-qualified ordering codes apply - the standard I-temp part is not automotive-grade.
