DSPIC33EP512GM310-I/BG - 16-bit 70 MIPS DSC 512KB | Microchip
부품 번호: DSPIC33EP512GM310-I/BG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $7.48 | $7.48 |
| 10 | $7.1 | $71.00 |
| 100 | $6.8 | $680.00 |
| 500 | $6.5 | $3,250.00 |
| 1,000 | $6.2 | $6,200.00 |
DSPIC33EP512GM310-I/BG 개요
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and ease of use of a microcontroller. In the embedded hierarchy, the DSC sits between general-purpose MCUs and dedicated DSPs, making it the natural choice for control loops that also need fast multiply-accumulate math - motor control, digital power conversion, and sensor fusion. The dsPIC33EP family is Microchip's flagship 16-bit DSC platform, supported by MPLAB X IDE, XC16 compiler, and the MPLAB REAL ICE debugging ecosystem.
Key features of the GM310 variant include a 70 MIPS dsPIC DSC core with DSP instruction extensions, integrated operational amplifiers for direct current-shunt and sensor interfacing, two 3 MSPS high-speed ADCs, multiple PWM and motor-control peripherals (2 QEI modules), and rich connectivity including UART, SPI, I2C, and CAN per the Mouser feature summary (12 MC / 8 IC/OC / 2 QEI / 4 OpAmp class integration). ECCN is 3A991.a.2, and the part is halogen-free compliant per distributor data.
Architecturally, the dsPIC33E core uses a modified Harvard pipeline with single-cycle MAC, hardware divide support, and deterministic interrupt latency - essential for field-oriented motor control and digital power topologies where ISR jitter directly affects THD and control-loop bandwidth. The large 512KB FLASH enables complex field-oriented control (FOC) algorithms, communication stacks, and field firmware upgrades in a single-chip solution.
Typical applications include precision brushless DC and PMSM motor drives, digital power supplies and solar inverters, industrial automation sensor nodes, and automotive-adjacent control systems operating on 3.3V rails. The 121-TFBGA footprint offers high I/O density in a compact 10x10 mm area for space-constrained designs.
Design consideration: the BGA package requires controlled-impedance multilayer PCB fabrication and X-ray inspection capability for rework; the 100-TQFP (I/PT) variant of the same die is recommended for designs preferring hand-reworkable packages.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: DSPIC33EP512GM310-I/BG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33EP512GM310-I/BG (동일 폼 팩터 및 풋프린트) — 차이점: Core, Input Capture / Output Compare, Quadrature Encoder Interfaces, Motor Control PWM Channels, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33EP512GM310-E/BG
✅ 드롭인✓ 재고 있음
$5.95 / 개
데이터시트 보기 →DSPIC33EP512GM710T-I/BG
✅ 드롭인✓ 재고 있음
$7.44 / 개
데이터시트 보기 →DSPIC33EP256GM310-I/BG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →DSPIC33EP128GM310-I/BG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP512GM310-I/BG 최대 정격 & 전기적 특성
| Core | dsPIC33EP 16-bit DSC |
| CPU Speed | 70 MIPS |
| Program Memory (FLASH) | 512KB (170K x 24) |
| RAM | 48KB (per OnlineComponents; Mouser lists 16KB - verify with datasheet) |
| 공급 전압 | 3.3 V |
| 동작 온도 | -40C to +85C |
| 패키지 | 121-TFBGA (10x10 mm) |
| 실장 유형 | Surface Mount |
| Peripherals (Mouser summary) | 12 Motor Control PWM / 8 IC-OC / 2 QEI / 4 OpAmp |
| ADC | High-speed 3 MSPS ADC (per family datasheet) |
| Communication Interfaces | UART, SPI, I2C, CAN (per family datasheet) |
| Product Family | dsPIC33E (dsPIC33EP 512KB GM series) |
| Introduction Date | June 19, 2013 |
| ECCN | 3A991.a.2 |
| Estimated EOL Date | 2026 (per distributor data) |
| 할로겐 프리 | Compliant |
| Supply/Demand Status | Limited |
DSPIC33EP512GM310-I/BG 121-tfbga (10x10 mm) 핀 구성 가이드
DSPIC33EP512GM310-I/BG(121-tfbga (10x10 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33EP512GM310-I/BG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33EP512GM310-I/BG 적합 용도: 6 애플리케이션s: Precision Motor Control (FOC PMSM/BLDC), Digital Power Conversion, Industrial Automation and Sensing, Automotive-Adjacent Control Units, Battery Management and Portable Instruments, Embedded Networking Gateways.
Precision Motor Control (FOC PMSM/BLDC)
The DSPIC33EP512GM310-I/BG is purpose-built for field-oriented control of PMSM and BLDC motors. Its 70 MIPS DSP core executes single-cycle MAC instructions for the Park/Clarke transforms and PI current loops, while 12 motor-control PWM channels generate complementary dead-time-controlled drive signals. The 2 quadrature encoder interfaces decode position feedback, and the 4 integrated op-amps amplify shunt currents before the high-speed ADCs sample phase currents simultaneously. In a typical 3-shunt FOC drive, the controller closes current loops at 10-20 kHz with deterministic interrupt latency, achieving smooth low-speed torque. Use the Microchip Motor Control application libraries on this die to shorten development cycles.
추천
Digital Power Conversion
Switching power supplies, solar inverters, and PFC stages benefit from the GM310's deterministic 70 MIPS core and high-speed 3 MSPS ADCs, which sample input/output voltage and inductor current with the timing precision digital power loops require. The motor-control PWM peripheral is easily repurposed for phase-shifted full-bridge or interleaved buck topologies with programmable dead time. The 512KB FLASH holds compensation algorithms, protection state machines, and communication firmware (UART/SPI/I2C/CAN) simultaneously. Unlike analog controllers, firmware control allows nonlinear compensation and adaptive dead-time optimization. Keep ADC sampling synchronized to PWM triggers to minimize conversion jitter and THD.
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Industrial Automation and Sensing
In factory automation nodes, the GM310 combines signal-chain integration with industrial connectivity. The 4 on-chip op-amps condition analog sensor signals (pressure, load cells, encoders) without external amplifiers, reducing BOM cost and board area in the compact 10x10 mm BGA footprint. CAN, UART, SPI, and I2C interfaces connect to PLCs, HMIs, and field buses. The 70 MIPS headroom supports FFT-based vibration analysis and digital filtering at the edge. Operating from 3.3V at -40C to +85C, it suits unconditioned cabinet environments. The -E/BG extended-temperature sibling is available for hot-mounted installations near drives or heaters.
추천
Automotive-Adjacent Control Units
While the standard -I grade is not AEC-Q100 qualified per the retrieved data, the GM310 architecture with dual-CAN capable siblings (GM710T-I/BG in the same package) fits non-safety-critical vehicle functions such as auxiliary pump control, lighting actuators, and accessory motor drives. The 70 MIPS core handles sensor fusion and diagnostics, motor-control PWM drives actuators, and CAN networking integrates with body controllers. 512KB FLASH stores bootloaders supporting field OTA firmware updates. For programs requiring documented automotive qualification, consult Microchip for the corresponding automotive-grade variant before locking the 121-TFBGA footprint into the design.
추천
Battery Management and Portable Instruments
Battery-powered test and measurement instruments leverage the GM310's DSP throughput for signal processing while peripheral integration keeps the power budget manageable. The high-speed ADCs sample battery voltage, current, and cell temperatures for coulomb counting and state-of-charge estimation algorithms running on the 70 MIPS core. PWM channels control balancing FETs or charger stages, and UART/SPI/I2C support displays, radios, and host links. The compact 121-TFBGA (10x10 mm) suits handheld enclosures where board area is scarce. The 512KB FLASH supports rich GUI firmware and data logging; the -E/BG variant covers outdoor temperature extremes.
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Embedded Networking Gateways
Protocol-conversion gateways between CAN, RS-485/UART, and SPI/I2C devices run efficiently on the GM310. The 70 MIPS core handles framing, CRC checking, and store-and-forward buffering in 48KB RAM with margin for multiple simultaneous links. The 512KB FLASH hosts multiple protocol stacks plus a field-updatable bootloader, protecting long-deployment installations from obsolescence. Designers needing dual independent CAN channels can drop in the pin-compatible DSPIC33EP512GM710T-I/BG without PCB changes. Note the BGA package requires controlled-impedance fabrication; for hand-reworkable builds the same die in 100-TQFP (DSPIC33EP512GM310-I/PT) is an option.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33EP512GM310-I/BG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33EP512GM310-E/BG | DSPIC33EP512GM710T-I/BG | DSPIC33EP256GM310-I/BG | DSPIC33EP128GM310-I/BG |
|---|---|---|---|---|---|
| Package | 121-TFBGA (10x10) | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| FLASH Memory | 512KB (170K x 24) | 512KB | 512KB | 256KB | 128KB |
| Operating Temperature | -40C to +85C | -40C to +125C (extended) | -40C to +85C | -40C to +85C | -40C to +85C |
| CAN Channels | CAN (standard GM310 feature set) | CAN (standard) | Dual CAN (enhanced) | CAN (standard) | CAN (standard) |
| Package Alternative (same die) | 121-TFBGA (this SKU) | 121-TFBGA | 121-TFBGA | 121-TFBGA | 121-TFBGA |
주요 차별점
- Extended temperature capability in identical footprint (vs DSPIC33EP512GM310-E/BG)
- Standard CAN feature set at lower family price point (vs DSPIC33EP512GM710T-I/BG)
- Full 512KB FLASH for complex firmware (vs DSPIC33EP256GM310-I/BG)
설계 노트
The 121-TFBGA (10x10 mm) package requires a multilayer PCB with via-in-pad or dog-bone fanout, solder-mask-defined or NSMD pads per Microchip's package outline drawing, and X-ray inspection capability for production rework. Estimated: at 0.8 mm ball pitch, standard 4-layer stackups with 4/4 mil trace/space are typically sufficient for fanout. If your assembly line lacks BGA rework capability, the identical die in 100-TQFP (DSPIC33EP512GM310-I/PT) is the rework-friendly choice.
Decouple every VDD/VDDCORE pair with 100 nF ceramics placed within 2 mm of the balls, plus bulk 10 uF per supply domain. The dsPIC33E core requires the internal regulator's recommended capacitor per the family datasheet - do not omit it or the core may brown out at 70 MIPS. Estimated: at 3.3V the device draws tens of mA at full-speed operation, but switching current spikes during FLASH writes make a solid ground plane under the BGA mandatory.
Distributor RAM data conflicts (Mouser: 16KB vs OnlineComponents: 48KB) - confirm actual RAM from the official family datasheet before allocating buffers, since FOC control structures plus CAN/UART buffers can exceed 16KB. Also note the retrieved data flags an estimated EOL of 2026 and Limited supply status; for long-life products, design the footprint so the pin-compatible GM710T-I/BG or the -E/BG grade can be second-sourced without a PCB respin.
Keep the high-speed ADC reference and the 4 on-chip op-amp inputs away from PWM switching nodes. Route motor-control PWM outputs on an outer layer with series termination resistors (10-22 ohm) near the BGA balls to control gate-drive ringing. Estimated: with 3 MSPS ADC sampling synchronized to PWM triggers, any ground bounce between power and analog grounds directly appears as current-sense noise - use a single-point analog ground tie.
규정 준수 정보
Halogen Free: Compliant per distributor datasheet metadata; ECCN 3A991.a.2. RoHS/lead-free inferred from current Microchip production status; REACH and conflict-minerals declarations not stated in retrieved data - confirm on Microchip product page.
