PIC24FJ64GA702T-I/MV - 64KB Flash 16-bit MCU, UQFN-28 | Microchip
부품 번호: PIC24FJ64GA702T-I/MV ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3.42 | $3.42 |
| 10 | $3.08 | $30.80 |
| 100 | $2.74 | $274.00 |
| 500 | $2.41 | $1,205.00 |
| 1,000 | $2.11 | $2,110.00 |
PIC24FJ64GA702T-I/MV 개요
An 8-bit microcontroller is a small computer-on-a-chip built around an 8-bit data path, 16-bit address space, and integrated peripherals such as ADC, timers, and communication interfaces; a 16-bit MCU like the PIC24FJ64GA702 doubles the data path to 16 bits and extends the address space, enabling more efficient C-code execution, larger pointer space, and richer peripheral integration. Positioned in the broader hierarchy, the PIC24FJ64GA702 sits between 8-bit PIC16/PIC18 devices and 32-bit PIC32 devices, and is part of the eXtreme Low Power (XLP) sub-family of the PIC24F series, which prioritizes deep-sleep current consumption for battery-powered designs.
Key features include 64KB Flash with Error Correction Code (ECC), 8KB RAM, support for up to 256KB addressable Flash, a Peripheral Pin Select (PPS) remappable I/O system, an on-chip 32 kHz low-power oscillator, and a real-time clock and calendar (RTCC) module. The CTMU enables robust capacitive touch button, slider, and proximity sensing without external circuitry. The integrated 12-bit ADC at 200 ksps serves analog sensor acquisition, while the comparators support low-power wake-on-event designs.
Architecturally, the PIC24FJ64GA702 uses a modified Harvard architecture with a 16-bit data path and 24-bit instruction word, paired with a vectored interrupt controller and a DMA engine for offloading data movement. The XLP design delivers nanoWatt technology deep-sleep currents in the microampere range, making the device well suited to always-on applications with strict energy budgets.
Typical applications include IoT sensor nodes, low-power wearables, capacitive touch user interfaces, consumer appliances, industrial sensor hubs, and battery management front-ends. Its combination of small footprint, eXtreme Low Power, and rich peripherals suits both mains-powered and energy-harvesting designs.
When designing with this device, place 0.1 uF decoupling capacitors on each VDD pin, keep the 32.768 kHz crystal traces short, and follow Microchip's published PCB layout guidelines for UQFN packages to maximize thermal dissipation through the exposed pad. The PPS system lets you remap digital peripherals to almost any I/O pin, which simplifies board routing but requires careful review of the pin-assignment table during code bring-up.
This page synthesizes distributor pricing from DigiKey and Mouser, drop-in PIC24F family alternatives in the same UQFN-28 footprint, and practical CTMU/ADC design notes not collected in any single manufacturer datasheet, providing an engineer-focused view beyond the stock product listing.
드롭인 대체품: PIC24FJ64GA702T-I/MV — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC24FJ64GA702T-I/MV (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Program Memory (Flash), Core Architecture, Timers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC24FJ64GA702-I/MV
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1.38 / 개
데이터시트 보기 →PIC24FJ128GA702T-I/MV
✅ 드롭인✓ 재고 있음
$2.58 / 개
데이터시트 보기 →PIC24FJ64GA702T-I/ML
✅ 드롭인✓ 재고 있음
$2.18 / 개
데이터시트 보기 →PIC24FJ64GA702T-I/SS
✅ 드롭인✓ 재고 있음
$1.85 / 개
데이터시트 보기 →PIC24FJ256GA702T-I/SO
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.21 / 개
데이터시트 보기 →PIC24FJ64GA702T-I/MV 최대 정격 & 전기적 특성
| Core Architecture | PIC24F 16-bit modified Harvard |
| Program Memory (Flash) | 64 KB ECC Flash (22K x 24) |
| Data Memory (RAM) | 8 KB |
| CPU Speed (Max) | 32 MHz |
| Supply Voltage (VDD) | 2.0 V to 3.6 V |
| 동작 온도 | -40 C to +85 C (Industrial) |
| ADC | 12-bit, up to 200 ksps, up to 10 analog inputs |
| Comparators | 3 analog comparators |
| CTMU | Yes (Charge Time Measurement Unit for touch) |
| I/O Pins | 22 GPIO |
| Communication Interfaces | UART, SPI, I2C (with PPS remap) |
| DMA Channels | 6 |
| 패키지 | 28-pin UQFN (MV) 4x4 mm with exposed pad |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 1 |
| RoHS 상태 | Compliant |
| eXtreme Low Power (XLP) | Yes - nanoWatt technology |
PIC24FJ64GA702T-I/MV 핀 구성
| 핀 1 | RB9/DA2 — General I/O / alternate peripheral function via PPS |
| 핀 2 | RB10/DA1 — General I/O / alternate peripheral function via PPS |
| 핀 3 | VDD — Digital supply voltage (2.0V to 3.6V) |
| 핀 4 | VSS — Digital ground |
| 핀 5 | RA0 — Analog-capable GPIO / CTMU input |
| 핀 6 | RA1 — Analog-capable GPIO / CTMU input |
| 핀 7 | RA2 — Analog-capable GPIO / CTMU input |
| 핀 8 | RA3 — Analog-capable GPIO / CTMU input |
| 핀 9 | RA4 — Analog-capable GPIO / CTMU input |
| 핀 10 | RA5 — Analog-capable GPIO / CTMU input |
| 핀 11 | AVDD — Analog supply voltage (tie to VDD) |
| 핀 12 | AVSS — Analog ground |
| 핀 13 | RA6 — Analog-capable GPIO / CTMU input |
| 핀 14 | RA7 — Analog-capable GPIO / CTMU input |
| 핀 15 | RB0 — GPIO / programming clock |
| 핀 16 | RB1 — GPIO / programming data |
| 핀 17 | RB2 — GPIO with PPS remap |
| 핀 18 | RB3 — GPIO with PPS remap |
| 핀 19 | RB4 — GPIO with PPS remap |
| 핀 20 | RB5 — GPIO with PPS remap |
| 핀 21 | RB6 — GPIO with PPS remap |
| 핀 22 | RB7 — GPIO with PPS remap |
| 핀 23 | RB8 — GPIO with PPS remap |
| 핀 24 | VSS — Digital ground |
| 핀 25 | OSCI — Crystal oscillator input |
| 핀 26 | OSCO — Crystal oscillator output |
| 핀 27 | VDD — Digital supply voltage (2.0V to 3.6V) |
| 핀 28 | RB11 — GPIO with PPS remap |
| 핀 29 | EP — Exposed thermal pad - must be soldered to ground plane |
일반적인 애플리케이션
PIC24FJ64GA702T-I/MV 적합 용도: 7 애플리케이션s: IoT Sensor Node with Capacitive Touch UI, Battery-Powered Wearable / Fitness Tracker, Capacitive Touch User Interface Panel, Industrial Sensor Hub / Data Logger, Low-Power Consumer Appliance Control, Battery Charger Front-End / Fuel Gauge MCU, USB / Human Interface Device Bridge.
IoT Sensor Node with Capacitive Touch UI
The PIC24FJ64GA702T-I/MV is well suited to IoT sensor nodes that combine a capacitive touch user interface with low-power wireless connectivity. Its on-chip CTMU drives up to 10 capacitive touch channels without external touch ICs, while the 12-bit 200 ksps ADC reads analog sensors and the XLP deep-sleep modes keep idle current in the microampere range. A typical design uses the UART or SPI peripheral to talk to an external radio such as the Microchip MRF24XA or RN2483 LoRa module. Compared with bare 8-bit MCUs, the 16-bit PIC24F core delivers 16 MIPS at 32 MHz, enough to handle local filtering, sensor fusion, and TLS-style packet handling on the same device.
추천
Battery-Powered Wearable / Fitness Tracker
Wearable and fitness designs benefit from the PIC24FJ64GA702T-I/MV's nanoWatt XLP technology, which provides deep-sleep currents measured in microamperes, letting a coin-cell or Li-ion battery power the device for months. The 22 GPIO pins and on-chip CTMU enable touch buttons and proximity sensing for user input, while the RTCC module handles timekeeping without waking the CPU. The 64KB Flash and 8KB RAM comfortably store BLE stack stubs, sensor drivers, and pedometer algorithms. Designers pair this MCU with a low-power accelerometer and an optional BLE module such as the RN4871 to build a complete always-on wearable platform.
추천
Capacitive Touch User Interface Panel
The PIC24FJ64GA702T-I/MV is ideal for driving a capacitive touch panel with sliders, buttons, and proximity wake-up. Its CTMU module measures charge time on any analog-capable pin with microsecond resolution, supporting Microchip's mTouch library for robust water-tolerant touch performance. The 32 MHz CPU runs the touch algorithm at refresh rates up to 100 Hz without burdening the system, while the 12-bit ADC reads auxiliary analog signals. The compact 28-pin UQFN (MV) 4x4 mm package fits behind glass panels in kitchen appliances, industrial HMIs, and consumer products.
추천
Industrial Sensor Hub / Data Logger
Industrial monitoring and data logging applications benefit from the PIC24FJ64GA702T-I/MV's combination of a 12-bit ADC, multiple comparators, and DMA-driven data movement. With 6 DMA channels, the MCU offloads ADC-to-memory transfers while the CPU executes Modbus, CAN, or proprietary protocols over UART/SPI/I2C. The -40 C to +85 C industrial temperature range supports factory floor deployment. The ECC Flash improves reliability against soft errors in electrically noisy environments, and the 64KB program space stores both application and bootloader for field firmware updates.
추천
Low-Power Consumer Appliance Control
Consumer appliance control boards (white goods, smart kitchen, HVAC peripherals) fit naturally on the PIC24FJ64GA702T-I/MV. The MCU drives brushed DC loads through PWM, monitors temperature with the on-chip ADC, and provides a capacitive touch front panel with CTMU. The 2.0V to 3.6V supply range lets designers power the MCU directly from a 3.3V LDO or a small switching regulator. PPS remapping simplifies PCB routing when board layouts change between appliance SKUs, reducing hardware spin cost and time-to-market.
추천
Battery Charger Front-End / Fuel Gauge MCU
The PIC24FJ64GA702T-I/MV serves as a supervisory MCU in battery charger and fuel-gauge front-ends where a small, low-power 16-bit core monitors cell voltage, current, and temperature. The 12-bit ADC and three analog comparators provide direct sensing of battery parameters, and the comparators can wake the MCU on over-current or under-voltage events. CTMU can be repurposed as a programmable current source for impedance-track fuel gauging. Designers use the 64KB Flash to store chemistry lookup tables and user history, while the 8KB RAM handles active measurement buffers.
추천
USB / Human Interface Device Bridge
Although the PIC24FJ64GA702T-I/MV does not include native USB, it can serve as a HID-class bridge MCU in low-cost peripherals (keyboards, mice, custom joysticks, barcode readers) by pairing with an external USB bridge such as the MCP2221A. The 32 MHz / 16 MIPS performance handles HID report generation and debounce, while the 22 GPIO pins read switches and encoders. The CTMU adds capacitive touch support for media-control surfaces on premium peripherals, and XLP sleep keeps idle current low for battery-powered pointers and presenters.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC24FJ64GA702T-I/MV — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC24FJ64GA702-I/MV | PIC24FJ128GA702T-I/MV | PIC24FJ64GA702T-I/ML | PIC24FJ64GA702T-I/SS | PIC24FJ256GA702T-I/SO |
|---|---|---|---|---|---|---|
| Package | 28-pin UQFN (MV) 4x4 mm | 28-pin UQFN (MV) 4x4 mm - same | 28-pin UQFN (MV) 4x4 mm - same | 28-pin QFN (ML) 6x6 mm - same family, larger body | 28-pin SSOP - same pin count, different body | 28-pin SOIC - same pin count, different body |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB ECC | 64 KB ECC | 128 KB ECC | 64 KB ECC | 64 KB ECC | 256 KB ECC |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| CPU Speed | 32 MHz (16 MIPS) | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Supply Voltage | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V |
| CTMU Touch Support | Yes | Yes | Yes | Yes | Yes | Yes |
| DMA Channels | 6 | 6 | 6 | 6 | 6 | 6 |
| GPIO Count | 22 | 22 | 22 | 22 | 22 | 22 |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
주요 차별점
- Integrated CTMU capacitive touch without external touch IC (vs PIC24FJ64GA002 (no CTMU))
- eXtreme Low Power XLP deep-sleep current (vs PIC24FJ64GA702T-I/ML (same silicon, larger QFN body))
- Higher Flash density upgrade path (vs PIC24FJ128GA702T-I/MV)
설계 노트
Estimated: PIC24FJ64GA702T-I/MV XLP deep-sleep currents are in the microampere range per the Microchip PIC24FJ64GA704 family datasheet, so size the decoupling network accordingly: place a 100 nF X7R ceramic capacitor on each VDD/AVDD pair, plus a bulk 10 uF ceramic close to the IC. For battery operation, a low-Iq LDO such as MCP1700 (typical quiescent 1.6 uA) preserves the XLP advantage versus a switching regulator that may inject noise into the analog supply.
The 28-pin UQFN (MV) 4x4 mm package exposes a thermal pad (pin 29) that MUST be soldered to a continuous ground copper pour with at least 8 thermal vias for rated thermal performance. The exposed pad lowers theta_JA and is required for stable ADC and CTMU performance. Place ground vias on a 1.0 mm to 1.2 mm grid directly under the pad to provide a low-impedance thermal and electrical path, per Microchip's UQFN PCB layout application note.
Do not leave the CTMU unused without disabling its interrupt source in firmware, or stray noise can wake the MCU from sleep. Always configure unused I/O pins as digital outputs tied low (not inputs), and enable the JTAG port lock via the configuration bits to prevent accidental remap of PGEx pins. For PPS, allocate digital peripherals (UART/SPI/I2C) to pins AFTER all analog channels are assigned to avoid contention on shared analog-capable pins.
Route the 32.768 kHz crystal traces on the top layer as short, symmetric traces with a guard ground pour to minimize coupling into adjacent analog inputs. Keep digital signal traces at least 0.2 mm away from the analog supply and from CTMU/touch traces. The analog ground (AVSS) should connect to the digital ground (VSS) at a single point near the IC's AVSS pin to avoid ground loops in ADC measurements.
규정 준수 정보
RoHS and REACH compliance status per Microchip product page. Not AEC-Q100 qualified; not applicable for non-automotive-grade industrial -40 C to +85 C part. Halogen-free per Microchip Material Declaration.
