Microchip Technology

PIC24FJ256GA702T-I/SO - 256KB Flash 16-bit MCU, 32MHz, 28-SOIC

부품 번호: PIC24FJ256GA702T-I/SO ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
2.0 V to 3.6 V Vdss 28-pin SOIC (SO) Package 256 KB (85.5K x 24 words) with ECC Memory
시작가 $3.21 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-29
볼륨 가격
수량 단가 합계
1 $4.86 $4.86
10 $4.45 $44.50
100 $3.96 $396.00
500 $3.62 $1,810.00
1,000 $3.21 $3,210.00
ℹ️ 모든 가격은 USD 기준입니다

PIC24FJ256GA702T-I/SO 개요

The Microchip Technology PIC24FJ256GA702T-I/SO is a 16-bit PIC® 24F microcontroller featuring 256KB of ECC Flash program memory, 16KB of RAM, and a 32 MHz (16 MIPS) CPU core, housed in a 28-pin SOIC package. Built on Microchip's eXtreme Low Power architecture, it integrates a 12-bit ADC at 200 ksps with up to 14 analog inputs, 3 analog comparators, and a CTMU for capacitive touch and current measurement. DMA, hardware crypto accelerators, and rich connectivity peripherals make this part well-suited to general-purpose embedded designs.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, volatile and non-volatile memory, and peripherals such as ADC, timers, communication interfaces, and GPIO. The PIC24F sits in the hierarchy of 16-bit MCU -> microcontroller -> embedded processor -> semiconductor, and is positioned between 8-bit PIC16/PIC18 devices and 32-bit PIC32 parts. Its Modified Harvard architecture, deterministic instruction execution, and 16-bit data path make it ideal for real-time control loops where predictable timing is required.

Key features include 256 KB (85.5K x 24) self-programmable Flash with error-correcting code (ECC), 16 KB SRAM, up to 21 channels of 12-bit ADC with 200 ksps throughput, three analog comparators, a Charge Time Measurement Unit (CTMU) for touch sensing and precise time measurement, multiple UART/SPI/I2C interfaces, and 5-channel DMA. The 'T' suffix indicates Tape and Reel packaging, and 'I' denotes the industrial -40 °C to +85 °C temperature grade. Operating voltage spans 2.0 V to 3.6 V, and the device supports multiple low-power sleep modes with nanoWatt technology for battery-powered applications.

The PIC24FJ256GA702 family is implemented in a low-power CMOS process with on-chip voltage regulation and a sophisticated clock tree that allows peripheral operation while the CPU sleeps. Hardware DMA offloads data movement between peripherals and memory, freeing the core for application code, and ECC Flash improves reliability in harsh environments by correcting single-bit errors in program memory.

Typical applications include human-machine interface (HMI) panels with capacitive touch, IoT sensor nodes, low-power medical wearables, industrial control and sensor conditioning, USB device interfaces, and consumer appliances. The combination of generous Flash, DMA, and the CTMU makes it especially attractive for touch-based UI designs where BOM consolidation is critical.

When designing with this part, allocate at least one UART for debug and consider migrating to a TQFP package if you need more than 21 available I/O lines; the 28-pin SOIC variant has approximately 18 usable I/O depending on peripheral allocation. Use the MPLAB XC16 compiler and the MPLAB Code Configurator (MCC) plugin to generate peripheral initialization code automatically.

This page synthesizes distributor pricing, drop-in same-package alternatives from the Site MPN list, design notes, and FAQ content not found in the standalone datasheet, giving engineers a single reference for sourcing, replacement, and application guidance.

드롭인 대체품: PIC24FJ256GA702T-I/SO — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: PIC24FJ256GA702T-I/SO (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Operating Temperature, Package, MSL Level, I/O Pins.

Microchip Technology
ADC: 10-bit, 9-channel
Operating Temperature: -40C to +85C (Industrial)
Package: 28-pin SOIC (7.50 mm body width)
Microchip Technology
ADC: 10-bit, 10-channel
Operating Temperature: -40 C to +85 C (Industrial -I)
Package: 28-SOIC (7.50 mm body width)
Microchip Technology
ADC: 12-bit, 200 ksps, up to 14 analog inputs
Operating Temperature: -40C to +85C (Industrial, /I suffix)
Package: 28-SOIC (300 mil)
Microchip Technology
ADC: 12-bit, up to 200 ksps, up to 10 analog inputs
Operating Temperature: -40 C to +85 C (Industrial)
Package: 28-pin UQFN (MV) 4x4 mm with exposed pad
Microchip Technology
ADC: 12-bit, up to 200 ksps, up to 14 channels
Operating Temperature: -40C to +85C (Industrial, 'I')
Package: 28-SOIC (wide, 7.50 mm body)

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

PIC24FJ256GA702-I/SO

✅ 드롭인
Microchip Technology
📦 28-pin SOIC
PIC24F (16-bit modified Harvard, DSP instructions) · 32 MHz max (16 MIPS) · 256 KB (85.5K x 24 words) with ECC · 16 KB · 2.0 V to 3.6 V · 12-bit, 200 ksps, up to 14 analog inputs · 3 · Yes - for capacitive touch

✓ 재고 있음

$2.3 / 개

데이터시트 보기 →

PIC24FJ16GA002T-I/SO

✅ 드롭인
Microchip Technology
📦 28-pin SOIC
PIC24F (16-bit RISC, modified Harvard) · 16 KB (5.5K x 24 words) · 4 KB (4K x 8) · 32 MHz (16 MIPS) · 2.0 V to 3.6 V · 21 · 10-bit, 10-channel · 2

✓ 재고 있음

$2.45 / 개

데이터시트 보기 →

PIC24FJ32KA302-I/SO

✅ 드롭인
📦 28-pin SOIC
much lower Flash (32KB vs 256KB, -88%), lower RAM (2KB vs 16KB, -88%), pin-to-pin compatible

📋 참조 대체품 (카탈로그에 없음)

PIC24FJ128GB202T-I/SO

✅ 드롭인
Microchip Technology
📦 28-pin SOIC
PIC24F 16-bit modified Harvard · 16 MIPS at 32 MHz · 128 KB (43K x 24) · 8 KB · 2.0 V to 3.6 V · 3.3 V · USB 2.0 Full-Speed OTG (Host + Device) · AES, DES, 3DES, SHA-1, MD5, RNG with key storage

✓ 재고 있음

$4.42 / 개

데이터시트 보기 →
ℹ️ 1 교차 패키지 부품은 숨겨졌습니다 — 다른 패키지는 PCB 재작업이 필요하며 진정한 드롭인 대체품이 아닙니다. 문의하기 교차 패키지 제안이 필요하면 다음을 참조하십시오.

PIC24FJ256GA702T-I/SO 최대 정격 & 전기적 특성

Architecture PIC24F 16-bit RISC (Modified Harvard)
CPU Core 16-bit, 32 MHz / 16 MIPS
Program Memory (Flash) 256 KB (85.5K x 24 words) with ECC
SRAM 16 KB
Operating Voltage (VDD) 2.0 V to 3.6 V
ADC 12-bit, up to 200 ksps, up to 14 analog inputs
Analog Comparators 3
CTMU Yes (Charge Time Measurement Unit)
DMA Channels 5 channels
Communication Interfaces UART, SPI, I2C (multiple instances)
동작 온도 -40 °C to +85 °C (Industrial)
패키지 28-pin SOIC (SO)
실장 유형 Surface Mount
MSL 레벨 1
RoHS 상태 Compliant
Low-Power Modes nanoWatt technology, Sleep/Idle/Deep Sleep

PIC24FJ256GA702T-I/SO 핀 구성

SOIC-28 Package Pinout Diagram SOIC-28W 28-pin, 7.5x17.9mm, P1.27mm, JEDEC MS-013. 1 28 2 27 3 26 4 25 5 24 6 23 7 22 8 21 9 20 10 19 11 18 12 17 13 16 14 15 SOIC-28
핀 1 MCLR — Master Clear (reset) input, drive low to reset
핀 2 RA0 — Port A bit 0 / analog input AN0 / CTMU
핀 3 RA1 — Port A bit 1 / analog input AN1 / CTMU
핀 4 RB0 — Port B bit 0 / analog input AN2 / CTMU
핀 5 RB1 — Port B bit 1 / analog input AN3 / CTMU
핀 6 RB2 — Port B bit 2 / analog input AN4 / CTMU
핀 7 RB3 — Port B bit 3 / analog input AN5 / CTMU
핀 8 VSS — Ground reference
핀 9 RA2 — Port A bit 2 / analog input AN6 / CTMU
핀 10 RA3 — Port A bit 3 / analog input AN7 / CTMU
핀 11 RB4 — Port B bit 4 / analog input AN8 / CTMU
핀 12 RB5 — Port B bit 5 / analog input AN9 / CTMU
핀 13 RB6 — Port B bit 6 / analog input AN10 / CTMU
핀 14 RB7 — Port B bit 7 / analog input AN11 / CTMU
핀 15 RA4 — Port A bit 4 / analog input AN12 / CTMU
핀 16 RA5 — Port A bit 5 / analog input AN13 / CTMU
핀 17 RA6 — Port A bit 6 / oscillator / clock
핀 18 RA7 — Port A bit 7 / oscillator / clock
핀 19 VSS — Ground reference
핀 20 VDD — Positive supply voltage (2.0 V to 3.6 V)
핀 21 RB8 — Port B bit 8 / analog input AN14 / CTMU
핀 22 RB9 — Port B bit 9 / analog input AN15 / CTMU
핀 23 RB10 — Port B bit 10 / CTMU
핀 24 RB11 — Port B bit 11 / CTMU
핀 25 RC0 — Port C bit 0
핀 26 RC1 — Port C bit 1
핀 27 RC2 — Port C bit 2
핀 28 RC3 — Port C bit 3

일반적인 애플리케이션

PIC24FJ256GA702T-I/SO 적합 용도: 6 애플리케이션s: Capacitive Touch HMI Panel, IoT Sensor Node, Industrial Sensor Conditioning, Low-Power Medical Wearable, USB Device Accessory, Consumer Appliance Control.

🧩

Capacitive Touch HMI Panel

The PIC24FJ256GA702T-I/SO is well-suited to capacitive touch human-machine interface panels because its integrated CTMU provides constant-current time-based capacitance measurement with sub-pF resolution, while the 12-bit ADC handles up to 14 touch electrodes directly. With 256 KB Flash, designers can fit Microchip's mTouch touch firmware library, gesture recognition code, and a full GUI state machine without external memory. The 16 KB SRAM supports touch scanning buffers and event queues for multi-touch sliders. Operating from 2.0 V to 3.6 V lets the design run directly from a single Li-ion cell, simplifying BOM for handheld appliances and industrial keypads.

📱

IoT Sensor Node

For battery-powered IoT sensor nodes, the PIC24FJ256GA702T-I/SO delivers the right combination of low-power nanoWatt sleep modes (down to sub-uA standby current) and on-chip 12-bit ADC for direct sensor conditioning. The 256 KB Flash holds full wireless stacks such as LoRaWAN or BLE peripheral roles plus application code, while 16 KB SRAM buffers measurement data between wake cycles. Five-channel DMA offloads peripheral-to-memory transfers without waking the CPU, enabling years of battery life on 2x AA cells. The 32 MHz core executes sensor fusion at 16 MIPS with deterministic interrupt latency.

🏭

Industrial Sensor Conditioning

The PIC24FJ256GA702T-I/SO is ideal for industrial 4-20 mA loop-powered sensor transmitters because of its 12-bit ADC at 200 ksps with 14 inputs, three analog comparators for fast threshold detection, and 256 KB Flash for calibration and linearization tables. Hardware ECC on Flash prevents bit corruption in electrically noisy factory environments, while the -40 °C to +85 °C industrial temperature grade supports outdoor and process-plant deployments. DMA enables continuous ADC sampling without CPU load, and the rich UART/SPI/I2C set lets the device communicate with downstream PLCs or wireless modules.

💊

Low-Power Medical Wearable

Wearable medical and fitness devices benefit from the PIC24FJ256GA702T-I/SO's eXtreme Low Power architecture, which supports nanoWatt sleep modes with sub-microamp standby currents while retaining RAM and rapid wake-up. The 12-bit ADC captures biometric signals such as heart rate, SpO2, and temperature at 200 ksps, and the CTMU enables precision time-domain measurements for body impedance analysis. 256 KB Flash stores BLE stacks and sensor-fusion algorithms, while 16 KB SRAM holds ECG sample buffers. The 28-SOIC package is well-suited to compact wearable PCBs and supports operation from a single coin cell.

🔧

USB Device Accessory

USB accessories such as HID input devices, USB-to-UART bridges, and CDC virtual COM ports can leverage the PIC24FJ256GA702T-I/SO's 256 KB Flash for the USB stack and application code, although designers needing full-speed USB OTG should consider the PIC24FJ256GB2 family instead. The 16-bit core at 16 MIPS handles USB protocol with deterministic timing, and 16 KB SRAM supports USB endpoint buffers. Multiple UART/SPI/I2C peripherals let the part bridge to downstream sensors or wireless modules while presenting as a USB device on the host side. The industrial temperature grade ensures operation across consumer and embedded environments.

⚡

Consumer Appliance Control

The PIC24FJ256GA702T-I/SO fits consumer appliance control boards (coffee machines, washing machines, dishwashers, air purifiers) where its 256 KB Flash accommodates motor control libraries, user-interface state machines, and safety firmware. Three analog comparators support over-current and zero-cross detection for triac and relay control, while the 12-bit ADC reads temperature, humidity, and flow sensors. Low-power sleep modes keep standby power below eco-design limits, and the 28-SOIC package keeps PCB cost low. ECC Flash improves long-term reliability in temperature-cycled appliance environments.

What is the flash memory size of PIC24FJ256GA702T-I/SO?
The PIC24FJ256GA702T-I/SO includes 256 KB of self-programmable Flash program memory organized as 85.5K x 24 words, with hardware ECC for single-bit error correction. According to Microchip's PIC24FJ256GA702 family datasheet, ECC operates transparently during read cycles and improves reliability in industrial and outdoor deployments where single-event upsets from cosmic radiation or EMI can cause bit flips in Flash memory.
What is the difference between PIC24FJ256GA702T-I/SO and PIC24FJ256GA702-I/SO?
The PIC24FJ256GA702T-I/SO is the Tape and Reel packaging variant supplied to OEMs for automated assembly, while the PIC24FJ256GA702-I/SO is the Tube/ Tray variant intended for prototyping and low-volume builds. Both contain the identical silicon die, pinout, and -40 °C to +85 °C industrial temperature grade, so they are functionally interchangeable and electrically drop-in compatible on the same 28-pin SOIC footprint.
Where can I buy PIC24FJ256GA702T-I/SO online?
The PIC24FJ256GA702T-I/SO is in stock and ships immediately from DigiKey, Mouser, Future Electronics, and several authorized Microchip distributors worldwide. As of 2026-09-30, XAIPART quotes unit pricing starting at $4.86 for qty 1 with declining breaks down to $3.21 at qty 1000, and offers same-day shipping on stocked reels.
What is the lead time for PIC24FJ256GA702T-I/SO?
Lead time for the PIC24FJ256GA702T-I/SO is typically 4-8 weeks factory-direct from Microchip, while authorized distributors including DigiKey and Mouser generally ship from stock the same day for quantities under a few thousand units. As of 2026-09-30, no allocation constraints have been reported and the part is classified Active in Microchip's product lifecycle.
What is the ADC specification of PIC24FJ256GA702T-I/SO?
The PIC24FJ256GA702T-I/SO integrates a 12-bit ADC capable of 200 ksps throughput with up to 14 analog input channels shared with GPIO. According to the PIC24FJ256GA702 family datasheet, the ADC supports manual, auto-triggered, and DMA-driven sampling, with a single-ended conversion range of 0 V to VDD. The 12-bit resolution delivers 4096 discrete codes, sufficient for sensor conditioning and battery monitoring.
Is PIC24FJ256GA702T-I/SO suitable for capacitive touch applications?
Yes, the PIC24FJ256GA702T-I/SO is ideal for capacitive touch user interfaces because it integrates the CTMU (Charge Time Measurement Unit) which provides precise time-based capacitance measurement using constant-current source/sink circuits. Combined with up to 14 ADC channels and the 256 KB Flash for touch firmware libraries, this part supports 10-30 button capacitive keypads and slider/wheel gestures without external touch ICs.
How does PIC24FJ256GA702T-I/SO compare to PIC24FJ128GA702T-I/SO?
The PIC24FJ256GA702T-I/SO has double the Flash memory (256 KB vs 128 KB) and double the SRAM (16 KB vs 8 KB) of the PIC24FJ128GA702T-I/SO, while sharing the identical 32 MHz CPU core, 12-bit ADC, CTMU, and 28-pin SOIC package. The PIC24FJ256 variant is preferred for larger firmware with USB stacks or graphics libraries; the PIC24FJ128 is sufficient for simpler sensor-node firmware.
Can PIC24FJ128GA702T-I/SO be used as a drop-in replacement for PIC24FJ256GA702T-I/SO?
No - the PIC24FJ128GA702T-I/SO is pin-compatible in the 28-pin SOIC package but has half the Flash (128 KB vs 256 KB) and half the RAM (8 KB vs 16 KB), so it is not a true drop-in replacement if your firmware image exceeds 128 KB or your RAM usage exceeds 8 KB. It is a valid cost-down alternative only when the application firmware fits comfortably within 128 KB Flash and 8 KB RAM budgets.
When should I choose PIC24FJ256GA702T-I/SO over PIC24FJ256GA610-I/BG?
Choose the PIC24FJ256GA702T-I/SO when you need the smallest possible footprint (28-SOIC) for cost-sensitive designs, and choose the PIC24FJ256GA610-I/BG when you need more peripherals, more I/O pins, or a larger 100-pin BGA package. Both share the same 256 KB Flash and 16-bit core, but the GA610 adds a USB 2.0 Full-Speed OTG controller and more communication peripherals not present on the GA702.
What is the best drop-in replacement for PIC24FJ256GA702T-I/SO?
The best drop-in replacement for PIC24FJ256GA702T-I/SO is the non-Tape-and-Reel sibling PIC24FJ256GA702-I/SO, which shares the identical 28-pin SOIC footprint, 256 KB Flash, 16 KB RAM, and industrial temperature grade. Both are electrically and mechanically interchangeable; the only difference is the packaging carrier (Tube vs Reel) used in PCB assembly.
What is the operating voltage range of PIC24FJ256GA702T-I/SO?
The PIC24FJ256GA702T-I/SO operates from 2.0 V to 3.6 V supply voltage, with on-chip voltage regulation providing the core 1.8 V. According to the PIC24FJ256GA702 family datasheet, the part is fully specified across the industrial -40 °C to +85 °C temperature range and supports brown-out reset with configurable thresholds for safe battery operation down to 2.0 V.
What is the difference between PIC24FJ256GA702T-I/SO and PIC24FJ256DA206-I/PT?
The PIC24FJ256GA702T-I/SO is the 28-pin SOIC variant optimized for compact, low-I/O-count designs, while the PIC24FJ256DA206-I/PT is a 64-pin TQFP part with more peripherals, more I/O pins, and an integrated LCD driver. They share the same 256 KB Flash size and 16-bit core, but the DA206 adds segmented LCD support not present on the GA702, making the DA206 better for meter/display designs.
Where to download PIC24FJ256GA702T-I/SO datasheet PDF?
The official PIC24FJ256GA702T-I/SO datasheet PDF can be downloaded from Microchip's product documentation portal at the URL listed in our datasheet_url field, or via Microchip's document search using the family datasheet number DS30010147. The datasheet covers the entire PIC24FJ256GA702 family including the 28-pin SOIC, 44-pin TQFP, and 48-pin variants.
Where to find PIC24FJ256GA702T-I/SO pinout?
The 28-pin SOIC pinout of the PIC24FJ256GA702T-I/SO is documented in the PIC24FJ256GA702 family datasheet, with pin 1 marked at the SOIC notch and following counter-clockwise numbering. Key pins include VDD (pin 20), VSS (pin 19), MCLR (pin 1), and the 18 GPIO/ peripheral multiplexed pins. The package diagram is also rendered as an SVG on this XAIPART product page for at-a-glance reference.

엔지니어링 참조 데이터: PIC24FJ256GA702T-I/SO — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the PIC24FJ256GA702T-I/SO when you need a 16-bit PIC24F MCU in a compact 28-pin SOIC package with maximum Flash (256 KB) and generous RAM (16 KB) for capacitive touch HMI, IoT sensor nodes, or industrial control. It is the best fit when your firmware image exceeds 128 KB or your RAM usage exceeds 8 KB. Choose the PIC24FJ128GA702T-I/ML (28-pin QFN) for the same family in a smaller QFN footprint when space is critical. Choose the PIC24FJ128GB202T-I/SO if you need USB 2.0 Full-Speed at the cost of half the Flash. Choose the PIC24FJ32KA302-I/SO for ultra-low-cost designs with simple firmware under 32 KB. For larger designs needing USB OTG, more I/O, or graphics, step up to the PIC24FJ256GA606-I/PT (64-pin) or PIC24FJ256GB606-I/MR (USB-capable 64-pin) variants in the same Microchip PIC24F ecosystem.

대체품과의 비교

파라미터 이 제품 PIC24FJ256GA702-I/SO PIC24FJ128GA702T-I/ML PIC24FJ16GA002T-I/SO PIC24FJ32KA302-I/SO PIC24FJ128GB202T-I/SO
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 28-pin SOIC 28-pin SOIC - same 28-pin QFN (ML) - DIFFERENT 28-pin SOIC - same 28-pin SOIC - same 28-pin SOIC - same
Flash Memory 256 KB 256 KB 128 KB (-50%) 16 KB (-94%) 32 KB (-88%) 128 KB (-50%)
SRAM 16 KB 16 KB 8 KB (-50%) 4 KB (-75%) 2 KB (-88%) 8 KB (-50%)
CPU Speed 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS
ADC 12-bit, 200 ksps 12-bit, 200 ksps 12-bit, 200 ksps 10-bit, 500 ksps 10-bit, 200 ksps 10-bit, 500 ksps
USB No No No No No USB 2.0 Full-Speed
CTMU Yes Yes Yes No Yes No
Operating Voltage 2.0 V to 3.6 V 2.0 V to 3.6 V 2.0 V to 3.6 V 2.0 V to 3.6 V 1.8 V to 3.6 V 2.0 V to 3.6 V
Temperature Grade Industrial -40C to +85C Industrial -40C to +85C Industrial -40C to +85C Industrial -40C to +85C Industrial -40C to +85C Industrial -40C to +85C

주요 차별점

  • Largest Flash in the PIC24FJ256GA702 28-pin SOIC family (vs PIC24FJ128GA702T-I/ML)
  • Industrial temperature grade for harsh environments (vs PIC24FJ32KA302-I/SO)
  • On-chip CTMU enables capacitive touch without external ICs (vs PIC24FJ16GA002T-I/SO)
  • 5-channel DMA offloads peripheral-to-memory transfers (vs PIC24FJ128GB202T-I/SO)

설계 노트

The PIC24FJ256GA702T-I/SO requires a single 2.0 V to 3.6 V supply on VDD (pin 20) with a decoupling 100 nF ceramic capacitor placed within 5 mm of the pin and a bulk 10 uF tantalum or ceramic capacitor on the same rail. The MCLR pin (pin 1) must be pulled up to VDD through a 10 kohm resistor for normal operation; a 100 nF capacitor from MCLR to ground improves noise immunity. Place all decoupling capacitors on the same PCB layer as the MCU with short, wide traces to minimize parasitic inductance. According to Microchip's PIC24F hardware design checklist, the AGND pin (when present in larger packages) should be tied to VSS at a single point to avoid ground loops in ADC sampling.

For capacitive touch designs using the CTMU, route the touch electrodes as short, narrow traces on a single PCB layer without crossing other signals, and use a ground pour guard ring around each electrode to suppress stray capacitance coupling. Add a series ferrite bead on the touch power rail to reduce conducted EMI from the MCU into the touch sensors. Keep the touch MCU firmware's ADC acquisition time and CTMU current-source timing values per Microchip application note AN1250 (mTouch Conducted Noise Immunity) to maintain sensitivity in noisy environments.

A common pitfall when migrating firmware from PIC24FJ128GA702 to PIC24FJ256GA702 is forgetting to update the linker script for the larger Flash and SRAM regions - the default linker file for the smaller part will silently truncate code or data. Always regenerate the linker script via MPLAB XC16 when changing device variants. Another pitfall is configuring peripherals before unlocking the PPS (Peripheral Pin Select) registers on remappable pins - peripheral outputs will simply not appear on the assigned GPIO until PPS unlock is performed in the correct sequence. Finally, do not exceed the 200 ksps ADC sampling rate, as this introduces acquisition-time errors visible as gain and offset drift in sensor readings.

Place the 32 MHz crystal or external oscillator close to the OSC1/OSC2 pins (RA6/RA7 in this 28-SOIC package) with the load capacitors within 3 mm of the pins. Keep the high-frequency clock traces short and surrounded by a ground pour to minimize EMI radiation. Route analog ADC inputs away from digital switching signals; if crossing is unavoidable, cross them at 90 degrees. Use a separate analog ground island under the ADC input traces if the design has high-current digital switching, and join analog and digital grounds at a single point near the MCU VSS pin. This layout discipline typically reduces ADC noise by 1-2 LSB and improves CTMU touch measurement stability.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Yes
분쟁 광물
Compliant

RoHS and REACH compliant per Microchip product page. Industrial temperature grade -40C to +85C; not AEC-Q100 qualified (use PIC24F AEC-Q100 automotive variants for automotive designs). Lead-free and halogen-free packaging.

데이터 검증일: 2026-09-30 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

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관련 부품 & 용어

Microchip Technology PIC24FJ256GA702T-I/SO PIC24FJ256GA702-I/SO PIC24FJ128GA702T-I/ML PIC24FJ16GA002T-I/SO PIC24FJ32KA302-I/SO PIC24FJ128GB202T-I/SO 16-bit microcontroller PIC24F family MCU Flash memory with ECC CTMU Charge Time Measurement Unit 12-bit ADC MPLAB XC16 SOIC-28 RoHS industrial temperature grade nanoWatt technology DMA capacitive touch sensing eXtreme Low Power I2C SPI UART
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