PIC24FJ64GB202-E/MM - 16-bit USB MCU, 64KB Flash, 28-QFN | Microchip
부품 번호: PIC24FJ64GB202-E/MM ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5.91 | $5.91 |
| 10 | $5.32 | $53.20 |
| 100 | $4.75 | $475.00 |
| 500 | $4.26 | $2,130.00 |
| 1,000 | $3.8 | $3,800.00 |
PIC24FJ64GB202-E/MM 개요
What is a PIC24F XLP microcontroller: PIC24F XLP (eXtreme Low Power) is a 16-bit MIPS-based MCU family from Microchip Technology designed for ultra-low-power embedded applications. It belongs to the broader hierarchy microcontroller -> embedded processor -> semiconductor, and is engineered to consume nanoamp-level sleep currents while integrating USB, cryptographic, and analog peripherals on-chip. The GB2 sub-family adds full-speed USB and a hardware crypto module for secure connected nodes.
Key differentiating features include hardware AES/SHA encryption, a random number generator, and a dedicated crypto key storage area; integrated USB 2.0 full-speed device with on-chip transceiver; eXtreme Low Power modes with sub-uA sleep currents (typical 100 nA in Deep Sleep); up to 16 channels of 10/12-bit ADC; and a 16-bit enhanced PMP/EPMP for parallel displays or memory expansion. The integrated crypto accelerator offloads AES, DES and SHA from the CPU, freeing MIPS for application code.
Architecturally, the PIC24FJ64GB202 uses the standard PIC24F core with a 16-bit modified Harvard architecture, hardware multiply/divide, and a 7-channel DMA controller. The integrated USB PHY eliminates external transceivers, and the 28-QFN exposed pad provides a low-thermal-resistance path (~28 C/W theta_JA on a 4-layer JEDEC JESD51 board) for reliable operation at full 32 MHz.
Typical applications include USB HID or CDC sensor and metering dongles, secure IoT edge nodes that authenticate and encrypt over USB, low-power portable medical accessories, battery-powered secure token/authenticator products, industrial HMI panels with USB diagnostics, and consumer wearables with USB charging/communication. The hardware crypto engine is especially useful in payment terminals, electronic locks and secure firmware update over USB.
Design consideration: when laying out the PCB, the exposed thermal pad of the 28-QFN MUST be soldered to a sufficiently sized ground plane with thermal vias; this is critical for both electrical grounding of the MCU substrate and for heat dissipation at 32 MHz full load. Decouple VDD with a 100 nF ceramic placed within 3 mm of the VDD pin, and route the USB DP/DM pair as a 90 ohm differential with matching length to keep the Full-Speed eye diagram compliant.
This page synthesizes distributor pricing, drop-in same-package alternatives, and PCB design notes that go beyond the manufacturer datasheet, helping engineers select and lay out the PIC24FJ64GB202-E/MM with confidence.
드롭인 대체품: PIC24FJ64GB202-E/MM — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC24FJ64GB202-E/MM (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Core, Crypto Engine, Operating Temperature, Timers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC24FJ128GB202-I/MM
✅ 드롭인✓ 재고 있음
$4.65 / 개
데이터시트 보기 →PIC24FJ64GB202-E/MM 최대 정격 & 전기적 특성
| Family | PIC24F XLP |
| Core | PIC24F (16-bit modified Harvard, MIPS) |
| CPU Speed | 32 MHz / 8 MIPS |
| Program Memory | 64 KB Flash |
| Data Memory | 8 KB RAM |
| USB | USB 2.0 Full-Speed Device, on-chip transceiver |
| Crypto Engine | Hardware AES, DES, SHA; RNG; key storage |
| 공급 전압 | 2.0 V to 3.6 V |
| 동작 온도 | -40C to +125C (E = Extended Industrial) |
| 패키지 | 28-pin QFN-S (6x6 mm) with Exposed Pad |
| 실장 유형 | Surface Mount |
| I/O Pins | 21 (approximate, varies by peripheral use) |
| ADC | 10-bit, 16 channels |
| Timers | 5 x 16-bit or 32-bit Timer/Capture/Compare |
| DMA Channels | 7 channels |
| Sleep Current (Deep Sleep) | approx. 100 nA (typical, per family datasheet) |
| RoHS 상태 | Compliant |
PIC24FJ64GB202-E/MM 28-pin qfn-s (6x6 mm) with exposed pad 핀 구성 가이드
PIC24FJ64GB202-E/MM(28-pin qfn-s (6x6 mm) with exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC24FJ64GB202-E/MM.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC24FJ64GB202-E/MM 적합 용도: 6 애플리케이션s: USB Secure Authentication Token, USB CDC/HID Sensor Dongle, Secure IoT Edge Node over USB, USB Payment Terminal Module, Battery-Powered Wearable / Portable Medical Accessory, Industrial HMI Panel with USB Diagnostics.
USB Secure Authentication Token
The PIC24FJ64GB202-E/MM is purpose-built for USB secure authentication tokens where it serves as both the USB device and the crypto engine. Its on-chip USB 2.0 full-speed transceiver and on-die hardware AES/SHA engine plus RNG allow the firmware to perform challenge-response or signature verification locally without exposing key material to external memory. The 64 KB Flash fits a complete PKI/secure-boot stack with USB HID/CCID class drivers, while 8 KB RAM supports transient message buffers. Extended-industrial -40C to +125C rating covers outdoor and industrial token environments.
추천
USB CDC/HID Sensor Dongle
For low-power USB sensor dongles (gas sensors, environmental monitors, medical accessories), the PIC24FJ64GB202-E/MM provides a CDC or HID USB class device implementation with DMA-driven endpoint transfers offloading the 8-MIPS CPU. The hardware crypto engine is available for secure telemetry when paired with a host verifier. eXtreme Low Power sleep currents below 1 uA in Deep Sleep preserve battery life when the host is off, and the 28-QFN 6x6 mm footprint leaves room for a coin-cell or Li-Ion cell in compact form factors.
추천
Secure IoT Edge Node over USB
The PIC24FJ64GB202-E/MM suits secure IoT edge nodes that communicate with a host over USB. The hardware crypto engine can encrypt sensor telemetry using AES-256 while the USB device interface maintains a continuous link. DMA channels move ADC samples into USB endpoints with minimal CPU intervention, preserving MIPS for protocol overhead. The 2.0V to 3.6V supply range matches single-cell Li-Ion or 2xAA topologies, and the extended -40C to +125C temperature range supports outdoor deployment.
추천
USB Payment Terminal Module
POS terminals and payment dongles benefit from the PIC24FJ64GB202-E/MM hardware crypto engine, which performs PIN block encryption, MAC computation, and key agreement without software overhead. The integrated USB Full-Speed device supports HID-based PIN-pad class devices or CCID smart-card readers, and 64 KB Flash is sufficient for EMV/PIN entry firmware. Extended-industrial temperature grade covers store and field environments; the small 28-QFN 6x6 mm footprint enables compact handset designs.
추천
Battery-Powered Wearable / Portable Medical Accessory
Battery-powered wearables, glucose meters, and portable diagnostic accessories leverage the PIC24FJ64GB202-E/MM XLP sleep modes (sub-uA Deep Sleep) to extend battery life between data syncs over USB. The integrated USB Full-Speed device enables direct charging and data exchange with a host PC or phone adapter, and the crypto engine protects patient data at rest. The 28-QFN 6x6 mm package allows compact PCB layouts with room for a small Li-Po cell and a touch-sensing UI based on the on-chip CTMU.
추천
Industrial HMI Panel with USB Diagnostics
Industrial HMI panels and operator interfaces use the PIC24FJ64GB202-E/MM as a USB diagnostics channel to expose service logs, calibration data, or secure firmware updates to a laptop. The 16-channel 10-bit ADC reads analog sensor inputs, and the hardware crypto engine validates signed firmware before flashing. The extended -40C to +125C temperature range handles factory-floor and outdoor cabinet environments without derating, and the 28-QFN exposed pad provides a low-thermal-resistance path for continuous 32 MHz operation.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC24FJ64GB202-E/MM — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC24FJ128GB202-I/MM | PIC24FJ128GB202T-I/SO | PIC24FJ64GB002-I/SP |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN-S (6x6) with Exposed Pad | 28-QFN-S (6x6) - same footprint | 28-SOIC - NOT pin-compatible with 28-QFN | 28-SPDIP - NOT pin-compatible with 28-QFN |
| Flash Memory | 64 KB | 128 KB | 128 KB | 64 KB |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB |
| CPU Speed | 32 MHz / 8 MIPS | 32 MHz / 8 MIPS | 32 MHz / 8 MIPS | 32 MHz / 8 MIPS |
| USB 2.0 FS Device | Yes (on-chip transceiver) | Yes (on-chip transceiver) | Yes (on-chip transceiver) | Yes (on-chip transceiver) |
| Hardware Crypto Engine | Yes (AES/DES/SHA/RNG/Key Storage) | Yes (AES/DES/SHA/RNG/Key Storage) | Yes (AES/DES/SHA/RNG/Key Storage) | No crypto engine |
| Supply Voltage | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V |
| Operating Temperature | -40C to +125C (Extended Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
주요 차별점
- Integrated hardware crypto engine (AES/DES/SHA/RNG/Key Storage) (vs PIC24FJ64GB002-I/SP)
- Doubled Flash capacity with same peripherals and footprint (vs PIC24FJ128GB202-I/MM)
- Extended-industrial -40C to +125C operating temperature (vs PIC24FJ128GB202-I/MM (Industrial -40C to +85C))
설계 노트
The 28-QFN exposed thermal pad MUST be soldered to the PCB ground plane with an array of thermal vias (typically 4-9 vias, 0.3 mm drill, 0.6 mm pitch) for the device to meet its rated thermal performance. Estimated: at 32 MHz full CPU activity, VDD = 3.3V, and IO toggling, the part draws approximately 15-20 mA, so power dissipation is around 50-66 mW. With proper thermal pad soldering the junction-to-ambient theta_JA is approximately 28 C/W on a 4-layer JEDEC JESD51 board, giving a junction rise of only a few degrees above ambient.
Route the USB DP/DM pair as a 90 ohm differential with matched length (delta < 150 mil) to keep the Full-Speed eye diagram compliant. Place the USB series resistor on D+/D- close to the MCU pins, and keep the traces away from clock lines, switching regulators, and other noisy sources. The DP/DM traces should be no longer than 50 mm on a FR-4 stack-up, with a continuous ground reference plane beneath. Decouple VDD/VUSB with a 100 nF X7R ceramic within 3 mm of the pin and a bulk 4.7 uF tantalum or polymer cap.
Do not program the crypto key storage area without a complete understanding of the write-once restrictions - keys cannot be re-read after write, and a single bad write can permanently lock the part. Ensure your programming flow uses the proper unlock sequence and verify against the family datasheet DS30010038 crypto programming model. Also, do not exceed 3.6V on any IO - the part is NOT 5V tolerant on digital I/O and will latch up if driven above VDD+0.3V.
Use a low-IQ LDO such as MIC5219-3.3 or MCP1700 for the always-on VDD rail; XLP deep-sleep current is around 100 nA typical per the family datasheet, so the LDO quiescent current directly limits battery life. Disable unused peripherals in firmware and configure all unused I/O as digital outputs driven low to minimize leakage. The on-chip FRC 8 MHz oscillator can be left running in sleep to provide a fast wake-up, or switched to the low-power 31 kHz SOSC for nanoamp sleep currents.
규정 준수 정보
RoHS/REACH compliance per Microchip product page; lead-free reflow-compatible; not AEC-Q100 qualified - choose automotive-qualified PIC24FJ64GB202-E/MM variants if AEC-Q100 is required.
