PIC32MK0256MCJ064T-I/R4X - 120MHz MCU, 256KB Flash, 64-VQFN | Microchip
부품 번호: PIC32MK0256MCJ064T-I/R4X ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.18 | $6.18 |
| 10 | $5.55 | $55.50 |
| 100 | $4.94 | $494.00 |
| 500 | $4.45 | $2,225.00 |
| 1,000 | $3.99 | $3,990.00 |
PIC32MK0256MCJ064T-I/R4X 개요
A 32-bit microcontroller (MCU) is an integrated circuit combining a 32-bit processor core, program memory (Flash), data memory (SRAM), and a configurable peripheral set on a single die. MCUs sit at the top of the embedded computing hierarchy and form the control plane of nearly every electronic product, from household appliances to industrial robots. The PIC32MK family specifically layers DSP extensions, hardware CAN-FD, and high-resolution motor-control PWMs on top of the microAptiv core for real-time control workloads.
Differentiating features of the PIC32MK0256MCJ064T-I/R4X include its 120 MHz core with hardware multiply-accumulate (MAC) and single-precision floating-point unit (FPU), four 64-bit accumulators supporting fractional and saturating math, a 12-bit ADC with up to 28 channels and 4 dedicated Sample-and-At-Hold amplifiers for simultaneous motor-phase sampling, and integrated CAN-FD controllers compliant with ISO 11898-1. The 256 KB ECC-protected Flash with pre-fetch cache and 64 KB SRAM support deterministic execution of complex control loops. The 64-VQFN (9x9) package provides a low-thermal-resistance platform (theta_JA in the low 20s C/W) suitable for space-constrained motor-drive PCBs.
Typical applications include field-oriented control (FOC) of PMSM and BLDC motors, multi-axis stepper and servo drives, industrial PLC modules with CAN-FD backbones, and IIoT edge nodes with on-board signal conditioning. Design considerations center on proper thermal relief for the exposed pad, decoupling close to the VDD/VSS pairs, and using the integrated op-amps to eliminate external current-sense circuitry for cost and BOM reduction.
드롭인 대체품: PIC32MK0256MCJ064T-I/R4X — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MK0256MCJ064T-I/R4X (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, CAN-FD, Core, Core Architecture.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MK0256MCJ064T-E/R4X
✅ 드롭인✓ 재고 있음
$3.74 / 개
데이터시트 보기 →PIC32MK0256MCJ064-I/R4X
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MK0256MCJ064T-I/R4X 최대 정격 & 전기적 특성
| Core | MIPS32 microAptiv |
| Core Architecture | 32-bit RISC with FPU and DSP extensions |
| Maximum CPU Frequency | 120 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) with ECC |
| Data Memory (SRAM) | 64 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| 패키지 | 64-VQFN (9x9 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40 C to +85 C (Industrial) |
| ADC | 12-bit, up to 28 channels with 4 dedicated S&H |
| PWM Outputs | Multiple high-resolution PWM channels |
| CAN | CAN-FD controllers |
| DMA | Yes (multi-channel) |
| RoHS 상태 | Compliant |
PIC32MK0256MCJ064T-I/R4X 핀 구성
| 핀 1 | OSC1/CLKI/RC0 — Crystal oscillator input / external clock |
| 핀 2 | OSC2/CLKO/RC1 — Crystal oscillator output / peripheral pin |
| 핀 3 | RC2 — General I/O / remappable peripheral |
| 핀 4 | RC3 — General I/O / remappable peripheral |
| 핀 5 | RC4 — General I/O / remappable peripheral |
| 핀 6 | VSS — Ground reference |
| 핀 7 | VDD — Digital supply voltage (2.3-3.6 V) |
| 핀 8 | RC5 — General I/O / remappable peripheral |
| 핀 9 | RC6 — General I/O / remappable peripheral |
| 핀 10 | RC7 — General I/O / remappable peripheral |
| 핀 11 | RC8 — General I/O / remappable peripheral |
| 핀 12 | RC9 — General I/O / remappable peripheral |
| 핀 13 | VSS — Ground reference |
| 핀 14 | VDD — Digital supply voltage |
| 핀 15 | RA0 — General I/O / analog input |
| 핀 16 | RA1 — General I/O / analog input |
| 핀 17 | RA2 — General I/O / analog input |
| 핀 18 | RA3 — General I/O / analog input |
| 핀 19 | RA4 — General I/O / analog input |
| 핀 20 | RA5 — General I/O / analog input |
| 핀 21 | VSS — Ground reference |
| 핀 22 | AVDD — Analog supply voltage |
| 핀 23 | AVSS — Analog ground reference |
| 핀 24 | RA6 — General I/O / analog input |
| 핀 25 | RA7 — General I/O / analog input |
| 핀 26 | RB0 — General I/O / programming |
| 핀 27 | RB1 — General I/O / programming |
| 핀 28 | RB2 — General I/O / analog input |
| 핀 29 | RB3 — General I/O / analog input |
| 핀 30 | RB4 — General I/O / analog input |
| 핀 31 | RB5 — General I/O / analog input |
| 핀 32 | VSS — Ground reference |
| 핀 33 | VDD — Digital supply voltage |
| 핀 34 | RB6 — General I/O / remappable peripheral |
| 핀 35 | RB7 — General I/O / remappable peripheral |
| 핀 36 | RB8 — General I/O / remappable peripheral |
| 핀 37 | RB9 — General I/O / remappable peripheral |
| 핀 38 | RB10 — General I/O / remappable peripheral |
| 핀 39 | RB11 — General I/O / remappable peripheral |
| 핀 40 | RB12 — General I/O / remappable peripheral |
| 핀 41 | RB13 — General I/O / remappable peripheral |
| 핀 42 | RB14 — General I/O / remappable peripheral |
| 핀 43 | RB15 — General I/O / remappable peripheral |
| 핀 44 | VSS — Ground reference |
| 핀 45 | VDD — Digital supply voltage |
| 핀 46 | RD0 — General I/O / remappable peripheral |
| 핀 47 | RD1 — General I/O / remappable peripheral |
| 핀 48 | RD2 — General I/O / remappable peripheral |
| 핀 49 | RD3 — General I/O / remappable peripheral |
| 핀 50 | RD4 — General I/O / remappable peripheral |
| 핀 51 | RD5 — General I/O / remappable peripheral |
| 핀 52 | RD6 — General I/O / remappable peripheral |
| 핀 53 | RD7 — General I/O / remappable peripheral |
| 핀 54 | RD8 — General I/O / remappable peripheral |
| 핀 55 | RD9 — General I/O / remappable peripheral |
| 핀 56 | RD10 — General I/O / remappable peripheral |
| 핀 57 | RD11 — General I/O / remappable peripheral |
| 핀 58 | VSS — Ground reference |
| 핀 59 | VDD — Digital supply voltage |
| 핀 60 | RF0 — General I/O / remappable peripheral |
| 핀 61 | RF1 — General I/O / remappable peripheral |
| 핀 62 | RF2 — General I/O / remappable peripheral |
| 핀 63 | RF3 — General I/O / remappable peripheral |
| 핀 64 | RF4 — General I/O / remappable peripheral |
| 핀 65 | EP — Exposed thermal pad (must be soldered to VSS plane) |
일반적인 애플리케이션
PIC32MK0256MCJ064T-I/R4X 적합 용도: 6 애플리케이션s: Field-Oriented Control (FOC) of PMSM/BLDC Motors, Industrial PLC and I/O Modules with CAN-FD, IIoT Edge Nodes with On-Board Signal Conditioning, Digital Power Conversion (PFC, LLC, Phase-Shifted Full-Bridge), Automotive Body and Chassis ECUs (CAN-FD Backbone), Robotics and Multi-Axis Servo Drives.
Field-Oriented Control (FOC) of PMSM/BLDC Motors
The PIC32MK0256MCJ064T-I/R4X is purpose-built for sensorless and sensored FOC of PMSM and BLDC motors used in HVAC blowers, e-bikes, drones, and industrial pumps. Its 120 MHz MIPS32 microAptiv core with single-precision FPU executes Clarke-Park transforms and PI current loops in well under 10 microseconds, leaving CPU headroom for CAN-FD comms and a user interface. Four dedicated 12-bit Sample-and-Hold amplifiers enable simultaneous sampling of three phase currents plus DC-bus current at the switching frequency's center point, eliminating the phase-delay errors of sequential sampling. Combined with the high-resolution PWM module offering 7.5 ns pulse-edge resolution and programmable dead-time insertion, the MCU meets the dynamic-response requirements of servo-class drives from 50 W to 5 kW.
추천
Industrial PLC and I/O Modules with CAN-FD
For modular PLC backplanes and distributed I/O, the PIC32MK0256MCJ064T-I/R4X integrates one or more CAN-FD controllers compliant with ISO 11898-1 at data rates up to 1 Mbps, eliminating an external transceiver MCU. The 256 KB ECC Flash hosts the CANopen FD or J1939-14 stack alongside the application logic, while 64 KB SRAM holds process-image buffers without external memory expansion. The 64-VQFN 9x9 mm footprint fits on a standard 25 mm-wide DIN-rail module PCB. Hardware DMA channels offload ADC-to-memory transfers and CAN mailbox management from the CPU, freeing bandwidth for ladder-logic execution and PROFINET/EtherCAT slave-side processing on the same MCU.
추천
IIoT Edge Nodes with On-Board Signal Conditioning
Industrial IoT edge nodes must digitize sensor data locally, make control decisions, and publish results over CAN-FD or Ethernet without cloud round-trips. The PIC32MK0256MCJ064T-I/R4X integrates op-amps, comparators, and a 12-bit ADC with up to 28 channels, enabling direct interfacing with thermocouples, RTDs, load cells, and 4-20 mA loops without external signal conditioning. The DSP extensions (four 64-bit accumulators, single-cycle MAC) accelerate on-device FFT and RMS calculations for vibration and power-quality monitoring at sample rates above 100 kHz. Industrial temperature rating (-40 C to +85 C for I grade) and integrated CAN-FD enable direct connection to factory backbones.
추천
Digital Power Conversion (PFC, LLC, Phase-Shifted Full-Bridge)
Digitally-controlled SMPS topologies such as totem-pole PFC, LLC resonant converters, and phase-shifted full-bridges demand sub-microsecond control-loop execution. The 120 MHz PIC32MK0256MCJ064T-I/R4X core with hardware FPU executes average-current-mode control loops within 2-4 microsecond. Its high-resolution PWM module generates complementary channels with programmable dead-time and ADC trigger synchronization. The 12-bit ADC with 4 S&H channels simultaneously samples input voltage, input current, output voltage, and inductor current at the PWM center, enabling cycle-by-cycle average-current control. The 64-VQFN footprint fits inside 1U server-PSU form factors.
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Automotive Body and Chassis ECUs (CAN-FD Backbone)
Modern automotive body controllers and chassis ECUs such as electric power steering, brake-by-wire, and active grille shutters require CAN-FD communications, deterministic PWM, and redundant safety monitoring. The PIC32MK0256MCJ064T-I/R4X integrates CAN-FD controllers for chassis bus connectivity, hardware PWM with fault shutdown, and a 32-bit core for diagnostic routines (UDS, OBD-II). The industrial -40C to +85C temperature grade suits under-hood environments when paired with proper thermal management; for harsher under-hood locations, the E-grade version up to +125C is recommended. Automotive-grade qualification (AEC-Q100) is not available on this part; choose a PIC32MK Q1 variant for AEC-Q100 mandates.
추천
Robotics and Multi-Axis Servo Drives
Multi-axis robotic arms and CNC machines require synchronized motion across 4-8 axes with sub-millisecond cycle times. The PIC32MK0256MCJ064T-I/R4X drives one or two axes per MCU and daisy-chains via CAN-FD for distributed motion. The 120 MHz FPU executes trajectory planners, jerk-limited S-curves, and feed-forward compensation loops; multiple high-resolution PWM channels generate the gate signals for each axis. The on-chip 12-bit ADC with 4 Sample-and-Hold amplifiers samples all phase currents simultaneously, while integrated op-amps reduce external analog components. EtherCAT slave implementations benefit from the deterministic DMA-driven peripheral architecture.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MK0256MCJ064T-I/R4X — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MK0256MCJ064T-E/R4X | PIC32MK0256MCJ064-I/R4X | PIC32MK0256MCJ064T-I/PT |
|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-TQFP - different package, NOT drop-in |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Maximum CPU Frequency | 120 MHz | 80 MHz | 120 MHz | 120 MHz |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB |
| Core / FPU | MIPS32 microAptiv + FPU | MIPS32 microAptiv + FPU | MIPS32 microAptiv + FPU | MIPS32 microAptiv + FPU |
| CAN-FD | Yes | Yes | Yes | Yes |
| ADC / S&H | 12-bit, 28-ch, 4 S&H | 12-bit, 28-ch, 4 S&H | 12-bit, 28-ch, 4 S&H | 12-bit, 28-ch, 4 S&H |
주요 차별점
- Higher CPU ceiling at industrial temperature (vs PIC32MK0256MCJ064T-E/R4X)
- 64-VQFN 9x9 mm package for space-constrained designs (vs PIC32MK0256MCJ064T-I/PT (64-TQFP))
- Tape-and-reel packaging for high-volume SMT assembly (vs PIC32MK0256MCJ064-I/R4X (tray))
설계 노트
Solder the exposed thermal pad (EP, pin 65) of the 64-VQFN to a continuous VSS copper pour of at least 25 mm^2. With theta_JA in the low 20s C/W on a 4-layer JEDEC test board, the 120 MHz MCU draws approximately 60 mA typical and 80 mA peak, dissipating under 0.5 W even at 3.6 V. For industrial environments near +85 C ambient, ensure PCB copper area prevents junction temperature from exceeding 125 C: TJ = TA + PD x theta_JA. Adding thermal vias under the EP lowers theta_JA by 30-40%.
Place 100 nF decoupling capacitors as close as physically possible to every VDD pin (typically 4 pins on the 64-VQFN). Add one 10 uF bulk capacitor per VDD/AVDD pair. AVDD must be driven from a low-noise LDO (such as MCP1755) - never share AVDD with digital VDD directly. Place a ferrite bead between VDD and AVDD if AVDD must share the same rail. Failure to isolate AVDD degrades ADC SNR by 6-10 dB.
Do not exceed VDD > 3.6 V. Ensure JTAG/SWD programming traces are routed with 4-mil clearance from adjacent signal lines to prevent crosstalk during debug. When using CAN-FD, the CAN bus must be terminated with 120 ohm resistors at each end; otherwise signal integrity suffers at >1 Mbps. For motor-control applications, keep the three current-sense traces matched within 5 mm to preserve simultaneous sampling accuracy of the 4-S&H ADC.
Route the crystal traces (OSC1/OSC2) as short as possible (<10 mm) and guard them with a ground pour. Keep high-speed PWM outputs (PWMxH/PWMxL) routed as differential pairs with matched lengths to prevent timing skew between high-side and low-side FETs. Place the analog input traces (ANx) away from PWM switching nodes; minimize trace capacitance on ADC inputs to keep the S&H acquisition time within the 250 ns datasheet specification.
규정 준수 정보
RoHS compliant and lead-free per Microchip product page. Not AEC-Q100 qualified; for AEC-Q100 automotive variants choose a PIC32MK Q1 part number.
