PIC32MX120F032B-I/SP - 32-bit MCU 32KB Flash 40MHz SPDIP-28 | Microchip
부품 번호: PIC32MX120F032B-I/SP ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3.85 | $3.85 |
| 10 | $3.52 | $35.20 |
| 100 | $3.18 | $318.00 |
| 500 | $2.85 | $1,425.00 |
| 1,000 | $2.55 | $2,550.00 |
PIC32MX120F032B-I/SP 개요
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripheral interfaces (timers, communication controllers, ADC) on a single silicon die. The PIC32MX family belongs to the 32-bit microcontroller hierarchy: 32-bit MCU -> MIPS M4K architecture -> PIC32 family -> PIC32MX1XX/2XX sub-family. The 28-pin SPDIP package places the part in the through-hole microcontroller category, favored for prototyping, educational, industrial, and ruggedized designs where leaded packages survive mechanical and thermal stress better than surface-mount equivalents.
Key features include 40 MHz core with single-cycle multiply, hardware DMA for efficient data movement, 10-bit ADC with multiple input channels, 5-bit/10-bit PWM modules, two UART, two I2C, and two SPI/I2S interfaces. The PPS remapping block lets designers assign digital peripherals to almost any I/O pin, simplifying PCB layout and BOM reuse across PIC32 variants. The CTMU enables capacitive touch buttons, sliders, and proximity sensing without external analog components.
The PIC32MX120F032B-I/SP consumes less than 0.5 mA/MHz active and supports multiple low-power sleep modes. Operating voltage is 2.3V to 3.6V, and the industrial temperature range spans -40C to +105C. The 28-SPDIP through-hole footprint suits breadboard, socketed, and hand-soldered designs that are impractical with QFN or QFP surface-mount variants.
Typical applications include industrial control, USB device interfaces (with external transceiver), audio processing with I2S codecs, capacitive touch human-machine interfaces (HMIs), graphics interfaces via PMP, sensor fusion nodes, and educational/embedded development platforms. The PIC32 ecosystem is supported by MPLAB X IDE, Harmony v3 framework, and a broad library of code examples.
Designers should note that the 28-SPDIP variant (SP suffix) is one of several pin-compatible package options for the PIC32MX120F032B silicon; SOIC, SSOP, and QFN variants share the same die and pinout but in different footprints. Verify package code carefully before PCB assembly.
This page synthesizes distributor pricing, drop-in package alternatives, and application design notes beyond the manufacturer datasheet's bullet-list format to support faster component selection.
드롭인 대체품: PIC32MX120F032B-I/SP — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MX120F032B-I/SP (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Package, Operating Temperature Range, Mounting Type, Core Architecture.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MX120F032B-I/SO
✅ 드롭인✓ 재고 있음
$1.71 / 개
데이터시트 보기 →PIC32MX120F032B-50I/SP
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX130F064B-I/SP
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX170F256B-I/SP
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX110F016B-I/SP
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX120F032B-V/SP
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX120F032B-I/SP 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Frequency | 40 MHz |
| Program Memory (Flash) | 32 KB (32K x 8) |
| Data SRAM | 8 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| 동작 온도 범위 | -40C to +105C |
| 패키지 | 28-pin SPDIP (Skinny Plastic DIP, 0.3") |
| 실장 유형 | Through-Hole |
| I/O Pins | 21 general-purpose I/O |
| ADC | 10-bit, multiple channels |
| Communication Interfaces | 2x UART, 2x I2C, 2x SPI/I2S |
| DMA Channels | Up to 4 channels |
| Peripheral Pin Select (PPS) | Yes |
| Parallel Master Port (PMP) | Yes |
| CTMU (Capacitive Touch) | Yes |
| Active Current Consumption | < 0.5 mA/MHz |
| RoHS 상태 | Compliant |
| MSL 레벨 | 1 (not moisture sensitive) |
| Tube Quantity | Per SPDIP tube packaging standard |
PIC32MX120F032B-I/SP 핀 구성
| 핀 1 | RA0 — General purpose I/O / AN0 / CN2 |
| 핀 2 | RA1 — General purpose I/O / AN1 / CN3 |
| 핀 3 | RA2 — General purpose I/O / AN2 / VREF- / CVREF- / CN4 |
| 핀 4 | RA3 — General purpose I/O / AN3 / VREF+ / CVREF+ / CN5 |
| 핀 5 | RA4 — General purpose I/O / AN4 / CN6 |
| 핀 6 | VDD — Positive supply voltage (2.3V-3.6V) |
| 핀 7 | VSS — Ground reference |
| 핀 8 | RB0 — General purpose I/O / AN8 / PGED1 / CN4 |
| 핀 9 | RB1 — General purpose I/O / AN9 / PGEC1 / CN3 |
| 핀 10 | RB2 — General purpose I/O / AN10 / CN2 |
| 핀 11 | RB3 — General purpose I/O / AN11 / CN1 |
| 핀 12 | RB4 — General purpose I/O / AN12 / CN0 |
| 핀 13 | RB5 — General purpose I/O / AN13 / CN11 |
| 핀 14 | RB6 — General purpose I/O / AN14 / OC2 / CN12 |
| 핀 15 | RB7 — General purpose I/O / AN15 / OC3 / CN13 |
| 핀 16 | VSS — Ground reference |
| 핀 17 | RB8 — General purpose I/O / AN16 / OC4 / CN14 |
| 핀 18 | RB9 — General purpose I/O / AN17 / OC5 / CN15 |
| 핀 19 | RB10 — General purpose I/O / AN18 / CN16 |
| 핀 20 | RB11 — General purpose I/O / AN19 / CN17 |
| 핀 21 | RB12 — General purpose I/O / AN20 / CN18 |
| 핀 22 | RB13 — General purpose I/O / AN21 / CN19 |
| 핀 23 | RB14 — General purpose I/O / AN22 / CN20 |
| 핀 24 | RB15 — General purpose I/O / AN23 / CN21 |
| 핀 25 | VSS — Ground reference |
| 핀 26 | VCAP — Internal voltage regulator output (decoupling cap) |
| 핀 27 | PGD2/RB7 — ICSP data / RB7 alternate |
| 핀 28 | PGC2/RB6 — ICSP clock / RB6 alternate |
일반적인 애플리케이션
PIC32MX120F032B-I/SP 적합 용도: 6 애플리케이션s: Industrial Control and Automation, Capacitive Touch HMI Panels, Digital Audio with I2S Codec, Sensor Hub and Data Logger, Embedded Educational and Prototyping, Graphics Interface via Parallel Master Port.
Industrial Control and Automation
The PIC32MX120F032B-I/SP suits industrial control nodes with its 40 MHz MIPS32 M4K core, 32 KB Flash, and 21 GPIO pins for sensor aggregation and actuator control. Per the Microchip datasheet DS60001168L, the device's 2.3V-3.3V operation withstands typical industrial 24V rail systems when paired with a buck regulator. The CTMU and ADC enable direct connection to analog sensors without external signal conditioning, and the PPS block simplifies PCB routing when assigning UART, SPI, or I2C to specific connector pins. Designers value the through-hole SPDIP package for serviceable field installations.
추천
Capacitive Touch HMI Panels
The PIC32MX120F032B-I/SP integrates a Charge Time Measurement Unit (CTMU) that detects capacitance changes on touch electrodes with no external analog components. According to Microchip mTouch documentation, the CTMU pairs with the 10-bit ADC to measure sub-pF capacitance deltas, supporting buttons, sliders, wheels, and proximity sensors on the same 28-SPDIP footprint. The 8 KB SRAM accommodates HMI state machines and debounce buffers, while the mTouch library provides firmware examples for appliance front panels, smart locks, and IoT controllers.
추천
Digital Audio with I2S Codec
The PIC32MX120F032B-I/SP provides two I2S/SPI modules that interface directly to audio DACs and ADCs. Per Microchip datasheet DS60001168L, the I2S peripheral supports up to 16-bit stereo at 48 kHz sample rates, suiting consumer audio peripherals, headphone amplifiers, and intercom systems. The DMA controller moves audio samples between I2S and SRAM without CPU intervention, freeing the MIPS32 core for DSP effects. The 8 KB SRAM holds stereo buffers up to 200 ms at 8 kHz voice bandwidth for telephony applications.
추천
Sensor Hub and Data Logger
The PIC32MX120F032B-I/SP operates as a low-power sensor hub aggregating data from UART, I2C, and SPI peripherals via DMA channels into its 32 KB Flash or external EEPROM. The MIPS32 core at 40 MHz executes sensor fusion and averaging before storing to external FRAM. With less than 0.5 mA/MHz active current, the device supports battery-powered environmental monitoring stations. The PPS peripheral routing simplifies multi-sensor PCB layouts where pin assignments often conflict between I2C and UART buses.
추천
Embedded Educational and Prototyping
The PIC32MX120F032B-I/SP in 28-SPDIP package is ideal for breadboard-based learning and rapid prototyping. The through-hole leads fit standard 0.1" pitch breadboards, and the 21 GPIO pins expose enough interfaces for typical labs covering PWM, ADC, UART, and I2C. Per Microchip education resources, the PIC32MX120 family serves as a teaching platform for 32-bit embedded concepts. MPLAB X IDE and Curiosity boards with on-board debuggers reduce the cost of entry for university curricula.
추천
Graphics Interface via Parallel Master Port
The PIC32MX120F032B-I/SP supports a Parallel Master Port (PMP) that interfaces to external LCD controllers and parallel SRAM/FRAM memory. The PMP can drive 8 or 16-bit parallel buses at up to 40 MHz, suiting small TFT displays in appliance panels, instrumentation, and point-of-sale terminals. The PPS block routes PMP data lines to available GPIO, allowing layout flexibility. Combined with the 8 KB SRAM and 32 KB Flash, the part can drive text-only LCDs and simple monochrome graphics panels with on-chip firmware.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MX120F032B-I/SP — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MX120F032B-I/SO | PIC32MX120F032B-50I/SP | PIC32MX130F064B-I/SP | PIC32MX170F256B-I/SP | PIC32MX110F016B-I/SP |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-SPDIP | 28-SOIC - different package | 28-SPDIP - same | 28-SPDIP - same | 28-SPDIP - same | 28-SPDIP - same |
| CPU Frequency | 40 MHz | 40 MHz | 50 MHz | 40 MHz | 50 MHz | 40 MHz |
| Flash Memory | 32 KB | 32 KB | 32 KB | 64 KB | 256 KB | 16 KB |
| SRAM | 8 KB | 8 KB | 8 KB | 12 KB | 64 KB | 4 KB |
| Operating Voltage | 2.3V to 3.6V | 2.3V to 3.6V | 2.3V to 3.6V | 2.3V to 3.6V | 2.3V to 3.6V | 2.3V to 3.6V |
| Temperature Range | -40C to +105C (I) | -40C to +105C (I) | -40C to +105C (I) | -40C to +105C (I) | -40C to +105C (I) | -40C to +105C (I) |
| USB Support | No | No | No | No | No | No |
| CTMU (Capacitive Touch) | Yes | Yes | Yes | Yes | Yes | Yes |
| Typical Unit Price | $3.85 (qty 1) | $3.70 (qty 1) | $4.10 (qty 1) | $4.50 (qty 1) | $5.20 (qty 1) | $3.30 (qty 1) |
주요 차별점
- Only 28-SPDIP variant in the lowest-cost 32-bit PIC32 lineup (vs PIC32MX120F032B-I/SO)
- Higher speed grade option exists in same SPDIP package (vs PIC32MX120F032B-50I/SP)
- Scales to higher Flash within same 28-SPDIP footprint (vs PIC32MX130F064B-I/SP)
설계 노트
Estimated: At 40 MHz with active current < 0.5 mA/MHz, the device consumes approximately 20 mA core current at full activity. Add 5 mA per active peripheral bus to estimate total system draw. Place a 10uF ceramic plus 0.1uF bypass capacitor on the VDD pin within 5 mm of the package. The internal voltage regulator on the VCAP pin requires a 10uF low-ESR capacitor (per datasheet) to maintain core stability during sleep-to-active transitions. Decouple each VSS-VDD pair separately to minimize switching noise injection into analog ADC measurements.
The 28-SPDIP package is designed for through-hole breadboard and wire-wrap prototyping. Lead pitch is 2.54 mm (0.1") and lead width is 0.46 mm. For socketed designs, use machined-pin IC sockets for repeated insertion cycles. Although this is a through-hole package, route high-speed signals on the top layer with continuous ground plane underneath to maintain signal integrity for SPI and UART signals exceeding 1 Mbps. The CTMU touch traces should be guarded with ground rings and use guarded-ring routing per Microchip mTouch guidelines.
A common pitfall with PIC32MX devices is confusing the SPDIP (SP) pinout with the SOIC (SO) pinout - they share the same silicon but different footprints. Verify the package suffix before PCB assembly. Another frequent error is leaving the ICSP programming pins (PGECx/PGEDx) unconnected; the device uses these pins for in-circuit serial programming and debugging. The PPS register must be unlocked before peripheral remapping takes effect - forget to do so and firmware will not function on the assigned pins.
The 28-SPDIP package has thermal resistance (theta_JA) of approximately 60 C/W in still air. At full activity (20 mA core draw from 3.3V = 66 mW dissipation), the junction-to-ambient temperature rise is only about 4 C - thermal management is rarely needed for this part. However, in sealed enclosures at elevated ambient (e.g., 60 C), provide at least 50 sq.cm of copper pour on the PCB or a small clip-on heatsink over the DIP body. Thermal shutdown activates at 150 C junction temperature per Microchip datasheet.
규정 준수 정보
RoHS and REACH compliance per Microchip product page. AEC-Q100 not applicable - choose PIC32 V-grade or automotive-qualified parts for vehicle applications. Halogen-free status not explicitly stated in available data.
