PIC32MX174F256DT-I/ML - 72MHz 32-bit MCU 256KB Flash | Microchip
부품 번호: PIC32MX174F256DT-I/ML ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.2 | $4.20 |
| 10 | $3.78 | $37.80 |
| 100 | $3.36 | $336.00 |
| 500 | $2.95 | $1,475.00 |
| 1,000 | $2.55 | $2,550.00 |
PIC32MX174F256DT-I/ML 개요
What is a 32-bit microcontroller? A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and peripherals such as timers, communication interfaces, and analog blocks. The PIC32MX family uses the MIPS32 M4K core, a Harvard-architecture RISC processor with single-cycle multiplication, sitting in the broader hierarchy: MCU -> embedded controller -> semiconductor. The XLP (eXtreme Low Power) variants add aggressive power-saving modes that extend battery life in always-on products.
Key features include 72 MHz core clock with 83 DMIPS performance, 256 KB Flash (256K x 8), 64 KB SRAM, Full-Speed USB 2.0 Device/Host/OTG, three comparators with a CTMU (Charge Time Measurement Unit) for touch and capacitive sensing, a Real-Time Clock and Calendar (RTCC), and the standard PIC32 peripheral set: I2C, SPI, UART, PMP, ADC, and JTAG programming/debug. The 44-QFN package reduces PCB footprint while exposing up to 34 usable I/O pins.
Architecturally, the device pairs the M4K core with a multi-vector interrupt controller, hardware DMA into dedicated RAM regions, and a peripheral bus that allows ADC and USB transfers without CPU intervention. Deep-sleep current is in the microamp range thanks to dedicated low-power regulator and RTCC retention, while the 72 MHz operation delivers enough headroom for USB stacks, graphics libraries, and sensor-fusion algorithms.
Typical applications include low-power IoT sensor nodes with USB, consumer wearables, USB HID peripherals (keyboards, mice, custom input devices), capacitive-touch user interfaces, industrial control panels, and educational/development boards. The combination of XLP operation and FS USB makes the part especially attractive for tethered battery-powered devices that occasionally need to enumerate as a USB device.
When designing with this MCU, ensure the VUSB 3.3V rail is stable before USB enumeration and provide a 1uF bypass on VCAP for the internal core regulator. JTAG/ICSP pins should be reserved on the PCB for in-circuit programming, and unused I/O must be configured as outputs low to minimise sleep current.
This page synthesizes distributor pricing, drop-in alternatives from the same PIC32MX1xx/2xx family, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: PIC32MX174F256DT-I/ML — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MX174F256DT-I/ML (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Operating Temperature, USB, I/O Pins.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MX274F256D-I/ML
✅ 드롭인✓ 재고 있음
$2.52 / 개
데이터시트 보기 →PIC32MX174F256D-I/ML
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX170F256D-I/ML
✅ 드롭인✓ 재고 있음
$3.45 / 개
데이터시트 보기 →PIC32MX154F128D-I/ML
✅ 드롭인✓ 재고 있음
$3.92 / 개
데이터시트 보기 →PIC32MX274F256DT-I/ML
✅ 드롭인✓ 재고 있음
$2.71 / 개
데이터시트 보기 →PIC32MX174F256DT-I/ML 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Core Frequency | 72 MHz |
| Performance | 83 DMIPS |
| Program Memory (Flash) | 256 KB (256K x 8) |
| Data Memory (SRAM) | 64 KB |
| USB Interface | USB 2.0 Full-Speed Device/Host/OTG |
| I/O Pins | Up to 34 (44-pin package) |
| Timers | 5 16-bit, 2 32-bit (per family) |
| Comparators | 3 with CTMU (Charge Time Measurement Unit) |
| RTCC | Yes (Real-Time Clock and Calendar) |
| ADC | 10-bit 1.1 Msps, up to 13 channels |
| Communication Interfaces | I2C, SPI, UART, PMP, USB, JTAG/ICSP |
| Operating Voltage | 2.3 V to 3.6 V |
| 동작 온도 | -40 C to +85 C (industrial) |
| 패키지 | 44-pin QFN (8x8 mm) |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| RoHS 상태 | Compliant |
PIC32MX174F256DT-I/ML 핀 구성
| 핀 1 | RPB0/RF2/RPG6 — Remappable I/O, RF2 USB D-, RPG6 RTCC |
| 핀 2 | RPB1/RF3/RPG7 — Remappable I/O, RF3 USB D+, RPG7 RTCC |
| 핀 3 | RPB2/RG8 — Remappable I/O |
| 핀 4 | RPB3/RG9 — Remappable I/O |
| 핀 5 | VSS — Ground reference |
| 핀 6 | VDD — I/O supply voltage (2.3V-3.6V) |
| 핀 7 | RPB4/RG10 — Remappable I/O |
| 핀 8 | RPB5/RG11 — Remappable I/O |
| 핀 9 | RPB6/RG12 — Remappable I/O |
| 핀 10 | RPB7/RG13 — Remappable I/O |
| 핀 11 | VSS — Ground reference |
| 핀 12 | VDD — I/O supply voltage (2.3V-3.6V) |
| 핀 13 | RPC0/RG14 — Remappable I/O |
| 핀 14 | RPC1/RG15 — Remappable I/O |
| 핀 15 | RPC2 — Remappable I/O |
| 핀 16 | RPC3 — Remappable I/O |
| 핀 17 | RPC4 — Remappable I/O |
| 핀 18 | VUSB — USB 3.3V supply pin |
| 핀 19 | RPG6/RPB8 — Remappable I/O |
| 핀 20 | RPG7/RPB9 — Remappable I/O |
| 핀 21 | RPG8/RPB10 — Remappable I/O |
| 핀 22 | RPG9/RPB11 — Remappable I/O |
| 핀 23 | VSS — Ground reference |
| 핀 24 | VDD — I/O supply voltage (2.3V-3.6V) |
| 핀 25 | VCAP — Internal 1.8V core regulator output; 1uF cap to ground required |
| 핀 26 | RPG0/RPB12 — Remappable I/O |
| 핀 27 | RPG1/RPB13 — Remappable I/O |
| 핀 28 | AN0/C2IN+/RPA0/CTED1 — Analog input 0, Comparator 2 input+, GPIO |
| 핀 29 | AN1/C2IN-/RPA1/CTED2 — Analog input 1, Comparator 2 input-, GPIO |
| 핀 30 | AN2/C1IN+/RPA2/RPG13 — Analog input 2, Comparator 1 input+, GPIO |
| 핀 31 | AN3/C1IN-/RPA3 — Analog input 3, Comparator 1 input-, GPIO |
| 핀 32 | AN4/C1OUT/RPA4 — Analog input 4, Comparator 1 output, GPIO |
| 핀 33 | AVSS — Analog ground reference |
| 핀 34 | AVDD — Analog supply voltage (2.3V-3.6V) |
| 핀 35 | AN5/C2OUT/RPA5 — Analog input 5, Comparator 2 output, GPIO |
| 핀 36 | AN6/C3IN+/RPA6 — Analog input 6, Comparator 3 input+, GPIO |
| 핀 37 | AN7/C3IN-/RPA7 — Analog input 7, Comparator 3 input-, GPIO |
| 핀 38 | AN8/C3OUT/RPA8 — Analog input 8, Comparator 3 output, GPIO |
| 핀 39 | AN9/RPA9 — Analog input 9, GPIO |
| 핀 40 | OSC1/CLKI/RC12 — Crystal oscillator input or external clock input |
| 핀 41 | OSC2/CLKO/RC15 — Crystal oscillator output or clock output |
| 핀 42 | MCLR/RPA11 — Master Clear reset input (active low) or GPIO |
| 핀 43 | PGED2/RPB14 — Programming/debug data, GPIO |
| 핀 44 | PGEC2/RPB15 — Programming/debug clock, GPIO |
일반적인 애플리케이션
PIC32MX174F256DT-I/ML 적합 용도: 6 애플리케이션s: Low-Power IoT Sensor Node with USB, USB HID Input Devices (Keyboard, Mouse, Custom), Capacitive Touch User Interface, Consumer Wearable Device, Industrial Control Panel, Educational Microcontroller Board.
Low-Power IoT Sensor Node with USB
The PIC32MX174F256DT-I/ML is well suited for tethered IoT sensor nodes because its on-chip Full-Speed USB 2.0 transceiver enables direct enumeration as a CDC or HID device without an external PHY. XLP deep-sleep current in the microamp range allows the part to idle on battery and wake on a USB bus-attach event or RTCC alarm, while 256 KB of Flash fits firmware for sensor-fusion libraries, encrypted boot, and over-the-air update handlers. Place the device with a 0.01 uF VUSB bypass and a 1 uF VCAP decoupling within 5 mm of the pins.
추천
USB HID Input Devices (Keyboard, Mouse, Custom)
The integrated USB 2.0 Full-Speed Device controller and 72 MHz MIPS M4K core allow the PIC32MX174F256DT-I/ML to implement USB HID input devices such as keyboards, mice, programmable keypads, and custom multimedia controllers. The 256 KB Flash fits HID report descriptors and consumer-control mappings, while 64 KB SRAM supports debounce buffers and macro recording. Design with a 5 V to 3.3 V LDO (e.g. MCP1700) for bus-powered operation, and route D+/D- as a 90-ohm differential pair per USB 2.0 specification.
추천
Capacitive Touch User Interface
The PIC32MX174F256DT-I/ML integrates the CTMU (Charge Time Measurement Unit) with three analog comparators, enabling cost-effective capacitive touch sensing on up to 16 channels via time-multiplexed PCB electrodes. The 72 MHz core can run a 200 Hz touch-scan loop while still serving USB and a graphics UI library. Pair the device with the Microchip mTouch reference design and ensure the analog rails (AVDD/AVSS) are decoupled with a 10 uF bulk and 0.1 uF ceramic cap.
추천
Consumer Wearable Device
The XLP low-power modes of the PIC32MX174F256DT-I/ML make it suitable for battery-powered wearables such as fitness bands, BLE-beacon remote controls, and smart-watch accessory boards. Sleep currents below 1 uA with RTCC retention allow multi-month coin-cell operation, while 256 KB Flash holds BLE stack shims and sensor drivers. Pair with an external Bluetooth module via UART and consider an external SPI Flash for firmware image storage.
추천
Industrial Control Panel
The 72 MHz performance, 256 KB Flash, and 44-QFN footprint of the PIC32MX174F256DT-I/ML support compact industrial control panels driving small TFT displays via PMP, reading keypad/encoder inputs, and communicating over RS-485 or CAN via external transceivers. The -40 C to +85 C industrial temperature range ensures operation in factory-floor enclosures. Add a hardware watchdog IC and TVS protection on field-side I/O for industrial robustness.
추천
Educational Microcontroller Board
The PIC32MX174F256DT-I/ML is a strong choice for university curricula and maker boards thanks to MPLAB X IDE support, a free Harmony and XC32 toolchain, the integrated USB 2.0 peripheral, and a documented peripheral library. The 44-QFN package exposes sufficient I/O for breadboard adapter PCBs, and 256 KB Flash supports student projects combining USB device firmware, RTCC data logging, and ADC sampling. The device is also supported by Microchip's Curiosity and PIC32MX starter platforms.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MX174F256DT-I/ML — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MX274F256D-I/ML | PIC32MX174F256D-I/ML | PIC32MX170F256D-I/ML | PIC32MX154F128D-I/ML | PIC32MX274F256DT-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Core / Frequency | MIPS M4K / 72 MHz | MIPS M4K / 72 MHz | MIPS M4K / 72 MHz | MIPS M4K / 72 MHz | MIPS M4K / 72 MHz | MIPS M4K / 72 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB (-50%) | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 48 KB or 32 KB (-25% to -50%) | 64 KB |
| USB 2.0 Interface | Yes (FS Device/Host/OTG) | Yes (FS Device/Host/OTG) | Yes (FS Device/Host/OTG) | No | Yes (FS Device/Host/OTG) | Yes (FS Device/Host/OTG) |
| Operating Voltage | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V |
| Operating Temperature | -40 C to +85 C (industrial) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Single-Piece Price (USD, as of 2026-10-01) | $4.20 | ~$4.30 | ~$4.20 | ~$3.50 | ~$3.30 | ~$4.30 |
주요 차별점
- Same-die tape-and-reel variant matches footprint exactly (vs PIC32MX174F256D-I/ML)
- USB 2.0 Full-Speed integrated versus absent (vs PIC32MX170F256D-I/ML)
- Double the Flash memory versus PIC32MX154 variant (vs PIC32MX154F128D-I/ML)
설계 노트
Estimated: The PIC32MX174F256DT-I/ML core runs from an internal 1.8 V regulator powered through the VCAP pin. Place a 1 uF X7R ceramic capacitor within 5 mm of VCAP to ground with a short, wide trace; insufficient capacitance causes core instability and erratic USB enumeration. VUSB requires a separate 0.01 uF bypass close to the pin to meet USB 2.0 inrush-current requirements. Decouple each VDD/VSS pair with 0.1 uF and bulk 4.7 uF to handle USB suspend-current spikes.
Route the USB D+/D- pair as a 90-ohm differential with matched length, keep them short, and isolate from switching signals and clocks to pass USB compliance. The exposed thermal pad on the 44-QFN must be soldered to a continuous ground pour with thermal vias (typically 0.3 mm drill, 1 mm pitch) to meet the datasheet thermal resistance specification of 34 C/W (theta_JA). JTAG/ICSP pins PGED2/PGEC2 must be routed out to a 0.1 inch header for in-circuit programming.
Do not exceed absolute maximum VDD of 3.6 V; the part is NOT 5 V tolerant on any GPIO. The MCLR pin must have a 10 kohm pull-up to VDD for normal operation; leaving it floating prevents startup. Always configure unused I/O as outputs driving low (not inputs) to minimise deep-sleep leakage. When migrating from PIC32MX170 to PIC32MX174 in the same package, verify USB firmware configuration is enabled in fuses before USB enumeration.
규정 준수 정보
RoHS and REACH compliance per Microchip product page. AEC-Q100 not applicable for industrial-temperature MCU. Lead-free reflow JEDEC J-STD-020 MSL3.