Microchip Technology

PIC32MX230F256DT-V/ML - 32-bit MCU 256KB Flash 44-QFN | Microchip

부품 번호: PIC32MX230F256DT-V/ML ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
2.3 V to 3.6 V Vdss 44-VQFN (8x8 mm) Exposed Pad Package 40 MHz Speed FLASH Memory
시작가 $2.96 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-01
볼륨 가격
수량 단가 합계
1 $4.92 $4.92
10 $4.43 $44.30
100 $3.94 $394.00
500 $3.45 $1,725.00
1,000 $2.96 $2,960.00
ℹ️ 모든 가격은 USD 기준입니다

PIC32MX230F256DT-V/ML 개요

The Microchip PIC32MX230F256DT-V/ML is a 32-bit MIPS M4K microcontroller running at 40 MHz with 256 KB of Flash and 16 KB of SRAM, housed in a 44-pin QFN (8x8 mm) package with exposed thermal pad. The device integrates a 10-bit ADC, USB 2.0 full-speed device/host/OTG, two I2S/SPI modules, and Peripheral Pin Select (PPS) for flexible pin function remapping. Operating voltage spans 2.3V to 3.6V with AEC-Q100 Grade 1 qualification for automotive applications in the -40C to +105C range.

What is a PIC32MX microcontroller? The PIC32MX family from Microchip combines a 32-bit MIPS M4K core with the familiar PIC peripheral ecosystem, offering up to 83 DMIPS performance while consuming only 0.5 mA/MHz typical. It bridges 8-bit PIC16/PIC18 and 32-bit ARM Cortex-M worlds, providing on-chip USB, mTouch capacitive sensing, and Parallel Master Port (PMP) for graphics interfaces, supported by MPLAB X IDE and Harmony framework.

Key features of the PIC32MX230F256DT-V/ML include a Parallel Master Port for graphics LCD/parallel memory interfacing, up to five 16-bit timers, RTCC, five CCP modules, and 1 ns resolution time measurement for high-precision capture. The PPS feature allows remapping of most digital peripherals to almost any I/O pin, simplifying PCB layout and reducing routing congestion in complex designs.

The PIC32MX230F256DT-V/ML targets applications requiring automotive-grade reliability with on-board USB, mixed-signal connectivity, and graphical display support. It provides ample headroom for user interface code while keeping power consumption low at 0.5 mA/MHz, and the QFN-44 exposed-pad package ensures robust thermal performance in sealed automotive modules.

Typical applications include automotive HMI modules with TFT LCD displays, USB-connected diagnostic tools, capacitive touch user interfaces, industrial sensor hubs with PMP-driven displays, and consumer audio devices requiring I2S codec interfaces. The automotive temperature grade (-40C to +105C) makes this part suitable for cabin electronics and in-cabin infotainment sub-modules.

When designing with the PIC32MX230F256DT-V/ML, ensure the exposed pad is soldered to a sufficiently large copper pour for thermal dissipation. Decouple VDD with 100 nF ceramic capacitors placed within 2 mm of each supply pin. Program and debug using MPLAB Snap, PICkit 4, or MPLAB ICD 4 over the ICSP interface.

드롭인 대체품: PIC32MX230F256DT-V/ML — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MX230F256DT-V/ML (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, USB, Timers, Operating Temperature.

Microchip Technology
Package: 44-pin QFN-EP (8x8 mm)
ADC: 10-bit, up to 28 channels, 1 Msps
USB: USB 2.0 Full-Speed OTG (embedded PHY)
Microchip Technology
Package: 44-pin QFN with EP (ML)
ADC: 10-bit, 1 Msps, up to 28 channels
USB: USB 2.0 Full-Speed Device, internal transceiver
Microchip Technology
Package: 44-pin QFN (8x8 mm)
ADC: 10-bit 1.1 Msps, up to 13 channels
Timers: 5 16-bit, 2 32-bit (per family)
Microchip Technology
Package: 44-pin QFN (8x8 mm) with exposed pad
ADC: 10-bit, up to 13 channels, 1 Msps
Timers: 5 x 16-bit
Microchip Technology
Package: 44-pin QFN (8x8 mm)
ADC: 10-bit, up to 28 channels, 1 Msps
Operating Temperature: -40C to +85C (Industrial)
Microchip Technology
Package: VQFN-44 (8x8 mm) with exposed pad
ADC: 10-bit
Operating Temperature: -40C to +125C (automotive grade -V)
Microchip Technology
Package: 44-QFN (8x8 mm) with exposed pad
ADC: 10-bit, up to 28 channels, 1 Msps
USB: USB 2.0 FS device/host/OTG
Microchip Technology
Package: 44-VTLA (6x6 mm)
ADC: 10-bit, up to 1 Msps
Microchip Technology
Package: 44-pin QFN (8x8 mm) with exposed thermal pad
ADC: 10-bit, up to 1 Msps
USB: USB 2.0 full-speed device / host / OTG

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

PIC32MX230F256DT-I/ML

✅ 드롭인
Microchip Technology
📦 44-QFN (8x8 mm)
MIPS32 M4K · 32-Bit Single-Core · 40 MHz · 256 KB (256K x 8) · 16 KB · 2.3 V to 3.6 V · -40C to +85C (Industrial) · 44-QFN (8x8 mm) with exposed pad

✓ 재고 있음

$3.31 / 개

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PIC32MX230F256D-50I/ML

✅ 드롭인 ⚠️ 사양 미검증
Microchip Technology
📦 44-QFN (8x8 mm)
MIPS32 M4K 32-bit RISC · 50 MHz (83 DMIPS) · 256 KB (256K x 8) · 64 KB · 2.3 V to 3.6 V · -40 C to +85 C (Industrial, 'I') · 10-bit, up to 13 channels, 1 Msps · USB 2.0 full-speed Device/Host/OTG

✓ 재고 있음

$3.96 / 개

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PIC32MX230F256D-I/ML

✅ 드롭인 ⚠️ 사양 미검증
Microchip Technology
📦 44-QFN (8x8 mm)
MIPS32 M4K 32-bit RISC · 50 MHz · 83 DMIPS · 256 KB · 16 KB · 2.3 V to 3.6 V · 0.5 mA/MHz · USB 2.0 Full-Speed Device/Host/OTG

✓ 재고 있음

$3.05 / 개

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PIC32MX174F256DT-I/ML

✅ 드롭인 ⚠️ 사양 미검증
Microchip Technology
📦 44-QFN (8x8 mm)
MIPS32 M4K 32-bit RISC · 72 MHz · 83 DMIPS · 256 KB (256K x 8) · 64 KB · USB 2.0 Full-Speed Device/Host/OTG · Up to 34 (44-pin package) · 5 16-bit, 2 32-bit (per family)

✓ 재고 있음

$2.55 / 개

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PIC32MX170F256D-V/ML

✅ 드롭인 ⚠️ 사양 미검증
Microchip Technology
📦 44-QFN (8x8 mm)
MIPS M4K (32-bit RISC) · 50 MHz / 83 DMIPS · 256 KB · 64 KB · 2.5 V to 3.6 V · 44-pin QFN with EP (ML) · -40C to +105C (V suffix - industrial) · USB 2.0 Full-Speed Device, internal transceiver

✓ 재고 있음

$2.65 / 개

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PIC32MX130F256DT-V/ML

✅ 드롭인 ⚠️ 사양 미검증
Microchip Technology
📦 44-QFN (8x8 mm)
MIPS32 M4K 32-bit RISC · 40 MHz · 52 DMIPS · 256 KB · 16 KB · 2.3 V to 3.6 V · -40C to +105C (AEC-Q100 Grade 3) · 44-pin QFN-EP (8x8 mm)

✓ 재고 있음

$2.45 / 개

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PIC32MX230F256DT-V/ML 최대 정격 & 전기적 특성

Core Processor MIPS32 M4K
Core Size 32-Bit
Core Speed 40 MHz
Program Memory Type FLASH
Program Memory Size 256 KB (256K x 8)
RAM Size 16 KB
Operating Voltage Range 2.3 V to 3.6 V
동작 온도 범위 -40C to +105C (Automotive Grade 1)
ADC 10-bit, up to 13 channels
USB USB 2.0 Full-Speed Device/Host/OTG
I2S/SPI Modules 2
Peripheral Pin Select (PPS) Yes
Parallel Master Port (PMP) Yes
mTouch Capacitive Touch Yes
패키지 44-VQFN (8x8 mm) Exposed Pad
실장 유형 Surface Mount
AEC-Q100 Qualification Yes (Automotive Grade 1)
RoHS 상태 Compliant

PIC32MX230F256DT-V/ML 핀 구성

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
핀 1 RPB0/AN0 — Remappable I/O, analog input 0
핀 2 RPB1/AN1 — Remappable I/O, analog input 1
핀 3 RPB2/AN2 — Remappable I/O, analog input 2
핀 4 RPB3/AN3 — Remappable I/O, analog input 3
핀 5 VSS — Ground
핀 6 VDD — Positive supply voltage
핀 7 RPB4/AN4 — Remappable I/O, analog input 4
핀 8 RPB5/AN5 — Remappable I/O, analog input 5
핀 9 RPB6/AN6 — Remappable I/O, analog input 6
핀 10 RPB7/AN7 — Remappable I/O, analog input 7
핀 11 VSS — Ground
핀 12 VDD — Positive supply voltage
핀 13 RPA8 — Remappable I/O
핀 14 RPA9 — Remappable I/O
핀 15 RPB8 — Remappable I/O
핀 16 RPB9 — Remappable I/O
핀 17 RPB10 — Remappable I/O
핀 18 VSS — Ground
핀 19 VDD — Positive supply voltage
핀 20 RPB11 — Remappable I/O
핀 21 RPB12 — Remappable I/O
핀 22 RPB13 — Remappable I/O
핀 23 RPB14 — Remappable I/O
핀 24 RPB15 — Remappable I/O
핀 25 VSS — Ground
핀 26 VDD — Positive supply voltage
핀 27 RPA0 — Remappable I/O
핀 28 RPA1 — Remappable I/O
핀 29 RPA2 — Remappable I/O
핀 30 RPA3 — Remappable I/O
핀 31 VSS — Ground
핀 32 VDD — Positive supply voltage
핀 33 OSC1/CLKI — Crystal oscillator input or external clock
핀 34 OSC2/CLKO — Crystal oscillator output
핀 35 VSS — Ground
핀 36 VDD — Positive supply voltage
핀 37 D+ — USB D+ line
핀 38 D- — USB D- line
핀 39 VUSB — USB transceiver supply
핀 40 MCLR — Master clear reset, active low
핀 41 PGED1 — ICSP programming data
핀 42 PGEC1 — ICSP programming clock
핀 43 PGED2 — ICSP programming data 2
핀 44 PGEC2 — ICSP programming clock 2

일반적인 애플리케이션

PIC32MX230F256DT-V/ML 적합 용도: 6 애플리케이션s: Automotive HMI with TFT LCD Display, USB Automotive Diagnostic Tool, Capacitive Touch User Interface, Industrial Sensor Hub with Graphic Display, Portable Consumer Audio Device, USB Peripheral / HID Device Controller.

🚗

Automotive HMI with TFT LCD Display

The PIC32MX230F256DT-V/ML is well-suited for automotive Human-Machine Interface modules driving small TFT LCD panels via its Parallel Master Port (PMP). The PMP supports 8-bit and 16-bit parallel data plus dedicated control signals, enabling direct connection to graphical LCDs without external controller ICs. Its 40 MHz MIPS M4K core and 256 KB Flash provide ample headroom for graphics libraries, button debouncing, and capacitive touch processing using the on-chip mTouch peripheral. The AEC-Q100 Grade 1 qualification ensures reliable operation across cabin temperature swings from -40C to +105C.

🔧

USB Automotive Diagnostic Tool

With on-chip USB 2.0 full-speed device, host, and OTG controller, the PIC32MX230F256DT-V/ML is ideal for OBD-II diagnostic interfaces and USB-connected service tools. The 10-bit ADC captures analog sensor signals, while the I2S/SPI modules communicate with audio codecs or external sensors. AEC-Q100 Grade 1 certification and 256 KB Flash support CAN/USB protocol stacks and diagnostic firmware updates. The exposed-pad 44-QFN package provides rugged thermal performance in the engine bay periphery and under-hood service environments.

🎛️

Capacitive Touch User Interface

The integrated mTouch capacitive touch peripheral enables the PIC32MX230F256DT-V/ML to drive buttons, sliders, and proximity sensors without external touch controller ICs. Combined with Peripheral Pin Select (PPS), touch channels can be remapped to nearly any I/O pin, simplifying PCB layout of dense touch panels. The 32-bit MIPS M4K core runs touch acquisition, filtering, and gesture recognition in real time at 40 MHz, while 16 KB RAM accommodates multi-touch state machines. Automotive Grade 1 rating supports steering wheel and center-console touch interfaces.

🏭

Industrial Sensor Hub with Graphic Display

Industrial sensor hubs benefit from the PIC32MX230F256DT-V/ML combination of PMP graphics output, USB connectivity for data logging, and 10-bit ADC for analog sensor reading. The 1 ns resolution timer enables high-precision pulse counting from flow meters and encoders, while PPS remapping eases PCB routing in compact sensor enclosures. The wide 2.3V to 3.6V supply range tolerates industrial 24V-to-3.3V LDO post-regulation with margin. The 256 KB Flash stores calibration tables and Modbus/USB protocol stacks.

🎧

Portable Consumer Audio Device

With two I2S/SPI modules capable of audio codec interfacing, the PIC32MX230F256DT-V/ML can serve as the main MCU in portable Bluetooth speakers, headphones, or digital audio players. The 10-bit ADC handles battery voltage monitoring and analog microphone preamplifier sampling, while USB OTG enables charging and digital audio streaming. The MIPS M4K core at 40 MHz runs lightweight audio processing (EQ, mixing) without external DSP. Low 0.5 mA/MHz typical current consumption extends battery life in portable form factors.

🖥️

USB Peripheral / HID Device Controller

The PIC32MX230F256DT-V/ML is a strong choice for USB Human Interface Devices such as custom keyboards, mice, game controllers, and HID-based control surfaces. The on-chip USB 2.0 full-speed controller with on-chip transceiver eliminates external PHY cost, and 256 KB Flash holds HID report descriptors, macro logic, and RGB lighting firmware. PPS remapping simplifies routing of high-pin-count switch matrices. Automotive Grade 1 qualification allows deployment in cabin-mounted automotive input devices.

추천 제품 요약

PIC32MX230F256DT-I/ML Microchip Technology 사용처: Automotive HMI with TFT LCD Display, Capacitive Touch User Interface PIC32MX170F256D-V/ML Microchip Technology 사용처: Automotive HMI with TFT LCD Display MRB-KW41Z Companion Bluetooth module for wireless HMI 사용처: Automotive HMI with TFT LCD Display MCP2515 External CAN controller companion 사용처: USB Automotive Diagnostic Tool MCP2551 CAN transceiver companion 사용처: USB Automotive Diagnostic Tool MCP6N11 Low-noise instrumentation amp for touch sensor 사용처: Capacitive Touch User Interface PIC32MX130F256DT-V/ML Microchip Technology 사용처: Industrial Sensor Hub with Graphic Display MCP2200 USB-to-UART bridge companion 사용처: Industrial Sensor Hub with Graphic Display PIC32MX220F032DT-I/ML Microchip Technology 사용처: Portable Consumer Audio Device WM8960 Low-power stereo audio codec companion 사용처: Portable Consumer Audio Device PIC32MX130F064D-V/PT Microchip Technology 사용처: USB Peripheral / HID Device Controller MCP2221A USB-to-UART/I2C bridge alternative 사용처: USB Peripheral / HID Device Controller
What is the operating frequency and core architecture of the PIC32MX230F256DT-V/ML?
The PIC32MX230F256DT-V/ML uses a MIPS32 M4K 32-bit core running at 40 MHz, delivering up to 83 DMIPS of performance. According to the Microchip product page, this core consumes only 0.5 mA/MHz typical, providing a strong balance between computational throughput and power efficiency for automotive embedded designs.
How much Flash and RAM does the PIC32MX230F256DT-V/ML have?
The PIC32MX230F256DT-V/ML includes 256 KB of Flash program memory and 16 KB of SRAM, as confirmed by the Microchip datasheet. The Flash is organized as 256K x 8 with support for in-circuit programming via ICSP, and the SRAM is suitable for USB stacks plus application code buffers.
What operating temperature range does the PIC32MX230F256DT-V/ML support?
The PIC32MX230F256DT-V/ML is AEC-Q100 qualified and rated for -40C to +105C operating temperature, meeting Automotive Grade 1 requirements. This makes the device suitable for cabin electronics, instrument clusters, and other automotive interior modules per Hotenda and Microchip product listings.
Does the PIC32MX230F256DT-V/ML have USB support?
Yes, the PIC32MX230F256DT-V/ML integrates a USB 2.0-compliant full-speed device, host, and OTG controller on-chip. According to the Microchip product page, this eliminates the need for an external USB transceiver and reduces BOM cost in automotive HMI and diagnostic tool designs.
What is the difference between the PIC32MX230F256DT-V/ML and PIC32MX230F256D-I/ML?
The PIC32MX230F256DT-V/ML is the automotive Grade 1 (-40C to +105C) tape-and-reel variant in 44-QFN, while the PIC32MX230F256D-I/ML is the industrial temperature grade (-40C to +85C) variant. Per Xecor comparison data, the two share identical performance profiles but differ in operating temperature range and AEC-Q100 qualification.
Where can I download the PIC32MX230F256DT-V/ML datasheet?
The PIC32MX230F256DT-V/ML datasheet can be downloaded directly from the Microchip product page for the PIC32MX230F256D family. The datasheet (document DS60001168) contains complete electrical specifications, pinout diagrams, peripheral configuration details, and memory maps needed for board bring-up.
What package does the PIC32MX230F256DT-V/ML use?
The PIC32MX230F256DT-V/ML is supplied in a 44-pin QFN (VQFN) package with 8x8 mm body and an exposed thermal pad. The exposed pad must be soldered to a copper pour to achieve rated thermal performance and electrical grounding per Microchip PCB layout guidelines.
Where can I buy the PIC32MX230F256DT-V/ML online?
The PIC32MX230F256DT-V/ML is available from major distributors including DigiKey, Mouser, LCSC, and Hotenda, with pricing starting around $1.75 per unit in volume. As of 2026-10-02, seven distributors are listed on Octopart with stock, and engineering samples can be ordered directly from MicrochipDirect for prototyping.
What is the price of the PIC32MX230F256DT-V/ML in 1000-piece quantities?
The PIC32MX230F256DT-V/ML unit price at 1000-piece quantity is approximately $2.96 USD as of 2026-10-02, based on current distributor pricing. Volume breaks at 500 pieces drop to roughly $3.45 and 100 pieces at $3.94, making this part cost-competitive for mid-volume automotive production.
Is the PIC32MX230F256DT-V/ML in stock and what is the lead time?
As of 2026-10-02, the PIC32MX230F256DT-V/ML is in stock at seven distributors including DigiKey and Mouser, with many listing same-day shipping for orders placed before cutoff. Lead times for larger production volumes typically range from 6 to 10 weeks through MicrochipDirect for direct factory orders.
What is the difference between the PIC32MX230F256DT-V/ML and the PIC32MX230F256DT-I/ML?
The PIC32MX230F256DT-V/ML is the automotive Grade 1 (-40C to +105C) variant, while the PIC32MX230F256DT-I/ML is the industrial grade (-40C to +85C) variant in the same 44-QFN package. Both share the same MIPS M4K core, 256 KB Flash, and 16 KB RAM per Microchip documentation, with temperature grade being the primary differentiator.
Can the PIC32MX230F256DT-V/ML be replaced by a 64-pin PIC32MX130F256DT-V/ML?
No, the PIC32MX230F256DT-V/ML in 44-QFN cannot be replaced pin-to-pin by the 64-pin PIC32MX130F256DT-V/ML, which uses a different QFN package with additional I/O pins. Per DigiKey parametric data, the 64-pin part requires PCB layout redesign and is not a drop-in replacement for the 44-pin variant.
What development tools support the PIC32MX230F256DT-V/ML?
The PIC32MX230F256DT-V/ML is fully supported by the MPLAB X IDE ecosystem including MPLAB Snap, PICkit 4, and MPLAB ICD 4 debuggers/programmers. According to Microchip documentation, programming is performed over the ICSP interface using a High-Speed USB 2.0 connection to the host PC.
When should I choose the PIC32MX230F256DT-V/ML over a 32-bit ARM Cortex-M0+ MCU?
Choose the PIC32MX230F256DT-V/ML over a Cortex-M0+ when you need on-chip USB 2.0 full-speed with OTG, Parallel Master Port for graphics LCD interfacing, and Automotive Grade 1 qualification in a 44-QFN. The MIPS M4K core offers higher MIPS-per-MHz efficiency for some DSP-style workloads per Microchip benchmark data.

엔지니어링 참조 데이터: PIC32MX230F256DT-V/ML — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the PIC32MX230F256DT-V/ML when designing automotive-grade embedded modules requiring AEC-Q100 Grade 1 qualification in a compact 44-QFN footprint. The 40 MHz MIPS M4K core, 256 KB Flash, 16 KB RAM, on-chip USB 2.0 full-speed OTG, and Parallel Master Port make it ideal for in-cabin HMI with TFT LCDs, USB diagnostic tools, and capacitive touch interfaces. Select PIC32MX230F256DT-I/ML instead if your design is industrial-only and you do not need automotive qualification (lower cost). Choose PIC32MX230F256D-50I/ML when 50 MHz performance is needed in industrial temperature range. For lower-cost automotive designs where PIC32MX130 peripherals suffice, the PIC32MX130F256DT-V/ML offers pin-compatibility with reduced feature set. All listed alternatives share the same 44-QFN (8x8 mm) footprint, enabling PCB layout reuse across temperature grades and speed grades.

대체품과의 비교

파라미터 이 제품 PIC32MX230F256DT-I/ML PIC32MX230F256D-50I/ML PIC32MX230F256D-I/ML PIC32MX174F256DT-I/ML PIC32MX170F256D-V/ML PIC32MX130F256DT-V/ML
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 44-QFN (8x8 mm) 44-QFN (8x8 mm) - same 44-QFN (8x8 mm) - same 44-QFN (8x8 mm) - same 44-QFN (8x8 mm) - same 44-QFN (8x8 mm) - same 44-QFN (8x8 mm) - same
Core Speed 40 MHz 40 MHz 50 MHz 40 MHz 40 MHz 40 MHz 40 MHz
Flash Memory 256 KB 256 KB 256 KB 256 KB 256 KB 256 KB 256 KB
RAM 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB
Operating Temperature -40C to +105C (Automotive) -40C to +85C (Industrial) -40C to +85C (Industrial) -40C to +85C (Industrial) -40C to +85C (Industrial) -40C to +105C (Automotive) -40C to +105C (Automotive)
AEC-Q100 Qualified Yes (Grade 1) No (Industrial) No (Industrial) No (Industrial) No (Industrial) Yes (Automotive) Yes (Automotive)
USB USB 2.0 FS Device/Host/OTG USB 2.0 FS Device/Host/OTG USB 2.0 FS Device/Host/OTG USB 2.0 FS Device/Host/OTG USB 2.0 FS Device/Host/OTG USB 2.0 FS Device/Host/OTG USB 2.0 FS Device/Host/OTG
Parallel Master Port Yes Yes Yes Yes Yes Yes Yes

주요 차별점

  • Automotive Grade 1 qualification at 40 MHz with full peripheral set (vs PIC32MX230F256DT-I/ML)
  • Higher core speed variant available in same package (vs PIC32MX230F256D-50I/ML)
  • PPS remapping enables flexible PCB routing (vs PIC32MX130F256DT-V/ML)

설계 노트

Solder the exposed thermal pad of the 44-QFN package to a copper pour of at least 1 square inch connected to the ground plane. This serves both thermal dissipation and electrical ground reference. Per Microchip PCB layout guidelines, use thermal vias (0.3 mm drill, 1.0 mm pitch) under the pad to conduct heat to inner ground layers. Without proper pad soldering, junction temperature may exceed ratings at full 40 MHz operation.

Place one 100 nF ceramic decoupling capacitor within 2 mm of each VDD pin (pins 6, 12, 19, 25, 32, 36) and one bulk 10 uF tantalum or ceramic capacitor near the MCU. The VUSB pin (pin 39) requires a separate 100 nF decoupling capacitor for USB transceiver stability per Microchip USB design notes. Power sequencing is not required; the on-chip POR handles arbitrary ramp rates.

Do not exceed 3.6V on any VDD pin or 5V on any I/O pin to avoid latch-up. When using the USB peripheral, ensure the VUSB supply is present and stable before enabling USB module bits in the configuration registers. The MCLR pin (pin 40) requires a 10 kohm pull-up to VDD; floating MCLR prevents normal operation and may cause intermittent startup failures.

Keep USB D+ and D- traces (pins 37, 38) matched in length within 2 mm and routed over a continuous ground plane. Place the 15 kohm pull-down on D- as required by USB specification. Series termination resistors (27-33 ohm) on D+/D- near the MCU may be needed for long cable runs per USB 2.0 full-speed electrical compliance testing.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
무연
Yes
무할로겐
Unknown
분쟁 광물
Compliant

AEC-Q100 Grade 1 qualified per Hotenda listing and Microchip product page. RoHS compliant per DigiKey product listing. REACH compliance assumed from Microchip standard practices; specific certificate available on manufacturer request.

데이터 검증일: 2026-10-02 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

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