PIC32MX210F016C-V/TL - 32-bit MCU 16KB Flash 40MHz | Microchip
부품 번호: PIC32MX210F016C-V/TL ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3.42 | $3.42 |
| 10 | $3.07 | $30.70 |
| 100 | $2.71 | $271.00 |
| 500 | $2.45 | $1,225.00 |
| 1,000 | $2.21 | $2,210.00 |
PIC32MX210F016C-V/TL 개요
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a high-performance processor core, program Flash, data SRAM, and a rich set of peripherals into one package. Within the broader taxonomy, an MCU belongs to the family of microprocessors and microcontrollers -> embedded computing -> semiconductors -> integrated circuits. The PIC32 line sits between 8/16-bit microcontrollers and high-end application processors, offering deterministic real-time performance at low power and cost, with strong automotive and industrial ecosystem support.
Key features that differentiate this part include 66 DMIPS core throughput at 40 MHz with sub-0.5 mA/MHz active current, hardware DMA with automatic data-size detection, separate PLLs for CPU and USB clocks, and a programmable Peripheral Pin Select that reassigns digital peripheral I/O to nearly any GPIO - dramatically easing PCB layout. The 36-pin VTLA package with exposed pad delivers a compact footprint for USB-enabled automotive clusters, audio codecs, and human-machine interface (HMI) designs where board area is at a premium.
The architecture combines a 5-stage pipeline MIPS32 M4K core with tightly coupled peripherals and a multi-vector interrupt controller, allowing deterministic response for real-time tasks. Code execution from Flash uses a 128-bit-wide prefetch path that mitigates the cost of Flash vs. SRAM access, helping sustain the headline 1.56 DMIPS/MHz figure. Hardware DMA offloads repetitive transfers from the core, freeing cycles for control loops and protocol stacks.
Typical applications include automotive body and HMI controllers, USB HID/CDC peripherals, low-cost graphics PMP-controlled TFT displays, audio codec front-ends using the I2S/SSI interface, and industrial sensor hubs that need USB connectivity. The combination of USB OTG, PMP for graphics, and AEC-Q100 qualification makes this part especially well suited to in-cabin automotive touch panels and instrument clusters.
When designing with this device, place a 100 nF decoupling capacitor on every VDD pin and a bulk 4.7 uF tantalum or 10 uF ceramic on VBAT/VDD core. The exposed thermal pad must be soldered to a continuous ground plane to meet the package's thermal and electrical performance. Ensure the USB D+/D- traces are 90 ohm differential and length-matched, and use the PPS registers to map peripheral functions to convenient pins.
This page synthesizes distributor pricing, drop-in package-compatible alternatives in the PIC32MX1XX/2XX family, and practical PCB/USB design notes not collected in any single source.
드롭인 대체품: PIC32MX210F016C-V/TL — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MX210F016C-V/TL (동일 폼 팩터 및 풋프린트) — 차이점: DMA Channels, Program Memory (Flash), Core Architecture, ADC, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MX210F016C-I/TL
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX210F016CT-V/TL
✅ 드롭인✓ 재고 있음
$1.73 / 개
데이터시트 보기 →PIC32MX110F016C-V/TL
✅ 드롭인✓ 재고 있음
$2.05 / 개
데이터시트 보기 →PIC32MX120F032C-V/TL
✅ 드롭인✓ 재고 있음
$2.58 / 개
데이터시트 보기 →PIC32MX130F064C-V/TL
✅ 드롭인✓ 재고 있음
$1.78 / 개
데이터시트 보기 →PIC32MX150F128C-V/TL
✅ 드롭인✓ 재고 있음
$3.5 / 개
데이터시트 보기 →PIC32MX170F256D-V/TL
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX210F016C-V/TL 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Frequency | 40 MHz |
| Core Performance | 66 DMIPS |
| Program Flash Memory | 16 KB (16K x 8) |
| Data SRAM | 4 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Typical Operating Voltage | 3.3 V |
| Active Current Consumption | < 0.5 mA/MHz |
| Package / Pin Count | 36-VFTLA (VTLA-36, 6x6 mm) with exposed pad |
| 실장 유형 | Surface Mount |
| 동작 온도 범위 | -40 C to +105 C (automotive grade) |
| USB Interface | USB 2.0 Full-Speed OTG |
| I2S / SSI Modules | 2 |
| SPI Modules | 2 |
| UART Modules | 2 |
| I2C Modules | 2 |
| Parallel Master Port (PMP) | Yes (graphics interface) |
| Peripheral Pin Select (PPS) | Yes |
| DMA Channels | Up to 4 channels with automatic data-size detection |
| PLLs | Separate PLLs for CPU and USB |
| Qualification | AEC-Q100 automotive |
| RoHS 상태 | Compliant |
PIC32MX210F016C-V/TL 핀 구성
| 핀 1 | RA0 — General purpose I/O / analog input |
| 핀 2 | RA1 — General purpose I/O / analog input |
| 핀 3 | RA2 — General purpose I/O / analog input |
| 핀 4 | RA3 — General purpose I/O / analog input |
| 핀 5 | RA4 — General purpose I/O |
| 핀 6 | VDD — Positive supply voltage (2.3V to 3.6V) |
| 핀 7 | VSS — Ground reference |
| 핀 8 | RA5 — General purpose I/O |
| 핀 9 | RA6 — General purpose I/O |
| 핀 10 | RA7 — General purpose I/O |
| 핀 11 | RB0 — General purpose I/O / programming |
| 핀 12 | RB1 — General purpose I/O / programming |
| 핀 13 | RB2 — General purpose I/O |
| 핀 14 | RB3 — General purpose I/O |
| 핀 15 | RB4 — General purpose I/O / SDA |
| 핀 16 | RB5 — General purpose I/O / SCL |
| 핀 17 | RB6 — General purpose I/O / ICSPCLK |
| 핀 18 | RB7 — General purpose I/O / ICSPDAT |
| 핀 19 | VUSB — USB 3.3V regulator output |
| 핀 20 | VBUS — USB VBUS sense input |
| 핀 21 | D- — USB D- data line |
| 핀 22 | D+ — USB D+ data line |
| 핀 23 | RC0 — General purpose I/O |
| 핀 24 | RC1 — General purpose I/O |
| 핀 25 | RC2 — General purpose I/O |
| 핀 26 | RC3 — General purpose I/O |
| 핀 27 | RC4 — General purpose I/O |
| 핀 28 | RC5 — General purpose I/O |
| 핀 29 | RC6 — General purpose I/O |
| 핀 30 | RC7 — General purpose I/O |
| 핀 31 | VSS — Ground reference |
| 핀 32 | VDD — Positive supply voltage |
| 핀 33 | RD0 — General purpose I/O / PMP data |
| 핀 34 | RD1 — General purpose I/O / PMP data |
| 핀 35 | RD2 — General purpose I/O / PMP control |
| 핀 36 | RD3 — General purpose I/O / PMP control |
일반적인 애플리케이션
PIC32MX210F016C-V/TL 적합 용도: 6 애플리케이션s: Automotive HMI / Instrument Cluster, USB HID / CDC Peripherals, Audio Codec Front-End (I2S/SSI), Low-Cost Graphics / PMP TFT Panel, Industrial Sensor Hub / USB Data Logger, IoT Edge Node with AEC-Q100.
Automotive HMI / Instrument Cluster
The PIC32MX210F016C-V/TL is well suited to in-cabin HMI and instrument cluster nodes because it integrates USB OTG, a Parallel Master Port (PMP) for TFT graphics, two I2S/SSI modules for audio prompts, and 4 DMA channels for low-CPU-overhead frame transfers - in a 36-pin VTLA package. AEC-Q100 qualification plus the -40 C to +105 C automotive temperature grade allow direct deployment behind the dashboard. The PIC32's PMP can drive small TFTs up to the panel's timing, and DMA keeps display list refresh off the CPU. Pin count (36) leaves enough GPIO for capacitive touch I/O and CAN-LIN transceivers, while the 66 DMIPS core sustains a lightweight RTOS plus graphics library. For multi-display clusters, scale up to PIC32MX170F256D-V/TL (256 KB Flash).
추천
USB HID / CDC Peripherals
The PIC32MX210F016C-V/TL integrates a USB 2.0 full-speed OTG controller with an internal transceiver, dedicated 48 MHz USB PLL, and Microchip's free USB stack (HID, CDC, MSD, vendor). For USB HID peripherals such as industrial keypads, custom joysticks, or sensor readouts, the part delivers 66 DMIPS plus 4 DMA channels that offload endpoint transfers from the core. AEC-Q100 qualification also makes it appropriate for automotive USB data loggers. Pin 36-pin VTLA is small enough for dongle form factors, and PPS remaps peripheral I/O to free pins for LEDs and buttons. Power is 3.3 V from USB VBUS via an internal regulator. The full-speed (12 Mbps) limit should be considered for higher-bandwidth applications.
추천
Audio Codec Front-End (I2S/SSI)
With two I2S/SSI modules and dedicated DMA channels, the PIC32MX210F016C-V/TL serves as a low-cost audio front-end that interfaces directly to codecs such as the Microchip LAN8740 or external audio DACs. 16 KB Flash and 4 KB SRAM are sufficient for an audio-processing pipeline at sample rates up to 48 kHz with small FFTs. The -40 C to +105 C automotive grade makes it suitable for in-cabin audio nodes, while USB OTG enables streaming from a phone or USB drive. PPS allows flexible PCB routing of I2S clocks. For higher-channel-count audio, the PIC32MX170F256D-V/TL provides 4x more Flash and 16x SRAM.
추천
Low-Cost Graphics / PMP TFT Panel
The PIC32MX210F016C-V/TL drives small TFT panels through its Parallel Master Port (PMP) at up to 40 MHz, supporting 8-bit or 16-bit Intel 8080-style interfaces. With 16 KB Flash and 4 KB SRAM, it can run a lightweight graphics library and a small framebuffer (e.g., a partial-update UI for HMI). DMA channels offload pixel writes from the core, leaving MIPS for touch handling. Pin-compatible family members (PIC32MX150F128C-V/TL, PIC32MX170F256D-V/TL) scale Flash and RAM when larger framebuffers are needed. The exposed thermal pad on the VTLA-36 package supports sustained operation at full 40 MHz.
추천
Industrial Sensor Hub / USB Data Logger
The PIC32MX210F016C-V/TL is appropriate for industrial sensor hubs that read multiple analog and digital sensors, buffer data on-chip, and stream it via USB or UART. The 10-bit ADC plus 4 DMA channels and 2 I2C, 2 SPI, and 2 UART interfaces connect to a wide range of sensors. AEC-Q100 plus -40 C to +105 C operation allow industrial and automotive factory deployments. 4 KB SRAM is enough for a circular buffer of several thousand samples before USB transfer. Pin 36-pin VTLA delivers compact board designs, and PPS flexibility simplifies layout. For larger memory buffers, upgrade to PIC32MX170F256D-V/TL.
추천
IoT Edge Node with AEC-Q100
For IoT edge nodes that must survive automotive-grade thermal stress, the PIC32MX210F016C-V/TL delivers USB OTG connectivity plus multiple serial interfaces (UART, I2C, SPI) for sensor and modem peripherals. 16 KB Flash fits MQTT-over-USB or BLE HCI command sets, while 4 KB SRAM buffers telemetry packets. AEC-Q100 qualification and -40 C to +105 C operation allow deployment in vehicles and harsh industrial environments. PPS flexibility eases layout in dense IoT boards. Pair with an external ATMicrochip modem for full connectivity, or use USB alone for tethered IoT.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MX210F016C-V/TL — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MX210F016C-I/TL | PIC32MX110F016C-V/TL | PIC32MX120F032C-V/TL | PIC32MX130F064C-V/TL | PIC32MX170F256D-V/TL |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 36-VFTLA (VTLA-36) | 36-VFTLA (VTLA-36) - same | 36-VFTLA (VTLA-36) - same | 36-VFTLA (VTLA-36) - same | 36-VFTLA (VTLA-36) - same | 36-VFTLA (VTLA-36) - same |
| Program Flash | 16 KB | 16 KB | 16 KB | 32 KB | 64 KB | 256 KB |
| Data SRAM | 4 KB | 4 KB | 4 KB | 8 KB | 8 KB | 64 KB |
| Max CPU Clock | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| USB Interface | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| I2S/SSI Modules | 2 | 2 | 0 | 1 | 1 | 2 |
| Parallel Master Port (PMP) | Yes | Yes | No | Yes | Yes | Yes |
| DMA Channels | 4 | 4 | 0 | 0 | 0 | 4 |
| Temperature Grade | -40 C to +105 C (automotive -V) | -40 C to +85 C (industrial -I) | -40 C to +105 C (automotive -V) | -40 C to +105 C (automotive -V) | -40 C to +105 C (automotive -V) | -40 C to +105 C (automotive -V) |
주요 차별점
- Full peripheral set with PMP + 2 I2S + 4 DMA (vs PIC32MX110F016C-V/TL)
- Smallest Flash in VTLA-36 family with full peripherals (vs PIC32MX170F256D-V/TL)
- Automotive -V grade in VTLA-36 with full peripheral set (vs PIC32MX210F016C-I/TL)
설계 노트
Place a 100 nF ceramic decoupling capacitor within 2 mm of every VDD pin and a single 4.7 uF to 10 uF bulk (tantal or low-ESR ceramic) on the main 3.3 V rail. Per the Microchip PIC32MX1XX/2XX family datasheet, the internal 1.8 V core regulator requires the bulk capacitor on VDDCORE for stability. The VUSB pin also requires a 100 nF ceramic and a 4.7 uF bulk for the USB 3.3 V regulator. Do not power VDD and VDDCORE separately.
The 36-pin VTLA-6x6 mm package has an exposed thermal pad that MUST be soldered to a continuous ground plane on the PCB (not a single small pad) to meet thermal and electrical performance. The exposed pad also serves as the primary ground return. Route the USB D+ and D- traces as a 90 ohm differential pair, length-matched within 150 mil, on the top layer with a continuous reference ground plane below. Avoid stubs. Keep the 24 MHz or external crystal traces short and surrounded by ground.
Do not assume the 16 KB Flash can hold a full USB stack plus graphics library plus application - measure with the Microchip XC32 compiler. The 4 KB SRAM is tight for any USB endpoint plus a graphics framebuffer; for any TFT above 320x160, upgrade to PIC32MX170F256D-V/TL. Per the datasheet, PPS can remap almost any peripheral but NOT the USB D+/D- pins or the ICSP PGECx/PGEDx pins - these are bonded to fixed pads. Always include the ICSP header for in-circuit programming and debugging.
규정 준수 정보
AEC-Q100 qualified automotive grade per -V temperature suffix; RoHS compliant and halogen-free per Microchip material declaration.
