PIC32MX340F128L-80V/BG - 32-bit MCU, 128KB Flash, 80MHz | Microchip
부품 번호: PIC32MX340F128L-80V/BG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $7.42 | $7.42 |
| 10 | $6.68 | $66.80 |
| 100 | $5.95 | $595.00 |
| 500 | $5.32 | $2,660.00 |
| 1,000 | $4.78 | $4,780.00 |
PIC32MX340F128L-80V/BG 개요
A microcontroller (MCU) is a single-chip computer containing a CPU core, non-volatile program memory (Flash), volatile working memory (SRAM), and integrated peripherals such as ADCs, timers, communication controllers, and GPIO. Within the embedded hierarchy, MCUs sit between discrete logic and full microprocessors (MPUs), offering deterministic real-time control with low system BOM cost. The PIC32MX340F128L-80V/BG specifically belongs to the MIPS-based PIC32 family, which bridges 8/16-bit PIC microcontrollers and 32-bit application processors by delivering MHz-class MIPS performance with Microchip's familiar MPLAB ecosystem.
Key features include 128 KB Flash (128K x 8), 32 KB RAM, a 10-bit ADC with DMA support, 53 digital I/O pins, and a 2.5V/3.3V operating voltage range. The internal oscillator and 80 MHz core deliver up to 1.56 DMIPS/MHz instruction throughput, with peripheral pin select providing flexible signal routing. The 121-ball TFBGA package enables high-density board layouts while the industrial temperature grade (-40°C to +105°C) supports automotive and industrial deployments.
Typical applications include industrial automation controllers, USB device peripherals, graphics-enabled HMI displays, audio processing nodes, and embedded connectivity gateways. The integrated DMA engine and ample SRAM also suit sensor-fusion front-ends and protocol bridging between CAN, UART, SPI, and I2C networks.
Designers should allocate a 0.1 µF decoupling capacitor per power pin and follow Microchip's recommended TFBGA escape pattern. The PIC32MX340F128L-80V/BG requires the MPLAB X IDE and a compatible programmer (PICkit 3/4/5 or ICD) for development.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, helping engineers accelerate sourcing and PCB layout decisions for PIC32MX-based designs.
드롭인 대체품: PIC32MX340F128L-80V/BG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MX340F128L-80V/BG (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Operating Temperature, Package, Timers, Core Architecture.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MX340F128LT-80V/BG
✅ 드롭인✓ 재고 있음
$5.42 / 개
데이터시트 보기 →PIC32MX340F128L-80I/BG
✅ 드롭인✓ 재고 있음
$5.48 / 개
데이터시트 보기 →PIC32MX320F128L-80V/BG
✅ 드롭인✓ 재고 있음
$4.85 / 개
데이터시트 보기 →PIC32MX340F128HT-80V/MR
✅ 드롭인✓ 재고 있음
$3.92 / 개
데이터시트 보기 →PIC32MX340F128L-80V/BG 최대 정격 & 전기적 특성
| Core | MIPS32 M4K |
| 데이터 버스 폭 | 32-bit |
| 최대 클록 주파수 | 80 MHz |
| Program Memory Size (Flash) | 128 KB (128 K x 8) |
| RAM Size | 32 KB |
| ADC | 10-bit |
| DMA Channels | Yes (8-channel) |
| Number of I/O Pins | 53 |
| 공급 전압 | 2.5 V / 3.3 V |
| 동작 온도 범위 | -40 °C to +105 °C |
| 패키지 / 케이스 | 121-TFBGA (10 x 10 mm) |
| 실장 유형 | Surface Mount |
| Oscillator Type | Internal |
| RoHS 상태 | Compliant |
PIC32MX340F128L-80V/BG 핀 구성
| 핀 A1 | I/O — General purpose I/O (refer to datasheet pin table for specific assignment) |
| 핀 A11 | VDD — Power supply |
| 핀 B1 | I/O — General purpose I/O |
| 핀 K11 | VSS — Ground |
| 핀 L1 | OSC1 — Oscillator input |
| 핀 L11 | OSC2 — Oscillator output |
일반적인 애플리케이션
PIC32MX340F128L-80V/BG 적합 용도: 6 애플리케이션s: Industrial Automation Controllers, USB Device Peripherals, Graphics-Enabled HMI Displays, Audio Processing and Playback, Embedded Connectivity Gateways, Automotive Body Electronics.
Industrial Automation Controllers
The PIC32MX340F128L-80V/BG fits industrial automation as a deterministic 32-bit controller for PLC expansion modules, sensor hubs, and motor-control front-ends. With 80 MHz MIPS32 M4K core, 32 KB SRAM, and 8-channel DMA, it handles multi-axis control loops and real-time fieldbus bridging (Modbus, CAN) without external memory. The 53 GPIO and 10-bit ADC with DMA support high-speed sensor sampling, while the industrial -40C to +105C range ensures reliable operation in factory cabinets. USB device connectivity enables field firmware updates and HMI panel integration.
추천
USB Device Peripherals
The PIC32MX340F128L-80V/BG integrates a USB 2.0 full-speed device controller, making it ideal for USB peripherals such as HID input devices, CDC serial adapters, and custom vendor-class products. Pinout from the 121-TFBGA exposes USB D+/D- pins and provides ample GPIO for application-specific functions. The 80 MHz MIPS core executes USB stacks and HID report handling with low interrupt latency, while 32 KB SRAM accommodates USB descriptors and class drivers. The internal oscillator eliminates external crystal cost for non-USB or low-precision USB applications.
추천
Graphics-Enabled HMI Displays
The PIC32MX340F128L-80V/BG drives small TFT LCD panels and segment LCDs for HMI applications in appliances, instruments, and control panels. With 80 MHz core, parallel PMP interface, and ample GPIO, it can refresh small color TFTs at 30+ FPS for graphical menus and gauges. Pinout allocation in the 121-TFBGA reserves 8-bit PMP data lines plus control signals, while 32 KB SRAM holds frame buffers for small QVGA displays. The 32-bit MIPS throughput outperforms 8/16-bit MCUs at rasterizing icons and text.
추천
Audio Processing and Playback
The PIC32MX340F128L-80V/BG serves audio applications including audio file decoding, DSP filter chains, and tone generation. Pinout in the 121-TFBGA exposes I2S-compatible peripherals and PWM outputs for Class D amplifier control. The 32 KB SRAM holds audio buffers, while the 80 MHz MIPS core executes sample-rate conversion and equalization. The integrated 10-bit ADC captures analog audio input, and the DMA engine handles audio streaming without CPU intervention. This makes it suitable for doorbells, intercoms, and instrument audio modules.
추천
Embedded Connectivity Gateways
The PIC32MX340F128L-80V/BG bridges multiple serial protocols in IoT gateways, sensor concentrators, and protocol converters. Pinout in the 121-TFBGA provides up to 5 UART, 2 SPI, and 2 IIC peripherals for multi-protocol bridging. The 80 MHz core and 32 KB SRAM maintain concurrent protocol stacks, while the DMA engine offloads buffer management. Industrial temperature grade suits outdoor enclosures. This combination makes it ideal for industrial sensor hubs, building automation bridges, and asset-tracking devices.
추천
Automotive Body Electronics
The PIC32MX340F128L-80V/BG handles automotive body control applications including lighting controllers, seat modules, and instrument cluster sub-controllers. The 121-TFBGA package provides ample GPIO for driving multiple loads, while the 80 MHz core executes CAN/LIN stacks. Pinout allocation supports PWM outputs for LED dimming and motor control. The -40C to +105C industrial temperature range suits cabin-mounted modules. While not AEC-Q100 qualified, it is widely deployed in non-safety automotive body applications.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MX340F128L-80V/BG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MX340F128LT-80V/BG | PIC32MX340F128L-80I/BG | PIC32MX320F128L-80V/BG |
|---|---|---|---|---|
| Package | 121-TFBGA (10x10) | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Clock | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Flash | 128 KB | 128 KB | 128 KB | 128 KB |
| RAM | 32 KB | 32 KB | 32 KB | 16 KB |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +85C | -40C to +105C |
| Packaging | Tray | Tape & Reel | Tray | Tray |
| I/O Count | 53 | 53 | 53 | 53 |
| Price (qty 1) | $7.42 | $7.42 | $7.20 | $6.85 |
주요 차별점
- Identical silicon in tape-and-reel format (vs PIC32MX340F128LT-80V/BG)
- Industrial temperature range vs commercial (vs PIC32MX340F128L-80I/BG)
- 32 KB RAM vs 16 KB RAM (vs PIC32MX320F128L-80V/BG)
설계 노트
The PIC32MX340F128L-80V/BG requires a stable 3.3 V supply. Place a 10 µF bulk capacitor and 0.1 µF decoupling capacitor close to each VDD pin. The internal LDO generates the core 1.8 V from VDD; ensure VDD never falls below 2.5 V to maintain regulation. Use a low-ESR ceramic for bulk decoupling to handle 80 MHz switching transients.
Estimated: At 80 MHz with all peripherals enabled, typical core current is approximately 50-70 mA, dissipating 165-230 mW at 3.3 V. The 121-TFBGA thermal resistance is approximately 25-35 C/W (per Microchip packaging data). For continuous full-speed operation, provide at least 1 square inch of copper pour connected to VSS balls for heat spreading.
The 121-TFBGA package uses 0.8 mm ball pitch and requires microvia PCB technology. Fan-out traces on inner layers with 0.4 mm/0.2 mm trace/spacing design rules. Decoupling capacitors must be placed within 5 mm of the respective VDD/VSS balls. Avoid routing high-speed USB signals (D+/D-) near oscillator traces.
Do not leave unused I/O pins floating - configure them as outputs or inputs with pull-ups. The 80 MHz part requires the PLL configuration to match the input crystal frequency per datasheet Section 31 (Oscillator Configuration). Ensure JTAG/ICSP pins are not inadvertently driven externally during programming.
Route USB D+/D- with 90 ohm differential impedance if USB is used. Keep crystal traces short (under 5 mm) and symmetric to OSC1/OSC2. Place the 32.768 kHz secondary oscillator components close to SOSC1/SOSC2 if RTCC is used. Maintain solid ground plane under the BGA footprint.
규정 준수 정보
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - not recommended for automotive safety applications. Halogen-free status not verified in source data.
