PIC32MX460F512LT-80V/BG - 32-bit MCU 512KB Flash USB-OTG | Microchip
부품 번호: PIC32MX460F512LT-80V/BG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.98 | $6.98 |
| 10 | $6.42 | $64.20 |
| 100 | $5.74 | $574.00 |
| 500 | $5.21 | $2,605.00 |
| 1,000 | $4.85 | $4,850.00 |
PIC32MX460F512LT-80V/BG 개요
A PIC32MX microcontroller is a 32-bit MIPS-based MCU that combines the performance of a microprocessor with the peripheral integration of an embedded controller. Within the broader taxonomy, it sits as MCU -> 32-bit MCU -> MIPS microcontroller -> PIC32 family -> semiconductor. These devices bridge the gap between 8/16-bit PIC microcontrollers and 32-bit ARM Cortex-M parts, targeting cost-sensitive embedded applications that need moderate compute, large memory, and rich connectivity.
Key features include 80 MHz core frequency (up to 100 DMIPS), 1.56 DMIPS/MHz, hardware Multiply/Divide, single-cycle Flash access via 128-bit prefetch cache, 5-stage pipeline, and a wide 2.3V-3.6V operating range. The integrated USB 2.0 full-speed OTG transceiver eliminates the need for an external PHY, simplifying USB device, host, and On-The-Go designs.
The PIC32MX460F512L architecture uses a 5-stage MIPS M4K pipeline with separate instruction and data buses and a configurable prefetch cache, allowing sustained execution from Flash. USB-OTG integration, 16 channels of 10-bit ADC at 1 Msps, and a Parallel Master Port give designers connectivity and mixed-signal capability without external components.
Typical applications include USB peripherals (barcode scanners, custom HID, CDC devices), embedded graphics (graphical LCD control via PMP), industrial control (PLC I/O modules, sensor hubs), consumer audio, and general-purpose 32-bit embedded control. The wide memory and USB integration make it a strong fit for connected appliances and Human-Machine Interface panels.
When designing with this device, ensure the 121-ball TFBGA is on a 4-layer or more PCB with matched-impedance USB routing (90 ohm differential), adequate decoupling (100 nF + 4.7 uF near each VDD pin), and that the JTAG/ICSP traces are short per Microchip ICD guidance. Watch the 3.3V rail tolerance during inrush and use a 32.768 kHz crystal for RTCC if calendar functions are required.
This page synthesizes distributor pricing, drop-in package-compatible alternatives from the same family, and practical design notes that complement the manufacturer datasheet.
드롭인 대체품: PIC32MX460F512LT-80V/BG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MX460F512LT-80V/BG (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Core Architecture, Package, DMA Channels, Timers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MX460F512L-80V/BG
✅ 드롭인✓ 재고 있음
$6.1 / 개
데이터시트 보기 →PIC32MX360F512L-80V/BG
✅ 드롭인✓ 재고 있음
$6.65 / 개
데이터시트 보기 →PIC32MX460F512L-80V/PT
✅ 드롭인✓ 재고 있음
$9.8 / 개
데이터시트 보기 →PIC32MX460F512L-80I/PT
✅ 드롭인✓ 재고 있음
$6.05 / 개
데이터시트 보기 →PIC32MX460F512LT-80I/BG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX460F512LT-80V/BG 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 M4K |
| Core Bit Width | 32-bit |
| Maximum CPU Clock | 80 MHz |
| Performance | 1.56 DMIPS/MHz |
| Program Flash Memory | 512 KB (512K x 8) |
| SRAM | 32 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| USB Interface | USB 2.0 Full-Speed OTG (integrated transceiver) |
| ADC | 10-bit, 16-channel, up to 1 Msps |
| Parallel Master Port (PMP) | Yes |
| UART / SPI / I2C | Multiple (see datasheet for channel counts) |
| Timers | Multiple 16-bit and 32-bit (see datasheet) |
| 패키지 | 121-ball TFBGA (10x10 mm) |
| 실장 유형 | Surface Mount |
PIC32MX460F512LT-80V/BG 121-ball tfbga (10x10 mm) 핀 구성 가이드
PIC32MX460F512LT-80V/BG(121-ball tfbga (10x10 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC32MX460F512LT-80V/BG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC32MX460F512LT-80V/BG 적합 용도: 6 애플리케이션s: USB HID / CDC Device Peripherals, Embedded Graphical HMI Panels, Industrial Control / PLC I/O Modules, Connected Consumer Appliances, Custom Audio Devices, Data Acquisition Front-Ends.
USB HID / CDC Device Peripherals
The PIC32MX460F512LT-80V/BG is purpose-built for USB peripherals thanks to its integrated USB 2.0 Full-Speed OTG transceiver. The 80 MHz MIPS M4K core delivers 100 DMIPS, easily running Microchip's MLA USB stack plus application code, while 512 KB Flash fits full HID, CDC, and MSD class drivers. Typical designs include barcode scanners, custom HID input devices, and USB-to-UART bridges. The 32 KB SRAM handles USB packet buffering and a small TCP/IP stack if needed. Integrated USB eliminates an external PHY, reducing BOM cost and PCB area versus MCU + discrete USB solutions. Use 90 ohm differential routing on D+/D- and place 15 kohm pull-down on D- for full-speed device mode per USB 2.0 spec.
추천
Embedded Graphical HMI Panels
The PIC32MX460F512LT-80V/BG's Parallel Master Port (PMP) drives graphical LCDs and OLED panels directly without an external graphics controller, while 512 KB Flash accommodates Microchip's graphics library and assets. The 16-channel 10-bit ADC reads touch and analog sensors alongside display refresh, and 32 KB SRAM holds frame buffers for small QVGA panels. The 80 MHz CPU renders UI widgets smoothly and handles touch events at low latency. Typical deployments include appliance control panels, industrial HMI, and medical device front panels. Designers can daisy-chain PMP to external SRAM for larger displays; ensure PMP timing matches the panel's setup/hold requirements from the manufacturer datasheet.
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Industrial Control / PLC I/O Modules
The PIC32MX460F512LT-80V/BG's wide 2.3-3.6V supply, 16-channel 10-bit ADC at 1 Msps, and multiple UART/SPI/I2C peripherals make it a strong fit for PLC I/O expansion modules and industrial sensor hubs. 512 KB Flash supports Modbus RTU/TCP stacks, custom industrial protocols, and digital signal filtering routines at the edge. The 32 KB SRAM handles protocol buffers and a small RTOS without external memory. Industrial temperature variants (PIC32MX460F512L-80I series) operate from -40C to +85C. Designers use the ADC for analog sensor readout (4-20 mA, 0-10 V via front-end), and DMA-driven SPI offloads high-speed sensor polling. Watch the 3.3V supply tolerance and add TVS diodes on field-side connections.
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Connected Consumer Appliances
USB-OTG plus 80 MHz compute and 512 KB Flash position the PIC32MX460F512LT-80V/BG well for connected home appliances - smart thermostats, kitchen controllers, and USB-upgradeable consumer devices. Microchip's TCP/IP and Wi-Fi companion libraries (via MRF24WG0MA modules) run on the PIC32, while 32 KB SRAM holds small HTTP servers and OTA buffers. The integrated ADC reads temperature, humidity, and tactile inputs; the PMP drives status LCDs. Designers typically add a Microchip RN4871 BLE module for phone pairing while keeping the PIC32 as the application controller. Cost of the 121-TFBGA at ~$4.85/1000 is competitive against 32-bit ARM Cortex-M0+ parts that lack integrated USB-OTG.
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Custom Audio Devices
The PIC32MX460F512LT-80V/BG drives custom USB audio class devices - USB headphones, microphones, and speakers - using its integrated USB-OTG full-speed transceiver. The 512 KB Flash fits USB Audio class drivers, sample-rate conversion code, and DSP-style effects. I2S peripheral (available on the PIC32MX4XX) interfaces to external audio codecs, while the 10-bit ADC reads level controls. 80 MHz CPU sustains 48 kHz/16-bit stereo bidirectionally with minimal overhead. Compared to PIC32MX3XX (no USB), the 460 variant removes the need for a separate USB audio bridge IC, saving ~$1 BOM. Add an external 24-bit codec like the TI PCM5101A for higher-fidelity output.
추천
Data Acquisition Front-Ends
With 16 channels of 10-bit ADC sampling up to 1 Msps and a DMA engine that streams conversions without CPU intervention, the PIC32MX460F512LT-80V/BG serves as a multi-channel data acquisition front-end. 32 KB SRAM buffers sample bursts; 512 KB Flash holds calibration tables and a small RTOS for logging. The Parallel Master Port dumps data to external SRAM or an LCD; UART/SPI exports to a host PC. Designers wire the ADC inputs to sensor bridges (load cells, thermistors, strain gauges) with proper anti-alias filtering. For higher resolution (12/16-bit), step up to the PIC32MX1XX/2XX family; for higher channel count, stack multiple PIC32s via SPI daisy-chain.
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추천 제품 요약
엔지니어링 참조 데이터: PIC32MX460F512LT-80V/BG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MX460F512L-80V/BG | PIC32MX360F512L-80V/BG | PIC32MX460F512L-80V/PT | PIC32MX460F512L-80I/PT | PIC32MX460F512LT-80I/BG |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 100-TQFP (12x12 mm) - different footprint | 100-TQFP (12x12 mm) - different footprint | 121-TFBGA (10x10 mm) - same |
| Core | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit |
| Max Clock | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| USB-OTG | Yes (integrated) | Yes (integrated) | No | Yes (integrated) | Yes (integrated) | Yes (integrated) |
| Parallel Master Port | Yes | Yes | No | Yes | Yes | Yes |
| Operating Voltage | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V |
| Temperature Grade | V (commercial) | V (commercial) | V (commercial) | V (commercial) | I (industrial) | I (industrial) |
주요 차별점
- Integrated USB 2.0 Full-Speed OTG with on-chip transceiver (vs PIC32MX360F512L-80V/BG)
- On-chip Parallel Master Port for graphics and external memory (vs PIC32MX360F512L-80V/BG)
- Tape and Reel packaging for SMT production lines (vs PIC32MX460F512L-80V/BG (tray))
설계 노트
The 121-ball TFBGA package requires 4 or more PCB layers with microvia or via-in-pad capability for reliable assembly. Place a 100 nF ceramic decoupling capacitor plus a 4.7 uF bulk capacitor within 2 mm of each VDD/VDDCORE pin pair. Use a continuous ground plane on layer 2 directly under the BGA for thermal spreading and return-current control.
Route the USB D+ and D- signals as a 90 ohm differential pair with matched length (delta < 150 mil). Keep the pair over a continuous ground plane and away from switching signals; place the 15 kohm pull-down on D- as close to the MCU as possible. Series ferrite bead on VBUS is recommended for EMI reduction in USB host mode.
Do not omit the ICSP connector - even production designs should include 4-pin ICSP access for field firmware updates and recovery. Per the Microchip family datasheet, keep PGECx/PGEDx traces shorter than 50 mm to the ICSP header. Configure the alternate I/O functions early in firmware; remapping mid-development can cause confusing GPIO conflicts.
At 80 MHz with all peripherals active, the PIC32MX460F512LT-80V/BG typically draws ~75 mA from 3.3V, dissipating roughly 250 mW. The TFBGA package is well-suited for the small PCB copper area; still, ensure a 25x25 mm minimum ground pour for thermal relief. The internal die temperature sensor is available for monitoring junction temperature in industrial deployments.
The Parallel Master Port (PMP) timing budget at 80 MHz requires careful trace-length matching - keep all PMP data and address lines within 1 inch of each other to avoid setup/hold violations on the connected LCD or external memory. Use a 33 ohm series resistor on PMP outputs for source termination if the load is more than 2 inches away.
규정 준수 정보
Per Microchip product page: RoHS compliant, lead-free matte tin finish, halogen-free mold compound. Not AEC-Q100 qualified - not recommended for automotive safety-critical applications.