PIC24FJ512GA610T-I/BG - 32MHz 16-bit MCU 512KB Flash | Microchip
부품 번호: PIC24FJ512GA610T-I/BG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12.45 | $12.45 |
| 10 | $11.2 | $112.00 |
| 100 | $9.85 | $985.00 |
| 500 | $8.95 | $4,475.00 |
| 1,000 | $8.1 | $8,100.00 |
PIC24FJ512GA610T-I/BG 개요
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and peripherals such as timers, ADC, communication interfaces, and GPIO onto a single silicon die. The PIC24FJ family sits in the broader 16-bit MCU category, positioned between 8-bit MCUs (PIC16, PIC18) and 32-bit MCUs (PIC32, ARM Cortex-M). Within the power-management hierarchy, MCUs sit alongside DSPs, FPGAs, and microprocessors as the principal embedded computing elements.
The PIC24FJ512GA610 is differentiated by its dual-partition Flash with Live Update, allowing firmware to be updated in the field without stopping the application, plus a rich peripheral set including USB, capacitive touch, parallel master port, and a 16-channel 12-bit ADC. Its nanoWatt XLP (eXtreme Low Power) technology delivers sleep currents in the sub-microamp range, directly addressing battery-powered portable designs.
Architecturally, the device uses a modified Harvard architecture with separate program and data buses, a 16-bit wide datapath, and a peripheral set mapped through the Peripheral Pin Select (PPS) subsystem. This PPS flexibility lets engineers remap digital peripherals to a wide choice of I/O pins, simplifying PCB layout in dense designs.
Typical applications include industrial control panels, USB peripherals, portable medical monitors, fitness wearables, and low-power IoT sensor hubs. The 121-ball TFBGA package is suited to compact boards where high pin count is required but vertical clearance is limited.
Design considerations for this part focus on PCB routing density around the 0.8mm pitch BGA, decoupling strategy for the dual VDD/VDDCORE rails, and proper reset circuit design. The Live Update dual-partition feature requires careful bootloader design to avoid bricking the device during field updates.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not consolidated in the manufacturer datasheet.
드롭인 대체품: PIC24FJ512GA610T-I/BG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC24FJ512GA610T-I/BG (동일 폼 팩터 및 풋프린트) — 차이점: Program Memory (Flash), Package, Operating Temperature, Core Architecture, MSL Level.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC24FJ512GA610-I/BG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC24FJ256GA610T-I/BG
✅ 드롭인✓ 재고 있음
$5.36 / 개
데이터시트 보기 →PIC24FJ256GA610-I/BG
✅ 드롭인✓ 재고 있음
$3.41 / 개
데이터시트 보기 →PIC24FJ128GA610-I/BG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC24FJ128DA110-I/BG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.25 / 개
데이터시트 보기 →PIC24FJ1024GA610-I/BG
✅ 드롭인✓ 재고 있음
$8.2 / 개
데이터시트 보기 →PIC24FJ512GA610T-I/BG 최대 정격 & 전기적 특성
| Core Architecture | PIC24 (16-bit modified Harvard) |
| Family | PIC24FJ512GA610 |
| Program Memory (Flash) | 512 KB (170K x 24) |
| Data Memory (SRAM) | 32 KB |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Operating Voltage Range | 2.0 V to 3.6 V |
| 동작 온도 범위 | -40 C to +85 C (industrial) |
| 패키지 | 121-ball TFBGA (10x10 mm) |
| Ball Pitch | 0.8 mm |
| Touch Sensing | Capacitive mTouch peripheral included |
| Special Features | Dual-partition Flash with Live Update, nanoWatt XLP |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 (per distributor listing) |
| RoHS 상태 | Compliant |
PIC24FJ512GA610T-I/BG 121-ball tfbga (10x10 mm) 핀 구성 가이드
PIC24FJ512GA610T-I/BG(121-ball tfbga (10x10 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC24FJ512GA610T-I/BG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC24FJ512GA610T-I/BG 적합 용도: 6 애플리케이션s: Industrial Control Panels, Portable Medical / Fitness Devices, USB Peripherals and HID Devices, Low-Power IoT Sensor Hubs, Capacitive Touch User Interfaces, Graphical Display Controllers.
Industrial Control Panels
The PIC24FJ512GA610T-I/BG suits industrial HMI panels and control modules where its 512 KB Flash stores graphical firmware plus multiple language tables, while 32 KB SRAM buffers active UI states. The 32 MHz PIC24 core executes 16 MIPS, sufficient for capacitive touch scanning via the integrated mTouch peripheral and for driving character/graphic LCDs through the Parallel Master Port. The 121-ball TFBGA package fits behind compact panel cutouts, and the industrial -40C to +85C temperature range handles factory-floor thermal stress without derating. NanoWatt XLP sleep currents below 1 uA suit battery-backed panels that must retain state across power cycles. Recommended companion parts include the PIC24FJ256GA610T-I/BG for cost-reduced 256 KB variants and the MCP1700 low-dropout regulator for the 3.3V rail.
추천
Portable Medical / Fitness Devices
The PIC24FJ512GA610T-I/BG fits portable medical monitors and fitness wearables that demand long battery life, integrated USB, and enough Flash to hold BLE stack libraries plus custom firmware. Its 512 KB Flash with dual-partition Live Update enables secure in-field firmware upgrades for FDA-regulated devices without taking the unit out of service. The 12-bit ADC with internal voltage reference captures biosensor signals such as heart rate, SpO2, or temperature with adequate resolution for consumer-grade accuracy. The nanoWatt XLP technology drops quiescent current below 1 uA in sleep, extending coin-cell battery life to months. The compact 121-ball TFBGA (10x10 mm) fits inside wristbands and small enclosures. Recommended companions include the MCP1702 LDO for ultra-low- Iq regulation and the PIC24FJ128GA610-I/PT for cost-optimized single-partition designs.
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USB Peripherals and HID Devices
The PIC24FJ512GA610T-I/BG integrates a full-speed USB 2.0 device controller with on-chip transceiver, eliminating the external PHY chip and BOM cost typical of USB peripherals. With 512 KB Flash, designers can stack USB HID, CDC, and vendor-class drivers alongside application firmware without external memory. The 32 KB SRAM buffers USB endpoint descriptors and bulk transfers at full-speed 12 Mbps. The 32 MHz system clock divided down for USB frame timing keeps timing margins within USB-IF compliance. The 121-TFBGA package supports compact dongle form factors, and the 2.0V-3.6V VDD range aligns with USB bus-powered designs using internal 3.3V regulator output. Recommended companions include the PIC24FJ256GB610-I/BG for designs needing additional crypto peripherals, and the USB3300 external PHY if high-speed USB is later required.
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Low-Power IoT Sensor Hubs
The PIC24FJ512GA610T-I/BG serves as a battery-powered IoT sensor hub that aggregates data from multiple I2C/SPI sensors and transmits over UART, SPI, or radio modules. Its nanoWatt XLP modes allow the CPU to enter sleep with RTCC running at sub-microamp currents, waking periodically to read sensors and transmit. The 512 KB Flash accommodates application logic plus over-the-air (OTA) bootloader code required for fleet management, and the dual-partition Live Update enables safe OTA rollbacks. The 12-bit ADC reads analog sensors directly without external components, and the Peripheral Pin Select (PPS) subsystem allows digital peripherals to be mapped to nearly any I/O pin, simplifying PCB layout. The industrial -40C to +85C range handles outdoor enclosures. Recommended companions include the PIC24FJ256GU405-I/PT for lower-cost variants and the MCP9808 temperature sensor for environmental monitoring.
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Capacitive Touch User Interfaces
The PIC24FJ512GA610T-I/BG integrates Microchip's mTouch capacitive touch sensing peripheral, supporting buttons, sliders, and proximity sensors through the ADC and dedicated charge-time measurement unit. Designers can implement 10+ touch channels with hardware-accelerated scanning, leaving the CPU free for UI logic. The 512 KB Flash holds touch-tuning libraries plus GUI code for OLED or TFT displays, while 32 KB SRAM supports frame buffering. The 121-ball TFBGA package allows dense PCB layouts where touch electrodes route directly underneath the BGA. The Peripheral Pin Select lets designers reassign touch channels to alternative pins to optimize board placement. The 32 MHz core completes touch scans within microseconds, supporting responsive sliders and wheels. Recommended companions include the PIC24FJ256GA610-I/BG for cost-reduced variants and the MCP1700 LDO for clean analog rails.
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Graphical Display Controllers
The PIC24FJ512GA610T-I/BG drives small-to-medium color TFT and OLED graphical displays through its Parallel Master Port (PMP) at up to 16 MHz, handling displays up to QVGA (320x240) with single-chip frame buffering in 32 KB SRAM plus external memory interface for larger buffers. The 512 KB Flash stores graphical assets, fonts, and application firmware, while the 32 MHz CPU core executes 16 MIPS - sufficient for layered UI rendering. The 121-ball TFBGA package fits behind the display footprint, and the 2.0V-3.6V VDD range accommodates displays with internal regulators. The Peripheral Pin Select allows flexible PMP pin assignment to simplify BGA routing. Recommended companions include the PIC24FJ1024GA610-I/BG for higher-resolution displays requiring 1 MB firmware and the PIC24FJ256GA606-I/MR for lower-cost QVGA designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC24FJ512GA610T-I/BG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC24FJ512GA610-I/BG | PIC24FJ256GA610T-I/BG | PIC24FJ128GA610-I/BG | PIC24FJ1024GA610-I/BG |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 121-TFBGA (10x10) | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same |
| Program Memory (Flash) | 512 KB | 512 KB | 256 KB (-50%) | 128 KB (-75%) | 1024 KB (+100%) |
| Data Memory (SRAM) | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| CPU Speed | 32 MHz (16 MIPS) | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V |
| Dual-Partition Live Update | Yes | Yes | Yes | Yes | Yes |
| Temperature Range | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
주요 차별점
- Dual-partition Flash with Live Update for safe in-field firmware upgrades (vs PIC24FJ256GA610T-I/BG)
- Higher memory capacity than 256 KB and 128 KB siblings (vs PIC24FJ128GA610-I/BG)
- Same 121-TFBGA footprint as 1024 KB variant enables PCB reuse (vs PIC24FJ1024GA610-I/BG)
설계 노트
The 121-ball TFBGA at 0.8 mm pitch demands 4-layer PCB with microvia-in-pad capability for reliable assembly. Place at least one 0.1 uF decoupling capacitor per VDD ball pair, plus a single 10 uF bulk capacitor near the VDDCORE pin. Estimated via-in-pad cost is +$0.15/unit over standard 4-layer PCB but is mandatory for production yield above 95%.
Do not omit the External Interrupt pins configuration when using the Peripheral Pin Select (PPS) - all PPS-mapped digital peripherals require explicit unlocking via the IOLOCK bit sequence in software. Forgetting this locks the MCU out of peripheral reconfiguration in field. Refer to the PIC24FJ512GA610 datasheet section on PPS configuration before finalizing firmware.
Estimated: with all peripherals active at 32 MHz, the core consumes approximately 15 mA from VDDCORE at 3.3V. In Sleep mode with RTCC, current falls to under 1 uA per the nanoWatt XLP specification. Use the MCP1700 or MCP1702 for LDO powering, as they offer low Iq (1.6 uA typical) compatible with deep-sleep currents.
규정 준수 정보
RoHS and REACH compliance per Microchip product page. Not AEC-Q100 qualified - not designed for automotive applications. Lead-free reflow profile per JEDEC J-STD-020.