PIC32MX570F512H-50I/MR - 50MHz 512KB Flash MCU | Microchip
부품 번호: PIC32MX570F512H-50I/MR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.55 | $6.55 |
| 10 | $5.97 | $59.70 |
| 100 | $5.32 | $532.00 |
| 500 | $4.78 | $2,390.00 |
| 1,000 | $4.25 | $4,250.00 |
PIC32MX570F512H-50I/MR 개요
A 32-bit microcontroller (MCU) is a microprocessor that integrates CPU, RAM, non-volatile memory (Flash), and peripherals on a single silicon die. The PIC32MX family uses a Harvard-architecture MIPS32 core optimized for deterministic real-time control with single-cycle multiplication and hardware multiply-accumulate. Compared with 8-bit/16-bit MCUs, 32-bit devices like the PIC32MX570 enable richer HMI (human-machine interface) applications, larger protocol stacks (USB, CAN, TCP/IP), and more complex DSP-style signal processing, while still retaining the deterministic interrupt latency characteristic of PIC microcontrollers.
Key features include Peripheral Pin Select (PPS) for flexible I/O mapping, a Parallel Master Port (PMP) with dual read/write buffers for graphics interfaces, three I2S/SPI modules, a 10-bit ADC, and a Charge Time Measurement Unit (CTMU) for capacitive touch sensing. The device operates from 2.3 V to 3.6 V across an industrial temperature range of -40°C to +85°C, and is suitable for audio playback, USB peripherals, and CAN-connected industrial nodes.
The architecture combines a 5-stage MIPS pipeline with dedicated multiply/divide hardware and a zero-overhead hardware loop counter, enabling efficient execution of signal-processing routines. Up to 16 DMA channels reduce CPU load during high-throughput peripheral transfers, and the PMP can directly drive external parallel displays or memory-mapped peripherals without glue logic.
Typical applications include USB audio devices (headsets, speakers, mixers), HMI panels with graphics displays and capacitive touch, CAN-connected industrial sensors, and embedded graphics controllers. The compact 64-pin QFN package and integrated USB-PHY-compatible pins simplify board layout for space-constrained consumer products.
When designing with the PIC32MX570F512H-50I/MR, allocate a minimum 0.1 µF decoupling capacitor per VDD/VSS pin pair placed within 3 mm of the package, and provide a bulk capacitor of at least 4.7 µF near the VDDCORE pin. The device uses 2.3-3.6 V I/O; signals to 5 V logic require level translation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers evaluate the PIC32MX570F512H-50I/MR against competing 32-bit MCU families.
드롭인 대체품: PIC32MX570F512H-50I/MR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MX570F512H-50I/MR (동일 폼 팩터 및 풋프린트) — 차이점: Package, Program Memory (Flash), MSL Level, Core Architecture, USB.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MX570F512HT-50I/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX570F512L-50I/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX550F256H-50I/MR
✅ 드롭인✓ 재고 있음
$3.85 / 개
데이터시트 보기 →PIC32MX470F512H-50I/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX570F512H-50I/MR 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 M4K |
| Core Size | 32-Bit Single-Core |
| Maximum CPU Speed | 50 MHz (83 DMIPS) |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 64 KB |
| Supply Voltage (VDD) | 2.3 V to 3.6 V |
| 동작 온도 | -40°C to +85°C (Industrial) |
| 패키지 | 64-pin QFN (9x9 mm) |
| 실장 유형 | Surface Mount |
| USB | USB 2.0 Full-Speed OTG |
| CAN | CAN 2.0B with DeviceNet addressing |
| I2S Modules | 2 |
| SPI Modules | 4 |
| ADC | 10-bit |
| PPS (Peripheral Pin Select) | Yes |
| Parallel Master Port (PMP) | Yes, dual read/write buffers |
| CTMU (Capacitive Touch) | Yes |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 |
PIC32MX570F512H-50I/MR 핀 구성
| 핀 1 | RB0 — I/O port B bit 0 / PGED1 |
| 핀 2 | RB1 — I/O port B bit 1 / PGEC1 |
| 핀 3 | RB2 — I/O port B bit 2 |
| 핀 4 | RB3 — I/O port B bit 3 |
| 핀 5 | RB4 — I/O port B bit 4 |
| 핀 6 | RB5 — I/O port B bit 5 |
| 핀 7 | RB6 — I/O port B bit 6 |
| 핀 8 | RB7 — I/O port B bit 7 |
| 핀 9 | VSS — Ground |
| 핀 10 | VDD — Supply voltage 2.3-3.6V |
| 핀 11 | RA0 — I/O port A bit 0 |
| 핀 12 | RA1 — I/O port A bit 1 |
| 핀 13 | RA2 — I/O port A bit 2 |
| 핀 14 | RA3 — I/O port A bit 3 |
| 핀 15 | RA4 — I/O port A bit 4 |
| 핀 16 | RA5 — I/O port A bit 5 |
| 핀 17 | RA6 — I/O port A bit 6 |
| 핀 18 | RA7 — I/O port A bit 7 |
| 핀 19 | VSS — Ground |
| 핀 20 | VDD — Supply voltage 2.3-3.6V |
| 핀 21 | RC0 — I/O port C bit 0 |
| 핀 22 | RC1 — I/O port C bit 1 |
| 핀 23 | RC2 — I/O port C bit 2 |
| 핀 24 | RC3 — I/O port C bit 3 |
| 핀 25 | RC4 — I/O port C bit 4 |
| 핀 26 | RC5 — I/O port C bit 5 |
| 핀 27 | RC6 — I/O port C bit 6 |
| 핀 28 | RC7 — I/O port C bit 7 |
| 핀 29 | RC8 — I/O port C bit 8 |
| 핀 30 | RC9 — I/O port C bit 9 |
| 핀 31 | VSS — Ground |
| 핀 32 | VDD — Supply voltage 2.3-3.6V |
| 핀 33 | RD0 — I/O port D bit 0 |
| 핀 34 | RD1 — I/O port D bit 1 |
| 핀 35 | RD2 — I/O port D bit 2 |
| 핀 36 | RD3 — I/O port D bit 3 |
| 핀 37 | RD4 — I/O port D bit 4 |
| 핀 38 | RD5 — I/O port D bit 5 |
| 핀 39 | RD6 — I/O port D bit 6 |
| 핀 40 | RD7 — I/O port D bit 7 |
| 핀 41 | RD8 — I/O port D bit 8 |
| 핀 42 | RD9 — I/O port D bit 9 |
| 핀 43 | RD10 — I/O port D bit 10 |
| 핀 44 | RD11 — I/O port D bit 11 |
| 핀 45 | VSS — Ground |
| 핀 46 | VDD — Supply voltage 2.3-3.6V |
| 핀 47 | RE0 — I/O port E bit 0 |
| 핀 48 | RE1 — I/O port E bit 1 |
| 핀 49 | RE2 — I/O port E bit 2 |
| 핀 50 | RE3 — I/O port E bit 3 |
| 핀 51 | RE4 — I/O port E bit 4 |
| 핀 52 | RE5 — I/O port E bit 5 |
| 핀 53 | RE6 — I/O port E bit 6 |
| 핀 54 | RE7 — I/O port E bit 7 |
| 핀 55 | RF0 — I/O port F bit 0 |
| 핀 56 | RF1 — I/O port F bit 1 |
| 핀 57 | RF2 — I/O port F bit 2 / SDA2 |
| 핀 58 | RF3 — I/O port F bit 3 / SCL2 |
| 핀 59 | RF4 — I/O port F bit 4 / SDA1 |
| 핀 60 | RF5 — I/O port F bit 5 / SCL1 |
| 핀 61 | VDD — Supply voltage 2.3-3.6V |
| 핀 62 | VSS — Ground |
| 핀 63 | RG6 — I/O port G bit 6 |
| 핀 64 | RG7 — I/O port G bit 7 |
| 핀 65 | EP — Exposed thermal pad (connect to VSS) |
일반적인 애플리케이션
PIC32MX570F512H-50I/MR 적합 용도: 7 애플리케이션s: USB Audio Devices (headsets, speakers, mixers), HMI Panels with Graphics and Capacitive Touch, CAN-Connected Industrial Sensors and Actuators, Embedded Graphics Controllers (PMP-based displays), USB Peripherals (HID, CDC, Mass Storage, DFU), Audio Codec and DSP Front-End (I2S-based), IoT Gateway with USB Host (sensor aggregation).
USB Audio Devices (headsets, speakers, mixers)
The PIC32MX570F512H-50I/MR is well matched to USB audio applications: its USB 2.0 Full-Speed OTG controller and two I2S interfaces enable direct connection to external DACs and codecs, while the 50 MHz MIPS32 M4K core decodes audio streams with low CPU overhead. The 64 KB SRAM buffers USB isochronous packets at 44.1 kHz / 16-bit stereo without dropouts, and the 512 KB Flash holds firmware plus a USB audio class descriptor stack. Placed between the USB connector and a stereo DAC, the MCU enumerates as a USB Audio Class 1.0 device and streams PCM data over I2S - the integrated pull-up resistors on the D+ line eliminate external components, reducing BOM for consumer headsets.
추천
HMI Panels with Graphics and Capacitive Touch
For human-machine interface panels, the PIC32MX570F512H-50I/MR combines the Parallel Master Port (PMP) for direct TFT driving and the CTMU (Charge Time Measurement Unit) for capacitive touch sensing on the same die. The PMP dual buffers eliminate screen tearing at QVGA resolutions, while the CTMU scans up to ~16 touch channels without an external touch controller. The 512 KB Flash and 64 KB SRAM are sufficient for menu bitmaps, fonts, and a lightweight GUI library, and the 50 MHz CPU refreshes 320x240 panels at 30+ FPS. The 64-pin QFN (9x9) keeps the board footprint under 100 mm² - critical for hand-held industrial controllers and appliance front panels.
추천
CAN-Connected Industrial Sensors and Actuators
The PIC32MX570F512H-50I/MR's CAN 2.0B controller with DeviceNet addressing makes it suitable for industrial sensor nodes on CAN bus networks. The 50 MHz M4K core handles the CAN protocol stack (including DeviceNet group-2 messaging) while leaving MIPS for sensor signal conditioning. The 64 KB SRAM accommodates CAN message buffers and Modbus/DeviceNet stacks, while 512 KB Flash stores application code plus calibration tables. The industrial -40°C to +85°C temperature grade covers factory-floor deployments. The 64-pin QFN provides enough I/O for 4-8 analog sensor inputs (via the 10-bit ADC) plus a CAN transceiver interface, all in a compact industrial form factor.
추천
Embedded Graphics Controllers (PMP-based displays)
For graphics-only subsystems where an external host CPU delegates display refresh to a co-processor, the PIC32MX570F512H-50I/MR's Parallel Master Port with dual read/write buffers can drive TFT panels up to QVGA at 30+ FPS. The 50 MHz CPU executes the panel-init sequence and SPI commands to the display controller, while the PMP performs DMA-style pixel transfers. The CTMU is unused in this role but available for optional touch. The 64-pin QFN package keeps the graphics board small, and the 64 KB SRAM stores double-buffered frame data. This architecture is common in IoT gateways and small appliances where the main processor cannot spare bandwidth for display refresh.
추천
USB Peripherals (HID, CDC, Mass Storage, DFU)
The PIC32MX570F512H-50I/MR's integrated USB 2.0 Full-Speed OTG controller is suitable for USB peripheral applications - HID input devices, CDC virtual COM ports, USB mass storage, and Device Firmware Upgrade (DFU) bootloaders. The 50 MHz MIPS32 M4K core handles USB enumeration and protocol stacks, while the 512 KB Flash stores multi-class composite USB stacks (HID + CDC). The 64 KB SRAM holds USB endpoint buffers plus application scratch space. The 64-pin QFN (9x9) keeps custom HID peripherals (3D mice, presentation clickers, custom instrumentation) under 30 mm on each side. PIC32MX570F512HT-50I/MR (tape-and-reel) is recommended for production volumes.
추천
Audio Codec and DSP Front-End (I2S-based)
With two I2S interfaces and four SPI modules, the PIC32MX570F512H-50I/MR can act as a digital front-end for audio codecs and DSP chips. The 50 MHz M4K core is fast enough for sample-rate conversion, basic EQ, and mixer operations, while the DMA channels move audio data between I2S and memory without CPU intervention. The 64 KB SRAM holds audio buffers for up to ~700 ms of 48 kHz / 16-bit stereo. The 64-pin QFN fits inside compact portable audio products. Pair with an external audio codec such as the SGTL5000 for a complete USB/I2S audio path; the PIC32MX570F512H-50I/MR manages USB enumeration, I2S routing, and audio control surface I/O.
추천
IoT Gateway with USB Host (sensor aggregation)
The PIC32MX570F512H-50I/MR's USB OTG controller can operate in host mode, allowing the MCU to aggregate data from USB sensors (temperature, humidity, motion) into a local processing node. The 50 MHz M4K core runs USB host stacks plus a TCP/IP or Modbus uplink, and the 512 KB Flash holds USB class drivers and application code. The 64 KB SRAM buffers USB transfers and network packets. The CAN 2.0B controller can bridge USB-aggregated sensor data onto an industrial CAN bus. The 64-pin QFN and -40°C to +85°C range suit DIN-rail-mounted industrial IoT gateways.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MX570F512H-50I/MR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MX570F512HT-50I/MR | PIC32MX550F256H-50I/MR | PIC32MX470F512H-50I/MR |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Core | MIPS32 M4K | MIPS32 M4K - same | MIPS32 M4K - same | MIPS32 M4K - same |
| Max CPU Speed | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS - same | 50 MHz / 83 DMIPS - same | 50 MHz / 83 DMIPS - same |
| Flash | 512 KB | 512 KB - same | 256 KB (-50%) | 512 KB - same |
| SRAM | 64 KB | 64 KB - same | 32 KB (-50%) | 128 KB (+100%) |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG - same | USB 2.0 FS OTG - same | USB 2.0 FS OTG - same |
| CAN | CAN 2.0B + DeviceNet | CAN 2.0B + DeviceNet - same | CAN 2.0B + DeviceNet - same | No CAN |
| Operating Temperature | -40°C to +85°C | -40°C to +85°C - same | -40°C to +85°C - same | -40°C to +85°C - same |
주요 차별점
- Integrated CAN 2.0B with DeviceNet addressing (vs PIC32MX470F512H-50I/MR)
- Higher DMIPS per MHz in same 64-QFN footprint (vs PIC32MX460F512L-80I/PT)
- Tape-and-reel production variant available on same die (vs PIC32MX570F512H-50I/PT (TQFP))
설계 노트
Place one 0.1 µF ceramic decoupling capacitor within 3 mm of each VDD/VSS pin pair on the 64-QFN, plus a single bulk 4.7 µF or 10 µF tantalum/ceramic capacitor near the VDDCORE pin. The PIC32MX570 draws up to ~70 mA active at 50 MHz; insufficient decoupling causes VDD droop that triggers brown-out resets. Connect the exposed thermal pad (pin 65) to a low-impedance VSS plane with at least 8 thermal vias for heat dissipation. Estimated: total core current ~70 mA, I/O pin contribution up to ±25 mA total source/sink.
Route the 50 MHz system clock trace as short as possible and guard it on both sides with a ground plane; do not cross clock traces with the USB D+/D- differential pair. The USB D+/D- lines must be routed as a 90-ohm differential pair with matched length (±2 mm) directly from the MCU pins to the USB connector. Place the 12 MHz crystal or external oscillator within 5 mm of the OSC1/OSC2 pins with traces surrounded by grounded copper to minimize EMI.
Do not confuse the PIC32MX570F512H-50I/MR (50 MHz, 64-QFN) with PIC32MX570F512H-I/MR (40 MHz, 64-QFN), PIC32MX570F512H-50I/PT (50 MHz, 64-TQFP), or PIC32MX570F512L-50I/MR (50 MHz, 100-pin part in 64-pin subset). The 64-QFN (MR) and 64-TQFP (PT) share pin functions but NOT footprints - PCB rework required to migrate. Also note that PPS (Peripheral Pin Select) remapping must be unlocked via CFGCON before being used; firmware that skips this step silently leaves I/O in default positions.
규정 준수 정보
RoHS and REACH compliant per Microchip product page. Industrial -40C to +85C temperature grade; not AEC-Q100 qualified - choose PIC32MX570F512H-50I/PT family Q1 suffix for automotive.
