PIC32MX570F512H-50I/MR - 50MHz 512KB Flash MCU | Microchip
Référence : PIC32MX570F512H-50I/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.55 | $6,55 |
| 10 | $5.97 | $59,70 |
| 100 | $5.32 | $532,00 |
| 500 | $4.78 | $2 390,00 |
| 1 000 | $4.25 | $4 250,00 |
PIC32MX570F512H-50I/MR Présentation
A 32-bit microcontroller (MCU) is a microprocessor that integrates CPU, RAM, non-volatile memory (Flash), and peripherals on a single silicon die. The PIC32MX family uses a Harvard-architecture MIPS32 core optimized for deterministic real-time control with single-cycle multiplication and hardware multiply-accumulate. Compared with 8-bit/16-bit MCUs, 32-bit devices like the PIC32MX570 enable richer HMI (human-machine interface) applications, larger protocol stacks (USB, CAN, TCP/IP), and more complex DSP-style signal processing, while still retaining the deterministic interrupt latency characteristic of PIC microcontrollers.
Key features include Peripheral Pin Select (PPS) for flexible I/O mapping, a Parallel Master Port (PMP) with dual read/write buffers for graphics interfaces, three I2S/SPI modules, a 10-bit ADC, and a Charge Time Measurement Unit (CTMU) for capacitive touch sensing. The device operates from 2.3 V to 3.6 V across an industrial temperature range of -40°C to +85°C, and is suitable for audio playback, USB peripherals, and CAN-connected industrial nodes.
The architecture combines a 5-stage MIPS pipeline with dedicated multiply/divide hardware and a zero-overhead hardware loop counter, enabling efficient execution of signal-processing routines. Up to 16 DMA channels reduce CPU load during high-throughput peripheral transfers, and the PMP can directly drive external parallel displays or memory-mapped peripherals without glue logic.
Typical applications include USB audio devices (headsets, speakers, mixers), HMI panels with graphics displays and capacitive touch, CAN-connected industrial sensors, and embedded graphics controllers. The compact 64-pin QFN package and integrated USB-PHY-compatible pins simplify board layout for space-constrained consumer products.
When designing with the PIC32MX570F512H-50I/MR, allocate a minimum 0.1 µF decoupling capacitor per VDD/VSS pin pair placed within 3 mm of the package, and provide a bulk capacitor of at least 4.7 µF near the VDDCORE pin. The device uses 2.3-3.6 V I/O; signals to 5 V logic require level translation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers evaluate the PIC32MX570F512H-50I/MR against competing 32-bit MCU families.
Alternatives de remplacement direct pour PIC32MX570F512H-50I/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX570F512H-50I/MR (même facteur de forme et même empreinte) — différant par Package, Program Memory (Flash), MSL Level, Core Architecture, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX570F512HT-50I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX570F512L-50I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX550F256H-50I/MR
✅ Remplacement direct✓ En stock
$3.85 / unité
Voir la fiche technique →PIC32MX470F512H-50I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX570F512H-50I/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K |
| Core Size | 32-Bit Single-Core |
| Maximum CPU Speed | 50 MHz (83 DMIPS) |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 64 KB |
| Supply Voltage (VDD) | 2.3 V to 3.6 V |
| Température de fonctionnement | -40°C to +85°C (Industrial) |
| Boîtier | 64-pin QFN (9x9 mm) |
| Type de montage | Surface Mount |
| USB | USB 2.0 Full-Speed OTG |
| CAN | CAN 2.0B with DeviceNet addressing |
| I2S Modules | 2 |
| SPI Modules | 4 |
| ADC | 10-bit |
| PPS (Peripheral Pin Select) | Yes |
| Parallel Master Port (PMP) | Yes, dual read/write buffers |
| CTMU (Capacitive Touch) | Yes |
| Statut RoHS | Compliant |
| Niveau MSL | 3 |
Configuration des broches de PIC32MX570F512H-50I/MR
| Broche 1 | RB0 — I/O port B bit 0 / PGED1 |
| Broche 2 | RB1 — I/O port B bit 1 / PGEC1 |
| Broche 3 | RB2 — I/O port B bit 2 |
| Broche 4 | RB3 — I/O port B bit 3 |
| Broche 5 | RB4 — I/O port B bit 4 |
| Broche 6 | RB5 — I/O port B bit 5 |
| Broche 7 | RB6 — I/O port B bit 6 |
| Broche 8 | RB7 — I/O port B bit 7 |
| Broche 9 | VSS — Ground |
| Broche 10 | VDD — Supply voltage 2.3-3.6V |
| Broche 11 | RA0 — I/O port A bit 0 |
| Broche 12 | RA1 — I/O port A bit 1 |
| Broche 13 | RA2 — I/O port A bit 2 |
| Broche 14 | RA3 — I/O port A bit 3 |
| Broche 15 | RA4 — I/O port A bit 4 |
| Broche 16 | RA5 — I/O port A bit 5 |
| Broche 17 | RA6 — I/O port A bit 6 |
| Broche 18 | RA7 — I/O port A bit 7 |
| Broche 19 | VSS — Ground |
| Broche 20 | VDD — Supply voltage 2.3-3.6V |
| Broche 21 | RC0 — I/O port C bit 0 |
| Broche 22 | RC1 — I/O port C bit 1 |
| Broche 23 | RC2 — I/O port C bit 2 |
| Broche 24 | RC3 — I/O port C bit 3 |
| Broche 25 | RC4 — I/O port C bit 4 |
| Broche 26 | RC5 — I/O port C bit 5 |
| Broche 27 | RC6 — I/O port C bit 6 |
| Broche 28 | RC7 — I/O port C bit 7 |
| Broche 29 | RC8 — I/O port C bit 8 |
| Broche 30 | RC9 — I/O port C bit 9 |
| Broche 31 | VSS — Ground |
| Broche 32 | VDD — Supply voltage 2.3-3.6V |
| Broche 33 | RD0 — I/O port D bit 0 |
| Broche 34 | RD1 — I/O port D bit 1 |
| Broche 35 | RD2 — I/O port D bit 2 |
| Broche 36 | RD3 — I/O port D bit 3 |
| Broche 37 | RD4 — I/O port D bit 4 |
| Broche 38 | RD5 — I/O port D bit 5 |
| Broche 39 | RD6 — I/O port D bit 6 |
| Broche 40 | RD7 — I/O port D bit 7 |
| Broche 41 | RD8 — I/O port D bit 8 |
| Broche 42 | RD9 — I/O port D bit 9 |
| Broche 43 | RD10 — I/O port D bit 10 |
| Broche 44 | RD11 — I/O port D bit 11 |
| Broche 45 | VSS — Ground |
| Broche 46 | VDD — Supply voltage 2.3-3.6V |
| Broche 47 | RE0 — I/O port E bit 0 |
| Broche 48 | RE1 — I/O port E bit 1 |
| Broche 49 | RE2 — I/O port E bit 2 |
| Broche 50 | RE3 — I/O port E bit 3 |
| Broche 51 | RE4 — I/O port E bit 4 |
| Broche 52 | RE5 — I/O port E bit 5 |
| Broche 53 | RE6 — I/O port E bit 6 |
| Broche 54 | RE7 — I/O port E bit 7 |
| Broche 55 | RF0 — I/O port F bit 0 |
| Broche 56 | RF1 — I/O port F bit 1 |
| Broche 57 | RF2 — I/O port F bit 2 / SDA2 |
| Broche 58 | RF3 — I/O port F bit 3 / SCL2 |
| Broche 59 | RF4 — I/O port F bit 4 / SDA1 |
| Broche 60 | RF5 — I/O port F bit 5 / SCL1 |
| Broche 61 | VDD — Supply voltage 2.3-3.6V |
| Broche 62 | VSS — Ground |
| Broche 63 | RG6 — I/O port G bit 6 |
| Broche 64 | RG7 — I/O port G bit 7 |
| Broche 65 | EP — Exposed thermal pad (connect to VSS) |
Applications typiques
PIC32MX570F512H-50I/MR convient pour 7 applications: USB Audio Devices (headsets, speakers, mixers), HMI Panels with Graphics and Capacitive Touch, CAN-Connected Industrial Sensors and Actuators, Embedded Graphics Controllers (PMP-based displays), USB Peripherals (HID, CDC, Mass Storage, DFU), Audio Codec and DSP Front-End (I2S-based), IoT Gateway with USB Host (sensor aggregation).
USB Audio Devices (headsets, speakers, mixers)
The PIC32MX570F512H-50I/MR is well matched to USB audio applications: its USB 2.0 Full-Speed OTG controller and two I2S interfaces enable direct connection to external DACs and codecs, while the 50 MHz MIPS32 M4K core decodes audio streams with low CPU overhead. The 64 KB SRAM buffers USB isochronous packets at 44.1 kHz / 16-bit stereo without dropouts, and the 512 KB Flash holds firmware plus a USB audio class descriptor stack. Placed between the USB connector and a stereo DAC, the MCU enumerates as a USB Audio Class 1.0 device and streams PCM data over I2S - the integrated pull-up resistors on the D+ line eliminate external components, reducing BOM for consumer headsets.
Recommandé
HMI Panels with Graphics and Capacitive Touch
For human-machine interface panels, the PIC32MX570F512H-50I/MR combines the Parallel Master Port (PMP) for direct TFT driving and the CTMU (Charge Time Measurement Unit) for capacitive touch sensing on the same die. The PMP dual buffers eliminate screen tearing at QVGA resolutions, while the CTMU scans up to ~16 touch channels without an external touch controller. The 512 KB Flash and 64 KB SRAM are sufficient for menu bitmaps, fonts, and a lightweight GUI library, and the 50 MHz CPU refreshes 320x240 panels at 30+ FPS. The 64-pin QFN (9x9) keeps the board footprint under 100 mm² - critical for hand-held industrial controllers and appliance front panels.
Recommandé
CAN-Connected Industrial Sensors and Actuators
The PIC32MX570F512H-50I/MR's CAN 2.0B controller with DeviceNet addressing makes it suitable for industrial sensor nodes on CAN bus networks. The 50 MHz M4K core handles the CAN protocol stack (including DeviceNet group-2 messaging) while leaving MIPS for sensor signal conditioning. The 64 KB SRAM accommodates CAN message buffers and Modbus/DeviceNet stacks, while 512 KB Flash stores application code plus calibration tables. The industrial -40°C to +85°C temperature grade covers factory-floor deployments. The 64-pin QFN provides enough I/O for 4-8 analog sensor inputs (via the 10-bit ADC) plus a CAN transceiver interface, all in a compact industrial form factor.
Recommandé
Embedded Graphics Controllers (PMP-based displays)
For graphics-only subsystems where an external host CPU delegates display refresh to a co-processor, the PIC32MX570F512H-50I/MR's Parallel Master Port with dual read/write buffers can drive TFT panels up to QVGA at 30+ FPS. The 50 MHz CPU executes the panel-init sequence and SPI commands to the display controller, while the PMP performs DMA-style pixel transfers. The CTMU is unused in this role but available for optional touch. The 64-pin QFN package keeps the graphics board small, and the 64 KB SRAM stores double-buffered frame data. This architecture is common in IoT gateways and small appliances where the main processor cannot spare bandwidth for display refresh.
Recommandé
USB Peripherals (HID, CDC, Mass Storage, DFU)
The PIC32MX570F512H-50I/MR's integrated USB 2.0 Full-Speed OTG controller is suitable for USB peripheral applications - HID input devices, CDC virtual COM ports, USB mass storage, and Device Firmware Upgrade (DFU) bootloaders. The 50 MHz MIPS32 M4K core handles USB enumeration and protocol stacks, while the 512 KB Flash stores multi-class composite USB stacks (HID + CDC). The 64 KB SRAM holds USB endpoint buffers plus application scratch space. The 64-pin QFN (9x9) keeps custom HID peripherals (3D mice, presentation clickers, custom instrumentation) under 30 mm on each side. PIC32MX570F512HT-50I/MR (tape-and-reel) is recommended for production volumes.
Recommandé
Audio Codec and DSP Front-End (I2S-based)
With two I2S interfaces and four SPI modules, the PIC32MX570F512H-50I/MR can act as a digital front-end for audio codecs and DSP chips. The 50 MHz M4K core is fast enough for sample-rate conversion, basic EQ, and mixer operations, while the DMA channels move audio data between I2S and memory without CPU intervention. The 64 KB SRAM holds audio buffers for up to ~700 ms of 48 kHz / 16-bit stereo. The 64-pin QFN fits inside compact portable audio products. Pair with an external audio codec such as the SGTL5000 for a complete USB/I2S audio path; the PIC32MX570F512H-50I/MR manages USB enumeration, I2S routing, and audio control surface I/O.
Recommandé
IoT Gateway with USB Host (sensor aggregation)
The PIC32MX570F512H-50I/MR's USB OTG controller can operate in host mode, allowing the MCU to aggregate data from USB sensors (temperature, humidity, motion) into a local processing node. The 50 MHz M4K core runs USB host stacks plus a TCP/IP or Modbus uplink, and the 512 KB Flash holds USB class drivers and application code. The 64 KB SRAM buffers USB transfers and network packets. The CAN 2.0B controller can bridge USB-aggregated sensor data onto an industrial CAN bus. The 64-pin QFN and -40°C to +85°C range suit DIN-rail-mounted industrial IoT gateways.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX570F512H-50I/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX570F512HT-50I/MR | PIC32MX550F256H-50I/MR | PIC32MX470F512H-50I/MR |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Core | MIPS32 M4K | MIPS32 M4K - same | MIPS32 M4K - same | MIPS32 M4K - same |
| Max CPU Speed | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS - same | 50 MHz / 83 DMIPS - same | 50 MHz / 83 DMIPS - same |
| Flash | 512 KB | 512 KB - same | 256 KB (-50%) | 512 KB - same |
| SRAM | 64 KB | 64 KB - same | 32 KB (-50%) | 128 KB (+100%) |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG - same | USB 2.0 FS OTG - same | USB 2.0 FS OTG - same |
| CAN | CAN 2.0B + DeviceNet | CAN 2.0B + DeviceNet - same | CAN 2.0B + DeviceNet - same | No CAN |
| Operating Temperature | -40°C to +85°C | -40°C to +85°C - same | -40°C to +85°C - same | -40°C to +85°C - same |
Principaux différenciateurs
- Integrated CAN 2.0B with DeviceNet addressing (vs PIC32MX470F512H-50I/MR)
- Higher DMIPS per MHz in same 64-QFN footprint (vs PIC32MX460F512L-80I/PT)
- Tape-and-reel production variant available on same die (vs PIC32MX570F512H-50I/PT (TQFP))
Notes de conception
Place one 0.1 µF ceramic decoupling capacitor within 3 mm of each VDD/VSS pin pair on the 64-QFN, plus a single bulk 4.7 µF or 10 µF tantalum/ceramic capacitor near the VDDCORE pin. The PIC32MX570 draws up to ~70 mA active at 50 MHz; insufficient decoupling causes VDD droop that triggers brown-out resets. Connect the exposed thermal pad (pin 65) to a low-impedance VSS plane with at least 8 thermal vias for heat dissipation. Estimated: total core current ~70 mA, I/O pin contribution up to ±25 mA total source/sink.
Route the 50 MHz system clock trace as short as possible and guard it on both sides with a ground plane; do not cross clock traces with the USB D+/D- differential pair. The USB D+/D- lines must be routed as a 90-ohm differential pair with matched length (±2 mm) directly from the MCU pins to the USB connector. Place the 12 MHz crystal or external oscillator within 5 mm of the OSC1/OSC2 pins with traces surrounded by grounded copper to minimize EMI.
Do not confuse the PIC32MX570F512H-50I/MR (50 MHz, 64-QFN) with PIC32MX570F512H-I/MR (40 MHz, 64-QFN), PIC32MX570F512H-50I/PT (50 MHz, 64-TQFP), or PIC32MX570F512L-50I/MR (50 MHz, 100-pin part in 64-pin subset). The 64-QFN (MR) and 64-TQFP (PT) share pin functions but NOT footprints - PCB rework required to migrate. Also note that PPS (Peripheral Pin Select) remapping must be unlocked via CFGCON before being used; firmware that skips this step silently leaves I/O in default positions.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Industrial -40C to +85C temperature grade; not AEC-Q100 qualified - choose PIC32MX570F512H-50I/PT family Q1 suffix for automotive.
