PIC32MZ0512EFF144-E/PH - 200MHz 512KB FPU MCU | Microchip
부품 번호: PIC32MZ0512EFF144-E/PH ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.42 | $18.42 |
| 10 | $16.58 | $165.80 |
| 100 | $13.91 | $1,391.00 |
| 500 | $11.62 | $5,810.00 |
| 1,000 | $10.04 | $10,040.00 |
PIC32MZ0512EFF144-E/PH 개요
An MCU (microcontroller unit) is a single-chip computer integrating a CPU core, program memory, data RAM, and peripheral set; the PIC32MZ EF family specifically targets high-performance connected embedded applications. Within the broader taxonomy, this part sits as MCU -> 32-bit MCU -> ARM/MIPS application processor class -> embedded computing, and forms the PIC32MZ EF sub-family in Microchip's portfolio. The "E" suffix denotes the -40C to +125C extended temperature grade for industrial and automotive use, while the trailing "/PH" indicates the 144-TQFP pin-out.
Key features include Dual Panel Flash for live firmware update support without downtime, 8-channel DMA, two 12-bit ADC modules (up to 48 analog inputs), dedicated audio data path with I2S/SPDIF interface, Hi-Speed USB 2.0 OTG, two CAN 2.0B controllers, Ethernet MAC (MII/RMII), HS/FS/LS timer, and 144 general-purpose I/O. The architecture supports live update (run-time firmware swap), 32-bit prefetch cache, and tightly-coupled SRAM for deterministic response.
Typical applications include industrial connectivity gateways, automotive instrument clusters, IoT edge nodes, HMI graphics with resistive/PCT touch, motor control FOC drives, and audio processing subsystems. When designing with the part, plan a 4-layer PCB stack-up and provision separate analog/digital ground regions to keep ADC SNR high; the FPU and DSP extensions should be enabled via the device configuration bits to fully realize the 330 DMIPS throughput.
드롭인 대체품: PIC32MZ0512EFF144-E/PH — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ0512EFF144-E/PH (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, ADC, FPU, USB, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ0512EFF144-I/PH
✅ 드롭인✓ 재고 있음
$8.75 / 개
데이터시트 보기 →PIC32MZ0512EFE144-I/PH
✅ 드롭인✓ 재고 있음
$7.05 / 개
데이터시트 보기 →PIC32MZ0512EFE144-E/PH
✅ 드롭인✓ 재고 있음
$6.84 / 개
데이터시트 보기 →PIC32MZ0512EFF144-E/JWX
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$10 / 개
데이터시트 보기 →PIC32MZ1024EFF144-I/PH
✅ 드롭인✓ 재고 있음
$9.84 / 개
데이터시트 보기 →PIC32MZ1024EFM144-I/PH
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
PIC32MZ0512EFF144-E/PH 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 Warrior M-class |
| Operating Frequency | 200 MHz (up to 252 MHz family max) |
| Performance | 330 DMIPS |
| FPU | IEEE 754 single/double precision |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC |
| Program Flash | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Dual Panel Flash (Live Update) | Yes |
| Operating Voltage | 3.3 V (2.1 V to 3.6 V core/IO supply family-typical) |
| 동작 온도 | -40C to +125C (E = Extended grade) |
| 패키지 | 144-TQFP (16x16 mm) |
| I/O Pins | Up to 144 GPIO |
| ADC | Two 12-bit modules (up to 48 channels) |
| DMA Channels | 8 |
| USB | Hi-Speed USB 2.0 OTG |
| CAN | 2x CAN 2.0B |
| Ethernet | 10/100 MAC with MII/RMII |
| Crypto Accelerator | No (No Crypto variant per distributor) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 (per lead finish) |
PIC32MZ0512EFF144-E/PH 144-tqfp (16x16 mm) 핀 구성 가이드
PIC32MZ0512EFF144-E/PH(144-tqfp (16x16 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC32MZ0512EFF144-E/PH.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC32MZ0512EFF144-E/PH 적합 용도: 7 애플리케이션s: Industrial Connectivity Gateway, Automotive Instrument Cluster / HMI, IoT Edge Sensor Node, Field-Oriented Control (FOC) Motor Drive, High-End Audio Processing Subsystem, Graphics HMI Touch Display, Medical Patient Monitoring.
Industrial Connectivity Gateway
The PIC32MZ0512EFF144-E/PH is well-suited to industrial connectivity gateways because its 200 MHz MIPS Warrior M-class core plus IEEE 754 FPU offloads TLS handshakes and MQTT message parsing, while Hi-Speed USB OTG and dual CAN 2.0B controllers bridge to fieldbuses like CANopen and DeviceNet. Its 10/100 Ethernet MAC supports EtherCAT, PROFINET, or Modbus TCP stacks, and the 512 KB dual-panel Flash allows over-the-air firmware updates without downtime, which is critical for remote industrial sites where physical service is expensive.
추천
Automotive Instrument Cluster / HMI
For instrument cluster and HMI applications, the PIC32MZ0512EFF144-E/PH integrates the graphics controller plus 144 GPIO needed to drive TFT LCDs, capacitive-touch sensing, and segmented tell-tales simultaneously. The 200 MHz core plus DSP extensions accelerates vector graphics rendering, while the two 12-bit ADC modules with 48 analog inputs handle rotary encoders, fuel-level sensing, and backlight current feedback. AEC-Q100 qualification is on the automotive sibling (PIC32MZ0512EFF144-E/PH with Q-grade), and the -40C to +125C operating range handles under-hood and cabin extremes.
추천
IoT Edge Sensor Node
The PIC32MZ0512EFF144-E/PH serves as an IoT edge node processor combining LoRa/Sigfox radio control via SPI, secure OTA firmware update via dual-panel Flash, and on-device analytics using the DSP extensions for FFT-based vibration or vibration anomaly detection. With 128 KB SRAM the part runs TCP/IP over Wi-Fi or Ethernet, executes TLS 1.0 handshakes with the FPU, and supports low-power sleep modes via the deep-sleep controller. The Hi-Speed USB OTG streamlines firmware provisioning during factory test.
추천
Field-Oriented Control (FOC) Motor Drive
For FOC motor drives, the PIC32MZ0512EFF144-E/PH delivers deterministic real-time control because its 200 MHz core plus single-cycle DSP MAC executes the Park/Clarke transforms and PI loops in under 10 microseconds per PWM period. The on-chip PWM, quadrature encoder interface, and 12-bit ADC with 4-sample-and-hold handle 3-phase BLDC/PMSM current sensing, while the FPU computes sin/cos and inverse transforms. The 144-TQFP package's thermal performance plus 128 KB SRAM is sufficient for sensorless observer-based control loops.
추천
High-End Audio Processing Subsystem
The PIC32MZ0512EFF144-E/PH hosts a high-end audio processing subsystem because its I2S/SPDIF interface streams uncompressed PCM up to 192 kHz / 32-bit, while the IEEE 754 FPU accelerates biquad filter cascades, parametric EQ, and dynamics compression. The 128 KB SRAM supports multi-tap reverb buffers, and the DSP extensions accelerate FFT-based spectrum analysis for visualization. Ethernet AVB or USB Audio Class 2.0 streams are handled natively via the on-chip peripherals, with deterministic latency from the dedicated audio PLL.
추천
Graphics HMI Touch Display
The PIC32MZ0512EFF144-E/PH drives medium-resolution graphics HMIs because its 200 MHz core, 512 KB Flash, and dedicated graphics controller can run Microchip's MPLAB Harmony Graphics Suite (MHGS) for up to 800x480 WVGA TFTs. Built-in resistive/PCT touch sensing via dedicated pins, plus 144 GPIO, allows direct connection to 24-bit RGB interface LCDs without external bridge ICs. The FPU accelerates anti-aliased font rendering and 2D widget transforms, while JTAG/SWD trace aids real-time debugging of UI state machines.
추천
Medical Patient Monitoring
The PIC32MZ0512EFF144-E/PH is appropriate for portable patient monitor peripherals running SpO2, ECG, and temperature measurement. The DSP extensions accelerate the FFT-based heart-rate-variability analysis and finite-impulse-response filter banks for EMG/ECG denoising, while the FPU executes K-nearest-neighbor arrhythmia classifiers. Two 12-bit ADC modules with 48 channels handle multi-lead ECG acquisition, and 128 KB SRAM stores rolling waveform buffers. The -40C to +125C extended temperature grade supports hospital and ambulance environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ0512EFF144-E/PH — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ0512EFF144-I/PH | PIC32MZ0512EFE144-I/PH | PIC32MZ0512EFE144-E/PH | PIC32MZ1024EFF144-I/PH | PIC32MZ1024EFM144-I/PH |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-TQFP (16x16 mm) | 144-TQFP (16x16 mm) - same | 144-TQFP (16x16 mm) - same | 144-TQFP (16x16 mm) - same | 144-TQFP (16x16 mm) - same | 144-TQFP (16x16 mm) - same |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| FPU | Yes (IEEE 754) | Yes | Disabled (EFE) | Disabled (EFE) | Yes | Yes |
| DSP Extensions | Yes (4x 64-bit accumulators) | Yes | Yes (DSP on, FPU off) | Yes (DSP on, FPU off) | Yes | Yes |
| Program Flash | 512 KB | 512 KB | 512 KB | 512 KB | 1024 KB | 1024 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Crypto Accelerator | No | No | No | No | No | Yes (AES/SHA) |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
주요 차별점
- Extended -40C to +125C operating temperature (vs PIC32MZ0512EFF144-I/PH)
- Full FPU and DSP extension enabled (vs PIC32MZ0512EFE144-E/PH)
- Dual-panel Flash for live update (vs PIC32MX795F512LT-80I/PT)
- MIPS Warrior core at 200 MHz with 128 KB SRAM (vs PIC32MX695F512LT-80V/PT)
설계 노트
The 144-TQFP package has 0.4 mm lead pitch - route all signals on inner layers with 0.2 mm trace-and-space and use 4-layer stack-up with continuous ground planes beneath the device. Per Microchip PIC32MZ EF datasheet (DS60001320), separate analog ground (AGND) and digital ground (DGND) regions with a single-point bridge under the IC's exposed pad (no pad on /PH, but the lead frame is the thermal path). Place 0.1 uF + 10 uF ceramic bypass caps within 5 mm of every VDD/VBAT pin pair.
Estimated: at 200 MHz core clock the core current on PIC32MZ EF family draws ~120 mA, and peripheral current adds ~40 mA; total VDD consumption ~160 mA plus USB PHY boost up to 220 mA during bus activity. Provide a 3.3 V LDO with at least 500 mA capacity (e.g. AP2112K-3.3 or MIC29150-3.3) and separate analog 3.3VAVDD fed through a ferrite bead to keep ADC SNR above 70 dB. Estimated using datasheet typical current per MHz; verify on bench with the actual application.
Do not enable the FPU bit in device configuration for PIC32MZ0512EFE variants or uninitialized FPU registers will trigger exceptions on first FPU instruction. Per Microchip PIC32MZ EF datasheet (DS60001320), the dual-panel Flash live-update feature requires linker scripts to place functions in non-overlapping regions; misconfigured live-update sections cause boot-loop after firmware swap. Ensure the JTAG/SWD pins are not remapped to GPIO during production code, or recovery becomes impossible without external programmer.
Estimated: at full 200 MHz operation the 144-TQFP package dissipates ~0.6 W (estimated from 160 mA core current at 3.3 V). Junction-to-ambient thermal resistance on a 4-layer PCB with 1 oz copper is approximately 35 C/W, so junction rises ~21 C above ambient at full load - acceptable for the -40C to +125C operating range. For continuous 100% CPU load in enclosed enclosures, recommend thermal vias under the lead frame and 1-foot-diameter copper pour on top layer.
규정 준수 정보
RoHS-compliant per Microchip product page. AEC-Q100 qualification status for this exact -E/PH SKU not specified in the verified web data; the family datasheet covers AEC-Q100 readiness but per-SKU qualification requires checking the Microchip automotive-grade selector. Lead-free / matte-tin finish standard.
