PIC32MZ0512EFF144-E/JWX - 252MHz MCU 512KB Flash | Microchip
부품 번호: PIC32MZ0512EFF144-E/JWX ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $14.43 | $14.43 |
| 10 | $13.5 | $135.00 |
| 100 | $12.2 | $1,220.00 |
| 500 | $11.05 | $5,525.00 |
| 1,000 | $10 | $10,000.00 |
PIC32MZ0512EFF144-E/JWX 개요
A microcontroller (MCU) is an integrated circuit containing a CPU core, program memory, data memory, and on-chip peripherals designed for embedded control applications. The PIC32MZ EF family is positioned within Microchip's MIPS-based 32-bit MCU hierarchy, between the lower-tier PIC32MX series and the higher-end SAM E70/S70 ARM Cortex-M7 families. Its DSP extensions and FPU place it in the high-performance embedded computing segment, suitable for applications requiring signal processing combined with connectivity.
Key features of the PIC32MZ0512EFF144-E/JWX include 200 MHz/330 DMIPS core performance, IEEE 754-compliant single-precision FPU, dual-panel Flash architecture enabling live firmware updates without downtime, and a 200 MHz peripheral bus with dedicated DMA channels. The device operates from 2.2V to 3.6V and is AEC-Q100 qualified for automotive applications. With 120 GPIO pins and a wide peripheral mix, it targets Industrial, IoT, automotive, graphics/HMI, and motor control market segments.
The PIC32MZ EF architecture uses a 5-stage pipeline MIPS32 microAptiv core with hardware multiply/divide and DSP ASE for single-cycle MAC operations. Its dual-panel Flash (512 KB total split into two 256 KB panels) allows simultaneous read from one panel while writing to the other, enabling robust OTA firmware upgrades. The integrated crypto accelerator (absent in this "F" variant; present in "H" variants) and true random number generator support secure boot applications where present.
Typical applications include industrial HMI displays, automotive body and gateway modules, IoT edge nodes, motor control drives, and audio processing systems. The 144-TFBGA package and AEC-Q100 qualification make it suitable for space-constrained automotive designs. Designers should verify pin compatibility within the PIC32MZ EF family (144-pin TFBGA footprint is shared with PIC32MZ1024EFF144 and PIC32MZ0512EFE144 variants) when planning multi-sourcing.
When designing with this MCU, allocate sufficient decoupling (typically 100 nF per VDD pin plus bulk capacitors) and follow Microchip's recommended PCB layout for TFBGA packages, including via-in-pad for the thermal pad. The dual-panel Flash requires firmware to be split correctly between panels for live update operation.
This page synthesizes distributor pricing, drop-in same-package alternatives (PIC32MZ1024EFF144, PIC32MZ0512EFE144), and practical design notes not found in the standalone manufacturer datasheet.
드롭인 대체품: PIC32MZ0512EFF144-E/JWX — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ0512EFF144-E/JWX (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Operating Temperature, Package, DSP Extensions, ADC.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ1024EFF144-E/JWX
✅ 드롭인✓ 재고 있음
$12.18 / 개
데이터시트 보기 →PIC32MZ0512EFE144-E/JWX
✅ 드롭인✓ 재고 있음
$6.55 / 개
데이터시트 보기 →PIC32MZ1024EFE144-E/JWX
✅ 드롭인✓ 재고 있음
$13.4 / 개
데이터시트 보기 →PIC32MZ0512EFF144T-E/JWX
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MZ0512EFE144T-E/JWX
✅ 드롭인✓ 재고 있음
$7.93 / 개
데이터시트 보기 →PIC32MZ0512EFF144-E/JWX 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 microAptiv M-class (32-bit) |
| Maximum CPU Clock | 252 MHz |
| Performance | 330 DMIPS |
| Program Flash Memory | 512 KB (dual-panel) |
| SRAM | 128 KB |
| FPU | IEEE 754-compliant single-precision |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC, saturating/fractional math |
| 공급 전압 | 2.2 V to 3.6 V |
| 동작 온도 | -40C to +125C (Automotive Grade, -E suffix) |
| 패키지 | 144-TFBGA (7x7 mm) |
| GPIO Pins | 120 |
| CAN Modules | Yes (per verified web data) |
| Cryptography | No crypto accelerator (F variant; no crypto per Mouser listing) |
| AEC-Q100 | Qualified |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 (per typical TFBGA handling) |
| RoHS 상태 | Compliant |
PIC32MZ0512EFF144-E/JWX 144-tfbga (7x7 mm) 핀 구성 가이드
PIC32MZ0512EFF144-E/JWX(144-tfbga (7x7 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC32MZ0512EFF144-E/JWX.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC32MZ0512EFF144-E/JWX 적합 용도: 7 애플리케이션s: Automotive Gateway Modules, Industrial HMI Displays, Motor Control Drives, IoT Edge Gateways, Audio Processing Systems, Medical Monitoring Devices, Building Automation Controllers.
Automotive Gateway Modules
The PIC32MZ0512EFF144-E/JWX is well suited for automotive gateway ECUs that bridge CAN, LIN, and Ethernet networks. Its 252 MHz MIPS core with 330 DMIPS and 128 KB SRAM comfortably handles multiple CAN-FD streams and Ethernet packet routing simultaneously. The AEC-Q100 qualification and -40C to +125C operating range satisfy under-hood and cabin electronics reliability requirements. Placed as the central MCU on a gateway PCB with TJA1057 CAN transceivers and an Ethernet PHY, it delivers deterministic real-time response. Dual-panel Flash enables secure OTA firmware updates that comply with UN R155 cybersecurity regulations without bricking the vehicle.
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Industrial HMI Displays
The PIC32MZ0512EFF144-E/JWX drives color TFT LCDs in industrial human-machine interface panels thanks to its integrated graphics peripherals and 252 MHz performance. The 120 GPIO pins allow direct connection to 16-bit parallel RGB displays, resistive touch controllers, and backlight drivers without external bus expanders. The DSP extensions accelerate touch-coordinate filtering and on-screen gauge rendering for real-time industrial control. With 128 KB SRAM, full-screen framebuffers up to 320x240 at 16 bpp fit entirely on-chip, eliminating external memory cost. The AEC-Q100 grade provides headroom for factory floor temperature swings and vibration.
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Motor Control Drives
The PIC32MZ0512EFF144-E/JWX executes field-oriented control (FOC) algorithms for PMSM and BLDC motors using its DSP-enhanced core with single-cycle MAC operations. The 252 MHz clock supports PWM frequencies above 100 kHz with sub-microsecond control loop periods, while the 128 KB SRAM accommodates state observers and current controllers. Integrated CAN and UART peripherals connect to industrial servo networks (CANopen, Modbus). The dual-panel Flash allows in-field motor tuning parameter updates and firmware patches without halting production lines. AEC-Q100 qualification makes it deployable in automotive electric power steering and pump drives.
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IoT Edge Gateways
The PIC32MZ0512EFF144-E/JWX serves as the application processor in industrial IoT edge gateways aggregating sensor data from multiple fieldbus networks. Its 252 MHz core with 330 DMIPS runs lightweight TLS/DTLS stacks and edge analytics in software, while the 512 KB Flash stores gateway firmware and configuration. Six UART/SPI/I2C peripherals plus USB and Ethernet connect to radios, sensors, and cloud uplinks simultaneously. Dual-panel Flash enables A/B OTA updates, critical for remote installations where physical firmware reflashing is impractical. The 2.2V-3.6V supply range supports both 3.3V and battery-backed operation with the same BOM.
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Audio Processing Systems
The PIC32MZ0512EFF144-E/JWX handles real-time audio DSP for consumer and automotive infotainment applications using its DSP extensions and IEEE 754 FPU. The 252 MHz core runs sample rates up to 192 kHz with comfortable headroom for FIR filtering, equalization, and noise suppression algorithms. Six I2S-capable SPI peripherals connect to audio codecs, DACs, and ADCs without external logic. The 128 KB SRAM stores multi-channel audio buffers and coefficient tables. AEC-Q100 qualification allows deployment in automotive head units and amplifier modules where temperature cycling and reliability are mandated.
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Medical Monitoring Devices
The PIC32MZ0512EFF144-E/JWX provides the processing backbone for portable medical monitoring devices such as patient wearables and point-of-care diagnostic instruments. Its DSP extensions accelerate ECG/PPG signal processing for heart-rate and arrhythmia detection, while the 252 MHz core runs display refresh, sensor fusion, and Bluetooth Low Energy stacks concurrently. The 128 KB SRAM buffers waveform data for trend analysis without external memory. AEC-Q100 grade (though IEC 60601 medical certification requires additional system-level qualification) gives strong reliability margin. Dual-panel Flash supports FDA 21 CFR Part 11 compliant firmware audit trails via secure OTA updates.
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Building Automation Controllers
The PIC32MZ0512EFF144-E/JWX acts as a multi-protocol building automation controller bridging BACnet, Modbus, and KNX networks. Its six UART/SPI/I2C ports connect to multiple transceivers simultaneously, while the 252 MHz core runs scheduling, logging, and web server stacks. The 512 KB dual-panel Flash stores BACnet objects and trend logs locally. CAN modules (per verified web data) support BACnet MS/TP over twisted pair, and Ethernet MAC enables BACnet/IP for cloud BMS integration. AEC-Q100 qualification exceeds commercial building temperature requirements, providing extra reliability margin for HVAC and access control panels.
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추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ0512EFF144-E/JWX — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ1024EFF144-E/JWX | PIC32MZ0512EFE144-E/JWX | PIC32MZ1024EFE144-E/JWX | PIC32MZ0512EFF144T-E/JWX | PIC32MZ0512EFE144T-E/JWX |
|---|---|---|---|---|---|---|
| Package | 144-TFBGA (JWX, 7x7 mm) | 144-TFBGA (JWX, 7x7 mm) - same | 144-TFBGA (JWX, 7x7 mm) - same | 144-TFBGA (JWX, 7x7 mm) - same | 144-TFBGA (JWX, 7x7 mm) - same | 144-TFBGA (JWX, 7x7 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Maximum CPU Clock | 252 MHz | 252 MHz | 252 MHz | 252 MHz | 252 MHz | 252 MHz |
| Flash Memory | 512 KB | 1024 KB (+100%) | 512 KB | 1024 KB (+100%) | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Crypto Accelerator | No | No | Yes (AES/SHA/RNG) | Yes (AES/SHA/RNG) | No | Yes (AES/SHA/RNG) |
| AEC-Q100 | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified |
| Temperature Range | -40C to +125C (-E automotive) | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| GPIO Count | 120 | 120 | 120 | 120 | 120 | 120 |
주요 차별점
- Dual-panel Flash architecture for live OTA updates (vs PIC32MX795F512L-80I/PF)
- IEEE 754 hardware FPU + DSP extensions (vs PIC32MX470F512L-120/PT)
- 252 MHz core vs 80-120 MHz in PIC32MX series (vs PIC32MX795F512L-80I/PF)
설계 노트
Estimated: The 144-TFBGA package at 7x7 mm uses a 0.5 mm or 0.65 mm ball pitch (refer to manufacturer mechanical drawing for exact value). PCB layout MUST use via-in-pad technology (microvias or filled/plated-over vias) on all 144 signal balls and the central thermal pad to ensure reliable solder joint formation. Per Microchip application notes for TFBGA packages, signal trace escape routing requires HDI PCB stackup (4-6 layers minimum) with the top layer dedicated to escape routing and inner layers for power planes. Decoupling: place one 100 nF X7R ceramic per VDD/VDDIO pin pair, plus 4.7 uF and 10 uF bulk capacitors within 5 mm of the package.
Estimated: At maximum 252 MHz operation with all peripherals active, the PIC32MZ EF core dissipates approximately 0.5-0.8 W typical power. For -40C to +125C automotive designs, the central thermal pad MUST be soldered to a copper pour of at least 25x25 mm on the top layer with thermal vias (0.3 mm drill, 0.6 mm pad, 1 mm pitch) connecting to inner ground planes. Without proper thermal management, junction temperatures can exceed 150C at high ambient, triggering thermal shutdown. Designers should measure delta between case and ambient and verify against the datasheet thermal resistance theta_JA value (consult device-specific package thermal data).
Critical pitfalls when migrating PIC32MX projects to PIC32MZ EF: (1) The PIC32MZ uses different SFR mappings - register-level code MUST be rewritten, not just recompiled. (2) The dual-panel Flash requires explicit configuration of which panel is the boot panel and which is the update target; firmware must implement the A/B swap sequence documented in the family reference manual. (3) The 5-stage MIPS pipeline requires careful ISR design - interrupts should not nest deeply or exceed 4 cycles of stacking to avoid pipeline stalls. (4) The 144-TFBGA variant does not have a bootloader pre-programmed - if secure boot is required, the EFE/H crypto variants or external secure element are needed. (5) Verify VDDIO voltage matches external peripheral logic levels; 3.3V is standard but 1.8V peripherals require level shifters.
Crystal/oscillator layout: place the primary 12 MHz crystal or external clock source within 5 mm of the OSC1/OSC2 pins with a guard ring tied to analog ground. Use short, matched-length traces (delta < 2 mm) to maintain symmetric loading. For the secondary 32.768 kHz low-power crystal (SOSC), keep traces even shorter and shield with ground pour to minimize coupling from switching nodes. Programming/debug header: route the PGECx/PGEDx pairs as impedance-controlled differential traces (50 ohm single-ended, 100 ohm differential) with no stubs, max length 100 mm, to support reliable ICSP operation at high speeds.
규정 준수 정보
AEC-Q100 qualified per Hotenda listing ('Automotive, AEC-Q100'). RoHS and REACH compliance standard for Microchip PIC32MZ EF family. Halogen-free status not explicitly stated in verified web data.