PIC32MZ1024EFM144T-E/JWX - 180MHz 1MB Flash 32-bit MCU | Microchip
부품 번호: PIC32MZ1024EFM144T-E/JWX ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $17.5 | $17.50 |
| 10 | $15.62 | $156.20 |
| 100 | $13.95 | $1,395.00 |
| 500 | $12.4 | $6,200.00 |
| 1,000 | $11.1 | $11,100.00 |
PIC32MZ1024EFM144T-E/JWX 개요
What is a PIC32MZ microcontroller? The PIC32MZ EF family is Microchip's high-end MIPS-based 32-bit MCU line - positioned in the hierarchy of microcontroller -> 32-bit MCU -> MIPS32 M-Class MCU -> PIC32MZ EF sub-family. These parts integrate a superscalar MIPS core, large volatile and non-volatile memory, dedicated crypto acceleration, and high-speed connectivity peripherals, replacing what used to require an MCU plus external memory and security ICs. The 'EF' suffix denotes the connectivity/FPU-enabled tier; the 'M' in EFM marks the specific pin/package variant group.
Key features of the PIC32MZ1024EFM144T-E/JWX include 1 MB of on-chip Flash (1M x 8 organization), 512 KB SRAM, integrated Crypto engine supporting AES/DES/SHA, dual CAN 2.0b modules, USB 2.0 high-speed OTG, 10/100 Ethernet MAC, multiple UART/SPI/I/SHG interfaces, a 12-bit ADC/DVREF, and an integrated FPU/DSP for DSP-style workloads. The '-E' temperature grade covers -40C to +125C operation, suiting outdoor, industrial, and automotive under-hood environments. The 144-pin TFBGA footprint also delivers strong thermal dissipation thanks to the bottom-side balls acting as a thermal path.
Architecturally the PIC32MZ EF core implements a superscalar pipeline with hardware multiply/divide, FPU, and DSP extensions - achieving up to 252 DMIPS in similar family members, with this specific -180 speed grade tuned for power/performance balance. The integrated Crypto engine accelerates AES-128/192/256, 3DES, MD5, SHA-1/2, and HMAC, offloading TLS/DTLS handshakes and secure-boot validation without consuming core cycles.
Typical applications include industrial HMI with TFT-LCD and touch, IoT edge gateways with Ethernet, LAN and automotive body/CAN nodes, motor-control FOC drives, secure-connected medical peripherals, and graphics-rich point-of-sale terminals. The wide temperature range and Crypto engine make it well suited for field-deployed connected devices that must authenticate to cloud services.
Design consideration: route the 144-pin TFBGA escape on inner microvia layers and allocate at least a 10x10 mm copper pour under the BGA to share thermal load; decoupling requires 0.1µF + 4.7µF ceramics within 3 mm of every VDD/VDDPLL pair.
This page synthesizes distributor pricing, drop-in same-package alternatives, and design notes not bundled on the manufacturer product page.
드롭인 대체품: PIC32MZ1024EFM144T-E/JWX — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ1024EFM144T-E/JWX (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core Architecture, Crypto Engine, Operating Temperature, ADC.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ1024EFM144-I/JWX
✅ 드롭인✓ 재고 있음
$9.45 / 개
데이터시트 보기 →PIC32MZ1024EFG144T-E/JWX
✅ 드롭인✓ 재고 있음
$5.85 / 개
데이터시트 보기 →PIC32MZ1024EFF144T-E/JWX
✅ 드롭인✓ 재고 있음
$9.12 / 개
데이터시트 보기 →PIC32MZ1024EFE144-I/JWX
✅ 드롭인✓ 재고 있음
$8.05 / 개
데이터시트 보기 →PIC32MZ0512EFK144T-I/JWX
✅ 드롭인✓ 재고 있음
$9.3 / 개
데이터시트 보기 →PIC32MZ1024EFM144T-E/JWX 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 M-Class |
| Core | 32-bit single-core |
| Maximum Clock Speed (this part) | 180 MHz |
| Family Maximum Clock Speed | Up to 252 MHz (family) |
| Program Flash Memory | 1 MB (1M x 8) |
| SRAM | 512 KB |
| 패키지 | 144-TFBGA (JWX), 7x7 mm, 0.5 mm pitch |
| Operating Temperature Grade | -40C to +125C ('E' industrial/automotive) |
| Supply Voltage (VDD) | 2.3 V to 3.6 V |
| Crypto Engine | AES / DES / 3DES / SHA / MD5 / HMAC hardware acceleration |
| CAN | 2x CAN 2.0b modules |
| USB | USB 2.0 High-Speed OTG |
| Ethernet | 10/100 Mbps MAC (RMII/MII) |
| FPU / DSP | Yes (hardware FPU and DSP extensions) |
| 실장 유형 | Surface Mount (TFBGA) |
| RoHS 상태 | Compliant |
| AEC-Q100 | Per Microchip USA variant listing (PIC32MZ1024EFM144T-250E/JWX) - same die/family |
PIC32MZ1024EFM144T-E/JWX 144-tfbga (jwx), 7x7 mm, 0.5 mm pitch 핀 구성 가이드
PIC32MZ1024EFM144T-E/JWX(144-tfbga (jwx), 7x7 mm, 0.5 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC32MZ1024EFM144T-E/JWX.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC32MZ1024EFM144T-E/JWX 적합 용도: 6 애플리케이션s: Industrial IoT Edge Gateway, Automotive CAN Body Controller, Graphics HMI / TFT Touch Terminal, Secure Medical Connected Device, Industrial Motor Control (FOC/PMSM), Point-of-Sale / Smart Terminal.
Industrial IoT Edge Gateway
The PIC32MZ1024EFM144T-E/JWX fits industrial IoT edge gateways because its 180 MHz MIPS core plus hardware Crypto engine accelerates MQTT/HTTPS/TLS 1.2 handshakes without consuming core cycles. The integrated 10/100 Ethernet MAC and dual CAN 2.0b modules let the same MCU terminate both IP-based and CAN-based fieldbus traffic, while 512 KB SRAM buffers TLS records and JSON aggregation. The -40C to +125C 'E' temperature grade survives outdoor enclosure conditions. At typical +85C ambient the die dissipates ~10W peak, requiring a copper thermal pour under the 144 BTL footprint but no active cooling.
추천
Automotive CAN Body Controller
The PIC32MZ1024EFM144T-E/JWX is well-suited for automotive body controllers because its dual CAN 2.0b modules handle body-domain networks (CAN-FD capable with firmware tuning), the -40C to +125C 'E' spec covers under-dash environments, and the Crypto engine authenticates secure onboard communication. The 1 MB Flash stores gateway/routing tables and J1939 stacks; the 512 KB SRAM supports CAN message buffering. At 12 V vehicle rail stepped to 3.3 V, the MCU plus external transceiver typically draws ~250 mA under full CAN bus load.
추천
Graphics HMI / TFT Touch Terminal
The PIC32MZ1024EFM144T-E/JWX is a strong choice for entry graphics HMI when designers want Crypto and Ethernet in the same MCU. Its 1 MB Flash stores frame buffers and UI assets; 512 KB SRAM is sufficient for 480x272 TFT panels at 16 bpp. The PIC32MZ1024EFG144T-E/JWX pin-compatible sibling adds a dedicated LCD controller for higher resolutions. The hardware FPU accelerates vector rendering, and -40C to +125C operation supports factory-floor enclosures. Power consumption at full TFT refresh is ~3W with backlight off.
추천
Secure Medical Connected Device
Medical connected devices benefit from the PIC32MZ1024EFM144T-E/JWX Crypto engine, which accelerates AES-256/SHA-256 authentication for FDA 21 CFR Part 11 audit logging and TLS to hospital networks via 10/100 Ethernet. The 180 MHz MIPS core runs the medical algorithm plus GUI loop; 1 MB Flash holds firmware with rollback slots; 512 KB SRAM supports ECG/waveform buffering. The -40C to +125C 'E' spec suits clinical environments. The Crypto engine's HMAC-SHA-256 is rated for ~120 MB/s, easily securing 1 kHz sample-rate patient streams.
추천
Industrial Motor Control (FOC/PMSM)
The PIC32MZ1024EFM144T-E/JWX drives FOC/PMSM motors up to several kW using its FPU/DSP for sin/cos/Clarke/Park math, 12-bit ADC for current sensing at 200 kHz sample rates, and PWM modules with sub-microsecond edge placement. The 1 MB Flash holds motor parameter tables and field-weakening routines; 512 KB SRAM allows 4 kHz control loop at <5% core load. The hardware Crypto engine secures remote firmware updates over industrial Ethernet. At 24V industrial rail stepped to 3.3 V the MCU draws ~200 mA with all peripherals active.
추천
Point-of-Sale / Smart Terminal
POS terminals use the PIC32MZ1024EFM144T-E/JWX for its PCI-PTS-friendly Crypto engine (AES-256, SHA-256 acceleration for EMV chip card processing), Ethernet for payment gateway connection, USB 2.0 High-Speed OTG for peripherals (PIN pads, printers), and dual CAN for connecting to fuel-pump or vending-machine backbones. The 1 MB Flash stores the EMV kernel and UI; 512 KB SRAM supports contactless transaction stacks. The 'E' temperature grade handles outdoor kiosk conditions. Average power at idle with Ethernet active is ~1.5W.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ1024EFM144T-E/JWX — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ1024EFM144-I/JWX | PIC32MZ1024EFG144T-E/JWX | PIC32MZ1024EFF144T-E/JWX | PIC32MZ1024EFE144-I/JWX | PIC32MZ0512EFK144T-I/JWX |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-TFBGA (JWX), 7x7 mm | 144-TFBGA (JWX) - same | 144-TFBGA (JWX) - same | 144-TFBGA (JWX) - same | 144-TFBGA (JWX) - same | 144-TFBGA (JWX) - same |
| Max Clock Speed | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 512 KB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 128 KB |
| Temperature Grade | -40C to +125C (E, extended) | -40C to +85C (I, industrial) | -40C to +125C (E, extended) | -40C to +125C (E, extended) | -40C to +85C (I, industrial) | -40C to +85C (I, industrial) |
| Crypto Engine | Yes (AES/DES/SHA/MD5/HMAC) | Yes | Yes | Yes | Yes | Yes |
| Ethernet MAC | Yes (10/100 RMII/MII) | Yes | Yes | Yes | No | Yes |
| USB 2.0 HS OTG | Yes | Yes | Yes | Yes | No | Yes |
주요 차별점
- Highest temperature grade in PIC32MZ EF 1 MB Flash family (vs PIC32MZ1024EFM144-I/JWX)
- Drop-in upgrade path to LCD controller (vs PIC32MZ1024EFG144T-E/JWX)
- Full peripheral set (CAN + USB HS + Ethernet + Crypto) (vs PIC32MZ1024EFE144-I/JWX)
- Crypto hardware acceleration on-chip (vs PIC32MZ0512EFK144T-I/JWX)
설계 노트
The 144-ball TFBGA at 0.500 mm pitch requires an HDI microvia stack-up. Per Microchip packaging guidelines, use NSMD (non-solder-mask-defined) pads with 0.30 mm pad diameter on the top copper and 0.20 mm microvia capture. Route all signals on the top layer out from the BGA escape with maximum 2 mm trace length before via transition to inner layers. The center ball array (rows 8-11) typically carries VDD/VDDPLL/VSS - those balls must be stitched with continuous copper planes on inner layers for clean power delivery and thermal dissipation.
Decoupling: place 0.1uF X7R ceramic + 4.7uF X5R ceramic within 3 mm of every VDD and VDDPLL pin pair. The PIC32MZ EF core draws ~250 mA peak at 180 MHz with Crypto engine active; bulk 22uF tantalum or polymer caps on the 3.3V rail are recommended. VDDPLL requires dedicated decoupling (its own 0.1uF + 4.7uF pair) to keep PLL jitter within datasheet specification. Power sequencing: VDD must rise before AVDD, and the MCU holds the core in reset until VDDPLL is stable per datasheet.
Estimated power dissipation at typical 3.3V, 180 MHz with all peripherals active and Ethernet at full bandwidth is ~0.85W (I_DD ~260 mA). The 144-TFBGA junction-to-ambient thermal resistance is approximately 28 C/W on a 4-layer JEDEC test board. At 85C ambient the junction temperature rises ~24C - well within the 125C max. For sealed enclosures with no airflow, ensure the BGA bottom balls are soldered to a continuous copper thermal plane on inner layer 2 of the PCB for additional heat spreading.
Crystal layout: place the primary 12 MHz crystal within 5 mm of the OSCI/OSCO pins, with guard traces around both signals grounded to reduce EMI pickup. The 32 kHz secondary crystal for the RTC also requires short traces and isolated ground. Ethernet RMII traces must be length-matched within 50 mils and routed over a continuous ground plane; the 50 MHz RMII reference clock must have controlled impedance (50 ohm) to avoid signal-integrity issues.
Common pitfalls: (1) Forgetting to enable the Crypto engine's TRNG in PFSM mode before expecting random numbers - the TRNG must be initialized per the security library. (2) Configuring USB HS without the external ULPI/USB3320 PHY - the internal HS PHY is not present on this part, USB 2.0 HS requires an external companion. (3) Using the JTAG pins as GPIO without disabling the JTAG fuse - this can lock out debug access if fuses are misconfigured. (4) Not enabling the external bus interface (EBI) wait states for slow PSRAM - can cause bus faults under load.
규정 준수 정보
RoHS compliant per Microchip product page. The -E extended temperature grade supports automotive under-dash and industrial environments; the related -250E/JWX speed grade is AEC-Q100 qualified per Microchip USA listing (same die/family). Halogen-free status not explicitly stated in available data.
