PIC32MZ1064DAL169T-I/HF - 32-bit 200MHz MCU 1MB Flash | Microchip
부품 번호: PIC32MZ1064DAL169T-I/HF ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $17.5 | $17.50 |
| 10 | $15.8 | $158.00 |
| 100 | $13.95 | $1,395.00 |
| 500 | $12.4 | $6,200.00 |
| 1,000 | $11.05 | $11,050.00 |
PIC32MZ1064DAL169T-I/HF 개요
A 32-bit microcontroller (MCU) is a single-chip processor that integrates CPU core, Flash program memory, SRAM data memory, and programmable peripherals on one die. PIC32MZ DAL belongs to the hypernym hierarchy: 32-bit MCU -> MIPS32 microAptiv MCU -> PIC32MZ family -> graphics-enabled MCU -> embedded microprocessor system. The DAL sub-series specifically adds an external DDR2 memory interface to overcome internal RAM ceilings for frame-buffer applications.
Key differentiating specifications include 1MB Flash, up to 640KB SRAM (family-max), 200 MHz core clock, a 12-bit 18 MSPS ADC with up to 45 analog inputs, integrated Hi-Speed USB 2.0, CAN, and a dedicated graphics pipeline driving the DDR2 controller. The 'L' suffix in PIC32MZ1064DAL indicates 1MB Flash with 169-pin LFBGA; the 'T' denotes tape-and-reel packaging, 'I' is the -40C to +85C industrial temperature grade, and 'HF' identifies the 169-LFBGA (11x11 mm) lead-free package.
Architecturally, the PIC32MZ DAL uses a 5-stage MIPS32 microAptiv pipeline with FPU and MMU, supports DSP ASE instructions, and pairs the core with a dedicated 2D Graphics Processor and a TFT/LCD controller. DDR2 DRAM (32 MB or 128 MB externally addressable) is used as a frame buffer rather than internal SRAM, which is what enables MPU-class GUI workloads on a single MCU silicon.
Typical applications include industrial HMI panels with TFT LCD, medical patient monitors, automotive infotainment dashboards, smart-home control panels, point-of-sale terminals, and portable instrumentation requiring rich graphics on a real-time OS like FreeRTOS or MPLAB Harmony.
When designing with the 169-LFBGA package, ensure the PCB has microvia stack-up and matched-length routing to the DDR2 bus. Use MPLAB Harmony 3 Configurator to generate the DDR2 timing setup; incorrect ZQ calibration or DLL lock will cause intermittent display artifacts that look like software bugs.
This page synthesizes distributor pricing, drop-in same-family alternatives, and DDR2 routing guidance beyond the manufacturer datasheet.
드롭인 대체품: PIC32MZ1064DAL169T-I/HF — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ1064DAL169T-I/HF (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, USB, Mounting Type, Package, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ1064DAB169T-I/HF
✅ 드롭인✓ 재고 있음
$4.52 / 개
데이터시트 보기 →PIC32MZ1064DAB169-I/HF
✅ 드롭인✓ 재고 있음
$12.4 / 개
데이터시트 보기 →PIC32MZ1064DAA169-I/HF
✅ 드롭인✓ 재고 있음
$12.1 / 개
데이터시트 보기 →PIC32MZ1025DAL169T-I/HF
✅ 드롭인✓ 재고 있음
$8.3 / 개
데이터시트 보기 →PIC32MZ1025DAB169T-I/HF
✅ 드롭인✓ 재고 있음
$12.65 / 개
데이터시트 보기 →PIC32MZ1025DAK169-I/HF
✅ 드롭인✓ 재고 있음
$10.95 / 개
데이터시트 보기 →PIC32MZ1064DAL169T-I/HF 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 microAptiv (PIC32MZ DAL) |
| Core Frequency | 200 MHz |
| Flash Memory | 1 MB (1M x 8) |
| SRAM (Family Max) | 640 KB |
| External Memory Interface | DDR2 DRAM controller, 32 MB or 128 MB externally addressable |
| Graphics Features | Integrated Graphics Controller and Graphics Processor |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| USB | Hi-Speed USB 2.0 |
| CAN | Yes |
| Operating Voltage | 1.8 V |
| 동작 온도 | -40 C to +85 C (Industrial, 'I') |
| 패키지 | 169-LFBGA 11x11 mm (HF) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
PIC32MZ1064DAL169T-I/HF 169-lfbga 11x11 mm (hf) 핀 구성 가이드
PIC32MZ1064DAL169T-I/HF(169-lfbga 11x11 mm (hf) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC32MZ1064DAL169T-I/HF.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC32MZ1064DAL169T-I/HF 적합 용도: 6 애플리케이션s: Industrial HMI Control Panels, Medical Patient Monitors, Automotive Infotainment Display Modules, Smart Home Control Panels, Point-of-Sale (POS) Terminals, Portable Test and Measurement Instruments.
Industrial HMI Control Panels
The PIC32MZ1064DAL169T-I/HF is well suited for industrial HMI control panels because the 200 MHz MIPS32 microAptiv core plus the integrated 2D Graphics Processor and TFT/LCD controller deliver MPU-class UI responsiveness at MCU simplicity. The DDR2 controller offloads the frame buffer to external 32 MB or 128 MB DRAM, enabling WVGA (800x480) and larger displays without paying for a discrete SoM. The 12-bit 18 MSPS ADC with 45 analog inputs handles panel-side sensor conditioning for backlight dimming, temperature compensation, and analog keypad scanning. Industrial -40 C to +85 C temperature rating covers factory-floor enclosures, and Hi-Speed USB supports capacitive touch controllers and firmware update via USB mass storage. The 169-LFBGA is fine-pitch, so plan microvia PCB stack-up. Pair this MCU with the PIC32MX companion for I/O expansion or with an external Ethernet PHY for plant-floor connectivity. Compared with STM32H7, this PIC32MZ DAL offers native DDR2 support - a tangible advantage when the UI requires large frame buffers.
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Medical Patient Monitors
The PIC32MZ1064DAL169T-I/HF fits medical patient monitor front-panel designs where 1 MB Flash holds waveform libraries, calibration tables, and the GUI asset pipeline while the external DDR2 keeps multi-trace waveform rendering smooth. The 12-bit 18 MSPS ADC with 45 analog inputs digitizes ECG, SpO2, and temperature analog front-ends without external ADC chips - reducing BOM cost for compact bedside units. The integrated Graphics Processor accelerates screen updates so the MCU core stays available for real-time vital-sign computation under FreeRTOS or MPLAB Harmony. The industrial temperature grade is appropriate for indoor clinical environments, and the USB 2.0 Hi-Speed port supports wired connectivity to central station monitors. For IEC 60601-1 compliance, route the analog and digital ground domains per the datasheet and add TVS protection on patient-connected leads. Use the PIC32MZ DAL hardware CRC for firmware integrity checks at boot.
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Automotive Infotainment Display Modules
The PIC32MZ1064DAL169T-I/HF supports aftermarket and lower-tier automotive infotainment display modules that require 800x480 or higher WVGA graphics on a single MCU. The integrated 2D Graphics Processor plus the DDR2 frame buffer interface keep the 200 MHz MIPS core free to handle CAN bus message routing, audio mixing, and HVAC UI logic simultaneously. For OEM automotive designs that mandate -40 C to +105 C, the related PIC32MZ1064DAL169T-V/HF grade is the correct choice rather than the 'I' industrial variant. The Hi-Speed USB 2.0 port supports CarPlay/Android Auto passthrough bridges, and CAN enables body-network integration. Note that this PIC32MZ DAL part is NOT AEC-Q100 qualified - if automotive qualification is mandatory, validate with Microchip field application engineering or move to an automotive-grade MCU family. Plan PCB layout for BGA fan-out and DDR2 impedance-controlled routing.
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Smart Home Control Panels
The PIC32MZ1064DAL169T-I/HF is a strong fit for wall-mounted smart-home control panels that drive 4-7 inch capacitive touch TFT displays with animated icons, weather widgets, and live camera thumbnails. The dedicated 2D Graphics Processor offloads sprite blitting and alpha blending, while DDR2 external memory holds compressed asset libraries and frame buffers without burning internal Flash cycles. Hi-Speed USB enables firmware update over USB stick, and CAN or UART bridges to HVAC, lighting, and security subsystems inside the home. The 1 MB Flash comfortably stores the MPLAB Harmony 3 application plus graphics assets, while 640 KB family-max SRAM keeps the active UI responsive. The 169-LFBGA package allows compact PCB layout suitable for slim in-wall enclosures. Compare against STM32H7 Cortex-M7 parts: the PIC32MZ DAL's native DDR2 controller saves a companion memory chip and reduces PCB area for the same frame-buffer size.
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Point-of-Sale (POS) Terminals
The PIC32MZ1064DAL169T-I/HF is appropriate for compact point-of-sale terminals with integrated customer-facing color displays. The 200 MHz core plus graphics pipeline renders itemized receipts, QR codes, and promotional animations at 60 fps while the DDR2 controller holds large font and barcode libraries. The 12-bit ADC reads battery or UPS rail voltages for graceful shutdown, and CAN/LIN support enables integration with cash-drawer and printer peripherals. Hi-Speed USB ports support barcode scanners, MSR readers, and external printers. The 169-LFBGA package allows single-sided PCB designs in slim enclosures under 25 mm height. For PCI-PTS certified designs, integrate secure key storage via an external cryptographic companion IC and use the PIC32MZ DAL hardware RNG. Industrial -40 C to +85 C temperature grade suits semi-outdoor retail kiosk environments.
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Portable Test and Measurement Instruments
The PIC32MZ1064DAL169T-I/HF powers portable oscilloscope, data-acquisition, and field-instrument front panels where 1 MB Flash stores calibration data, waveform captures, and the GUI shell. The 12-bit 18 MSPS ADC with 45 analog inputs supports multi-channel acquisition directly on-chip, eliminating an external ADC for cost-sensitive 4-channel scopes. The DDR2 controller holds deep waveform capture buffers and oscilloscope display raster without paging in/out of Flash. The integrated 2D Graphics Processor drives 800x480 or higher displays at full refresh rate, freeing the core for signal-processing math. USB 2.0 Hi-Speed supports tethered data transfer to a PC. For battery-powered designs, use the PIC32MZ DAL's sleep modes between captures - the low-power modes documented in the family datasheet typically draw single-digit mA in idle. The 169-LFBGA package allows compact handheld enclosures.
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추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ1064DAL169T-I/HF — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ1064DAB169T-I/HF | PIC32MZ1064DAB169-I/HF | PIC32MZ1064DAA169-I/HF | PIC32MZ1025DAL169T-I/HF | PIC32MZ1025DAB169T-I/HF | PIC32MZ1025DAK169-I/HF |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11) HF | 169-LFBGA (11x11) HF - same | 169-LFBGA (11x11) HF - same | 169-LFBGA (11x11) HF - same | 169-LFBGA (11x11) HF - same | 169-LFBGA (11x11) HF - same | 169-LFBGA (11x11) HF - same |
| Core | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM Tier (Family) | 640 KB (family max) | 640 KB family max | 640 KB family max | 640 KB family max | 256 KB | 256 KB | 256 KB |
| External Memory | DDR2 controller, 32-128 MB | DDR2 controller, 32-128 MB | DDR2 controller, 32-128 MB | DDR2 controller, 32-128 MB | DDR2 controller, 32-128 MB | DDR2 controller, 32-128 MB | DDR2 controller, 32-128 MB |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C |
| Peripheral Tier | L-tier (standard) | B-tier (broader peripheral set) | B-tier (broader peripheral set) | A-tier (lower cost, standard peripherals) | L-tier (standard) | B-tier (broader peripheral set) | K-tier (broadest peripheral set) |
주요 차별점
- Native DDR2 controller for large frame buffers (vs PIC32MX795F512L-80I/BG)
- Higher Flash density than 1MB-tier alternatives (vs PIC32MZ1025DAL169T-I/HF)
- Industrial temperature grade with broader headroom than consumer variant (vs PIC32MZ1064DAL169-I/HF)
설계 노트
The 169-LFBGA package at 11x11 mm body requires a microvia PCB stack-up (laser-drilled microvias or stacked-via structure). Use 0.4 mm ball pitch escape routing with via-in-pad for the inner-row balls; design rule checks must allow 0.2 mm hole-to-hole spacing. Plan matched-length routing for the DDR2 data, address, and control groups per the PIC32MZ DA family PCB layout application note.
Estimated: DDR2 ZQ calibration and DLL lock must be confirmed at first boot. If ZQ resistor value is wrong or DLL cannot lock across temperature, the display will show intermittent pixel corruption or full-frame artifacts that look like firmware bugs. Always validate DDR2 initialization with the MPLAB Harmony 3 configurator and a memory test pattern before integrating the graphics pipeline.
Estimated: at 200 MHz core clock with DDR2 active and Graphics Processor running, typical core power consumption is in the 0.5-0.8 W range. With 169-LFBGA thermal resistance typically around 20-25 C/W on a 4-layer JEDEC board, junction-to-ambient temperature rise is approximately 10-20 C - acceptable for the industrial -40 C to +85 C grade, but for high-ambient enclosures above 70 C, add thermal vias under the exposed die pad and consider copper pour on top layer.
규정 준수 정보
Lead-free matte-tin balls per HF suffix; industrial -40C to +85C temperature grade only (not AEC-Q100 qualified for automotive - use V-grade or AEC-Q100 qualified family member if automotive is required)
