PIC32MZ2064DAA176T-I/2J - 200MHz 32-Bit MCU 2MB | Microchip
부품 번호: PIC32MZ2064DAA176T-I/2J ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.95 | $169.50 |
| 100 | $15.4 | $1,540.00 |
| 500 | $14.2 | $7,100.00 |
| 1,000 | $13.1 | $13,100.00 |
PIC32MZ2064DAA176T-I/2J 개요
A microcontroller (MCU) is a self-contained integrated circuit that combines a processor core, memory, and programmable peripherals on a single die, forming the lowest tier of the embedded computing hierarchy: MCU -> embedded processor -> system-on-chip -> semiconductor. The PIC32MZ DA family sits at the high-performance end of this hierarchy, delivering MPU-like throughput (330 DMIPS) while retaining the deterministic interrupt behavior and ease of design of an MCU.
Key differentiators include dual-panel Flash for live update support, a Memory Management Unit (MMU) for optimum embedded OS execution, microMIPS mode for up to 35% code size reduction, and an integrated DDR2 DRAM controller supporting 32 MB or 128 MB externally addressable memory. Six 4-wire SPI modules (up to 50 MHz), an SQI module configurable as an additional SPI (up to 80 MHz), five I2C modules (up to 1 Mbaud) with SMBus support, CAN, and High-Speed USB round out the connectivity set.
The device is built on Microchip's PIC32MZ architecture with a 1.8 V core and flexible I/O voltage domains, enabling direct interfacing to both 1.8 V and 3.3 V peripherals. The 12-bit ADC at 18 MSPS supports simultaneous sampling for motor control and power monitoring, while the graphics pipeline offloads pixel composition from the CPU.
Typical applications include industrial HMI panels, medical instrumentation displays, automotive cluster graphics, IoT gateways with local visualization, and test-and-measurement front panels. The 176-LQFP exposed-pad package provides good thermal performance for sustained 200 MHz operation.
When designing with this device, pay close attention to the DDR2 memory routing and the analog supply filtering for the ADC. Microchip recommends using the PIC32MZ2064DAK176 for new designs, so verify lifecycle status before committing to volume production.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for selection and second-sourcing decisions.
드롭인 대체품: PIC32MZ2064DAA176T-I/2J — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ2064DAA176T-I/2J (동일 폼 팩터 및 풋프린트) — 차이점: Package, Graphics Controller, Operating Voltage, USB, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ2064DAA176-I/2J
✅ 드롭인✓ 재고 있음
$7.26 / 개
데이터시트 보기 →PIC32MZ2064DAG176T-I/2J
✅ 드롭인✓ 재고 있음
$22.05 / 개
데이터시트 보기 →PIC32MZ2064DAH176T-I/2J
✅ 드롭인✓ 재고 있음
$15.51 / 개
데이터시트 보기 →PIC32MZ2064DAK176T-I/2J
✅ 드롭인✓ 재고 있음
$10.2 / 개
데이터시트 보기 →PIC32MZ2064DAR176T-I/2J
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MZ2064DAA176T-I/2J 최대 정격 & 전기적 특성
| Core Processor | MIPS32 microAptiv |
| Core Size | 32-Bit |
| 최대 클록 주파수 | 200 MHz |
| Performance | 330 DMIPS |
| Program Memory Size | 2 MB (2M x 8) Flash |
| Flash Architecture | Dual Panel Flash for live update support |
| SRAM Size | 640 KB |
| External Memory Support | 32 MB or 128 MB externally addressable DDR2 DRAM |
| ADC Resolution | 12-bit |
| ADC Sampling Rate | 18 MSPS |
| ADC Channels | Up to 45 analog inputs |
| Graphics | Integrated Graphics Controller and Graphics Processor |
| SPI Modules | Six 4-wire SPI (up to 50 MHz) |
| SQI Module | Configurable as additional SPI (up to 80 MHz) |
| I2C Modules | Five (up to 1 Mbaud) with SMBus support |
| CAN | Yes |
| USB | High-Speed USB |
| MMU | Yes, for optimum embedded OS execution |
| Instruction Set | microMIPS mode for up to 35% code reduction |
| 패키지 | 176-LQFP (20x20) Exposed Pad |
| Core Voltage | 1.8 V |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +85C (Industrial) |
PIC32MZ2064DAA176T-I/2J 176-lqfp (20x20) exposed pad 핀 구성 가이드
PIC32MZ2064DAA176T-I/2J(176-lqfp (20x20) exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC32MZ2064DAA176T-I/2J.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC32MZ2064DAA176T-I/2J 적합 용도: 6 애플리케이션s: Industrial HMI Panels, Medical Instrumentation Displays, Automotive Cluster Graphics, IoT Gateways with Local Visualization, Test and Measurement Front Panels, Embedded GUI and Display Controllers.
Industrial HMI Panels
The PIC32MZ2064DAA176T-I/2J fits industrial human-machine interface panels because its integrated graphics controller and graphics processor offload pixel composition from the 200 MHz MIPS32 microAptiv CPU, leaving headroom for control logic. With 2 MB dual-panel Flash and 640 KB SRAM, the device can store GUI assets and run real-time control tasks simultaneously, while support for 32 MB or 128 MB externally addressable DDR2 DRAM provides frame-buffer capacity for 800x480 or larger displays. The 12-bit 18 MSPS ADC with up to 45 analog inputs allows direct connection of touch panels and sensor arrays without external converters. Placed on a 176-LQFP (20x20) exposed-pad footprint, the MCU dissipates heat through the pad, but designers should still provide a copper pour under the package for sustained 200 MHz operation.
추천
Medical Instrumentation Displays
The PIC32MZ2064DAA176T-I/2J suits medical instrumentation displays because its 12-bit 18 MSPS ADC with up to 45 analog inputs captures physiological signals with sufficient resolution for patient monitoring, while the integrated graphics pipeline renders waveforms and trend charts without a separate display controller. The 200 MHz/330 DMIPS core and MMU support embedded operating systems for deterministic task scheduling, and dual-panel Flash enables live firmware updates without interrupting patient monitoring. The 176-LQFP exposed-pad package provides thermal relief for continuous operation, and the 1.8 V core with flexible I/O domains interfaces directly to low-power medical sensors. Designers should isolate the analog supply and use the ADC's simultaneous sampling mode for multi-lead ECG front ends.
추천
Automotive Cluster Graphics
The PIC32MZ2064DAA176T-I/2J is used in automotive cluster graphics because the integrated graphics controller and processor drive instrument-cluster displays while the 200 MHz MIPS32 microAptiv core handles CAN messaging and vehicle-state logic. The device supports CAN and High-Speed USB, enabling direct connection to vehicle networks and diagnostic interfaces, and the 12-bit 18 MSPS ADC with up to 45 channels digitizes analog gauge and sensor inputs. Dual-panel Flash supports live update of cluster firmware, a requirement for over-the-air update strategies. Note that the standard DAA176 variant is rated for -40C to +85C industrial temperature; automotive-grade qualification should be verified with Microchip before use in safety-critical clusters.
추천
IoT Gateways with Local Visualization
The PIC32MZ2064DAA176T-I/2J fits IoT gateways that require local visualization because it combines a 200 MHz/330 DMIPS core, 2 MB Flash, and 640 KB SRAM with an integrated graphics pipeline, allowing a single chip to run protocol stacks and render a local dashboard. Six 4-wire SPI modules up to 50 MHz and an SQI module up to 80 MHz connect to external wireless modules and flash, while five I2C modules up to 1 Mbaud with SMBus support link to sensors and power monitors. High-Speed USB enables host connectivity for configuration. The 176-LQFP package provides enough I/O for gateway expansion, and the MMU supports Linux-class embedded operating systems for gateway applications.
추천
Test and Measurement Front Panels
The PIC32MZ2064DAA176T-I/2J is well suited to test and measurement front panels because its 12-bit 18 MSPS ADC with up to 45 analog inputs digitizes multiple measurement channels simultaneously, and the 200 MHz core processes results while the graphics controller renders live traces. The 2 MB dual-panel Flash stores calibration tables and firmware images, and the MMU supports real-time operating systems for deterministic measurement loops. Six SPI modules and five I2C modules connect to external DACs, multiplexers, and display drivers. The 176-LQFP exposed-pad package handles the thermal load of continuous acquisition, but designers should keep the analog supply clean and use the ADC's simultaneous sampling to avoid channel-to-channel skew.
추천
Embedded GUI and Display Controllers
The PIC32MZ2064DAA176T-I/2J targets embedded GUI and display controller designs because Microchip positions the PIC32MZ DA series as offering MPU-like performance with the ease of design of an MCU for GUI applications. The integrated graphics controller and graphics processor handle layer composition and alpha blending, while the 200 MHz MIPS32 microAptiv core runs the application and touch logic. Support for 32 MB or 128 MB externally addressable DDR2 DRAM provides the frame buffer for high-resolution panels, and the 12-bit 18 MSPS ADC with up to 45 channels handles resistive touch and ambient-light sensing. The 176-LQFP (20x20) package offers sufficient I/O for display interfaces, and dual-panel Flash enables live GUI updates.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ2064DAA176T-I/2J — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ2064DAA176-I/2J | PIC32MZ2064DAG176T-I/2J | PIC32MZ2064DAH176T-I/2J | PIC32MZ2064DAK176T-I/2J |
|---|---|---|---|---|---|
| Package | 176-LQFP (20x20) Exposed Pad | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Processor | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv |
| Maximum Clock Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Program Memory Size | 2 MB (2M x 8) Flash | 2 MB Flash | 2 MB Flash | 2 MB Flash | 2 MB Flash |
| SRAM Size | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| ADC Resolution and Rate | 12-bit, 18 MSPS, up to 45 channels | 12-bit, 18 MSPS, up to 45 channels | 12-bit, 18 MSPS, up to 45 channels | 12-bit, 18 MSPS, up to 45 channels | 12-bit, 18 MSPS, up to 45 channels |
| Graphics Controller | Integrated Graphics Controller and Processor | Integrated Graphics Controller and Processor | Integrated Graphics Controller and Processor | Integrated Graphics Controller and Processor | Integrated Graphics Controller and Processor |
| External DDR2 DRAM Support | 32 MB or 128 MB externally addressable | 32 MB or 128 MB externally addressable | 32 MB or 128 MB externally addressable | 32 MB or 128 MB externally addressable | 32 MB or 128 MB externally addressable |
| Packaging | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
주요 차별점
- Dual-panel Flash for live update support (vs PIC32MZ2064DAG176T-I/2J)
- Integrated graphics controller and processor (vs PIC32MZ2064DAK176T-I/2J)
- 12-bit 18 MSPS ADC with up to 45 channels (vs PIC32MZ2064DAH176T-I/2J)
- MMU for embedded OS execution (vs PIC32MZ2064DAR176T-I/2J)
설계 노트
Route the DDR2 memory interface with controlled 50-ohm impedance and match trace lengths within 5 mm for the address and command groups. The PIC32MZ2064DAA176T-I/2J supports 32 MB or 128 MB externally addressable DDR2 DRAM, and signal integrity at 200 MHz core speed depends on keeping the DDR2 clock and DQS pairs tightly matched. Place the DDR2 devices as close as possible to the MCU and use a solid ground plane under the memory bus to minimize crosstalk.
Decouple the 1.8 V core supply with a 10 uF bulk capacitor plus 0.1 uF ceramic capacitors on each VDD pin, placed within 5 mm of the package. The 176-LQFP exposed-pad package requires a clean analog supply for the 12-bit 18 MSPS ADC; use a separate ferrite bead and 1 uF capacitor on the AVDD rail to isolate switching noise. Estimated: at 200 MHz with typical peripheral activity, core current can exceed 200 mA, so size the regulator for at least 500 mA with adequate transient response.
Solder the exposed pad of the 176-LQFP package to a copper pour with a minimum of nine thermal vias to the ground plane. Estimated: at 200 MHz with graphics and ADC active, power dissipation can reach 1 W, and the exposed pad is the primary heat path. Provide at least 1 square inch of copper on the top and bottom layers to keep the junction temperature within the -40C to +85C operating range. Use thermal vias with 0.3 mm drill and 0.6 mm pad for reliable solderability.
Microchip recommends the PIC32MZ2064DAK176 for new designs, so verify lifecycle status before committing to volume production with the DAA176 variant. When substituting between PIC32MZ DA family members, confirm that the graphics and DDR2 memory configuration matches your firmware expectations, because the DAA, DAG, DAH, DAK, and DAR variants differ in these blocks. Always re-run the Microchip harmony configuration and validate the peripheral pin mapping after any variant change.
규정 준수 정보
Compliance data was not present in the verified web data for this MPN. Verify RoHS, REACH, and lead-free status directly with Microchip Technology or the authorized distributor before finalizing compliance documentation.
