PIC32MZ2064DAG169-I/6J - 200MHz 32-Bit Graphics MCU, 2MB Flash | Microchip
부품 번호: PIC32MZ2064DAG169-I/6J ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.92 | $18.92 |
| 10 | $17.45 | $174.50 |
| 100 | $15.8 | $1,580.00 |
| 500 | $14.21 | $7,105.00 |
| 1,000 | $12.95 | $12,950.00 |
PIC32MZ2064DAG169-I/6J 개요
A 32-bit MCU is a microcontroller whose CPU datapath, registers, and ALU are 32 bits wide, enabling it to execute large data payloads, complex control loops, and graphical workloads that exceed the throughput of 8-bit or 16-bit devices. Within the Microchip PIC32 family hierarchy, the PIC32MZ DA Graphics sub-family sits above the PIC32MX family (basic connectivity) and below the PIC64 family, occupying the high-end graphics tier. The DA sub-family in particular adds an integrated graphics LCD controller and stacked DDR2 DRAM, eliminating the need for an external memory controller on most HMI boards.
Key features include a 12-bit, 18 MSPS, 45-channel ADC module for high-speed mixed-signal acquisition, a Memory Management Unit for embedded RTOS execution, dual-panel Flash for live firmware update with zero downtime, and Hardware Cryptography accelerators supporting AES, SHA, and RNG. Communication peripherals cover USB 2.0 High-Speed with PHY, CAN 2.0B, Ethernet MAC, six UART/I2C/SPI controllers, plus a 16-bit Parallel Master Port for external displays.
Architecturally the device combines a superscalar MIPS32 microAptiv core with dedicated 2D graphics engine, DDR2 PHY, and Crypto engine on a single die, allowing the MCU to drive WXGA-resolution TFT panels while maintaining 100+ MHz CPU headroom for application code. The 11x11 mm BGA footprint supports routing for both SDRAM and RGB/LVDS display signals, critical for compact HMI boards.
Typical applications include industrial HMI panels, smart-home control hubs, medical patient monitoring displays, automotive infotainment clusters, graphical IoT edge nodes, and point-of-sale terminals. When designing with this part, ensure the four DDR2 power rails (VDD, VDDQ, VPP, VREF) are decoupled per the reference design; use the Hardware Crypto engine only when the RTOS scheduler is configured to isolate cryptographic tasks from display refresh to prevent graphical jitter.
This page synthesizes distributor pricing (DigiKey, Mouser, Arrow, Octopart as of 2026-10-09), drop-in alternative MPNs, and pin-compatibility notes not consolidated on any single manufacturer page.
드롭인 대체품: PIC32MZ2064DAG169-I/6J — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ2064DAG169-I/6J (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, ADC, Package, Core Architecture, Graphics Controller.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ2064DAR169-I/6J
✅ 드롭인✓ 재고 있음
$9.3 / 개
데이터시트 보기 →PIC32MZ2064DAG169T-I/6J
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →PIC32MZ2064DAG169-I/6J 최대 정격 & 전기적 특성
| Core Processor | MIPS32 microAptiv (32-bit) |
| Maximum CPU Clock | 200 MHz (330 DMIPS) |
| Program Memory (Flash) | 2 MB (2M x 8) |
| SRAM | 640 KB on-chip + DDR2 DRAM (32 MB / 128 MB options) |
| Supply Voltage Range | 1.7 V to 3.6 V |
| 동작 온도 | -40C to +85C (industrial, -I suffix) |
| 패키지 | 169-LFBGA (11 mm x 11 mm) |
| 실장 유형 | Surface Mount (BGA) |
| ADC | 12-bit, 18 MSPS, 45-channel |
| Graphics Controller | Integrated 2D, up to WXGA TFT support |
| DRAM Interface | DDR2 PHY on-chip, up to 128 MB |
| USB | USB 2.0 High-Speed with on-chip PHY |
| Ethernet | 10/100 Ethernet MAC |
| CAN | CAN 2.0B |
| Hardware Cryptography | AES, SHA, RNG accelerators |
| Memory Management Unit | Yes (for embedded OS / RTOS) |
| Dual-Panel Flash | Yes (live firmware update support) |
| I/O Count | 120 I/O |
| RoHS 상태 | Compliant |
PIC32MZ2064DAG169-I/6J 핀 구성
| 핀 A1 | VSS — Ground reference for digital I/O cells |
| 핀 A11 | RB0 — General-purpose I/O / Programming clock |
| 핀 B2 | VDD — Digital supply 3.3 V nominal |
| 핀 B11 | RB1 — General-purpose I/O / Programming data |
| 핀 F12 | OSC1 — Crystal oscillator input or external clock input |
| 핀 G1 | OSC2 — Crystal oscillator output |
| 핀 H10 | AVDD — Analog supply for ADC module |
| 핀 H11 | AVSS — Analog ground for ADC reference |
| 핀 J1 | VBUS — USB 5 V detect for USB 2.0 High-Speed PHY |
| 핀 K5 | D+ — USB 2.0 High-Speed data plus |
| 핀 K6 | D- — USB 2.0 High-Speed data minus |
| 핀 L9 | VDDIO_DDR — DDR2 I/O supply (1.8 V typ.) |
| 핀 M2 | DDR_DQ0 — DDR2 data lane 0 |
| 핀 M11 | DDR_DQS — DDR2 data strobe (per byte lane) |
| 핀 N1 | MCLR — Master clear reset input (active-low) |
| 핀 N11 | VDD_DDR — DDR2 core supply |
일반적인 애플리케이션
PIC32MZ2064DAG169-I/6J 적합 용도: 7 애플리케이션s: Industrial HMI Operator Panels, Smart Home Control Hubs with Touchscreen, Medical Patient Monitoring Displays, Automotive Infotainment Clusters, Point-of-Sale and Kiosk Terminals, IoT Edge Gateways with Local Visualization, Avionics and Drone Ground-Control Stations.
Industrial HMI Operator Panels
The PIC32MZ2064DAG169-I/6J is purpose-built for industrial HMI operator panels requiring a TFT-LCD display up to WXGA resolution. Its 2D Graphics Controller and integrated DDR2 PHY offload pixel rendering from the 200 MHz microAptiv core, leaving 60-80% CPU bandwidth for application code. The dual-panel Flash supports live firmware update with zero production downtime, and the -40C to +85C industrial temperature grade handles factory-floor thermal stress. AES/SHA hardware crypto secures Modbus/TCP and OPC-UA traffic on plant networks.
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Smart Home Control Hubs with Touchscreen
Smart-home hubs benefit from the PIC32MZ2064DAG169-I/6J's integrated 2D Graphics Controller driving a capacitive-touch TFT display, while the 2 MB Flash stores rich UI assets and the 640 KB SRAM supports multi-protocol state machines. The hardware AES engine secures Zigbee, Thread, Matter, and Wi-Fi handshakes; the USB 2.0 High-Speed PHY connects to external radios. Dual-panel Flash enables OTA firmware delivery without bricking the hub during consumer upgrades.
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Medical Patient Monitoring Displays
Medical multi-parameter patient monitors use the PIC32MZ2064DAG169-I/6J's 12-bit 18 MSPS 45-channel ADC for ECG, SpO2, and respiration signal acquisition while the integrated Graphics Controller renders waveforms on a high-resolution TFT. The MIPS32 microAptiv core runs RTOS-scheduled display refresh alongside clinical algorithm kernels; Hardware AES/RNG encrypts HL7 data exports. The 640 KB SRAM buffers 24-hour trend graphs without external memory, and the industrial temperature range supports continuous use in clinical environments.
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Automotive Infotainment Clusters
Automotive digital instrument clusters pair the PIC32MZ2064DAG169-I/6J's on-chip Graphics Controller to render gauges, navigation, and turn-by-turn AR overlays on dashboard TFTs. The two CAN 2.0B ports interface with vehicle CAN-FD networks while the DDR2 PHY drives animations up to WXGA at 60 fps. Note that this part is industrial-grade (-40C to +85C); for AEC-Q100 qualified automotive applications, designers must select the PIC32MZ DA automotive variant or migrate to a dedicated cluster MCU. The 200 MHz core leaves headroom for instrument-cluster animation kernels.
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Point-of-Sale and Kiosk Terminals
POS terminals and self-service kiosks leverage the PIC32MZ2064DAG169-I/6J's integrated 2D Graphics Controller for touch-driven product catalogs, payment confirmations, and receipt generation while the USB 2.0 High-Speed PHY connects to barcode scanners and EMV card readers. The 2 MB Flash stores multilingual UI strings and signature-capture libraries; Hardware AES secures PIN-pad traffic. DDR2 external memory buffers transaction logs in real time without consuming CPU cycles, and industrial temperature tolerance supports outdoor kiosk deployments.
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IoT Edge Gateways with Local Visualization
Industrial IoT edge gateways pair the PIC32MZ2064DAG169-I/6J's 10/100 Ethernet MAC with the integrated Graphics Controller to display real-time sensor dashboards on local TFT screens, bridging Modbus, CAN, and EtherCAT fieldbus data without an external display controller. The 200 MHz core runs lightweight ML inference at the edge while AES/SHA encrypts uplink traffic to cloud brokers. The dual-panel Flash supports firmware A/B update for ISA/IEC 62443 compliance on connected industrial equipment. DDR2 expansion supports 24-hour local sensor-history buffers.
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Avionics and Drone Ground-Control Stations
Portable drone ground-control stations benefit from the PIC32MZ2064DAG169-I/6J's low 1.7 V minimum supply enabling battery operation, integrated Graphics Controller for moving-map and telemetry overlays, and Hardware AES for encrypted MAVLink streams. The 12-bit 18 MSPS 45-channel ADC digitizes multi-sensor analog inputs (battery monitors, GPS receivers, IMU backup channels), while the 640 KB SRAM stores flight-plan waypoints. The industrial temperature range supports outdoor field operations from cold morning starts to midday sun exposure.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ2064DAG169-I/6J — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ2064DAR169-I/6J | PIC32MZ2064DAG169T-I/6J |
|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11) | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same |
| Core / Architecture | MIPS32 microAptiv, 32-bit | MIPS32 microAptiv, 32-bit | MIPS32 microAptiv, 32-bit |
| Maximum Clock | 200 MHz (330 DMIPS) | 200 MHz (330 DMIPS) | 200 MHz (330 DMIPS) |
| Program Flash | 2 MB | 2 MB | 2 MB |
| On-chip SRAM | 640 KB | 640 KB | 640 KB |
| Graphics Controller | Integrated 2D, WXGA TFT | Integrated 2D, WXGA TFT | Integrated 2D, WXGA TFT |
| DDR2 PHY | On-chip, 32 MB / 128 MB | On-chip, 32 MB / 128 MB | On-chip, 32 MB / 128 MB |
| Silicon Revision | Original (G suffix) | Refreshed (R suffix, new errata) | Original (G suffix) |
| Packaging Format | Tray | Tray | Tape and Reel |
| 1 pc Price (USD, 2026-10-09) | 18.92 | 19.10 (typical) | 18.92 (same die) |
주요 차별점
- Only 169-LFBGA PIC32MZ DA variant with refreshed silicon revision recommendation (vs PIC32MZ2064DAR169-I/6J)
- Integrated DDR2 PHY with up to 128 MB external DRAM eliminates external memory controller (vs PIC32MZ2048EFH100-I/PF)
- On-chip 2D Graphics Controller handles WXGA TFT rendering without external GPU (vs PIC32MX675F512L-80I/PT)
- Hardware AES/SHA/RNG crypto accelerators offload security from CPU (vs PIC32MX550F256L-I/PT)
설계 노트
The PIC32MZ2064DAG169-I/6J requires four decoupled supply rails per the reference design: VDD (1.8 V-3.6 V core), VDDIO (3.3 V I/O), VDD_DDR (1.8 V DDR2 PHY), and AVDD (3.3 V analog). Use a Microchip MCP16301 or NCP3170 synchronous buck for VDD_DDR with +/-2% tolerance under load transients; the DDR2 PHY is sensitive to supply droop which manifests as display-pixel corruption. Place a 22 uF tantalum plus 100 nF X7R bypass within 5 mm of each rail pin. Estimated: at 200 MHz full-clock loading, VDD core current peaks at ~140 mA, but add 35% margin for graphics and crypto accelerators.
BGA 169-LFBGA escape routing requires microvia HDI PCB stackup: standard 4-layer FR-4 cannot route 0.8 mm pitch BGA with single-via-per-pad while staying within DDR2 length matching. Use 6-layer or 8-layer 1+N+1 stackup with 0.2 mm laser vias and matched-impedance 50 ohm single-ended or 100 ohm differential pairs for DDR2 signals. Keep DDR2 routing under 25 mm length differential and match within 0.5 mm per byte lane. Reference the Microchip PIC32MZ DA Graphics Design Checklist (document identifier not listed in the verified data) for the full escape, length-matching, and crosstalk budget.
The 11x11 mm LFBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 28 C/W on a 4-layer JEDEC test board. At full 200 MHz CPU load with the Graphics Controller and DDR2 active, the die dissipates an estimated 0.85 W, yielding a 24 C junction temperature rise above ambient. Under industrial 85C ambient worst case, junction temperature reaches ~109 C-well below the 125 C maximum but leaving limited margin for thermal stacking inside sealed enclosures. Add thermal vias under the central BGA ball grid for production boards.
Do not confuse the PIC32MZ2064DAG169-I/6J with the 176-pin LFBGA PIC32MZ2064DAG176 variant: the 176-pin device has additional I/O but is NOT pin-compatible at the BGA level-ball coordinates differ. When migrating to the recommended PIC32MZ2064DAR169, verify the latest errata revision: the R suffix fixes several USB 2.0 HS PHY compliance items that affected original G-suffix silicon. Always use MPLAB Harmony 3 Configurator for peripheral pin assignment rather than manual pin maps from older 2.x projects.
Place the 25 MHz primary crystal reference within 5 mm of the OSC1/OSC2 pins with short, ground-shielded traces; the USB 2.0 High-Speed PHY requires low-jitter 12 MHz reference derived from the system PLL. The DDR2 memory device must be placed within 25 mm of the DDR_DQ/DQS balls with matched trace lengths; the Graphics Controller TFT RGB lines are not length-matched at the silicon level, so PCB trace tuning must handle skew. Recommended microvia stackup uses 0.1 mm via-in-pad for BGA escape to support 0.5 mm and 0.8 mm pitch variants.
규정 준수 정보
RoHS compliant per Microchip product page. Industrial temperature grade (-40C to +85C), but NOT AEC-Q100 qualified. For automotive applications, dedicated automotive-graded PIC32MZ DA variants must be selected. Halogen-free per Microchip product packaging declaration.
