PIC32MZ2064DAG176-I/2J - 200MHz 32-Bit MCU, 2MB Flash, 176-LQFP | Microchip
부품 번호: PIC32MZ2064DAG176-I/2J ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $39.19 | $39.19 |
| 10 | $35.27 | $352.70 |
| 100 | $31.35 | $3,135.00 |
| 250 | $28.5 | $7,125.00 |
| 500 | $26.1 | $13,050.00 |
PIC32MZ2064DAG176-I/2J 개요
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals on one die. PIC32MZ DA devices sit in the high-performance tier of the PIC32 family, alongside the EF (Ethernet) and EC (connectivity) sub-families, and are designed for applications that require large memory footprints, real-time graphics, and connectivity stacks. The DA series specifically adds an integrated Graphics LCD controller and a DDR2 external memory interface that can address 32 MB or 128 MB of external DDR2, distinguishing it from EF/EC variants that lack a GPU.
Key specifications include 2 MB (2M x 8) of Flash supporting live update via dual-panel architecture, 640 KB of SRAM, an integrated 12-bit 18 MSPS 45-channel ADC, USB-HS, Ethernet MAC, SD card host, CAN, and a 2D Graphics Processing Unit (GPU) for accelerating GUI rendering. The wide memory map and Memory Management Unit (MMU) support embedded operating systems such as FreeRTOS, OpenRTOS, and Micrium OS, while microMIPS compressed mode reduces code size by up to 35% compared to standard MIPS32 instruction encoding.
Architecturally, the PIC32MZ2064DAG176-I/2J uses a superscalar microAptiv core with hardware multiply/divide and a tightly-coupled peripheral bridge. The dual-panel Flash subsystem allows a firmware image to run from one panel while the other is being reprogrammed, enabling field firmware updates without downtime. The integrated GPU and LCD controller support resolutions up to WVGA with hardware-accelerated rendering, offloading pixel-pushing from the CPU.
Typical applications include industrial HMI panels, automotive instrument clusters, medical patient monitors, point-of-sale terminals, smart home control panels, and graphical IoT gateways. The wide 1.8 V core / 3.3 V I/O supply and 176-pin LQFP footprint simplify PCB layout for designs that previously required a discrete MPU plus external SDRAM.
When designing with this part, ensure the DDR2 interface is impedance-controlled and length-matched per JEDEC specifications; place a 1.8 V LDO close to the core supply pins and bulk-decouple every power rail. Microchip recommends considering the pin-compatible PIC32MZ2064DAR176 variant for new designs where extended commercial availability is required.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes that go beyond what the manufacturer datasheet provides, helping engineers and procurement teams make informed decisions.
드롭인 대체품: PIC32MZ2064DAG176-I/2J — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ2064DAG176-I/2J (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Package, External Memory Interface, USB, Graphics Controller.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ2064DAR176
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MZ2064DAA176-I/2J
✅ 드롭인✓ 재고 있음
$7.26 / 개
데이터시트 보기 →PIC32MZ2064DAB176T-I/2J
✅ 드롭인✓ 재고 있음
$9.45 / 개
데이터시트 보기 →PIC32MZ2064DAG176T-I/2J
✅ 드롭인✓ 재고 있음
$22.05 / 개
데이터시트 보기 →PIC32MZ2064DAG176-I/2J 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 microAptiv |
| Core Frequency | 200 MHz |
| Core Performance | 330 DMIPS |
| Instruction Set Width | 32-bit |
| microMIPS Compressed Mode | Yes (up to 35% code size reduction) |
| Program Flash Memory | 2 MB (2M x 8), dual-panel for live update |
| SRAM | 640 KB |
| External Memory Interface | DDR2 controller, up to 32 MB or 128 MB externally addressable |
| ADC | 12-bit, 18 MSPS, 45 channels |
| Graphics Controller | Integrated 2D GPU + LCD controller |
| USB | USB-HS (High-Speed) |
| Ethernet | 10/100 Mbps MAC |
| Other Connectivity | SD card host, CAN, I2C, SPI, UART |
| Operating Voltage | 1.8 V core / 3.3 V I/O |
| 패키지 | 176-LQFP (20x20 mm) with exposed thermal pad |
| 동작 온도 | -40C to +85C (Industrial grade, -I suffix) |
| RoHS 상태 | Compliant |
| Memory Management Unit (MMU) | Yes |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 (168 hours) |
PIC32MZ2064DAG176-I/2J 핀 구성
| 핀 1 | RPB0/AN0/RB0 — Remappable peripheral I/O, analog input AN0, or GPIO RB0 |
| 핀 2 | RPB1/AN1/RB1 — Remappable peripheral I/O, analog input AN1, or GPIO RB1 |
| 핀 3 | RPB2/AN2/RB2 — Remappable peripheral I/O, analog input AN2, or GPIO RB2 |
| 핀 4 | RPB3/AN3/RB3 — Remappable peripheral I/O, analog input AN3, or GPIO RB3 |
| 핀 5 | VSS — Ground reference |
| 핀 6 | VDD — I/O supply voltage (3.3V nominal) |
| 핀 7 | RPB5/AN5/RB5 — Remappable peripheral I/O, analog input AN5, or GPIO RB5 |
| 핀 8 | RPB6/AN6/RB6 — Remappable peripheral I/O, analog input AN6, or GPIO RB6 |
| 핀 9 | RPB7/AN7/RB7 — Remappable peripheral I/O, analog input AN7, or GPIO RB7 |
| 핀 10 | RPC0/RC0 — GPIO RC0, remappable peripheral |
| 핀 11 | RPC1/RC1 — GPIO RC1, remappable peripheral |
| 핀 12 | RPC2/RC2 — GPIO RC2, remappable peripheral |
| 핀 13 | RPC3/RC3 — GPIO RC3, remappable peripheral |
| 핀 14 | VSS — Ground reference |
| 핀 15 | VDD — I/O supply voltage (3.3V nominal) |
| 핀 16 | RPC4/RC4 — GPIO RC4, remappable peripheral |
| 핀 17 | RPC5/RC5 — GPIO RC5, remappable peripheral |
| 핀 18 | RPC6/RC6 — GPIO RC6, remappable peripheral |
| 핀 19 | RPC7/RC7 — GPIO RC7, remappable peripheral |
| 핀 20 | VSS — Ground reference |
| 핀 21 | VDD — I/O supply voltage (3.3V nominal) |
| 핀 22 | RPC8/RC8 — GPIO RC8, remappable peripheral |
| 핀 23 | RPC9/RC9 — GPIO RC9, remappable peripheral |
| 핀 24 | RPB9/RB9 — GPIO RB9, remappable peripheral |
| 핀 25 | RPB10/RB10 — GPIO RB10, remappable peripheral |
| 핀 26 | RPB11/RB11 — GPIO RB11, remappable peripheral |
| 핀 27 | VSS — Ground reference |
| 핀 28 | VDD — I/O supply voltage (3.3V nominal) |
| 핀 29 | RPB12/RB12 — GPIO RB12, remappable peripheral |
| 핀 30 | RPB13/RB13 — GPIO RB13, remappable peripheral |
| 핀 31 | RPB14/RB14 — GPIO RB14, remappable peripheral |
| 핀 32 | RPB15/RB15 — GPIO RB15, remappable peripheral |
| 핀 33 | VSS — Ground reference |
| 핀 34 | VDD — I/O supply voltage (3.3V nominal) |
| 핀 35 | RPD0/RD0 — GPIO RD0, remappable peripheral |
| 핀 36 | RPD1/RD1 — GPIO RD1, remappable peripheral |
| 핀 37 | RPD2/RD2 — GPIO RD2, remappable peripheral |
| 핀 38 | RPD3/RD3 — GPIO RD3, remappable peripheral |
| 핀 39 | RPD4/RD4 — GPIO RD4, remappable peripheral |
| 핀 40 | RPD5/RD5 — GPIO RD5, remappable peripheral |
| 핀 41 | VSS — Ground reference |
| 핀 42 | VDD — I/O supply voltage (3.3V nominal) |
| 핀 43 | RPD6/RD6 — GPIO RD6, remappable peripheral |
| 핀 44 | RPD7/RD7 — GPIO RD7, remappable peripheral |
| 핀 45 | RPD8/RD8 — GPIO RD8, remappable peripheral |
| 핀 46 | RPD9/RD9 — GPIO RD9, remappable peripheral |
| 핀 47 | RPD10/RD10 — GPIO RD10, remappable peripheral |
| 핀 48 | RPD11/RD11 — GPIO RD11, remappable peripheral |
| 핀 49 | VSS — Ground reference |
| 핀 50 | VDD — I/O supply voltage (3.3V nominal) |
| 핀 51 | RPD12/RD12 — GPIO RD12, remappable peripheral |
| 핀 52 | RPD13/RD13 — GPIO RD13, remappable peripheral |
| 핀 53 | RPD14/RD14 — GPIO RD14, remappable peripheral |
| 핀 54 | RPD15/RD15 — GPIO RD15, remappable peripheral |
| 핀 55 | VSS — Ground reference |
| 핀 56 | VDD — I/O supply voltage (3.3V nominal) |
| 핀 57 | RPE0/RE0 — GPIO RE0, remappable peripheral |
| 핀 58 | RPE1/RE1 — GPIO RE1, remappable peripheral |
| 핀 59 | RPE2/RE2 — GPIO RE2, remappable peripheral |
| 핀 60 | RPE3/RE3 — GPIO RE3, remappable peripheral |
| 핀 61 | VSS — Ground reference |
| 핀 62 | VDD — I/O supply voltage (3.3V nominal) |
| 핀 63 | RPE4/RE4 — GPIO RE4, remappable peripheral |
| 핀 64 | RPE5/RE5 — GPIO RE5, remappable peripheral |
| 핀 65 | RPE6/RE6 — GPIO RE6, remappable peripheral |
| 핀 66 | RPE7/RE7 — GPIO RE7, remappable peripheral |
| 핀 67 | VSS — Ground reference |
| 핀 68 | VDD — I/O supply voltage (3.3V nominal) |
| 핀 69 | RPE8/RE8 — GPIO RE8, remappable peripheral |
| 핀 70 | RPE9/RE9 — GPIO RE9, remappable peripheral |
| 핀 71 | RPF0/RF0 — GPIO RF0, remappable peripheral |
| 핀 72 | RPF1/RF1 — GPIO RF1, remappable peripheral |
| 핀 73 | VSS — Ground reference |
| 핀 74 | VDD — I/O supply voltage (3.3V nominal) |
| 핀 75 | RPF2/RF2 — GPIO RF2, remappable peripheral |
| 핀 76 | RPF3/RF3 — GPIO RF3, remappable peripheral |
| 핀 77 | RPF4/RF4 — GPIO RF4, remappable peripheral |
| 핀 78 | RPF5/RF5 — GPIO RF5, remappable peripheral |
| 핀 79 | VSS — Ground reference |
| 핀 80 | VDD — I/O supply voltage (3.3V nominal) |
| 핀 81 | RPF6/RF6 — GPIO RF6, remappable peripheral |
| 핀 82 | RPF7/RF7 — GPIO RF7, remappable peripheral |
| 핀 83 | RPF8/RF8 — GPIO RF8, remappable peripheral |
| 핀 84 | RPF9/RF9 — GPIO RF9, remappable peripheral |
| 핀 85 | RPF10/RF10 — GPIO RF10, remappable peripheral |
| 핀 86 | RPF11/RF11 — GPIO RF11, remappable peripheral |
| 핀 87 | VSS — Ground reference |
| 핀 88 | VDD — I/O supply voltage (3.3V nominal) |
| 핀 89 | RPF12/RF12 — GPIO RF12, remappable peripheral |
| 핀 90 | RPF13/RF13 — GPIO RF13, remappable peripheral |
| 핀 91 | RPG0/RG0 — GPIO RG0, remappable peripheral |
| 핀 92 | RPG1/RG1 — GPIO RG1, remappable peripheral |
| 핀 93 | VSS — Ground reference |
| 핀 94 | VDD — I/O supply voltage (3.3V nominal) |
| 핀 95 | RPG2/RG2 — GPIO RG2, remappable peripheral |
| 핀 96 | RPG3/RG3 — GPIO RG3, remappable peripheral |
| 핀 97 | RPG4/RG4 — GPIO RG4, remappable peripheral |
| 핀 98 | RPG5/RG5 — GPIO RG5, remappable peripheral |
| 핀 99 | VSS — Ground reference |
| 핀 100 | VDD — I/O supply voltage (3.3V nominal) |
| 핀 101 | RPG6/RG6 — GPIO RG6, remappable peripheral |
| 핀 102 | RPG7/RG7 — GPIO RG7, remappable peripheral |
| 핀 103 | RPG8/RG8 — GPIO RG8, remappable peripheral |
| 핀 104 | RPG9/RG9 — GPIO RG9, remappable peripheral |
| 핀 105 | VSS — Ground reference |
| 핀 106 | VDD — I/O supply voltage (3.3V nominal) |
| 핀 107 | DDR2_DQ0 — DDR2 external memory data bit 0 |
| 핀 108 | DDR2_DQ1 — DDR2 external memory data bit 1 |
| 핀 109 | DDR2_DQ2 — DDR2 external memory data bit 2 |
| 핀 110 | DDR2_DQ3 — DDR2 external memory data bit 3 |
| 핀 111 | DDR2_DQ4 — DDR2 external memory data bit 4 |
| 핀 112 | DDR2_DQ5 — DDR2 external memory data bit 5 |
| 핀 113 | DDR2_DQ6 — DDR2 external memory data bit 6 |
| 핀 114 | DDR2_DQ7 — DDR2 external memory data bit 7 |
| 핀 115 | DDR2_DQ8 — DDR2 external memory data bit 8 |
| 핀 116 | DDR2_DQ9 — DDR2 external memory data bit 9 |
| 핀 117 | DDR2_DQ10 — DDR2 external memory data bit 10 |
| 핀 118 | DDR2_DQ11 — DDR2 external memory data bit 11 |
| 핀 119 | DDR2_DQ12 — DDR2 external memory data bit 12 |
| 핀 120 | DDR2_DQ13 — DDR2 external memory data bit 13 |
| 핀 121 | DDR2_DQ14 — DDR2 external memory data bit 14 |
| 핀 122 | DDR2_DQ15 — DDR2 external memory data bit 15 |
| 핀 123 | DDR2_DM — DDR2 data mask |
| 핀 124 | DDR2_DQS — DDR2 data strobe |
| 핀 125 | VSS — Ground reference |
| 핀 126 | VDD — I/O supply voltage (3.3V nominal) |
| 핀 127 | DDR2_A0 — DDR2 address bit 0 |
| 핀 128 | DDR2_A1 — DDR2 address bit 1 |
| 핀 129 | DDR2_A2 — DDR2 address bit 2 |
| 핀 130 | DDR2_A3 — DDR2 address bit 3 |
| 핀 131 | DDR2_A4 — DDR2 address bit 4 |
| 핀 132 | DDR2_A5 — DDR2 address bit 5 |
| 핀 133 | DDR2_A6 — DDR2 address bit 6 |
| 핀 134 | DDR2_A7 — DDR2 address bit 7 |
| 핀 135 | DDR2_A8 — DDR2 address bit 8 |
| 핀 136 | DDR2_A9 — DDR2 address bit 9 |
| 핀 137 | DDR2_A10 — DDR2 address bit 10 |
| 핀 138 | DDR2_A11 — DDR2 address bit 11 |
| 핀 139 | DDR2_A12 — DDR2 address bit 12 |
| 핀 140 | DDR2_BA0 — DDR2 bank address bit 0 |
| 핀 141 | DDR2_BA1 — DDR2 bank address bit 1 |
| 핀 142 | DDR2_BA2 — DDR2 bank address bit 2 |
| 핀 143 | DDR2_CLK_P — DDR2 differential clock positive |
| 핀 144 | DDR2_CLK_N — DDR2 differential clock negative |
| 핀 145 | DDR2_CKE — DDR2 clock enable |
| 핀 146 | DDR2_CS — DDR2 chip select |
| 핀 147 | DDR2_RAS — DDR2 row address strobe |
| 핀 148 | DDR2_CAS — DDR2 column address strobe |
| 핀 149 | DDR2_WE — DDR2 write enable |
| 핀 150 | VSS — Ground reference |
| 핀 151 | VDD — I/O supply voltage (3.3V nominal) |
| 핀 152 | LCD_DATA0 — LCD parallel data bit 0 |
| 핀 153 | LCD_DATA1 — LCD parallel data bit 1 |
| 핀 154 | LCD_DATA2 — LCD parallel data bit 2 |
| 핀 155 | LCD_DATA3 — LCD parallel data bit 3 |
| 핀 156 | LCD_DATA4 — LCD parallel data bit 4 |
| 핀 157 | LCD_DATA5 — LCD parallel data bit 5 |
| 핀 158 | LCD_DATA6 — LCD parallel data bit 6 |
| 핀 159 | LCD_DATA7 — LCD parallel data bit 7 |
| 핀 160 | LCD_DATA8 — LCD parallel data bit 8 |
| 핀 161 | LCD_DATA9 — LCD parallel data bit 9 |
| 핀 162 | LCD_DATA10 — LCD parallel data bit 10 |
| 핀 163 | LCD_DATA11 — LCD parallel data bit 11 |
| 핀 164 | LCD_DATA12 — LCD parallel data bit 12 |
| 핀 165 | LCD_DATA13 — LCD parallel data bit 13 |
| 핀 166 | LCD_DATA14 — LCD parallel data bit 14 |
| 핀 167 | LCD_DATA15 — LCD parallel data bit 15 |
| 핀 168 | LCD_PCLK — LCD pixel clock |
| 핀 169 | LCD_HSYNC — LCD horizontal sync |
| 핀 170 | LCD_VSYNC — LCD vertical sync |
| 핀 171 | LCD_DE — LCD data enable |
| 핀 172 | LCD_DISP — LCD display enable backlight control |
| 핀 173 | VDD — I/O supply voltage (3.3V nominal) |
| 핀 174 | USB_DM — USB High-Speed data minus |
| 핀 175 | USB_DP — USB High-Speed data plus |
| 핀 176 | VDD_CORE — 1.8V core supply voltage |
일반적인 애플리케이션
PIC32MZ2064DAG176-I/2J 적합 용도: 6 애플리케이션s: Industrial HMI Touch Panels, Automotive Instrument Clusters, Medical Patient Monitoring Displays, Point-of-Sale (POS) Terminals, Smart Home Control Panels, IoT Gateways with Local Display.
Industrial HMI Touch Panels
The PIC32MZ2064DAG176-I/2J's integrated 2D GPU, LCD controller, and DDR2 external memory interface make it ideal for industrial HMI panels with WVGA-resolution touchscreens. The 200 MHz microAptiv core delivers 330 DMIPS, sufficient to drive a graphical UI stack (Microchip's MPLAB Harmony) while simultaneously handling Modbus TCP, EtherNet/IP, and SD card logging. The 2 MB dual-panel Flash supports OTA firmware updates critical for factory automation equipment. Place a 32 MB or 128 MB DDR2 SDRAM externally to back large UI framebuffers; the integrated GPU offloads drawing primitives, freeing the CPU for real-time control loops.
추천
Automotive Instrument Clusters
The PIC32MZ2064DAG176-I/2J is well-suited for two-wheel and entry-level automotive instrument clusters where it provides a CAN interface for vehicle bus messaging, a high-speed ADC for analog sensor reading, and the integrated GPU to render gauge animations on a color TFT. The 200 MHz core processes multiple CAN messages per frame at 1 Mbit/s while drawing tachometer and speedometer graphics. The 640 KB SRAM allows double-buffered display lists without external memory in simpler clusters. Industrial -40C to +85C temperature range covers cabin-mounted applications, though AEC-Q100 qualification is not present on this variant.
추천
Medical Patient Monitoring Displays
The PIC32MZ2064DAG176-I/2J powers graphical patient monitors that display ECG, SpO2, and respiration waveforms on color LCDs. The 12-bit 18 MSPS 45-channel ADC acquires multiple sensor channels simultaneously, while the integrated GPU renders scrolling waveforms in real time. The DDR2 interface supports framebuffers for SVGA and WVGA resolutions, and the 2 MB Flash stores waveform libraries and UI assets. The MMU supports Micrium OS or FreeRTOS for deterministic medical-grade scheduling. The device is intended for non-life-support equipment such as fitness and wellness devices.
추천
Point-of-Sale (POS) Terminals
The PIC32MZ2064DAG176-I/2J supports graphical POS terminals that combine a touchscreen UI, USB-HS for barcode scanners and receipt printers, Ethernet for payment gateway communication, and SD card storage for transaction logs. The 200 MHz core handles encrypted payment protocol stacks while the GPU renders touch-friendly button layouts. The 640 KB SRAM accommodates TLS session buffers, and the 2 MB dual-panel Flash enables secure boot and signed firmware updates required by PCI-PTS specifications. CAN support also enables integration with cash drawer peripherals.
추천
Smart Home Control Panels
The PIC32MZ2064DAG176-I/2J drives wall-mounted smart home control panels with capacitive touchscreens, providing the integrated GPU and LCD controller for smooth UI animations, the Ethernet MAC for connection to home routers, and the SD card host for local media playback or log storage. The 2 MB Flash supports multi-protocol home automation stacks (Zigbee gateway software, Matter bridges, MQTT brokers), and the DDR2 interface supports large icon libraries. Wi-Fi is added via an external module on SPI/UART, keeping the BOM compact.
추천
IoT Gateways with Local Display
The PIC32MZ2064DAG176-I/2J serves as a graphical IoT gateway that aggregates sensor data over Ethernet, CAN, or USB and presents status dashboards on a local LCD. The 200 MHz core runs lightweight MQTT brokers and edge analytics, while the 12-bit ADC reads analog sensor channels directly. The integrated GPU renders gauge and chart widgets on a 4.3- to 7-inch color TFT, removing the need for a separate HMI processor. The MMU enables FreeRTOS+TCP for managed networking stacks in industrial IoT deployments.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ2064DAG176-I/2J — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ2064DAR176 | PIC32MZ2064DAA176-I/2J | PIC32MZ2064DAB176T-I/2J |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP (20x20) | 176-LQFP (20x20) | 176-LQFP (20x20) | 176-LQFP (20x20) |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 2 MB dual-panel | 2 MB dual-panel | 2 MB dual-panel | 2 MB dual-panel |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB |
| Integrated GPU | Yes (2D GPU + LCD controller) | Yes (2D GPU + LCD controller) | Yes (2D GPU + LCD controller) | No (software rendering only) |
| DDR2 Controller | Yes (up to 128 MB external) | Yes (up to 128 MB external) | Yes (up to 128 MB external) | Yes (up to 128 MB external) |
| Recommended for New Designs | Limited - Microchip suggests DAR176 | Yes (Microchip-recommended successor) | Yes | Yes |
주요 차별점
- Microchip-recommended successor available with same footprint (vs PIC32MZ2064DAR176)
- Lower-cost same-package variant available without GPU (vs PIC32MZ2064DAB176T-I/2J)
- A-suffix variant with simplified peripheral set (vs PIC32MZ2064DAA176-I/2J)
설계 노트
The DDR2 interface requires controlled-impedance routing (typically 50 ohms single-ended, 100 ohms differential for clock/DQS pairs) and strict length matching per JEDEC DDR2 specifications. The exposed thermal pad on the 176-LQFP must be soldered to a copper pour connected to ground for thermal dissipation. Place a 1.8V LDO close to the VDD_CORE pin and bulk-decouple every VDD rail with at least 1uF ceramic + 100nF ceramic in parallel.
The PIC32MZ DA family uses a split-supply architecture: 1.8V for the core and 3.3V for I/O. Both rails must be sequenced with the 3.3V rail coming up first or simultaneously with the 1.8V core rail. Inrush current during Flash programming can exceed 100 mA, so the 3.3V regulator must be sized accordingly. Use a low-noise LDO for the core rail to avoid coupling switching noise into the ADC measurements.
Pin multiplexing on the 176-LQFP is extensive; failing to assign peripherals via the PPS (Peripheral Pin Select) module before code generation will result in non-functional peripherals. The dual-panel Flash requires the BOOT Flash row swap mechanism to be configured correctly for OTA updates - failing this will leave the device unable to recover from a corrupted panel. Always enable JTAG/SWD access during development in case of locked devices.
규정 준수 정보
RoHS compliant per Microchip product page. Industrial temperature grade -40C to +85C. AEC-Q100 not qualified - this part is not intended for automotive safety-critical applications. The -I suffix denotes industrial temperature grade.
