R7F7016844AFP-C#BA1 - 32-bit 120MHz 3MB Flash Automotive MCU | Renesas
부품 번호: R7F7016844AFP-C#BA1 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12.68 | $12.68 |
| 10 | $11.8 | $118.00 |
| 100 | $10.9 | $1,090.00 |
| 500 | $9.95 | $4,975.00 |
| 1,000 | $9.2 | $9,200.00 |
R7F7016844AFP-C#BA1 개요
A microcontroller (MCU) is a single-chip integrated circuit that combines a processor core, memory, and peripherals into one device, forming the lowest tier of embedded processing hierarchy: MCU -> embedded processor -> application processor -> semiconductor. The RH850/F1KM-S1 group is a member of the RH850/F1x series, which Renesas designed specifically for automotive electrical body applications such as body control modules, chassis systems, and gateway nodes.
Key features of this device include the 120 MHz RH850G3KH single-core CPU, 3 MB (3M x 8) on-chip flash memory for code storage, an integrated CAN FD interface for modern in-vehicle networking, and low power consumption typical of the F1KM family. Package options across the F1KM-S1 series span 48 to 100 pins, with flash densities from 512 KB to 3 MB, allowing designers to scale a single design across multiple cost tiers.
The RH850 architecture provides automotive-grade functional safety support, and the AEC-Q100 qualification ensures reliability over the automotive temperature range. The CAN FD peripheral enables higher data throughput than classical CAN while preserving backward compatibility with existing vehicle networks.
Typical applications include automotive body control units, chassis control units, door modules, lighting control, and driver assistance support nodes. The combination of 3 MB flash and CAN FD makes this part suitable for software-rich body domain controllers.
Design consideration: verify the exact flash density and option-byte suffix (#BA1 vs #AA1) against the Renesas datasheet before layout, as family members share the same footprint but differ in memory.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: R7F7016844AFP-C#BA1 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
R7F7016844AFP-C#AA1
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
R7F7016843AFP-C#BA1
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
R7F7016842AFP-C#BA1
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
R7F7016844AFP-C#BK1
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
R7F7016844AFP-C#BA1 최대 정격 & 전기적 특성
| Core Processor | RH850G3KH |
| Core Size | 32-Bit Single-Core |
| 최대 클록 주파수 | 120 MHz |
| Flash Memory | 3 MB (3M x 8) |
| 패키지 | 100-LFQFP (14 x 14 mm) |
| 실장 유형 | Surface Mount |
| Connectivity | CAN FD |
| Product Family | RH850/F1KM-S1 (RH850/F1x series) |
| Qualification | AEC-Q100 |
| Application Segment | Automotive |
| Series Flash Range (family) | 512 KB to 3 MB |
| Series Package Range (family) | 48 to 100 pins |
R7F7016844AFP-C#BA1 48 to 100 pins 핀 구성 가이드
R7F7016844AFP-C#BA1(48 to 100 pins 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: R7F7016844AFP-C#BA1.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
R7F7016844AFP-C#BA1 적합 용도: 6 애플리케이션s: Automotive Body Control Modules, Chassis Control Units, Driver Assistance Support Nodes, Door and Lighting Modules, In-Vehicle Network Gateways (Body Segment), Industrial Control with Functional Reliability Requirements.
Automotive Body Control Modules
The R7F7016844AFP-C#BA1 fits body control modules (BCM) because its 120 MHz RH850G3KH single core and 3 MB flash provide enough compute and code headroom for lamp control, wiper logic, seat, and mirror management in a single chip. The integrated CAN FD interface bridges legacy 500 kbps classical CAN segments with newer CAN FD backbones at up to several Mbps, allowing one BCM to serve mixed-vintage vehicle platforms. Used as the central body ECU, it handles network management, sleep/wake sequencing, and diagnostic services (UDS) while the low-power design of the F1KM-S1 family keeps key-off current draw low. A typical deployment pairs the MCU with external CAN FD transceivers and a low-dropout regulator sized for cranking transients, delivering a compact, cost-optimized body electronics platform.
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Chassis Control Units
Chassis ECUs such as suspension, steering-support, and brake-related auxiliary nodes benefit from this MCU's deterministic 120 MHz execution, AEC-Q100 qualification, and generous 3 MB flash for control algorithms plus fault-logging software. The RH850 architecture is designed for automotive electrical applications where predictable interrupt latency matters for closed-loop control. The CAN FD interface enables faster parameter streaming with chassis gateways than classical CAN, reducing bus load in feature-rich vehicles. In practice, the MCU reads sensor inputs (position, pressure), drives H-bridge or valve-driver outputs through pre-drivers, and participates in functional-safety communication with watchdog supervision. Designers should confirm the exact peripheral set (ADC resolution, PWM channels) in the RH850/F1KM-S1 hardware manual against their actuator interface requirements before finalizing the architecture.
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Driver Assistance Support Nodes
While not an ADAS vision processor, this MCU serves ADAS-adjacent body functions: camera cleaning, sensor heating, mirror actuators, and domain-gateway auxiliary control. The 3 MB flash accommodates diagnostic stacks and OTA-update bootloaders alongside application code, and the 100-pin LFQFP provides the GPIO density to interface multiple sensors and actuators. Xecor's listing explicitly identifies the device for body control units, chassis control units, and driver assistance systems. The CAN FD link at 120 MHz core speed allows timely relaying of ADAS network messages. Design consideration: ADAS support nodes often need functional-safety monitoring; verify the F1KM-S1 safety features (WDT, clock monitoring) documented by Renesas cover the required integrity level, and add external supervision ICs where the application demands higher ASIL capability.
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Door and Lighting Modules
Door modules (locks, windows, mirror fold) and adaptive lighting ECUs match this part's profile: dozens of GPIO and PWM channels in the 100-pin LFQFP, 3 MB flash for feature-rich firmware, and CAN/CAN FD connectivity to the body domain controller. The 120 MHz core drives soft-start PWM for LED headlamps and window motor profiling with current monitoring. Low quiescent consumption supports key-off operation where the module must wake on LIN or CAN messages. A common architecture pairs the F1KM-S1 MCU with LIN transceivers for per-door local networks and high-side switches for loads. Design tip: budget flash for calibration tables and end-of-line test firmware in the 3 MB space - door module software with diagnostics typically consumes well under this ceiling, leaving room for future feature growth without a hardware respin.
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In-Vehicle Network Gateways (Body Segment)
Segment gateways that translate between CAN FD backbones and classical CAN or LIN sub-buses can use this MCU's CAN FD controller and processing margin. The 120 MHz RH850G3KH core handles message filtering, routing tables, and network management traffic that would saturate smaller 80 MHz-class MCUs, while 3 MB flash hosts diagnostic services and cybersecurity stacks growing mandatory in modern vehicles. The F1KM-S1 family spans 512 KB to 3 MB and 48 to 100 pins, so a single board design can be scaled by re-populating memory grades for different vehicle trims. For high-bandwidth cross-domain gateways (Ethernet included), choose Renesas' dedicated RH850 gateway families instead; this part is best for body-segment gateway duties. Confirm CAN FD RAM buffering requirements in the hardware manual for your bus-load targets.
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Industrial Control with Functional Reliability Requirements
Although designed for automotive, the R7F7016844AFP-C#BA1 is usable in harsh industrial nodes - HVAC controllers, pump monitoring, and motor-support logic - where AEC-Q100 qualification signals robustness beyond consumer grade. The 32-bit 120 MHz core and 3 MB flash support protocol stacks (CANopen over CAN FD) and feature-rich control loops, while the 100-LFQFP 14 x 14 mm footprint suits standard industrial PCB processes. Industrial adopters gain supply-chain diversity: automotive-qualified parts often have deeper second-source stocking than industrial-only MCUs. Caveats: the peripheral set is automotive-oriented (LIN-oriented tooling, no industrial-specific safety certified timers), so validate that the ADC, PWM, and communication peripherals in the RH850/F1KM-S1 hardware manual meet the application requirement before committing, and verify extended-temperature availability for the selected option-byte grade.
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추천 제품 요약
엔지니어링 참조 데이터: R7F7016844AFP-C#BA1 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | R7F7016844AFP-C#AA1 | R7F7016843AFP-C#BA1 | R7F7016842AFP-C#BA1 |
|---|---|---|---|---|
| Package | 100-LFQFP (14x14 mm) | 100-LFQFP (14x14 mm) - same | 100-LFQFP (14x14 mm) - same | 100-LFQFP (14x14 mm) - same |
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Core / Frequency | RH850G3KH, 120 MHz | RH850G3KH, 120 MHz | RH850G3KH, 120 MHz | RH850G3KH, 120 MHz |
| Connectivity | CAN FD | CAN FD | CAN FD | CAN FD |
| Qualification | AEC-Q100, Automotive | AEC-Q100, Automotive | AEC-Q100, Automotive | AEC-Q100, Automotive |
| Family Flash Range | 512 KB to 3 MB (F1KM-S1) | 512 KB to 3 MB (F1KM-S1) | 512 KB to 3 MB (F1KM-S1) | 512 KB to 3 MB (F1KM-S1) |
주요 차별점
- Largest flash step in the F1KM-S1 family footprint (vs R7F7016843AFP-C#BA1)
- 120 MHz operation in a cost-optimized single-core family (vs R7F7016842AFP-C#BA1)
- Trade-off: no cross-brand drop-in exists (vs NXP/Infineon automotive MCUs)
설계 노트
Confirm the option-byte suffix before committing a purchase order. Within the RH850/F1KM-S1 family the same base number R7F7016844AFP-C appears with different suffixes (#AA1, #BA1, etc.) denoting flash grade and configuration; distributor listings even show the same MPN quoted with 1 MB and 3 MB flash in different catalogs. Read Renesas' ordering-information table in the hardware manual and match the exact suffix to your flash requirement - substituting suffixes can cause firmware overflow at programming time.
Automotive MCUs require supply design that survives cranking transients (ISO 16750-style load dump) even though the exact test conditions are not restated in this data. Use an automotive-qualified LDO or buck pre-regulator ahead of the MCU supply, place bulk and 0.1 uF/1 uF ceramic decoupling at all VDD/VSS pairs of the 100-LFQFP, and follow the Renesas hardware manual's power sequencing and A/D reference decoupling guidance. Estimated: budget decoupling of one 0.1 uF plus one bulk capacitor per supply pin pair as a baseline.
The 100-pin LFQFP (14 x 14 mm, 0.5 mm pitch) is hand-solderable but wave/reflow sensitive to warpage; specify an IPC-compatible land pattern from the Renesas package outline drawing rather than generic QFP footprints. Route the CAN FD pair as 120-ohm differential impedance with a common-mode choke near the transceiver, and keep the crystal traces short with guard ground. Expose adequate thermal relief on power pins; the LFQFP has no exposed pad, so all heat exits through leads.
CAN FD bit timing scales with the 120 MHz clock domain; derive the CAN FD bit-rate prescalers from the actual peripheral clock, not nominal system frequency, and validate with sample-point calculations for your bus length (e.g., 2 Mbps FD data phase needs tighter sample-point budgeting than 500 kbps arbitration). Follow the Renesas F1KM-S1 hardware manual's I/O multiplexing tables, since 100-pin LFQFP pins are heavily multiplexed and a wrong peripheral assignment can silently disconnect a CAN or PWM function.
규정 준수 정보
AEC-Q100 automotive qualification explicitly stated in DigiKey and datasheet-directory listings. RoHS/REACH/lead-free status not stated in provided web data - confirm via Renesas product page compliance documents.
