RTAX2000D-CQ352V - 2M-Gate Rad-Tolerant FPGA CQFP352 | Microchip
부품 번호: RTAX2000D-CQ352V ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3200 | $3,200.00 |
| 10 | $3040 | $30,400.00 |
| 100 | $2880 | $288,000.00 |
| 500 | $2720 | $1,360,000.00 |
| 1,000 | $2560 | $2,560,000.00 |
RTAX2000D-CQ352V 개요
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the ionizing radiation environment of space, where total ionizing dose (TID) and single-event effects would degrade or destroy commercial silicon. Within the semiconductor hierarchy, the RTAX2000D-CQ352V belongs to the RTAX-S/SL and RTAX-DSP family of rad-tolerant FPGAs, derived from the commercial Axcelerator architecture, and sits in the broader category of programmable logic devices (PLDs) alongside CPLDs and structured ASICs.
Key features include one-time-programmable antifuse configuration, which is inherently immune to configuration memory upsets caused by single-event effects; a nominal 1.5V core supply (1.425V to 1.575V range); and embedded SRAM blocks with built-in FIFO control logic for on-chip data buffering. The 'D' designation denotes the die lot, and the 'V' suffix indicates the qualification screening flow applied at final test.
Architecturally, the device uses segmentable clock resources and chip-wide highway routing to distribute high-speed clocks and wide buses with low skew, supporting system-level integration typical of space-flight payload and platform electronics.
Typical applications include satellite payload data processing, spacecraft bus control electronics, telemetry and telecommand interfaces, and radiation-hardened signal processing chains where reprogrammable SRAM FPGAs are unacceptable due to upset sensitivity.
A key design consideration is that antifuse FPGAs cannot be reprogrammed after programming; design flows therefore rely on the footprint-compatible prototyping methodology using adaptor boards (such as the Aldec ACT-H3Ki-CQ352) before committing flight hardware.
This page synthesizes distributor listings, family cross-references, and drop-in alternative data not consolidated in the manufacturer datasheet.
드롭인 대체품: RTAX2000D-CQ352V — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: RTAX2000D-CQ352V (동일 폼 팩터 및 풋프린트) — 차이점: Package, Technology, Configuration, Equivalent System Gates, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
RTAX2000D-1CQ352V
✅ 드롭인✓ 재고 있음
$3950 / 개
데이터시트 보기 →RTAX2000DL-CQ352V
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →RTAX2000DL-1CQ352V
✅ 드롭인✓ 재고 있음
$2950 / 개
데이터시트 보기 →RTAX2000S-1CQ352V
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →RTAX4000D-CQ352V
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →RTAX2000D-CQ352V 최대 정격 & 전기적 특성
| Family | RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs |
| Equivalent System Gates | 2,000,000 |
| Logic Cells | 29,568 |
| Configurable Logic Blocks (CLBs) | 19,712 |
| User I/O - Inputs | 166 |
| User I/O - Outputs | 166 |
| Supply Voltage (Core) | 1.425 V to 1.575 V (nominal 1.5 V) |
| Technology | CMOS, antifuse one-time programmable |
| 패키지 | CQFP352 ceramic quad flat pack |
| Terminal Pitch | 0.500 mm |
| 실장 유형 | Surface Mount |
| Configuration | One-time programmable (antifuse) |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Radiation Tolerance | Radiation-tolerant (space-flight applications) |
| Application Domain | Space-flight systems |
| Commercial Baseline Family | Actel/Microsemi Axcelerator |
RTAX2000D-CQ352V cqfp352 ceramic quad flat pack 핀 구성 가이드
RTAX2000D-CQ352V(cqfp352 ceramic quad flat pack 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: RTAX2000D-CQ352V.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
RTAX2000D-CQ352V 적합 용도: 6 애플리케이션s: Satellite Payload Data Processing, Spacecraft Bus Control Electronics, Telemetry and Telecommand Interfaces, Radiation-Hardened Signal Processing Chains, Launch Vehicle and Avionics Electronics, Prototyping and Flight Development Methodology.
Satellite Payload Data Processing
The RTAX2000D-CQ352V is a strong fit for satellite payload data processing because its 2,000,000 equivalent gates and 29,568 logic cells provide enough capacity for channelized digital signal processing, framing, and packetization, while its antifuse configuration is immune to the single-event configuration upsets that plague SRAM-based FPGAs in orbit. The embedded SRAM with built-in FIFO control logic buffers high-rate sensor data between acquisition front ends and downlink chains without external memory. In a typical topology, the FPGA sits between ADCs or receivers and the telemetry formatter, clocked by segmentable on-chip clock resources with low skew. The quantified benefit is zero configuration-rescrubbing overhead, freeing spacecraft computing margin, at the trade-off that the bitstream cannot be updated after launch.
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Spacecraft Bus Control Electronics
For spacecraft bus control - attitude determination, power switching supervision, and mode management - the RTAX2000D-CQ352V fits because it combines 19,712 CLBs of glue logic and sequencer capacity with 166 inputs and 166 outputs in a single ceramic CQFP352, consolidating functions that would otherwise require multiple rad-hard ASICs or discrete logic. The nominal 1.5V core (1.425V to 1.575V) matches modern low-power board rails, reducing dissipation in thermally constrained avionics boxes. The device is placed between the onboard computer and distributed subsystem interfaces, implementing command decoders and health-monitoring registers. Because configuration is OTP antifuse, control behavior is fixed and deterministic at power-up - critical for safe-mode logic - and the total dose performance of the RTAX family supports multi-year LEO and GEO mission profiles.
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Telemetry and Telecommand Interfaces
The RTAX2000D-CQ352V suits telemetry/telecommand (TM/TC) interface boards because chip-wide highway routing distributes wide data buses across the 2M-gate fabric with controlled skew, and the abundant user I/O (166 inputs plus 166 outputs) accommodates parallel bus formats, discrete discretes, and redundant command channels in one CQFP352 device. Antifuse one-time programming guarantees the TM/TC framing logic cannot be corrupted by single-event effects - a failure mode that would otherwise demand continuous configuration memory scrubbing in SRAM FPGAs. In the signal chain, the FPGA typically bridges the transponder baseband section and the OBC, implementing CCSDS framing, time-tagging, and majority-voting for command validity. Designers should note the OTP trade-off: any protocol change after flight-lot programming requires new devices, so interface standards should be frozen early.
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Radiation-Hardened Signal Processing Chains
Digital filtering, FFT, and correlation stages in space instruments benefit from the RTAX2000D-CQ352V's 29,568 logic cells and embedded SRAM FIFO blocks, which implement pipelined multiply-accumulate datapaths without external memory latency. As part of the RTAX-DSP family, the die is derived from the high-performance commercial Axcelerator architecture, so clock rates suitable for baseband processing are achievable while retaining radiation tolerance. The part typically sits after an ADC in an instrument's digital back end, with segmentable clocks isolating the fast datapath domain from slower control logic. A quantified benefit versus SRAM FPGAs is the elimination of SEU-induced datapath reconfiguration; bit errors are confined to flip-flops that can be protected with triple-modular redundancy in the netlist. Board prototyping is done on footprint-compatible adaptor boards before committing flight units.
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Launch Vehicle and Avionics Electronics
Launch vehicle sequencers and avionics interface units use the RTAX2000D-CQ352V where deterministic, power-up-correct behavior is non-negotiable: antifuse configuration means the logic is active immediately at power application with no configuration load time, unlike SRAM FPGAs that need hundreds of milliseconds and external configuration storage. The CQFP352 ceramic package with 0.500 mm lead pitch withstands the mechanical environments of launch, and the RTAX family's radiation-tolerant processing addresses the elevated radiation environment above the atmosphere. In the system, the FPGA implements event sequencers, safe-and-arm interface logic, and redundant sensor voting across its 166/166 I/O. The design trade-off is that qualification flow ('V' screening suffix) and lot traceability must match the program's parts, stress, and screening requirements, so ordering codes should be coordinated with the reliability engineer early.
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Prototyping and Flight Development Methodology
Because the RTAX2000D-CQ352V is one-time programmable, Microchip's recommended methodology - described in the application note Prototyping for RTAX-S and RTAX-SL Devices - uses a footprint-compatible adaptor board and an EDIF netlist and pinout converter for easy migration between prototype and flight silicon. The Aldec ACT-H3Ki-CQ352 adaptor provides power supply and footprint compatibility with the RTAX chip in the CQ352 site, powered either through the CQ352 leads or an onboard connector, with JTAG programming on board. This lets teams iterate logic in SRAM-based emulation silicon on the exact flight PCB footprint, then commit antifuse flight devices with unchanged pinout files. The quantified benefit is elimination of PCB respins during logic debug; the risk mitigated is burning expensive, screened flight parts during trial programming.
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추천 제품 요약
엔지니어링 참조 데이터: RTAX2000D-CQ352V — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | RTAX2000D-1CQ352V | RTAX2000DL-CQ352V | RTAX2000DL-1CQ352V | RTAX2000S-1CQ352V | RTAX4000D-CQ352V |
|---|---|---|---|---|---|---|
| Package | CQFP352 | CQFP352 - same | CQFP352 - same | CQFP352 - same | CQFP352 - same | CQFP352 - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent System Gates | 2,000,000 | 2,000,000 | 2,000,000 | 2,000,000 | 2,000,000 | 4,000,000 |
| Speed Grade | Standard | -1 (faster) | Standard | -1 (faster) | -1 (faster) | Standard |
| Supply Voltage (Core) | 1.425 V to 1.575 V (nominal 1.5 V) | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Screening Flow | D (standard RTAX-D ICCA limits) | D, -1 speed | DL (tighter ICCA at 125C) | DL (tighter ICCA at 125C) | S (RTAX-S flow) | D (standard RTAX-D ICCA limits) |
| Configuration Technology | Antifuse OTP | Antifuse OTP | Antifuse OTP | Antifuse OTP | Antifuse OTP | Antifuse OTP |
주요 차별점
- Standard speed grade maximizes timing margin headroom vs -1 parts costing more (vs RTAX2000D-1CQ352V)
- DL-screened variants offer tighter ICCA current limits for flight programs (vs RTAX2000DL-CQ352V)
- Same CQFP352 footprint scales to 4M gates without PCB redesign (vs RTAX4000D-CQ352V)
설계 노트
The RTAX2000D-CQ352V is one-time programmable. Once programmed, the antifuse configuration cannot be erased or modified - a design error means scrapping a flight-grade device. Follow Microchip's recommended methodology from the application note Prototyping for RTAX-S and RTAX-SL Devices: validate logic on a footprint-compatible adaptor board (e.g., Aldec ACT-H3Ki-CQ352) using an EDIF netlist and pinout converter before programming antifuse flight units. Freeze the netlist, pin assignment, and timing constraints, then run a formal review before committing any flight lot.
Plan the power distribution around the 1.5V nominal core supply, which must stay within 1.425V to 1.575V under all load and radiation conditions. Include I/O bank supply rails per the family datasheet banking rules. Because per the Microchip datasheet RTAX-D and RTAX-DL devices are distinguished by ICCA current limits at 125C final electrical test, budgets for programs using DL screening should use the tighter characterized current figures; allow margin in the power supply sizing for temperature-dependent standby current variation across the screening population.
The CQFP352 has a 0.500 mm terminal pitch with leads on all four sides - inspect land pattern fidelity carefully and use X-ray or AOI after reflow or solder-column attachment. Note that per the datasheet, only QA electrical and mechanical visual inspection is performed after solder column attachment on some assembly flows, so incoming inspection of the ceramic package and careful solder profile control are the designer's responsibility. Provide thermal relief through the ceramic package and PCB; verify the operating junction limits from the family datasheet thermal tables for your specific enclosure.
규정 준수 정보
Ceramic CQFP hermetic aerospace package; formal RoHS/REACH status not stated in the provided distributor data. Space-flight parts often use special screening flows where consumer compliance declarations do not apply - confirm with Microchip for the specific order code.
