RTS5766DL - PCIe Gen3x4 NVMe 1.4 SSD Controller | Realtek
부품 번호: RTS5766DL ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.2 | $4.20 |
| 10 | $3.85 | $38.50 |
| 100 | $3.4 | $340.00 |
| 500 | $2.95 | $1,475.00 |
| 1,000 | $2.55 | $2,550.00 |
| 3,000 | $2.2 | $6,600.00 |
RTS5766DL 개요
Background Knowledge: An SSD controller is the central processing unit of a solid-state drive that manages the NAND flash interface, host interface (PCIe/NVMe/SATA), wear leveling, garbage collection, error correction (ECC), and bad-block management. Within the storage hierarchy, an SSD controller sits between the host system and the raw NAND flash media. The RTS5766DL is specifically a DRAM-less PCIe NVMe controller, meaning it uses a portion of the host system memory (HMB - Host Memory Buffer) instead of an on-board DRAM cache to hold the flash translation layer (FTL) mapping table, reducing BOM cost and PCB complexity versus DRAM-equipped controllers.
Key features include PCIe Gen3 x4 host interface (4 GB/s peak bandwidth), NVMe 1.4 protocol support, DRAM-less architecture with HMB support, 4-channel NAND flash controller, 2K LDPC (Low-Density Parity-Check) error correction, and support for up to 1200 MT/s NAND interface speed. The controller supports both TLC and QLC (including pQLC/PLC) NAND flash, making it compatible with mainstream 128-layer and 192-layer 3D NAND.
The architecture combines a hardware-accelerated NVMe command processor with a multi-core RISC engine for flash management. The 2K LDPC engine provides robust error correction that extends NAND endurance and enables reliable operation with high-density 3D NAND including 192-layer pQLC. The DRAM-less HMB mode uses up to 64 MB of system DRAM for the FTL mapping table, trading peak random IOPS for lower BOM cost and lower power consumption.
Typical applications include mainstream consumer M.2 NVMe SSDs (M.2 2280 form factor), entry-level PCIe 3.0 SSDs targeting SATA-replacement segments, OEM and retail SSDs for budget gaming and productivity builds, and embedded storage in mini-PCs and industrial platforms where BOM cost is critical.
Design consideration: When designing an SSD around this controller, NAND channel balancing and CE (chip enable) count distribution across the four channels directly impacts sequential and random performance. Thermal management is essential - sustained writes without a heatsink may throttle the controller, especially in M.2 2280 form factors with limited airflow.
This page synthesizes Realtek RTS5766DL specifications, drop-in alternative controllers, application use cases and design notes beyond the data found in the raw datasheet PDF.
드롭인 대체품: RTS5766DL — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: RTS5766DL (동일 폼 팩터 및 풋프린트) — 차이점: Host Interface, NAND Type Support, Package, Product Type, Compliance.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청RTS5766DL 사양
| Product Type | PCIe Gen3 x4 NVMe 1.4 SSD Controller |
| Manufacturer | Realtek |
| Host Interface | PCIe 3.0 x4 (NVMe 1.4) |
| DRAM Support | DRAM-less (HMB / Host Memory Buffer) |
| NAND Channels | 4 channels |
| NAND Interface Speed | Up to 1200 MT/s |
| Error Correction | 2K LDPC (Low-Density Parity-Check) |
| NAND Type Support | TLC, QLC, pQLC/PLC 3D NAND |
| 패키지 | BGA-252 (11 x 11 mm, 0.65 mm pitch) |
| PCI-SIG Vendor ID | 0x10EC (Realtek) |
| 실장 유형 | Surface Mount (BGA) |
| Operating Mode | Mainstream consumer NVMe SSD |
| Compliance | NVMe 1.4, PCI-SIG PCIe 3.0, RoHS |
| Used In SSDs | ADATA Legend 710, Netac NV3000 |
| Form Factor Target | M.2 2280 SSD |
RTS5766DL bga-252 (11 x 11 mm, 0.65 mm pitch) 핀 구성 가이드
RTS5766DL(bga-252 (11 x 11 mm, 0.65 mm pitch) 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: RTS5766DL.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
RTS5766DL 적합 용도: 6 애플리케이션s: Mainstream Consumer M.2 NVMe SSDs, Cost-Optimized SATA-Replacement NVMe Drives, Entry Gaming and Productivity SSDs, Industrial and Embedded M.2 Storage, PCIe 3.0 NVMe Enablement Boards, Low-Power Mobile Storage Modules.
Mainstream Consumer M.2 NVMe SSDs
The RTS5766DL fits mainstream consumer M.2 2280 NVMe SSDs because of its PCIe 3.0 x4 host interface (3.5 GB/s practical sequential throughput) and DRAM-less HMB architecture, which slashes BOM cost by removing the external SDRAM chip used in higher-end controllers. A typical reference design pairs the RTS5766DL with 128-layer or 192-layer TLC/QLC NAND across four CE-balanced channels. ADATA's Legend 710 SSD uses this exact controller + pQLC pairing to hit consumer-segment price targets while delivering far better sequential read latency than SATA SSDs.
추천
Cost-Optimized SATA-Replacement NVMe Drives
OEMs building NVMe SSDs to replace 2.5" SATA SSDs in desktop and laptop refresh cycles benefit from the RTS5766DL's DRAM-less architecture because the controller's HMB mode uses 64 MB of host DRAM for the FTL mapping table, eliminating the need for a 256 MB to 1 GB SDRAM chip plus its associated PCB routing. This reduces bill-of-materials cost by roughly USD 1.5 to USD 3 per drive versus a DRAM-equipped controller like the Phison E12, allowing the OEM to hit mainstream SATA-like price points while doubling sequential throughput to 3 GB/s class.
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Entry Gaming and Productivity SSDs
Entry-tier PCIe 3.0 gaming SSDs (for game-loading optimization) and productivity builds benefit from the RTS5766DL's 2K LDPC engine, which extends endurance and sustains low bit error rates when paired with QLC or pQLC NAND. The 1200 MT/s NAND interface speed keeps random read IOPS competitive for game asset streaming. Realtek's mature NVMe 1.4 firmware stack provides TRIM, S.M.A.R.T. telemetry and Host Memory Buffer support, which are essential for gaming-drive monitoring software such as CrystalDiskInfo and vendor SSDs.
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Industrial and Embedded M.2 Storage
Industrial embedded systems such as fanless mini-PCs, kiosks and digital signage benefit from the RTS5766DL's compact BGA-252 (11 x 11 mm) footprint, which fits easily inside M.2 2280 modules and single-board computers with constrained routing area. The 0.65 mm ball pitch requires a 4-layer PCB with microvia stack-up, but the overall controller PCB footprint stays well under 200 mm². The DRAM-less architecture also reduces standby power draw versus DRAM-equipped controllers, which is valuable in always-on industrial deployments.
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PCIe 3.0 NVMe Enablement Boards
Evaluation boards and reference designs that demonstrate PCIe 3.0 x4 NVMe performance benefit from the RTS5766DL because it integrates the PCIe 3.0 physical layer, NVMe 1.4 controller, NAND interface and LDPC engine into one BGA. This simplifies the BOM to essentially the controller + power management IC + NAND packages, which is ideal for educational kits and engineering bring-up cards. Reference designs typically expose all four NAND channels, allowing engineers to characterize up to four packages of 3D NAND per channel.
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Low-Power Mobile Storage Modules
Mobile and ultra-portable SSDs benefit from the RTS5766DL's HMB DRAM-less architecture because it reduces module power draw by 10 to 20 percent compared to DRAM-equipped controllers in idle and read workloads, which translates into longer battery life for ultra-thin laptops that ship the controller in a BGA-keyed M.2 2230 or 2242 form factor. The PCIe 3.0 x4 interface also supports modern low-power L1.1 and L1.2 PCIe sub-states for additional idle power savings. Combined with QLC NAND at low utilization levels, the platform enables sub-1 W active power envelope.
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추천 제품 요약
엔지니어링 참조 데이터: RTS5766DL — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | RTS5766DL-CG | RTS5762 | RTS5765 | SM2263XT | PS5012-E12T | MAP1202 |
|---|---|---|---|---|---|---|---|
| Brand | Realtek | Realtek | Realtek | Realtek | Silicon Labs | Microchip Technology | Maxio |
| Package | BGA-252 (11x11, 0.65 mm) | BGA-252 (11x11, 0.65 mm) | BGA-252 (11x11, 0.65 mm) | BGA-252 (11x11, 0.65 mm) | BGA-252 (11x11, 0.65 mm) | BGA-252 (11x11, 0.65 mm) | BGA-252 (11x11, 0.65 mm) |
| Host Interface | PCIe 3.0 x4 (NVMe 1.4) | PCIe 3.0 x4 (NVMe 1.4) | PCIe 3.0 x4 (NVMe 1.3) | PCIe 3.0 x4 (NVMe 1.3) | PCIe 3.0 x4 (NVMe 1.3) | PCIe 3.0 x4 (NVMe 1.3) | PCIe 3.0 x4 (NVMe 1.4) |
| DRAM Support | DRAM-less (HMB) | DRAM-less (HMB) | DRAM-less (HMB) | DRAM-less (HMB) | DRAM-less (HMB) | DRAM-less (HMB) | DRAM-less (HMB) |
| NAND Channels | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Max NAND Speed (MT/s) | 1200 | 1200 | 800 | 800 | 800 | 800 | 1200 |
| Error Correction | 2K LDPC | 2K LDPC | LDPC | LDPC | LDPC | LDPC | LDPC |
| NAND Type Support | TLC, QLC, pQLC/PLC | TLC, QLC, pQLC/PLC | TLC, QLC | TLC, QLC | TLC, QLC | TLC, QLC | TLC, QLC |
| Typical Use Case | Mainstream consumer NVMe | Mainstream consumer NVMe | Mainstream consumer NVMe | Mainstream consumer NVMe | Mainstream consumer NVMe | Entry enthusiast NVMe | Mainstream consumer NVMe |
주요 차별점
- 1200 MT/s NAND interface in a DRAM-less controller (vs SM2263XT)
- Same die across -CG variant with confirmed PCI-SIG listing (vs RTS5766DL-CG)
- Single-vendor firmware stack across RTS5762/RTS5765/RTS5766DL (vs PS5012-E12T)
- Cost-optimized PCIe 3.0 x4 BGA-252 footprint class (vs MAP1202)
설계 노트
The RTS5766DL uses a 252-ball BGA package at 0.65 mm pitch (per JLCPCB listing). Place NSMD pads with ENIG finish and use a 4-layer microvia stack-up with via-in-pad for the inner BGA balls to ensure reliable assembly. Maintain continuous ground planes under the BGA and stitch the PCIe TX/RX pairs with reference-ground vias every 200 mil. Keep all NAND trace lengths matched within ±50 mil per channel to preserve read/write timing margins at 1200 MT/s.
Estimated: at 3.3 V core and ~1.5 W typical controller power, the BGA-252 package will rise several degrees C above ambient without airflow. For M.2 2280 form factors that lack a heatsink, derate sustained sequential write throughput by 20 to 30 percent or add a copper spreading layer under the BGA. Drive-level throttling is firmware-managed via SMART attributes; design the PCB with a thermal sensor pad near the controller for accurate telemetry.
PCIe 3.0 TX/RX pairs require 85 ohm differential routing with reference-ground stitching vias at every 100 mil. Series AC-coupling caps (75 nF typical) must be placed within 200 mil of the controller's TX balls. For the 1200 MT/s NAND interface, keep DQ/DQS traces matched per byte lane to within ±25 mil to avoid eye-margin degradation. Keep the REFCLK+/− pair routed as a 100 ohm differential pair with isolated ground reference and no stubs.
Do not omit the external 32.768 kHz crystal and 100 MHz reference clock - both are required for the controller's PLL lock. HMB DRAM-less mode requires operating-system support (Windows 10/11, modern Linux kernels); legacy OSes will fall back to a reduced FTL that lowers random write IOPS. Validate NAND CE distribution per channel: an unbalanced four-channel design (e.g. 1-1-1-4 CEs) loses up to 25 percent peak sequential throughput versus a balanced 2-2-2-2 distribution.
규정 준수 정보
JLCPCB listing states RoHS compliance for the RTS5766DL. REACH and conflict-mineral documentation must be requested from Realtek. AEC-Q100 is not applicable to a consumer SSD controller.
