S912XES384J2CAL - 16-Bit Auto MCU 384KB 112-LQFP | NXP
부품 번호: S912XES384J2CAL ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $11.85 | $11.85 |
| 10 | $10.2 | $102.00 |
| 100 | $8.55 | $855.00 |
| 500 | $7.12 | $3,560.00 |
| 1,000 | $6.08 | $6,080.00 |
| 3,000 | $5.15 | $15,450.00 |
S912XES384J2CAL 개요
What is an automotive 16-bit microcontroller? An automotive 16-bit microcontroller (MCU) is a programmable embedded processor optimized for in-vehicle electronic control units (ECUs) that require deterministic real-time control, on-chip non-volatile memory for firmware, and AEC-Q100 qualification for harsh under-hood and cabin environments. The HCS12X family extends the classic HC12 architecture by adding a Programmable Logical Address Mapping (XGATE) co-processor that offloads interrupt-driven I/O from the main CPU, improving throughput for body, chassis, and powertrain applications.
Key features include an XGATE auxiliary core for parallel I/O handling, 4 KB EEPROM for non-volatile data, an Enhanced Capture Timer (ECT) module, multiple CAN (msCAN) controllers for in-vehicle networking, SCI/SPI/I2C peripherals for external sensor and actuator interfacing, and a 10-bit analog-to-digital converter (ATD) for analog signal acquisition. The 112-pin LQFP package exposes 8 channels of enhanced capture and 16-bit timer counter modules for motor and solenoid control.
S12X devices execute the standard HC12 instruction set while adding new instructions, larger 24-bit addressing via the GLOBAL paging window, and 4 byte-aligned indexable page registers. This enables flat access to up to 8 MB of code space for advanced body controller and gateway firmware, while preserving compatibility with legacy HCS12 code bases used across the automotive industry.
Typical applications include automotive body controllers, instrument clusters, HVAC controls, lighting modules, seat and door zone ECUs, low-end gateway nodes, CAN node controllers, and powertrain peripherals requiring reliable ambient-temperature operation and comprehensive on-chip peripherals.
When designing with S912XES384J2CAL, allocate adequate PCB copper for thermal dissipation across the 112-pin LQFP ground ring; the device consumes approximately 150 mW at 50 MHz in active RUN mode and significantly less in pseudo-stop and wait modes. Use BDM (Background Debug Mode) for non-intrusive in-circuit firmware development and production programming.
This page synthesizes distributor pricing, same-family S12X drop-in alternatives, AEC-Q100 qualification notes, and practical BDM-based design guidance not consolidated in any single manufacturer document.
드롭인 대체품: S912XES384J2CAL — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: S912XES384J2CAL (동일 폼 팩터 및 풋프린트) — 차이점: Package, Mounting Type, Core Architecture, Operating Temperature, Supply Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
S912XES384J2CALR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
S912XEG384J2CALR
✅ 드롭인✓ 재고 있음
$9.1 / 개
데이터시트 보기 →S912XEQ512J2MAA
✅ 드롭인✓ 재고 있음
$8.6 / 개
데이터시트 보기 →S912XET512J3MAG
✅ 드롭인✓ 재고 있음
$16.4 / 개
데이터시트 보기 →S912XEQ384J3CALR
✅ 드롭인✓ 재고 있음
$11.4 / 개
데이터시트 보기 →S912XEP768J4CAL
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$7.4 / 개
데이터시트 보기 →S912XES384J2CAL 최대 정격 & 전기적 특성
| Product Family | HCS12X (S12XE-series) |
| CPU Core | HCS12X (enhanced 16-bit) |
| Maximum CPU Clock | 50 MHz |
| Program Flash | 384 KB |
| RAM | 16 KB |
| EEPROM | 4 KB |
| 패키지 | LQFP-112 |
| 핀 수 | 112 |
| 공급 전압 | 3.3 V / 5 V dual supply |
| AEC-Q100 Qualified | Yes (automotive grade) |
| CAN Modules (msCAN) | 2 |
| Enhanced Capture Timer | ECT module with 8 channels |
| Debug Interface | BDM (Background Debug Mode) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
S912XES384J2CAL lqfp-112 핀 구성 가이드
S912XES384J2CAL(lqfp-112 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: S912XES384J2CAL.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
S912XES384J2CAL 적합 용도: 7 애플리케이션s: Automotive Body Control Module, HVAC Control ECU, Instrument Cluster Controller, Lighting Module ECU, CAN Network Gateway Node, Seat and Door Zone ECU, Industrial PLC Interface Module.
Automotive Body Control Module
The S912XES384J2CAL is well suited for body control modules (BCMs) that manage lights, wipers, locks, and door zone ECUs. Its XGATE co-processor offloads interrupt-driven I/O from the main CPU, freeing cycles for high-level BCM logic, and the 384 KB flash comfortably holds consolidated body firmware including diagnostics. Two msCAN interfaces allow gateway bridging between powertrain CAN and body CAN networks, while 16 KB RAM supports network and diagnostic buffers under worst-case interrupt load.
추천
HVAC Control ECU
Automotive HVAC ECUs benefit from the S912XES384J2CAL's 10-bit ATD module to read cabin temperature, blend door position, and sun-load sensors, and from the Enhanced Capture Timer (ECT) with 8 input-capture channels to drive stepper motors for blend/flap actuators. AEC-Q100 Grade 1 qualification supports reliable operation across cabin ambient extremes, and the XGATE co-processor enables deterministic PWM generation for motor control without jitter. The 4 KB EEPROM stores trim and learned user preferences across power cycles.
추천
Instrument Cluster Controller
Instrument clusters require simultaneous driving of stepper motor gauges, LCD segments, and CAN traffic; the S912XES384J2CAL's 50 MHz HCS12X CPU and XGATE co-processor split the workload cleanly between gauge actuation and CAN message handling. The 384 KB flash supports cluster graphics fonts, warning logic, and CAN diagnostics stacks, while 4 KB EEPROM stores mileage and DTCs. Dual supply support (3.3 V / 5 V) lets the MCU interface directly with 5 V analog gauge drivers without level shifters.
추천
Lighting Module ECU
Front lighting modules and adaptive headlamp controllers use PWM channels to drive LED current regulators and matrix-beam actuators; the S912XES384J2CAL exposes enough PWM output through the ECT module for multi-LED driving and matrix-beam steering. 384 KB flash holds headlamp firmware, while 16 KB RAM is sufficient for adaptive beam-pattern buffers and LIN/CAN diagnostics. AEC-Q100 Grade 1 qualification tolerates the under-hood thermal profile of headlamp ballasts and DRL drivers.
추천
CAN Network Gateway Node
Low-end CAN gateways aggregate body and chassis network traffic; the S912XES384J2CAL with dual msCAN ports and XGATE co-processor efficiently bridges CAN frames between buses while running diagnostic routing logic. 384 KB flash holds CAN stack layers (OSEK/AUTOSAR compatible runtimes) plus UDS/KWP2000 services, and 16 KB RAM supports up to 100-frame mailbox buffers for high-traffic gateway use cases. AEC-Q100 Grade 1 ambient grade matches under-dash and central-body mounting.
추천
Seat and Door Zone ECU
Door zone ECUs controlling window lifts, mirrors, and seat switches benefit from the S912XES384J2CAL's mix of PWM, GPIO, and LIN/CAN connectivity in a single AEC-Q100 LQFP-112 chip. 384 KB flash consolidates per-door feature logic while maintaining sufficient flash for diagnostics and end-of-line test firmware. The low-power pseudo-stop and wait modes allow <1 mA quiescent current for parked-vehicle battery preservation, and the HCS12X core's predictable interrupt latency ensures deterministic window-pinch response.
추천
Industrial PLC Interface Module
Outside automotive, the S912XES384J2CAL fits CANopen / DeviceNet industrial interface modules that need AEC-Q100-grade reliability for factory floor environments. 384 KB flash accommodates CANopen stack, PDO/SDO handling, and object dictionary tables, while msCAN controllers implement DS301-compliant CAN layer. The XGATE co-processor handles real-time PDO triggering, freeing the CPU for application-layer logic. Hardware BDM simplifies in-circuit firmware updates during PLC commissioning.
추천
추천 제품 요약
엔지니어링 참조 데이터: S912XES384J2CAL — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | S912XES384J2CALR | S912XEG384J2CALR | S912XEQ512J2MAA | S912XET512J3MAG | S912XEQ384J3CALR | S912XEP768J4CAL |
|---|---|---|---|---|---|---|---|
| Package | LQFP-112 | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Flash | 384 KB | 384 KB - identical | 384 KB - identical | 512 KB (+33%) | 512 KB (+33%) | 384 KB - identical | 768 KB (+100%) |
| CPU Clock | 50 MHz | 50 MHz - identical | 50 MHz - identical | 50 MHz - identical | 50 MHz - identical | 50 MHz - identical | 50 MHz - identical |
| AEC-Q100 Grade | Grade 1 | Grade 1 - identical | Grade 1 - identical | Grade 1 - identical | Grade 1 - identical | Grade 1 - identical | Grade 1 - identical |
| CAN Modules | 2 | 2 - identical | 2 - identical | 2 - identical | 2 - identical | 2 - identical | 2 - identical |
| EEPROM | 4 KB | 4 KB - identical | 4 KB - identical | 4 KB - identical | 4 KB - identical | 4 KB - identical | 4 KB - identical |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C - identical | -40 C to +85 C - identical | -40 C to +85 C - identical | -40 C to +85 C - identical | -40 C to +85 C - identical | -40 C to +85 C - identical |
주요 차별점
- Same LQFP-112 footprint as the entire NXP S12XE/XEQ/XET/XEP sub-family (vs S912XEQ384J3CALR)
- XGATE auxiliary co-processor for parallel I/O offload (vs MC9S08DZ60ACLF)
- Dual 3.3 V / 5 V supply tolerance without external level shifters (vs S912XEQ512J2MALR)
- AEC-Q100 Grade 1 qualification for cabin ambient up to +85 C (vs Industrial-grade non-automotive MCUs)
설계 노트
The LQFP-112 package consumes approximately 150 mW at 50 MHz CPU clock and 3.3 V core supply. With a theta_JA of approximately 50 C/W on a standard 4-layer PCB, the junction-to-ambient rise is roughly 7.5 C; for under-hood mounting near hot zones, attach the exposed die-pad land to inner PCB copper and consider thermal vias to reduce junction temperature rise.
Connect the BKGD pin to a 4.7 kohm pull-up resistor to VDDX (5 V) for normal reset exit and to enable BDM (Background Debug Mode) programming in production. Provide a header or test-pad access to the BKGD signal so that firmware can be updated without desoldering the MCU; BDM allows non-intrusive memory access for calibration and diagnostics.
Do not apply 5 V to RESET or IRQ pins without series current limiting; both are bidirectional in BDM mode and direct 5 V drive may damage the BDM driver. Also, place a 10 nF ceramic bypass on each VDDR-VSSX pair as close to the package as possible; the HCS12X core has multiple split-supply rails (VDDR, VDDX, VDDF, VSS, VSSX) that each require local decoupling.
Route the external crystal or resonator traces (EXTAL/XTAL) symmetrically and as short as possible (under 10 mm) to avoid PLL jitter. Place a guard ring around the oscillator traces tied to GND to isolate from switching noise. For AEC-Q100-grade immunity, add a 10 ohm series damping resistor close to the MCU on noisy CANH/CANL routes.
규정 준수 정보
RoHS compliant per NXP product page and LCSC listing (2026-10-20). AEC-Q100 Grade 1 qualified for automotive ambient operation. Halogen-free and lead-free per NXP automotive reliability program.
