S9S08DZ60F2MLH - 8-bit S08 MCU, 60KB Flash, CAN | NXP
부품 번호: S9S08DZ60F2MLH ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3.2 | $3.20 |
| 10 | $3.05 | $30.50 |
| 100 | $2.85 | $285.00 |
| 500 | $2.65 | $1,325.00 |
| 1,000 | $2.45 | $2,450.00 |
S9S08DZ60F2MLH 개요
An 8-bit microcontroller is an integrated circuit that executes program code on a CPU processing 8-bit data words, combining processor core, memory, and peripherals on a single chip. Within the power-management and embedded-control hierarchy, the S08DZ family sits in NXP's automotive 8-bit lineup, one tier below the 16-bit S12 series, and is typically used for body electronics, gateway assistants, and control nodes rather than high-compute processing.
Key features include the 40 MHz S08 core with a maximum internal bus clock of 20 MHz, 60 KB of in-system-programmable flash, an msCAN controller for CAN 2.0 A/B networking, and an integrated LCD driver. The device also integrates a 12-channel, 12-bit ADC (per LCSC listing), a real-time counter, serial peripherals (SCI, SPI, IIC), and operates from a 3.3 V or 5 V supply.
The S08 core uses a CISC architecture with efficient addressing modes and single-cycle access to RAM, making C-compiler code density strong for 8-bit applications. The flash supports in-circuit programming through the background debug interface (BDM), simplifying field firmware updates in automotive modules. The -40 C to +125 C ambient rating and NXP automotive qualification make it suitable for under-hood-adjacent and body-control environments.
Typical applications include automotive body control modules, HVAC controllers, instrument clusters with LCD drive, CAN-networked sensor nodes, and industrial control systems requiring a robust 8-bit MCU with CAN connectivity.
When designing with this device, verify the flash programming voltage and use the on-chip FLL to derive the 40 MHz core clock from a low-cost crystal, keeping EMI low in CAN-heavy systems.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: S9S08DZ60F2MLH — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: S9S08DZ60F2MLH (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Instruction Set, RAM, Package, ADC.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC9S08DZ60AMLH
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
S9S08DZ60F1MLH
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
S9S08DZ60F2MLC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
S9S08DZ48F1CLH
✅ 드롭인✓ 재고 있음
$0.8 / 개
데이터시트 보기 →MC9S08DZ96CLH
✅ 드롭인✓ 재고 있음
$6.21 / 개
데이터시트 보기 →S9S08DZ32F1MLF
✅ 드롭인✓ 재고 있음
$4.21 / 개
데이터시트 보기 →MC9S08GB60ACFUER
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
S9S08DZ60F2MLH 최대 정격 & 전기적 특성
| Core Processor | S08 (HCS08), 8-bit |
| Core Architecture | CISC |
| 최대 클록 주파수 | 40 MHz |
| Flash Memory | 60 KB (60K x 8) |
| 공급 전압 | 3.3 V / 5 V |
| 동작 온도 | -40 C to +125 C |
| 패키지 | 64-LQFP (10x10 mm) |
| 실장 유형 | Surface Mount |
| CAN Module | msCAN (CAN 2.0 A/B) |
| LCD Driver | Integrated (per NXP product page) |
| ADC Resolution | 12-bit |
| Qualification | Automotive Qualified |
| Packaging | Tray |
| Peripherals | SCI, SPI, IIC, RTC, PWM |
S9S08DZ60F2MLH 64-lqfp (10x10 mm) 핀 구성 가이드
S9S08DZ60F2MLH(64-lqfp (10x10 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: S9S08DZ60F2MLH.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
S9S08DZ60F2MLH 적합 용도: 6 애플리케이션s: Automotive Body Control Modules, Instrument Clusters with LCD Drive, HVAC Control Units, Industrial CAN Sensor Nodes, Gateway and Legacy Control Card Rebuild, Battery-Backed Monitoring and Telemetry Units.
Automotive Body Control Modules
The S9S08DZ60F2MLH fits body control modules (BCM) because it combines an automotive-qualified -40 C to +125 C temperature rating with an integrated msCAN controller and 60 KB flash for lamp, door, and load-management logic. The 40 MHz S08 core provides sufficient headroom for CAN message filtering and timed I/O scanning, while the 12-bit ADC reads switch and sensor inputs with resolution adequate for threshold detection. Placed on the vehicle CAN bus as a slave node, the MCU handles network management and diagnostic (UDS-style) messaging in flash, and its in-circuit programmable memory supports end-of-line configuration without removing the module from the vehicle.
추천
Instrument Clusters with LCD Drive
Instrument clusters benefit directly from the S9S08DZ60F2MLH's integrated LCD driver, which drives segment and basic matrix LCDs without an external controller, reducing BOM cost and board area in a 10x10 mm 64-LQFP footprint. According to NXP, the S08DZ60 family was designed specifically for automotive and industrial applications needing LCD drive plus CAN. The 40 MHz core updates display segments and manages multiplexed keypad scanning while servicing periodic CAN messages from the vehicle network. The 12-bit ADC samples fuel-level, temperature, and voltage inputs, and the flash-resident firmware supports odometer data retention and variant configuration, with the -40 C to +125 C rating covering harsh cabin and windshield-adjacent environments.
추천
HVAC Control Units
Automotive and industrial HVAC controllers match the S9S08DZ60F2MLH well: the integrated LCD driver displays setpoints and status on low-cost segment panels, the 12-bit ADC reads NTC temperature sensors and potentiometer user inputs, and the msCAN module connects the controller to the vehicle network for zone commands and diagnostic queries. The 40 MHz S08 core executes PID-style blower and blend-door control loops with deterministic timing, while 60 KB flash holds multiple calibration tables and fault-log code. Its 5 V operation simplifies interfacing with legacy actuator drivers, and the automotive -40 C to +125 C qualification covers under-dash thermal conditions reliably.
추천
Industrial CAN Sensor Nodes
In industrial networks, the S9S08DZ60F2MLH serves as a compact CAN sensor node: the msCAN controller handles CAN 2.0 A/B framing in hardware, freeing the 40 MHz S08 core for signal conditioning, filtering, and local control logic. The 12-bit ADC digitizes 4-20 mA-derived or ratiometric sensor signals, and 60 KB flash stores node configuration, scaling coefficients, and a lightweight CANopen- or J1939-style protocol stack. Operation at 3.3 V or 5 V lets designers match the node to existing logic rails, and the extended -40 C to +125 C range suits cabinets near motors or outdoor enclosures. The 64-LQFP exposes ample GPIO for status LEDs and local I/O.
추천
Gateway and Legacy Control Card Rebuild
A documented real-world use case is rebuilding legacy control cards originally built around the MC9S08DZ60: NXP community discussions confirm the S9S08DZ60F2MLH as the equivalent continuation of that die for card repairs, making it a practical choice for service organizations maintaining 8-bit automotive controllers from the 2010s. Because the 64-LQFP footprint and 60 KB flash match, existing firmware binaries and programming fixtures carry over, and the msCAN plus LCD driver retain all original peripheral functionality. This reduces requalification effort to a die-revision review of NXP product change notices rather than a full redesign, keeping spare-part economics viable for low-volume service production.
추천
Battery-Backed Monitoring and Telemetry Units
The S9S08DZ60F2MLH suits battery-backed monitoring units because its S08 core offers low-power wait and stop modes suitable for duty-cycled data logging, while the real-time counter maintains timekeeping between wakeups. The 12-bit ADC samples battery voltage, temperature, and load-current sense lines at the resolution needed for coulomb-style estimation, and 60 KB flash logs event histories and stores parameter sets. When a vehicle or industrial CAN bus is present, the msCAN module reports telemetry without an external controller; the LCD driver option enables local status panels on service tools. The 3.3 V or 5 V supply flexibility simplifies integration with both automotive 12 V-derived and single-cell Li-ion-derived rails.
추천
추천 제품 요약
엔지니어링 참조 데이터: S9S08DZ60F2MLH — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC9S08DZ60AMLH | S9S08DZ60F1MLH | S9S08DZ48F1CLH | MC9S08GB60ACFUER |
|---|---|---|---|---|---|
| Package | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP - same | 64-LQFP (10x10 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Max Clock | S08, 40 MHz | S08, 40 MHz | S08, 40 MHz | S08, 40 MHz | S08, 40 MHz |
| Flash Memory | 60 KB | 60 KB | 60 KB | 48 KB | 60 KB |
주요 차별점
- Integrated LCD driver saves an external segment driver (vs MC9S08GB60ACFUER)
- Largest mainstream flash option in the DZ pin-compatible family (vs S9S08DZ48F1CLH)
- Active automotive-qualified continuation of the legacy MC9S08DZ60 die (vs MC9S08DZ60AMLH)
설계 노트
The F2 suffix in S9S08DZ60F2MLH denotes a specific die mask/revision ordering code. When substituting the MC9S08DZ60AMLH predecessor or an F1-mask part, review NXP product change notices (PCN) and errata for the target mask: flash timing parameters and documented errata can differ between revisions even when the pinout is identical. Always re-run flash programming and CAN timing validation on the exact ordering code before releasing the production build.
The device operates from 3.3 V or 5 V, so define the rail early in the design. In 12 V automotive systems, use a 5 V pre-regulator with load-dump transient protection upstream of the MCU. Estimated: an S08 core at 40 MHz with active peripherals typically draws tens of milliamps, so a low-cost linear regulator is acceptable at the board level, but verify per the datasheet IDDA/IDDB figures for your clock configuration rather than assuming this estimate.
For CAN networks, place the CAN transceiver (e.g., MCP2551-class device) close to the msCAN pins, keep the TxCAN/RxCAN traces short and length-matched, and use a common ground plane under the transceiver. Decouple VDD with 0.1 uF ceramics placed within 2 mm of the supply pins, and add bulk 4.7-10 uF near the regulator. Route the crystal with short traces and a guard ground to reduce EMI when the FLL multiplies to the 40 MHz core clock.
Estimated: with typical MCU active current on the order of 20-40 mA at 5 V, power dissipation is roughly 0.1-0.2 W, which the 64-LQFP (10x10 mm) package dissipates without any heatsink, even at +125 C ambient. Thermal design only becomes relevant if the MCU also drives high LCD backplane or GPIO loads; budget those currents against per-pin limits in the datasheet.
규정 준수 정보
The part is described as Automotive Qualified by NXP/Mouser listings; specific AEC-Q100 grade, RoHS/REACH status, and lead-free data are not stated in the provided web data and must be confirmed on the NXP product page quality/environmental section.