NXP Semiconductors

MC9S12DG128MPV - 16-bit HCS12 MCU 128KB Flash 112-LQFP | NXP

부품 번호: MC9S12DG128MPV ✗ 단종
재고 있음 영업일 기준 1~3일 내 발송
2.5V / 5V Vdss 112-LQFP (20 x 20 mm) Package 25 MHz Speed 128KB (128K x 8) Memory
문의하기 가격 문의
MOQ: 1 |
가격 업데이트: 2026-10-18
볼륨 가격
수량 단가 합계
1 $0 $0.00
10 $0 $0.00
100 $0 $0.00
500 $0 $0.00
1,000 $0 $0.00
ℹ️ 모든 가격은 USD 기준입니다

MC9S12DG128MPV 개요

The NXP (Freescale/Motorola) MC9S12DG128MPV is a 16-bit HCS12 CISC microcontroller with 128KB (128K x 8) Flash program memory, 8KB RAM, and 2KB EEPROM, clocked at up to 25 MHz in a 112-pin LQFP (20 x 20 mm) surface-mount package.

A microcontroller (MCU) is a single-chip computer that integrates a processor core, memory, and peripherals on one die, forming the lowest level of the embedded-systems hierarchy: MCU -> embedded processor -> microprocessor-based system. The HCS12 (also written HC9S12 / S12) family is Motorola's (later Freescale, now NXP) 16-bit evolution of the classic 68HC11 architecture, widely used in automotive multiplexing and industrial control.

Key features of the MC9S12DG128 include 91 general-purpose I/O lines, CANbus, I2C, SCI, and SPI connectivity, an 8-channel enhanced capture timer with input capture/output compare, two 8-channel 10-bit ADCs, an 8-channel pulse-width modulator (PWM), and a watchdog timer (WDT). It operates from a 5V supply (with 2.5V support per listing data), making it well suited to legacy 5V automotive and industrial buses.

Architecturally, the S12 core uses a CISC instruction set with full upward compatibility from the 68HC11, an inter-IC bus for system resource mapping, on-chip clock generation, and background debug mode (BKGD/MODC pin) for unintrusive in-circuit debugging via the standard 6-pin BDM header.

Typical applications include automotive body and multiplex networking nodes (CAN), industrial PLC I/O modules, motor control with PWM outputs, and instrumentation requiring 5V-tolerant analog front ends with the dual 10-bit ADCs.

Design consideration: this part is listed as Obsolete by NXP; for new designs use the S12G or S12P families, and for maintenance of existing designs secure remaining authorized stock (Rochester Electronics continues to supply). Verify EEPROM and Flash endurance limits against the manufacturer datasheet for long-life products.

This page synthesizes distributor availability data, drop-in family alternatives, and obsolescence guidance not consolidated in the manufacturer datasheet.

드롭인 대체품: MC9S12DG128MPV — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: MC9S12DG128MPV (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core Architecture, Supply Voltage, RAM Size, Program Memory Size.

NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Core Architecture: CISC
Supply Voltage: 3.3 V / 5 V
비교 대상: MC9S12DG128MPV →
NXP Semiconductors
Package: 80-QFP (14x14 mm)
Core Architecture: 16-bit CISC
Supply Voltage: 5 V
비교 대상: MC9S12DG128MPV →
NXP Semiconductors
Package: 112-LQFP (20 x 20 mm)
Core Architecture: CPU12 (HC12 / HCS12 CISC)
Supply Voltage: 5 V (typical)
비교 대상: MC9S12DG128MPV →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
RAM Size: 12 KB (12K x 8)
비교 대상: MC9S12DG128MPV →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Core Architecture: HCS12
Supply Voltage: 2.5 V / 5 V
비교 대상: MC9S12DG128MPV →
NXP Semiconductors
Package: 80-pin PQFP (QFP-80)
Core Architecture: HCS12 (CPU12) 16-bit CISC
비교 대상: MC9S12DG128MPV →
NXP Semiconductors
Package: 112-LQFP (20 x 20 mm, 0.5 mm pitch)
Core Architecture: HCS12 (CPU12, 16-bit CISC)
Supply Voltage: 2.35 V to 2.75 V (core) / 5 V I/O
비교 대상: MC9S12DG128MPV →
NXP Semiconductors
Package: 80-QFP (14x14 mm), LQFP
RAM Size: 12KB (12K x 8)
Program Memory Size: 256KB (256K x 8)
비교 대상: MC9S12DG128MPV →
NXP Semiconductors
Package: 112-LQFP (20 x 20 mm)
Core Architecture: 16-bit CISC
비교 대상: MC9S12DG128MPV →
NXP Semiconductors
Package: 112-pin LQFP
Core Architecture: HCS12 16-bit CISC
Supply Voltage: 2.5 V / 5 V
비교 대상: MC9S12DG128MPV →
NXP Semiconductors
Package: 144-LQFP (20 x 20 mm)
Core Architecture: CISC
Supply Voltage: 2.5 V core / 5 V I/O
비교 대상: MC9S12DG128MPV →
NXP Semiconductors
Package: 144-LQFP (20 x 20 mm)
Core Architecture: CISC
Supply Voltage: 2.5 V core / 5 V I/O
비교 대상: MC9S12DG128MPV →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

MC9S12DG128MPVE

✅ 드롭인
NXP Semiconductors
📦 112-LQFP (20 x 20 mm)
S12DG (HCS12) · HCS12 (CPU12, 16-bit CISC) · 25 MHz (max) · 50 MHz (max) · 128 KB · 8 KB · 2 KB · 2.35 V to 2.75 V (core) / 5 V I/O

✓ 재고 있음

$11.75 / 개

데이터시트 보기 →

MC9S12DG128BCPVE

✅ 드롭인
📦 112-LQFP (20 x 20 mm)
same DG128 die, 128KB Flash/8KB RAM, different temperature/ordering grade (BC vs MP); Findchips lists attribute comparison

📋 참조 대체품 (카탈로그에 없음)

MC9S12DG256MPV

✅ 드롭인 ⚠️ 사양 미검증
📦 112-LQFP (20 x 20 mm)
256KB Flash vs 128KB (+100%), 4KB EEPROM vs 2KB; same package and pinout within DG family

📋 참조 대체품 (카탈로그에 없음)

MC9S12DT128MPV

✅ 드롭인 ⚠️ 사양 미검증
NXP Semiconductors
📦 112-LQFP (20 x 20 mm)
HCS12 16-bit CISC · 128 KB · 8 KB · 2 KB · 25 MHz · 2.5 V / 5 V · -40 C to +125 C (Automotive Grade) · 112-pin LQFP

✓ 재고 있음

$17.5 / 개

데이터시트 보기 →

MC9S12A256CPVE

✅ 드롭인
📦 112-LQFP (20 x 20 mm)
256KB Flash vs 128KB (+100%); A-family peripheral set differs partially from DG family - verify port multiplexing

📋 참조 대체품 (카탈로그에 없음)

MC9S12DG128MPV 최대 정격 & 전기적 특성

Core Processor HCS12
Core Size 16-Bit
Architecture CISC
Speed 25 MHz
Program Memory Size 128KB (128K x 8)
Program Memory Type FLASH
RAM Size 8K x 8
EEPROM Size 2K x 8
Number of I/O 91
Connectivity CANbus, I2C, SCI, SPI
Peripherals PWM, WDT
ADC Resolution 10-bit
공급 전압 2.5V / 5V
패키지 / 케이스 112-LQFP (20 x 20 mm)
실장 유형 Surface Mount
Part Status Obsolete
Series HCS12 (MC9S12D family)

MC9S12DG128MPV 112-lqfp (20 x 20 mm) 핀 구성 가이드

MC9S12DG128MPV(112-lqfp (20 x 20 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

MC9S12DG128MPV의 112-lqfp (20 x 20 mm) 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: MC9S12DG128MPV.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

MC9S12DG128MPV 적합 용도: 6 애플리케이션s: Automotive Body & Multiplex Networking, Industrial PLC I/O Modules, Motor Control with PWM, Instrumentation & Sensor Data Acquisition, Gateways & Networked Nodes (CAN/SCI Bridges), Legacy Automotive ECU Maintenance & Remanufacturing.

🚗

Automotive Body & Multiplex Networking

The MC9S12DG128MPV was explicitly designed by Motorola for automotive multiplexing applications, and its on-chip msCAN controller, 91 I/O lines, and 5V-tolerant ports align directly with body-control module requirements. The 25 MHz HCS12 core comfortably runs CAN scheduling plus lamp/wiper/door control firmware within 128KB Flash, while the 2KB EEPROM stores trim and diagnostic data across power cycles. In this topology the MCU sits on the vehicle CAN bus, driving relays and reading switch arrays via its dual 8-channel 10-bit ADCs. The quantified benefit is single-chip integration: no external CAN controller or ADC is needed, cutting BOM count and PCB area versus a discrete 68HC11-plus-82C250 solution.

🏭

Industrial PLC I/O Modules

In programmable-logic-controller I/O cards, the MC9S12DG128MPV fits because its 91 GPIO lines provide dense discrete input/output capability, the SCI/SPI interfaces link to backplane coprocessors, and the watchdog timer enforces fail-safe behavior demanded in factory automation. The two 8-channel 10-bit ADCs digitize up to 16 analog sensor channels (4-20 mA via external conditioning), and the 8-channel PWM generates actuator drive signals without extra silicon. Running at 25 MHz from a 5V industrial rail simplifies noise immunity design, since 5V CMOS thresholds tolerate plant-floor transients better than 3.3V logic. The 112-LQFP keeps routing practical on two-layer carrier boards, and BDM debugging allows field firmware updates via the standard header.

⚙️

Motor Control with PWM

DC and brushless motor drives benefit from the MC9S12DG128MPV's 8-channel PWM block, which generates complementary or independent PWM waveforms with programmable period and duty resolution, while the enhanced capture timer provides input capture for tachometer feedback and output compare for commutation sequencing. The dual 10-bit ADCs, synchronizable to the PWM period, sample current-shunt and back-EMF signals with reduced switching noise when triggered at PWM centers - a quantified benefit of 8 bits-plus effective resolution under typical 5V scaling. The HCS12 core executes PI current loops at kHz rates within the 25 MHz bus budget, and 128KB Flash retains multiple motor-profile tables. CANbus connectivity integrates the drive into higher-level machine networks.

🔧

Instrumentation & Sensor Data Acquisition

Bench and field instrumentation uses the MC9S12DG128MPV's two 8-channel, 10-bit ADCs to digitize up to 16 single-ended inputs at full HCS12 bus speed, with the SCI port streaming results to a host PC and SPI/I2C interfacing external precision references or displays. The 5V analog domain provides a wide 0-5V input span, improving signal-to-noise headroom over 3.3V MCUs - roughly a 1.5x larger LSB span (about 4.9 mV per count at 10 bits) before external amplification is required. The 8KB RAM buffers scan data, and 2KB EEPROM calibrations survive power loss. The 112-LQFP footprint suits compact handheld enclosures, and the 25 MHz core supports on-the-fly linearization and filtering without a companion DSP.

🌐

Gateways & Networked Nodes (CAN/SCI Bridges)

As a protocol gateway, the MC9S12DG128MPV bridges CANbus to SCI (RS-232/RS-485) and SPI/I2C peripherals, using its on-chip msCAN controller for the vehicle or machine bus and the SCI for service-tool access. The 128KB Flash accommodates dual firmware banks for field-updatable gateway images, and 8KB RAM holds message queues sized for typical 500 kbps CAN traffic buffering. Because CAN, SCI, SPI, and I2C are all on-chip, a two-chip gateway (this MCU plus a physical-layer transceiver) is achievable - a BOM reduction versus discrete controller-plus-UART designs. The watchdog enforces autonomous recovery on bus-off conditions, a quantified reliability gain for unattended installations in industrial networking.

🎥

Legacy Automotive ECU Maintenance & Remanufacturing

Independent remanufacturers and repair shops servicing 2000s-era ECUs rely on the MC9S12DG128MPV because it is the exact original silicon in many engine, transmission, and body controllers; sourcing the same die guarantees firmware binary compatibility without recalibration. Rochester Electronics continues life-cycle supply of this obsolete part, and the BDM interface on the BKGD/MODC pin permits in-circuit flash reprogramming of mileage, immobilizer, and calibration data per the Motorola device user guide. The 112-LQFP (20 x 20 mm) footprint matches original PCB land patterns, enabling direct socket-and-replace repair. Lead-free remanufactured variants (MPVE) support RoHS-compliant service builds where regulations require them.

추천 제품 요약

MC9S12DG256MPV Same-family 256KB variant for larger body firmware 사용처: Automotive Body & Multiplex Networking, Motor Control with PWM, Gateways & Networked Nodes (CAN/SCI Bridges) MC9S12DT128MPV NXP Semiconductors 사용처: Automotive Body & Multiplex Networking, Motor Control with PWM, Gateways & Networked Nodes (CAN/SCI Bridges) MC9S12DG128MPVE NXP Semiconductors 사용처: Industrial PLC I/O Modules, Legacy Automotive ECU Maintenance & Remanufacturing MC9S12DG128BCPVE Alternate ordering grade for extended temperature modules 사용처: Industrial PLC I/O Modules, Legacy Automotive ECU Maintenance & Remanufacturing MAX187CEWE Maxim Integrated 사용처: Instrumentation & Sensor Data Acquisition TLV2545IDGKR Texas Instruments 사용처: Instrumentation & Sensor Data Acquisition
What is the MC9S12DG128MPV?
The MC9S12DG128MPV is a 16-bit HCS12 CISC microcontroller from NXP (formerly Freescale/Motorola) with 128KB Flash, 8KB RAM, 2KB EEPROM, 91 I/O lines, and 25 MHz maximum bus speed, housed in a 112-LQFP (20 x 20 mm) package. According to distributor listings (DigiKey, ABC-Semi), it integrates CANbus, I2C, SCI, SPI connectivity plus PWM and watchdog peripherals, and was designed primarily for automotive multiplexing applications.
Is the MC9S12DG128MPV obsolete?
Yes, the MC9S12DG128MPV is listed as Obsolete - part status is discontinued by NXP, though remaining stock and authorized excess inventory is still available through distributors and Rochester Electronics. For new designs NXP recommends newer S12-family derivatives. For legacy production, plan a last-time-buy or qualify a pin-compatible family variant such as the MC9S12DG256 before stock depletes. Confirm current availability as of 2026-10-18 with your distributor.
What is the price of MC9S12DG128MPV?
The MC9S12DG128MPV is an obsolete part with quote-based pricing that varies with remaining stock and order quantity, so fixed tier pricing is not published. As of 2026-10-18, authorized channels such as Rochester Electronics and excess-stock distributors (Sierra IC, IC-Components) offer it by request-for-quote. Expect legacy MCU pricing to exceed the original list price; obtain a formal quote for 1/10/100/1000-piece breaks before committing a bill of materials.
Where can I buy MC9S12DG128MPV online?
The MC9S12DG128MPV can be purchased online through DigiKey (listing 684607), Hotenda (Rochester Electronics stock), Sierra IC, and IC-Components, all of which list request-for-quote or stock purchasing for this obsolete NXP part. Because it is discontinued, availability fluctuates daily; verify stock as of 2026-10-18. XAIPART also accepts quote requests for this MPN with full traceability documentation on request.
What is the lead time for MC9S12DG128MPV?
Lead time for the obsolete MC9S12DG128MPV depends entirely on distributor stock position: in-stock distributor inventory (e.g., DigiKey, Hotenda) typically ships in 1-3 days, while Rochester Electronics life-cycle continuation builds can run 8-16 weeks. There is no standard factory lead time because NXP has discontinued the device. Confirm current stock before scheduling production, and consider a buffer purchase to cover the qualification time of any alternative.
What is the difference between MC9S12DG128MPV and MC9S12DG256MPV?
The MC9S12DG256MPV doubles the nonvolatile memory: 256KB Flash versus 128KB on the DG128, while keeping the same 112-LQFP package, 25 MHz HCS12 core, 4KB EEPROM, and 12KB RAM class of peripherals. It is pin-to-pin compatible within the same package suffix, so a PCB designed for the DG128 can typically accept the DG256 for extra code space. Always confirm the specific memory map and masking options in the respective NXP datasheets before substitution.
Can MC9S12DG128BCPVE replace MC9S12DG128MPV?
Yes, the MC9S12DG128BCPVE is a drop-in replacement candidate: it is the same DG128 die in the same 112-LQFP package with identical memory (128KB Flash, 8KB RAM) and peripherals, differing mainly in ordering code (temperature/speed masking options and tray-versus-reel packing). Findchips lists a direct attribute comparison between the MPV and BCPVE. Verify the exact temperature grade and package marking against your design requirements before ordering.
When should I choose MC9S12DG128 over MC9S12A256?
Choose the MC9S12DG128 when you need the DG-family peripheral set (dual CAN, larger I/O, full DG port multiplexing) at 128KB; choose the MC9S12A256 (as compared on ETEI) when you need 256KB Flash but can accept the A-family peripheral differences. Both come in 112-LQFP packages, but they are not guaranteed pin-identical across all peripheral multiplexing, so review the port substitution tables in both datasheets. For pure footprint and firmware continuity, prefer a DG-family variant.
Is MC9S12DG128MPV suitable for automotive CAN applications?
The MC9S12DG128MPV is well suited to automotive multiplexing: it was explicitly designed for automotive body/network nodes and includes an on-chip CANbus interface (msCAN), 25 MHz HCS12 core, 91 I/O lines, and two 10-bit ADCs for sensor inputs. Note that the 'P' temperature/package ordering variant should be checked against the AEC-qualification requirements of your program; for new automotive designs, NXP's current S12G/S12P families with AEC-Q100 qualification are the recommended path.
What is the best drop-in replacement for MC9S12DG128MPV?
The best drop-in replacement is MC9S12DG128MPVE (the RoHS lead-free variant of the identical part, listed on nxp.com) or MC9S12DG128BCPVE from Freescale, both pin-to-pin compatible in the 112-LQFP with identical 128KB Flash/8KB RAM memory. If more code headroom is needed, MC9S12DG256MPV offers 256KB Flash in the same footprint. All options preserve your PCB layout, BDM debug connector, and peripheral firmware. Validate flash programming algorithm compatibility before mass substitution.
Where can I download the MC9S12DG128MPV datasheet PDF?
The MC9S12DG128 (device user guide, covering the DG128 family including the MPV package variant) datasheet PDF is available from Mouser at mouser.com/datasheet/2/161/MC9S12DG128-190876.pdf and from datasheet aggregators such as Alldatasheet and Datasheets.com. NXP also hosts product documentation at nxp.com under the MC9S12DG128 product page. The document is the Motorola MC9S12DT128/DG128 Device User Guide V02.09, which details all registers, electrical characteristics, and the 112-LQFP pinout.
What are the key specifications of MC9S12DG128MPV that engineers should know?
Key specifications: HCS12 16-bit CISC core at 25 MHz; 128KB (128K x 8) Flash program memory; 8KB RAM; 2KB EEPROM; 91 general-purpose I/O; CANbus, I2C, SCI, and SPI interfaces; 8-channel PWM and watchdog timer; two 8-channel 10-bit ADCs; 5V operation (2.5V support); 112-LQFP 20 x 20 mm surface-mount package; part status Obsolete. These figures come from distributor parametric listings cross-checked against the Motorola device user guide.
What can replace MC9S12DG128MPV in an existing design?
In an existing design, drop-in replacements are MC9S12DG128MPVE (identical die, lead-free variant) and MC9S12DG128BCPVE (same die/package, different ordering grade), both requiring no PCB change. MC9S12DG256MPV adds 256KB Flash in the same footprint. If redesign is acceptable, NXP's S12G-family (e.g., S12G128) offers modern equivalents but with different pinout. Verify pinout, supply requirements, and flash programming support for any substitution, and validate a sample on real hardware before volume orders.
How do I debug the MC9S12DG128MPV?
The MC9S12DG128MPV is debugged through the single-wire Background Debug Mode (BDM) interface on the BKGD/MODC pin, using NXP's standard 6-pin BDM header and tools such as P&E Microconnection's Multilink or the classic P&E BDM Multilink with CodeWarrior IDE. Per the Motorola device user guide section on BKGD/TAGHI/MODC, background debug is non-intrusive and works even with the application running, letting you read memory, set breakpoints, and flash-program the device in-circuit.
Is MC9S12DG128MPV RoHS compliant and lead-free?
The base MC9S12DG128MPV was released before lead-free conversion; the RoHS-compliant, lead-free equivalent is the MC9S12DG128MPVE suffix variant, which NXP lists on its product page. Distributor listings for the MPVE indicate RoHS/lead-free status, while the MPV itself should be treated as non-RoHS (tin-lead plating) unless marked otherwise. For compliance-driven programs, order the MPVE suffix and request the certificate of conformance from the distributor as of 2026-10-18.

엔지니어링 참조 데이터: MC9S12DG128MPV — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the MC9S12DG128MPV only for maintenance of existing automotive or industrial designs already built around the DG128, since the part is Obsolete and best sourced as remaining stock or Rochester Electronics continuation builds. If your PCB must stay unchanged, order MC9S12DG128MPVE for RoHS-required builds (identical die, lead-free) or MC9S12DG128BCPVE when the ordering grade difference is acceptable - both are pin-to-pin drop-ins. If firmware needs more than 128KB, MC9S12DG256MPV doubles Flash in the same footprint with minimal redesign risk. Only if a PCB respin is possible should you evaluate the A-family (MC9S12A256CPVE, more Flash but different peripheral multiplexing) or NXP's newer S12G/S12P families for new designs. Always validate flash programming algorithms and mode-pin strapping on real hardware before committing to a substitute.

대체품과의 비교

파라미터 이 제품 MC9S12DG128MPVE MC9S12DG128BCPVE MC9S12DG256MPV MC9S12A256CPVE
Package 112-LQFP (20 x 20 mm) 112-LQFP (20 x 20 mm) - same 112-LQFP (20 x 20 mm) - same 112-LQFP (20 x 20 mm) - same 112-LQFP (20 x 20 mm) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors (Freescale) NXP Semiconductors (Freescale) NXP Semiconductors (Freescale)
Core / Speed HCS12 16-bit, 25 MHz HCS12 16-bit, 25 MHz HCS12 16-bit, 25 MHz HCS12 16-bit, 25 MHz HCS12 16-bit, 25 MHz
Flash Memory 128KB (128K x 8) 128KB (128K x 8) 128KB (128K x 8) 256KB (256K x 8) 256KB (256K x 8)
Connectivity CANbus, I2C, SCI, SPI CANbus, I2C, SCI, SPI CANbus, I2C, SCI, SPI CANbus, I2C, SCI, SPI CANbus, I2C, SCI, SPI

주요 차별점

  • Single-chip CAN integration (vs MC9S12A256CPVE)
  • Lead-free drop-in variant available (vs MC9S12DG128BCPVE)
  • Flash headroom within the same footprint (vs MC9S12DG256MPV)

설계 노트

The MC9S12DG128MPV is Obsolete: any new design-in risks immediate redesign. For maintenance designs, secure a last-time-buy covering the product's remaining service life plus attrition, and qualify MC9S12DG128MPVE (lead-free) in parallel since plating differs. Verify the exact masking/ordering suffix (temperature range, speed grade) on received stock against your original BOM - legacy DG128 parts circulated under multiple suffixes with different grade markings.

The device operates from a 5V rail (2.5V support per listing data - confirm the exact VDDx/VDDR configuration in the Motorola device user guide for your masked variant). Decouple all VDD/VDDA/VDDR pin pairs with 0.1 uF ceramics placed within 5 mm of each pin pair, plus one bulk 10 uF per supply domain. The 5V analog domain of the dual 10-bit ADCs is sensitive to CAN transceiver switching; isolate VDDA with an LC filter and route CAN transceiver ground returns away from the ADC analog ground plane.

Use the single-wire BKGD/MODC background debug pin on a standard 6-pin BDM header for production programming and field diagnostics - it is non-intrusive and requires no JTAG port. Keep the BKGD trace short (under 10 cm) with a weak pullup as specified in the device user guide's BKGD/TAGHI/MODC section. During mode selection at reset, ensure MODC level is stable before the internal reset release; floating mode pins cause intermittent boot failures that mimic firmware bugs.

규정 준수 정보

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
무연
Unknown
무할로겐
Unknown
분쟁 광물
Unknown

The MPV suffix predates lead-free conversion; the RoHS/lead-free equivalent is the MC9S12DG128MPVE suffix per NXP product page. No explicit RoHS/REACH/AEC-Q100 statements for the MPV appear in the provided data; request certificates from the distributor.

데이터 검증일: 2026-10-18 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

MC9S12DG128MPV MC9S12DG128MPV datasheet PDF NXP MC9S12DG128MPV MC9S12DG128MPV 112-LQFP microcontroller MC9S12DG128MPV drop-in replacement MC9S12DG128MPV equivalent MC9S12DG256 MC9S12DG128MPV price buy MC9S12DG128 128KB flash 25MHz 16-bit MCU HCS12 automotive CAN microcontroller 5V what can replace MC9S12DG128MPV MC9S12DG128MPV obsolete last time buy MC9S12DG128 pinout 112 LQFP

관련 부품 & 용어

NXP Semiconductors Freescale Semiconductor Motorola MC9S12DG128MPV MC9S12DG128MPVE MC9S12DG128BCPVE MC9S12DG256MPV MC9S12A256CPVE HCS12 microcontroller 16-bit CISC CANbus 112-LQFP LQFP package family surface mount BDM background debug mode PWM 10-bit ADC automotive multiplexing Rochester Electronics DigiKey Mouser Electronics CodeWarrior obsolete / last-time-buy
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