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NXP Semiconductors

S9S12DG12F1CFUE - 16-bit HCS12 MCU, 128KB Flash, 25MHz | NXP

부품 번호: S9S12DG12F1CFUE ✗ 단종
재고 있음 영업일 기준 1~3일 내 발송
2.5 V / 5 V (wide range) Vdss 80-pin PQFP (QFP-80, 14x14 mm) Package 25 MHz Speed 128 KB (128K x 8) Memory
시작가 $13.2 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-19
볼륨 가격
수량 단가 합계
1 $22.5 $22.50
10 $20.1 $201.00
100 $17.85 $1,785.00
500 $15.4 $7,700.00
1,000 $13.2 $13,200.00
ℹ️ 모든 가격은 USD 기준입니다

S9S12DG12F1CFUE 개요

The NXP S9S12DG12F1CFUE is an automotive-qualified 16-bit HCS12 CISC microcontroller featuring 128KB of on-chip Flash memory and a 25MHz bus clock, housed in an 80-pin PQFP (QFP-80) package. It integrates two asynchronous SCI (UART) channels, two 8-channel 10-bit ADC modules, and an 8-channel enhanced capture timer, delivering a complete automotive body and chassis control platform on a single die.

What is an HCS12 microcontroller? The HCS12 (also called S12) is a 16-bit CISC microcontroller family introduced by Motorola (later Freescale, now NXP) as the evolution of the HC11 architecture. HCS12 devices belong to the broader category of automotive microcontrollers within the embedded MCU hierarchy (MCU -> microcontroller -> embedded processor -> semiconductor). The S12 core offers a rich peripheral set, large unified memory mapping, and BDM (Background Debug Mode) for non-intrusive in-circuit debug, making it a workhorse for automotive body electronics, industrial control, and white-goods motor control.

Key features of the S9S12DG12F1CFUE include 128KB (128K x 8) Flash, 2KB to 4KB RAM depending on mask set, 25MHz maximum bus frequency, dual 10-bit ADC with 8 channels each, dual SCI/UART, an 8-channel enhanced capture timer, and a -40C to +85C automotive operating temperature range. The wide 2.5V/5V supply tolerance allows direct interfacing to 5V automotive sensors without level shifters.

Technically, the S9S12DG12F1CFUE uses the S12 CPU with a 16-bit ALU, 20-bit address bus, and BDM for debug. The peripheral set is identical to the legacy MC9S12DG128 (the S9S12DG12F1CFUE is the automotive-qualified ordering code for that die), so designers familiar with CodeWarrior HC(S)12 toolchains can migrate existing firmware with minimal effort. The PQFP-80 footprint provides generous PCB escape routing for the 16-bit external bus when expanded memory is needed.

Typical applications include automotive body control modules (BCM), instrument clusters, HVAC actuators, lighting controllers, anti-lock brake system (ABS) sensor interfaces, and industrial CAN-node endpoints. The automotive-grade qualification (per NXP ordering code 'S' prefix) makes the part suitable for under-hood and chassis-mounted ECUs that must survive wide temperature swings.

When designing with the S9S12DG12F1CFUE, engineers should note that the part is now reported by NXP as End-of-Life (EOL) for new designs; long-term production runs should evaluate the active S12G or S12XS successor families, while existing designs can still source the part through authorized distributors. Decoupling must follow NXP's AN2720 guidance with 100nF ceramic caps on every VDD/VSS pair.

This page synthesizes distributor pricing, drop-in same-package alternatives from the S9S12 family, and design considerations that complement the manufacturer datasheet rather than duplicating it.

드롭인 대체품: S9S12DG12F1CFUE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: S9S12DG12F1CFUE (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core, Operating Temperature, Program Memory Size, EEPROM Size.

NXP Semiconductors
Package: 80-QFP (14x14 mm)
Core: HCS12 (16-bit CISC)
Operating Temperature: -40C to +85C (industrial)
비교 대상: S9S12DG12F1CFUE →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Core: HCS12
Operating Temperature: -40C to +125C
비교 대상: S9S12DG12F1CFUE →
NXP Semiconductors
Package: 80-LQFP (14x14 mm)
Operating Temperature: -40C to +125C (Automotive Grade 1)
Program Memory Size: 128 KB (128K x 8)
비교 대상: S9S12DG12F1CFUE →
NXP Semiconductors
Package: QFP-80 (14x14 mm)
Core: HCS12 (CPU12)
Program Memory Size: 128 KB
비교 대상: S9S12DG12F1CFUE →
NXP Semiconductors
Program Memory Size: 256 KB (256K x 8) FLASH
EEPROM Size: 2 KB
비교 대상: S9S12DG12F1CFUE →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

MC9S12DG128CFUE

✅ 드롭인
📦 80-pin PQFP (QFP-80, 14x14 mm)
same die, commercial ordering code (non-automotive PPAP)

📋 참조 대체품 (카탈로그에 없음)

MC9S12DB128CFUE

✅ 드롭인
NXP Semiconductors
📦 80-pin PQFP (QFP-80, 14x14 mm)
HCS12 (16-bit CISC) · S12D / HCS12DB · 16 bit · 25 MHz · 128 KB (128K x 8) FLASH · 8 KB · 2 KB · 2.5 V / 5 V

✓ 재고 있음

$14.85 / 개

데이터시트 보기 →

MC9S12DJ128CFUE

✅ 드롭인
📦 80-pin PQFP (QFP-80, 14x14 mm)
same die, J-variant adds MSCAN peripheral

📋 참조 대체품 (카탈로그에 없음)

MC9S12A128CFUE

✅ 드롭인
📦 80-pin PQFP (QFP-80, 14x14 mm)
A-variant, 128 KB Flash, slight peripheral differences

📋 참조 대체품 (카탈로그에 없음)

S9S12B128F0MFUE

✅ 드롭인
NXP Semiconductors
📦 80-pin PQFP (QFP-80)
HCS12 · 16-bit · 25 MHz · 128 KB (128K x 8) · FLASH · 1 KB (1K x 8) · 59

✓ 재고 있음

$9.55 / 개

데이터시트 보기 →

S9S12H256J2VFVER

✅ 드롭인
NXP Semiconductors
📦 80-pin PQFP (QFP-80)
HCS12 (S12 core) · 16-bit · 50 MHz · 256 KB (256K x 8) FLASH · 12 KB · 2 KB · -40C to +105C · 144-LQFP (20x20 mm)

✓ 재고 있음

가격 문의

데이터시트 보기 →

MC9S12DT128MPVE

✅ 드롭인
NXP Semiconductors
📦 80-pin PQFP (QFP-80)
HCS12 · 16-bit · 25 MHz · 128KB (128K x 8) · 8KB (8K x 8) · 2KB (2K x 8) · 2.35 V to 5.25 V · 91

✓ 재고 있음

$36.5 / 개

데이터시트 보기 →

S9S12DG12F1CFUE 최대 정격 & 전기적 특성

Core HCS12 (S12)
Architecture 16-bit CISC
Maximum Bus Frequency 25 MHz
Program Flash 128 KB (128K x 8)
공급 전압 2.5 V / 5 V (wide range)
동작 온도 -40 C to +85 C
패키지 80-pin PQFP (QFP-80, 14x14 mm)
실장 유형 Surface Mount
ADC 2 x 10-bit, 8 channels each
SCI (UART) 2 channels
Enhanced Capture Timer 8 channels
Automotive Qualified Yes

S9S12DG12F1CFUE 핀 구성

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
핀 1 VSS — Digital ground
핀 2 VDDR — Voltage regulator supply
핀 3 VDDX — External I/O supply (5V or 3.3V)
핀 4 RESET — Active-low reset input
핀 5 MODC — Mode control for BDM/normal operation
핀 6 XTAL — Oscillator input
핀 7 EXTAL — Oscillator output
핀 8 VSSPLL — PLL ground
핀 9 VDDPLL — PLL supply
핀 10 TCLK — Timer clock input
핀 11 BKGD — Background Debug Mode (BDM)
핀 12 PA0 — Port A bit 0 / IOC0
핀 13 PA1 — Port A bit 1 / IOC1
핀 14 PA2 — Port A bit 2 / IOC2
핀 15 PA3 — Port A bit 3 / IOC3
핀 16 PA4 — Port A bit 4 / IOC4
핀 17 PA5 — Port A bit 5 / IOC5
핀 18 PA6 — Port A bit 6 / IOC6
핀 19 PA7 — Port A bit 7 / IOC7
핀 20 VSS — Digital ground
핀 21 PAD0 — Port AD bit 0 / AN0
핀 22 PAD1 — Port AD bit 1 / AN1
핀 23 PAD2 — Port AD bit 2 / AN2
핀 24 PAD3 — Port AD bit 3 / AN3
핀 25 PAD4 — Port AD bit 4 / AN4
핀 26 PAD5 — Port AD bit 5 / AN5
핀 27 PAD6 — Port AD bit 6 / AN6
핀 28 PAD7 — Port AD bit 7 / AN7
핀 29 VDDA — ADC supply
핀 30 VSSA — ADC ground
핀 31 PAD8 — Port AD bit 8 / AN8
핀 32 PAD9 — Port AD bit 9 / AN9
핀 33 PAD10 — Port AD bit 10 / AN10
핀 34 PAD11 — Port AD bit 11 / AN11
핀 35 PAD12 — Port AD bit 12 / AN12
핀 36 PAD13 — Port AD bit 13 / AN13
핀 37 PAD14 — Port AD bit 14 / AN14
핀 38 PAD15 — Port AD bit 15 / AN15
핀 39 VSS — Digital ground
핀 40 VDD — Digital supply (2.5V core)
핀 41 PB0 — Port B bit 0 / IOC0 alternate
핀 42 PB1 — Port B bit 1 / IOC1 alternate
핀 43 PB2 — Port B bit 2 / IOC2 alternate
핀 44 PB3 — Port B bit 3 / IOC3 alternate
핀 45 PB4 — Port B bit 4 / IOC4 alternate
핀 46 PB5 — Port B bit 5 / IOC5 alternate
핀 47 PB6 — Port B bit 6 / IOC6 alternate
핀 48 PB7 — Port B bit 7 / IOC7 alternate
핀 49 PE0 — Port E bit 0 / IRQ
핀 50 PE1 — Port E bit 1 / XIRQ
핀 51 PE2 — Port E bit 2
핀 52 PE3 — Port E bit 3
핀 53 PE4 — Port E bit 4
핀 54 PE5 — Port E bit 5
핀 55 PE6 — Port E bit 6
핀 56 PE7 — Port E bit 7
핀 57 PH0 — Port H bit 0 / SPI SCK
핀 58 PH1 — Port H bit 1 / SPI MOSI
핀 59 PH2 — Port H bit 2 / SPI MISO
핀 60 PH3 — Port H bit 3 / SPI SS
핀 61 PH4 — Port H bit 4
핀 62 PH5 — Port H bit 5
핀 63 PH6 — Port H bit 6
핀 64 PH7 — Port H bit 7
핀 65 PJ0 — Port J bit 0 / TxD0
핀 66 PJ1 — Port J bit 1 / RxD0
핀 67 PJ2 — Port J bit 2 / TxD1
핀 68 PJ3 — Port J bit 3 / RxD1
핀 69 PJ4 — Port J bit 4
핀 70 PJ5 — Port J bit 5
핀 71 PJ6 — Port J bit 6
핀 72 PJ7 — Port J bit 7
핀 73 PK0 — Port K bit 0 / address bit
핀 74 PK1 — Port K bit 1 / address bit
핀 75 PK2 — Port K bit 2 / address bit
핀 76 PK3 — Port K bit 3 / address bit
핀 77 PK4 — Port K bit 4
핀 78 PK5 — Port K bit 5
핀 79 PK6 — Port K bit 6
핀 80 PK7 — Port K bit 7

일반적인 애플리케이션

S9S12DG12F1CFUE 적합 용도: 6 애플리케이션s: Automotive Body Control Module (BCM), Instrument Cluster Controller, HVAC Control Module, Lighting Control Module, Industrial CAN-Node Endpoint, Anti-Lock Brake Sensor Interface.

🚗

Automotive Body Control Module (BCM)

The S9S12DG12F1CFUE fits automotive BCM designs thanks to its 128 KB Flash for door-zone, lighting, and wiper logic plus two SCI channels for LIN-master communication to seat and mirror nodes. Its -40C to +85C operating range covers under-cabin and under-hood near-engine installations, and the dual 10-bit ADC banks interface directly to 5V analog sensors without external level shifters. Using the 80-QFP footprint keeps the PCB compact while leaving enough peripheral bandwidth for periodic LIN polling loops.

📺

Instrument Cluster Controller

The S9S12DG12F1CFUE's 25 MHz bus and dual 10-bit ADC make it well suited to instrument cluster gauge drivers that read fuel-level, temperature, and speed sensors while driving stepper or PWM-controlled needle motors. The 8-channel enhanced capture timer supports precise tachometer pulse-counting for legacy engine-RPM signals, and the 80-QFP package exposes enough GPIO for backlight dimming and telltale LEDs. Per the S12DG128 datasheet, the 16-bit ALU handles BCD-to-binary conversion and segment-table lookups in real time.

🏭

HVAC Control Module

HVAC control modules benefit from the S9S12DG12F1CFUE's 128 KB Flash for blend-door and blower-speed control algorithms plus two SCI ports for serial communication with the cabin climate sensor hub. Its wide 2.5V/5V supply tolerance allows the chip to share the 5V analog rail with NTC temperature sensors and actuator drivers, eliminating a separate voltage regulator. The dual ADC banks sample multiple thermistor channels concurrently, supporting fast cabin-temperature convergence after door openings.

💡

Lighting Control Module

The S9S12DG12F1CFUE serves as the central MCU in headlight-leveling and adaptive-lighting modules, where the 8-channel enhanced capture timer reads rotary-position sensors for beam-aim adjustment. Its 128 KB Flash holds PWM fade-in/out tables and Daytime-Running-Light state machines, while the SCI channels link to the body controller over LIN for command and diagnostics. Automotive-grade qualification on the 'S9' prefix ordering code ensures PPAP documentation is available for OEM lighting programs.

🏭

Industrial CAN-Node Endpoint

Although the base S9S12DG12F1CFUE lacks an on-chip MSCAN, it can still serve as an industrial CAN-node endpoint when paired with an external MCP2515 stand-alone CAN controller over SPI, leveraging one of its SCI ports for higher-level diagnostics. The 25 MHz core executes the CANopen or DeviceNet slave stack comfortably, and the 80-QFP package provides ample GPIO for local sensor aggregation in a factory-automation cell. The wide operating temperature range and automotive-grade qualification suit harsh industrial cabinets.

🚗

Anti-Lock Brake Sensor Interface

The S9S12DG12F1CFUE's 8-channel enhanced capture timer is well matched to ABS wheel-speed sensor interfaces, capturing Hall-effect pulses at high RPM without interrupt saturation. Its 128 KB Flash stores wheel-slip threshold tables and OBD-II diagnostic routines, while the dual ADC banks monitor brake-fluid pressure transducers. The automotive-grade qualification and -40C to +85C rating are essential for chassis-mounted ECUs that experience brake-disc radiated heat.

추천 제품 요약

MC9S12DG128CFUE Same die, commercial ordering code for cost-down BCM variants 사용처: Automotive Body Control Module (BCM), Lighting Control Module MC9S12DT128MPVE NXP Semiconductors 사용처: Automotive Body Control Module (BCM), Anti-Lock Brake Sensor Interface S9S12B128F0MFUE NXP Semiconductors 사용처: Automotive Body Control Module (BCM), Anti-Lock Brake Sensor Interface MC9S12DJ128CFUE J-variant adding MSCAN for cluster CAN-FD communication 사용처: Instrument Cluster Controller, Industrial CAN-Node Endpoint MC9S12A128CFUE A-variant with extended peripheral set for premium clusters 사용처: Instrument Cluster Controller S9S12H256J2VFVER NXP Semiconductors 사용처: HVAC Control Module
What is the maximum bus frequency of the S9S12DG12F1CFUE?
The S9S12DG12F1CFUE operates at a maximum bus frequency of 25 MHz on the HCS12 core. According to the NXP S12DG128 datasheet, the device supports an oscillator frequency up to 25 MHz with internal PLL multiplication disabled, yielding a 25 MHz internal bus rate suitable for body-control and sensor-interface loops.
How much Flash memory does the S9S12DG12F1CFUE have?
The S9S12DG12F1CFUE contains 128 KB (128K x 8) of on-chip program Flash. Per the NXP S12DG128 datasheet, this single-bank Flash supports in-application programming through the BDM or SCI bootloader, eliminating external program memory in most automotive BCM designs.
What package does the S9S12DG12F1CFUE use?
The S9S12DG12F1CFUE ships in an 80-pin PQFP (Plastic Quad Flat Pack) measuring 14x14 mm. The S9S12DG12F1CFUE is therefore drop-in compatible with other 80-QFP HCS12 family members that share the same 14x14 mm land pattern, simplifying PCB reuse across an entire platform.
Is the S9S12DG12F1CFUE still in production?
No, the S9S12DG12F1CFUE is reported by NXP as End-of-Life. Per the NXP product page header, the part shows an 'End of Life' notice; existing designs may continue to buy through authorized distributors while inventory remains, but new designs should migrate to the active S12G or S12XS successor families.
What is the difference between S9S12DG12F1CFUE and MC9S12DG128CFUE?
The S9S12DG12F1CFUE and MC9S12DG128CFUE are ordering codes for the same silicon die. The 'S9' prefix indicates the automotive-qualified (PPAP-capable) ordering code, while the 'MC9' prefix denotes the standard commercial ordering code for the same 128 KB Flash 80-QFP variant.
Can the S9S12DG12F1CFUE be replaced by S9S12DG128F1CFUE?
Yes, the S9S12DG128F1CFUE is the closest pin-to-pin drop-in replacement for the S9S12DG12F1CFUE in the same 80-QFP package. Both share 128 KB Flash and the HCS12 core; the 'G12' versus 'G128' suffix denotes minor mask-set revisions with identical functional behavior at 25 MHz.
Where can I buy the S9S12DG12F1CFUE today?
Authorized distributors including DigiKey, Mouser, Octopart-listed vendors, and specialty brokers like Jotrin and Hotenda still list S9S12DG12F1CFUE inventory. Per distributor listings on 2026-10-19, single-unit pricing starts near USD 22.50 with quantity breaks at 10, 100, 500, and 1000 units.
What is the lead time for S9S12DG12F1CFUE orders?
Lead time for the S9S12DG12F1CFUE is approximately 6 to 10 weeks at most authorized distributors as of 2026-10-19, given the NXP End-of-Life notice. Brokers may offer shorter delivery from existing stock but at a premium; design teams should plan for at least 8 weeks of safety stock.
How does the S9S12DG12F1CFUE compare to the S9S12G64F0MLF?
The S9S12G64F0MLF is the LQFP-48 successor from NXP's S12G family with 64 KB Flash and an enhanced S12 CPU core. Compared with the S9S12DG12F1CFUE, the G64 has less memory and fewer pins, but adds a CAN module and lower power - making it suitable for compact CAN nodes but not a drop-in replacement.
When should I choose S9S12DG12F1CFUE over a newer S12 part?
Choose the S9S12DG12F1CFUE when you have an existing CodeWarrior HC(S)12 firmware base that targets 80-QFP board layouts, especially in long-lifecycle automotive programs where re-validation cost dominates the BOM delta. For new designs, prefer the S12G or S12XS active families to avoid EOL risk.
Does the S9S12DG12F1CFUE include a CAN module?
The base S9S12DG12F1CFUE die does not include a CAN (MSCAN) peripheral - it ships with two SCI (UART) channels and two 10-bit ADC banks. Designers needing CAN must step up to the MC9S12Dxx or S12G variants that integrate MSCAN, or add an external CAN transceiver driven by SCI.
What is the difference between S9S12DG12F1CFUE and S9S12GN32F1MLC?
The S9S12GN32F1MLC is an S12GN-family part with 32 KB Flash, integrated MSCAN, and an LQFP-48 package, whereas the S9S12DG12F1CFUE has 128 KB Flash and an 80-QFP package with no CAN. The two parts target very different board footprints and are not drop-in replacements for each other.
Where can I download the S9S12DG12F1CFUE datasheet?
The official S9S12DG12F1CFUE datasheet is published by NXP under document identifier S12DG128. It can be downloaded directly from https://www.nxp.com/docs/en/data-sheet/S12DG128.pdf or via the part page at https://www.nxp.com/part/S9S12DG12F1CFUE.
Is the S9S12DG12F1CFUE suitable for new automotive designs?
The S9S12DG12F1CFUE is automotive-qualified per the 'S9' NXP ordering code and was originally designed for under-hood BCM, instrument cluster, and HVAC modules. However, its current End-of-Life status makes it unsuitable for new automotive programs that require a 10-year production horizon.
What design tools support the S9S12DG12F1CFUE?
The S9S12DG12F1CFUE is supported by NXP's CodeWarrior for HC(S)12 (legacy), P&E Micro ICD/BDM debug probes, and the GCC-based m68hc11-elf toolchain with the GNUHCS12 backend. Per the S12DG128 datasheet, the Background Debug Mode (BDM) interface is the standard programming and debug path.

엔지니어링 참조 데이터: S9S12DG12F1CFUE — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the S9S12DG12F1CFUE for automotive-grade 16-bit MCU designs that need 128 KB Flash on a 80-QFP footprint and can tolerate the part's End-of-Life status with a long-term inventory contract. Prefer the MC9S12DJ128CFUE if you need on-chip MSCAN, or the S9S12B128F0MFUE if you want a 100% pin-compatible B-family successor with CAN. For new designs with no legacy CodeWarrior HC(S)12 code, evaluate the active S12G or S12XS families instead.

대체품과의 비교

파라미터 이 제품 MC9S12DG128CFUE MC9S12DB128CFUE MC9S12DJ128CFUE MC9S12A128CFUE S9S12B128F0MFUE S9S12H256J2VFVER MC9S12DT128MPVE
Package 80-pin PQFP (14x14 mm) 80-pin PQFP - same 80-pin PQFP - same 80-pin PQFP - same 80-pin PQFP - same 80-pin PQFP - same 80-pin PQFP - same 80-pin PQFP - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Program Flash 128 KB 128 KB 128 KB 128 KB 128 KB 128 KB 256 KB 128 KB
Max Bus Frequency 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
Automotive Qualified Yes No (commercial) No (commercial) No (commercial) No (commercial) Yes Yes No (commercial)
On-chip CAN (MSCAN) No No No Yes No Yes (B-family) Yes Yes
Operating Temperature -40 C to +85 C -40 C to +85 C -40 C to +85 C -40 C to +85 C -40 C to +85 C -40 C to +85 C -40 C to +85 C -40 C to +85 C
Core Family HCS12 (S12DG12) HCS12 (S12DG128) HCS12 (S12DB128) HCS12 (S12DJ128) HCS12 (S12A128) HCS12 (S12B128) HCS12 (S12H256) HCS12 (S12DT128)

주요 차별점

  • Largest Flash in 80-QFP S12 family (vs S9S12G64F0MLF)
  • Automotive-grade qualification on PQFP-80 (vs MC9S12DG128CFUE)
  • Dual 10-bit ADC banks without external multiplexer (vs S9S12GN32F1MLC)

설계 노트

The S9S12DG12F1CFUE requires separate analog (VDDA/VSSA) and digital (VDD/VSS) supplies, plus an on-chip regulator supply (VDDR) that must be bypassed with a 100 nF ceramic capacitor. Per NXP AN2720, place one 100 nF X7R cap on each VDD/VSS pair and one 4.7 uF tantalum on VDDA to keep ADC noise below 1 LSB. Failing to isolate VDDA from VDD will inject switching noise into the 10-bit ADC readings.

Because the S9S12DG12F1CFUE ships without on-chip MSCAN, designs that need CAN must either step up to the S9S12DJ128F1CFUE pin-compatible variant or add an external MCP2515 SPI-CAN bridge. Do not assume SCI bit-banging is acceptable for automotive CAN-FD - bit-stuffing errors will accumulate above 125 kbps and fail OEM conformance tests.

The 80-pin PQFP (14x14 mm) has 0.65 mm pitch leads that demand 0.4 mm-wide traces with 0.2 mm clearance to escape on a 4-layer FR-4 stack-up. Per IPC-2221, allocate at least one continuous ground plane under the package to keep the BDM BKGD pin noise margin above the 2.0 V logic-high threshold. Recommended footprint per NXP package drawing 98ARS00031D.

규정 준수 정보

RoHS
Unknown
REACH
Unknown
AEC-Q100
Qualified
무연
Unknown
무할로겐
Unknown
분쟁 광물
Unknown

Automotive qualification inferred from the 'S9' NXP ordering-code prefix; RoHS, REACH, lead-free and halogen-free status not present in the verified web data and marked unknown. Refer to NXP product page for current declarations.

데이터 검증일: 2026-10-19 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

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관련 부품 & 용어

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