S9S12HZ64J3CAL - 16-Bit 64KB Flash 50MHz MCU | NXP
부품 번호: S9S12HZ64J3CAL ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
S9S12HZ64J3CAL 개요
A microcontroller is a programmable semiconductor that integrates a CPU, memory, peripherals, and input/output resources on one integrated circuit. In the product hierarchy, the S9S12HZ64J3CAL is an MCU, a type of embedded controller, and a member of the semiconductor category. Its 16-bit S12 core is intended for real-time control rather than general-purpose computing, making it relevant to instrument clusters, actuator controllers, body electronics, and industrial automation equipment.
The supplied technical data identifies 64 KB of flash memory, a 50 MHz operating frequency, a -40 °C to +85 °C temperature range, and automotive qualification. These values support firmware storage and higher-rate control tasks, while the wide temperature range supports operation across industrial and automotive environments. The 112-pin LQFP package provides a substantial number of external connections compared with smaller MCU packages, which is useful when a design requires numerous I/O, communication, or mixed-signal resources.
The verified snippets do not specify RAM size, supply voltage, ADC resolution, communication peripherals, timer counts, watchdog behavior, or detailed electrical limits. Those values must be confirmed from the official manufacturer datasheet before final schematic or firmware design. The listed product page identifies the part as end-of-life, so procurement and engineering teams should plan around availability rather than assume a long-term active roadmap.
Typical design uses include automotive body and powertrain-adjacent control modules, industrial instrumentation, motor and actuator control, sensor-conditioning systems, and communication gateways. In these applications, the MCU executes control software, reads inputs, drives outputs, and coordinates timing-sensitive peripheral activity. The 112-pin package is particularly relevant when external memory, transceivers, analog interfaces, or several communication peripherals are required.
For a new design, preserve the exact package footprint, power architecture, clocking strategy, and peripheral mapping until the manufacturer documentation is reviewed. A legacy automotive MCU replacement should be validated for pin compatibility, memory requirements, timing behavior, software migration, qualification status, and lifecycle risk rather than selected from the processor frequency alone.
This page summarizes the verified NXP product-page and distributor information while explicitly separating unavailable technical details from confirmed values. It also highlights procurement considerations for an end-of-life component and explains why a true drop-in replacement requires manufacturer-level verification.
드롭인 대체품: S9S12HZ64J3CAL — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: S9S12HZ64J3CAL (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Core, Core Architecture, Supply Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
S9S12HZ128J3VAL
✅ 드롭인✓ 재고 있음
$13.1 / 개
데이터시트 보기 →S912XEQ384J3CALR
✅ 드롭인✓ 재고 있음
$11.4 / 개
데이터시트 보기 →S912XEG384J2CALR
✅ 드롭인✓ 재고 있음
$9.1 / 개
데이터시트 보기 →S912XEQ512J2MAL
✅ 드롭인✓ 재고 있음
$17.95 / 개
데이터시트 보기 →MC9S12XHZ256VAG
✅ 드롭인✓ 재고 있음
$15.2 / 개
데이터시트 보기 →S9S12HZ64J3CAL 최대 정격 & 전기적 특성
| Product Type | 16-bit microcontroller |
| CPU Core | S12 core |
| Flash Memory | 64 KB |
| 최대 클록 주파수 | 50 MHz |
| 동작 온도 범위 | -40 °C to +85 °C |
| Temperature Grade | Industrial, -40 °C to +85 °C |
| Automotive Qualification | Automotive qualified |
| 패키지 | 112-pin LQFP |
| Package Type | LQFP |
| Package Shape | Square |
| Terminal Form | Gull wing |
| Number of Terminals | 112 |
| Manufacturer | NXP Semiconductors |
| Original Brand | Freescale Semiconductor |
| Product Category | Microcontroller |
| Core Architecture | 16-bit |
S9S12HZ64J3CAL square 핀 구성 가이드
S9S12HZ64J3CAL(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: S9S12HZ64J3CAL.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
S9S12HZ64J3CAL 적합 용도: 7 애플리케이션s: Automotive Body Control, Industrial Instrumentation, Motor and Actuator Control, Sensor Acquisition Systems, Communication Gateway Modules, Instrument Cluster and Dashboard Control, Legacy Automotive Test and Repair.
Automotive Body Control
The S9S12HZ64J3CAL fits legacy automotive body-control and instrumentation platforms that need a 16-bit S12 core, 64 KB flash, and a 112-pin LQFP package. Its verified automotive qualification and -40 °C to +85 °C temperature range support controlled embedded operation in vehicle environments. A controller in this class may manage switch inputs, actuator outputs, diagnostic logic, and communication tasks. The exact peripheral resources and electrical limits must be confirmed from the NXP datasheet before implementation.
추천
Industrial Instrumentation
For industrial instrumentation, the S9S12HZ64J3CAL provides a 16-bit embedded-control core, 64 KB flash, and 112-pin LQFP footprint for systems requiring multiple external connections. It can be evaluated for data acquisition, signal conditioning, monitoring, and local control functions where deterministic firmware execution is useful. The -40 °C to +85 °C operating range is relevant to industrial environments, but EMC, ESD, supply-voltage, and sensor-interface requirements are not specified in the verified excerpts and must be validated.
추천
Motor and Actuator Control
The MCU can be considered for motor, actuator, and electromechanical control systems that require a compact embedded controller with a 50 MHz-class S12 core and ample package I/O. A 112-pin LQFP can support external drivers, position sensors, protection logic, and communication interfaces, although the actual peripheral allocation is not provided in the search excerpts. Firmware and board design must be checked against the official pinout and electrical specification before connecting power stages or safety-related actuators.
추천
Sensor Acquisition Systems
S9S12HZ64J3CAL is a candidate for sensor-acquisition and monitoring modules that combine local signal processing with external interface electronics. Its 16-bit CPU architecture and 50 MHz maximum frequency provide a defined control-processing target, while the 112-pin package offers more I/O opportunities than a small leaded package. ADC characteristics, input voltage ranges, timers, and communication interfaces are not confirmed in the supplied data, so analog front-end selection and sampling architecture must remain provisional until the datasheet is reviewed.
추천
Communication Gateway Modules
The MCU may be used in legacy communication gateways or distributed control nodes where a 16-bit embedded processor, local firmware storage, and a high-pin-count package are useful. The available verified material does not list CAN, LIN, SPI, UART, Ethernet, or other interface resources, so communication suitability cannot be established from frequency and package data alone. Engineers should use the complete peripheral table, pin multiplexing data, and electrical limits from NXP documentation before selecting this device for a network-specific design.
추천
Instrument Cluster and Dashboard Control
The S9S12HZ64J3CAL can be evaluated for dashboard, cluster, and operator-interface control functions that combine local logic with external display or input devices. Its automotive-qualified status and -40 °C to +85 °C range align with vehicle-oriented environments, while the 112-pin LQFP package provides a high pin count for peripheral expansion. The verified data does not specify display interfaces, memory type, or timing peripherals; therefore, any display bus or human-interface design requires direct datasheet confirmation.
추천
Legacy Automotive Test and Repair
Because the NXP page identifies S9S12HZ64J3CAL as end-of-life, it is particularly relevant to maintaining and repairing existing automotive electronic modules rather than starting an unrestricted new platform. The confirmed 16-bit architecture, 64 KB flash, 50 MHz class, and 112-pin LQFP footprint can help engineers identify the correct legacy device before board-level testing. Replacement sourcing should include date-code traceability, firmware preservation, schematic comparison, and validation against the original system requirements.
추천
추천 제품 요약
엔지니어링 참조 데이터: S9S12HZ64J3CAL — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | S9S12HZ128J3VAL | S912XEQ384J3CALR | S912XEG384J2CALR | S912XEQ512J2MAL | MC9S12XHZ256VAG |
|---|---|---|---|---|---|---|
| Package | 112-pin LQFP | LQFP-112 | LQFP-112 | LQFP-112 | LQFP-112 | LQFP-112 |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Freescale Semiconductor |
주요 차별점
- Confirmed 64 KB flash allocation for legacy embedded control (vs S9S12HZ128J3VAL)
- Confirmed 50 MHz S12-core processing target (vs S912XEQ384J3CALR)
- Directly identified automotive qualification (vs MC9S12XHZ256VAG)
- Verified 112-pin square gull-wing package description (vs S912XEQ512J2MAL)
설계 노트
Do not treat a matching 112-pin LQFP outline as proof of replacement. Compare every pin number, power domain, alternate function, clock connection, reset behavior, and exposed thermal or ground requirement against the official datasheets. The verified search results do not provide a complete pinout for S9S12HZ64J3CAL or the listed alternatives, so a footprint comparison alone is insufficient. Use schematic capture, ERC checks, and a hardware bring-up review before approving any substitution.
The verified excerpts do not specify the supply voltage, current consumption, internal regulators, or decoupling requirements. Before powering a board, obtain the NXP datasheet and confirm the exact VDD range, I/O voltage domains, power-up sequencing, and required bypass components. Do not infer capacitor values or regulator ratings from the 50 MHz CPU frequency; the external power design must follow the manufacturer’s electrical limits and application guidance.
The supplied data confirms a -40 °C to +85 °C operating range but provides no thermal resistance, maximum junction temperature, or power dissipation data. For an automotive or industrial enclosure, calculate worst-case dissipation from the actual supply and I/O load using the official electrical characteristics, then verify the LQFP copper area and airflow. Thermal validation should include ambient temperature, board construction, solder mask, copper pour, and enclosure conditions.
Use the manufacturer’s land pattern and pin numbering rather than a generic 112-pin LQFP footprint. Confirm pin 1 orientation, package height, lead pitch, solderable pad dimensions, and any thermal or exposed-pad requirement. Maintain short, symmetric routing for clock and high-speed signals, provide a stable ground reference, and keep programming and debug access accessible. After layout, inspect the design against the released NXP package drawing and assembly documentation.
The MCU’s end-of-life status creates both hardware and software continuity risk. Preserve the original toolchain, linker configuration, startup code, calibration data, bootloader, and approved firmware images before sourcing remaining stock. A nominally compatible MCU can still differ in interrupt vectors, memory maps, peripheral behavior, clock initialization, or driver assumptions. Build a regression plan that exercises boot, diagnostics, timing, communications, fault handling, and production programming.
규정 준수 정보
The verified NXP product information identifies S9S12HZ64J3CAL as automotive qualified, but the supplied excerpts do not provide RoHS, REACH, AEC-Q100 grade, lead-free, halogen-free, or conflict-minerals declarations.