SAF1761BE/V1 - Hi-Speed USB 2.0 OTG Controller | NXP | 128-LQFP
부품 번호: SAF1761BE/V1 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $15 | $15.00 |
| 10 | $13.5 | $135.00 |
| 100 | $11.95 | $1,195.00 |
| 500 | $10.5 | $5,250.00 |
| 1,000 | $9.5 | $9,500.00 |
SAF1761BE/V1 개요
A USB controller IC is an interface device that bridges a host processor to the Universal Serial Bus physical layer, handling protocol framing, transaction translation, and electrical signaling. The SAF1761BE/V1 belongs to the USB 2.0 controller family (hypernyms: USB 2.0 controller -> USB interface IC -> peripheral controller -> interface IC -> integrated circuit), enabling embedded microprocessors without native USB hardware to add one or more Hi-Speed USB ports. It operates as a Line/Bus Controller using PCI/CMOS technology and supports three supply rails (1.8V, 3.3V, and 5V) for core logic, I/O, and USB transceiver functions.
Key features include USB 2.0 Hi-Speed compliance (480 Mbps), On-The-Go (OTG) supplement support, a flexible parallel/generic processor interface for connection to virtually any 8/16-bit microcontroller or CPU, integrated PHY, and industrial temperature range (-40C to +85C). The 128-LQFP package supports both production and prototyping designs, while the PCI/CMOS process delivers low power consumption relative to USB controller solutions from this generation.
Architecturally, the SAF1761BE/V1 combines a USB 2.0 transceiver, serial interface engine (SIE), protocol handler, and a generic bus interface in a single die. This integration eliminates external PHY or transceiver components, reducing BOM and PCB area. The OTG controller allows the device to act as either host or peripheral, supporting dual-role operation useful in tablets, portable instrumentation, and industrial handhelds.
Typical applications include embedded USB host ports, industrial data loggers, USB OTG docking stations, portable medical devices, and automotive infotainment peripherals. Designers choose this part when they need a proven USB 2.0 Hi-Speed interface for embedded systems that lack native USB capability.
When designing with this device, allocate adequate PCB area for the 128-LQFP footprint and ensure clean 3.3V and 5V rails with sufficient decoupling. The parallel host interface pins must be routed to the host CPU data/address bus following standard bus-length and impedance guidelines.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: SAF1761BE/V1 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ISP1761BE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ISP1761BE/QM,518
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SAF1761BE/V1,557
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SAF1761BE/V1,518
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SAF1761BE/V1 사양
| Product Type | USB 2.0 Hi-Speed Controller |
| USB Standard | USB 2.0 with OTG supplement |
| Maximum Data Rate | 480 Mbps (Hi-Speed) |
| Host Interface | Generic Parallel / OTG |
| Supply Voltage - Operating | 1.8 V / 3.3 V / 5 V |
| 동작 온도 범위 | -40 C to +85 C (Industrial) |
| Technology | PCI, CMOS |
| Device Type | Line / Bus Controller |
| Protocol | USB |
| 패키지 | 128-LQFP (14x20 mm) |
| Terminal Form | GULL WING |
| Number of Terminals | 128 |
| Package Code | LFQFP / PQFP128 (MS-026) |
| 실장 유형 | Surface Mount |
SAF1761BE/V1 lfqfp / pqfp128 (ms-026) 핀 구성 가이드
SAF1761BE/V1(lfqfp / pqfp128 (ms-026) 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: SAF1761BE/V1.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
SAF1761BE/V1 적합 용도: 7 애플리케이션s: Embedded USB Host Port, USB OTG Docking Station, Industrial Data Logger, Portable Medical Device, Automotive Infotainment Peripheral, USB-to-Serial Bridge Module, Test and Measurement Instrumentation.
Embedded USB Host Port
The SAF1761BE/V1's USB 2.0 Hi-Speed controller and generic parallel processor interface make it ideal for adding USB host functionality to embedded microcontrollers (e.g., NXP LPC, Microchip PIC32MX, Renesas RX) that lack native USB 2.0 Hi-Speed capability. Operating at 480 Mbps, it supports mass-storage class (MSC) devices, USB keyboards, and USB-to-UART bridges in industrial HMIs. The 128-LQFP 14x20 mm package fits standard 4-layer embedded PCBs, and the -40C to +85C industrial temperature range handles factory-floor and outdoor installations. Decoupling 3.3V and 5V rails is essential because USB Hi-Speed signaling has tight supply-noise requirements.
추천
USB OTG Docking Station
The SAF1761BE/V1's USB 2.0 OTG support enables dual-role operation in docking stations where a portable device can act as either host or peripheral depending on cable orientation. The integrated PHY eliminates external transceiver components, reducing BOM cost. Operating from 1.8V/3.3V/5V rails, it pairs directly with 3.3V MCUs without level shifters on the parallel bus. The 128-LQFP package supports 480 Mbps Hi-Speed transfers between docked devices and the station's storage, suitable for tablet-to-printer or scanner-to-tablet docking scenarios.
추천
Industrial Data Logger
The SAF1761BE/V1's industrial temperature range (-40C to +85C) and 128-LQFP ruggedized package suit industrial data loggers that record sensor measurements to USB flash drives. The 480 Mbps Hi-Speed interface supports fast file writes to USB 2.0 MSC-class storage, while the generic parallel host interface connects to low-cost 8/16-bit MCUs that perform A/D conversion and timestamping. Multi-rail (1.8V/3.3V/5V) operation simplifies power design when the host MCU runs at 3.3V and the USB VBUS rail is 5V.
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Portable Medical Device
The SAF1761BE/V1's compact 128-LQFP footprint and CMOS low-power design fit handheld medical devices that upload patient data to USB hosts (PCs, tablets). Hi-Speed USB 2.0 (480 Mbps) accelerates large file transfers from imaging or continuous-monitoring equipment, while OTG support enables connection to USB flash drives for portable record backup. The industrial temperature range accommodates clinical and field environments. Multi-rail 1.8V/3.3V/5V operation is compatible with battery-powered architectures where a 3.3V LDO feeds both the MCU and the SAF1761BE/V1 I/O rails.
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Automotive Infotainment Peripheral
The SAF1761BE/V1's USB 2.0 OTG capability enables vehicle infotainment peripherals that connect USB media sticks, smartphones, or diagnostic tools. The 128-LQFP package is hand-solderable for prototype automotive builds, and the parallel host interface connects to head-unit MCUs running infotainment stacks. While not AEC-Q100 qualified, the -40C to +85C industrial temperature range covers cabin environments. OTG dual-role supports both reading media from USB sticks and exposing the head-unit as a USB device to smartphones for CarPlay/Android Auto bridging at 480 Mbps.
추천
USB-to-Serial Bridge Module
The SAF1761BE/V1's generic parallel host interface makes it suitable as a USB 2.0 Hi-Speed bridge between an embedded target board and a USB host PC, where the embedded MCU uses the parallel bus to send/receive data and the SAF1761BE/V1 handles USB protocol and signaling. The 480 Mbps data rate exceeds legacy USB-to-UART bridges (typically 12 Mbps Full-Speed), enabling fast firmware upload, debug logging, and field-upgrade operations. The 128-LQFP package supports through-hole adapter boards for legacy target systems.
추천
Test and Measurement Instrumentation
The SAF1761BE/V1's Hi-Speed USB 2.0 capability (480 Mbps) enables test equipment to stream digitized measurement data to host PCs in real time. The generic parallel host interface connects to FPGA or DSP front-ends that perform high-speed acquisition, while the SAF1761BE/V1 handles USB protocol and bulk transfer optimization. Industrial -40C to +85C operation supports bench and field test equipment. Multi-rail 1.8V/3.3V/5V supply aligns with typical FPGA/DSP power trees.
추천
추천 제품 요약
엔지니어링 참조 데이터: SAF1761BE/V1 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ISP1761BE | ISP1761BE/QM,518 | SAF1761BE/V1,557 | SAF1761BE/V1,518 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 128-LQFP (14x20 mm) | 128-LQFP - same | 128-LQFP - same | 128-LQFP - same | 128-LQFP - same |
| USB Standard | USB 2.0 Hi-Speed + OTG | USB 2.0 Hi-Speed + OTG | USB 2.0 Hi-Speed + OTG | USB 2.0 Hi-Speed + OTG | USB 2.0 Hi-Speed + OTG |
| Maximum Data Rate | 480 Mbps | 480 Mbps | 480 Mbps | 480 Mbps | 480 Mbps |
| Host Interface | Generic Parallel | PCI / Parallel | PCI / Parallel | Generic Parallel | Generic Parallel |
| Supply Voltage | 1.8V / 3.3V / 5V | 1.8V / 3.3V / 5V | 1.8V / 3.3V / 5V | 1.8V / 3.3V / 5V | 1.8V / 3.3V / 5V |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Lifecycle Status | Active | Active | Active | Active | Active |
주요 차별점
- Generic parallel processor interface for non-PCI hosts (vs ISP1761BE)
- NXP USB controller family drop-in compatibility (vs ISP1761BE/QM,518)
- Integrated USB 2.0 PHY eliminates external transceiver (vs ISP1504 (transceiver only))
설계 노트
The SAF1761BE/V1 requires three supply rails (1.8V core, 3.3V I/O, 5V USB). Each rail must be decoupled locally with at least one 100 nF ceramic capacitor placed within 5 mm of the respective VCC pin, plus a bulk 4.7 uF to 10 uF capacitor. Per the NXP datasheet section on power sequencing, the 1.8V rail should ramp before or simultaneously with the 3.3V rail to avoid latch-up; a simple RC delay or regulator Power-Good signal can enforce this. The 5V VBUS rail must be clean because USB Hi-Speed (480 Mbps) edge rates are sub-ns and supply noise directly degrades signal integrity.
Route the USB DP/DM differential pair with 90 ohm differential impedance and matched trace lengths (delta < 150 mil) directly to the USB connector. Place the 128-LQFP on the top layer with the parallel host bus (D[15:0], address, chip-select, read/write strobes) routed on inner layers to avoid crossing the DP/DM pair. Per NXP application note guidelines, keep the crystal/oscillator traces short and shield them with a ground guard ring. Provide a solid ground plane on layer 2 under the device to reduce EMI on the parallel bus.
Common pitfalls when designing with the SAF1761BE/V1 include: (1) failing to provide the proper 12 MHz or 24 MHz crystal reference - the part will not enumerate without a stable clock; (2) leaving TEST/NRESET pins floating during power-up, which can leave the parallel interface unresponsive; (3) not configuring the OTG ID pin correctly, which prevents dual-role negotiation; (4) using too-small bulk capacitors on the 5V rail, causing VBUS droop during Hi-Speed transmit. Per the NXP datasheet reset chapter, hold RESET low for at least 1 ms after all rails are stable before attempting parallel-bus reads.
규정 준수 정보
Compliance data not provided in the verified web data sources; RoHS/REACH status should be confirmed on the NXP product page or by requesting a compliance certificate from NXP. AEC-Q100 not applicable per available documentation - industrial temperature grade only.
