NXP Semiconductors

S912XHZ256F1VAG - 16-bit MCU, S12X, 256KB Flash, 80MHz | NXP

부품 번호: S912XHZ256F1VAG ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
2.5 V / 5 V Vdss 144-LQFP (20x20 mm) Package 80 MHz Speed 256 KB (256K x 8) Flash Memory
시작가 $13.98 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-09
볼륨 가격
수량 단가 합계
1 $22.5645 $22.56
10 $20.31 $203.10
100 $17.85 $1,785.00
500 $15.42 $7,710.00
1,000 $13.98 $13,980.00
ℹ️ 모든 가격은 USD 기준입니다

S912XHZ256F1VAG 개요

The NXP Semiconductors S912XHZ256F1VAG is a 16-bit HCS12X microcontroller IC featuring an 80 MHz CPU clock, 256 KB (256K x 8) of on-chip Flash, and a 144-pin LQFP (20x20 mm) package designed for automotive and industrial instrument-cluster applications. The device operates over a -40C to +105C temperature range and is qualified for automotive use, making it a drop-in fit for under-the-dash and body-electronics ECUs that demand long-term reliability. The integrated S12X core pairs a 16-bit CISC architecture with an XGATE peripheral co-processor, enabling deterministic, offloaded processing of display and communication tasks.

An automotive microcontroller (MCU) is a microprocessor optimized for vehicle applications, integrating CPU, memory, timers, ADC, communication controllers (CAN, LIN, SPI, SCI), and increasingly LCD/TFT display drivers on a single die. Automotive MCUs typically exceed AEC-Q100 stress-test requirements, support wide supply rails (commonly 2.5V/5V), and include functional-safety features such as watchdog timers and ECC-protected memory. They sit hierarchically between general-purpose MCUs and powertrain-grade MCUs in the broader automotive electronics taxonomy.

Key features of the S912XHZ256F1VAG include the industry's first on-chip TFT display driver for low-end dashboards, support for up to six analog gauges, dot-matrix displays, LCDs, and high-resolution color TFTs, plus an enhanced CAN count versus the legacy S12HZ family. Memory resources include 256 KB Flash and 12 KB RAM alongside 4 KB EEPROM emulation, while peripheral coverage provides MSCAN modules, SPI/SCI, PWM, an ADC, and the XGATE peripheral co-processor for real-time I/O handling.

The S12X architecture layers a second peripheral co-processor (XGATE) alongside the main CPU, which lets the MCU service interrupt-heavy CAN, LIN, and display-refresh traffic without offloading the main thread. This dual-core-in-one-die model was NXP's signature differentiator versus simpler 16-bit competitors and remains attractive for cost-sensitive instrument-cluster designs that need TFT support without committing to a 32-bit ARM core.

Typical applications include automotive instrument clusters with TFT displays, body control modules, HVAC human-machine interfaces, and industrial HMI panels that demand automotive-grade temperature and EMC behavior. Its automotive qualification also makes it suitable for motorcycle dashboards, agricultural equipment HMIs, and marine gauges. Compact design considerations include routing the wide LQFP-144 footprint on a 4-layer PCB and reserving an SPI/I2C bus for the TFT controller side-channel when an external larger TFT is cascaded.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping procurement and design engineers evaluate the S912XHZ256F1VAG for both new designs and field-replacement scenarios.

드롭인 대체품: S912XHZ256F1VAG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: S912XHZ256F1VAG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Core Architecture, Program Memory (Flash), RAM.

NXP Semiconductors
Operating Temperature: -40C to +105C (Automotive)
Core Architecture: HCS12X (16-bit)
Program Memory (Flash): 256 KB (256K x 8)
비교 대상: S912XHZ256F1VAG →
NXP Semiconductors
Package: 64-HLQFP, 10x10 mm with exposed thermal pad
Operating Temperature: -40C to +150C
비교 대상: S912XHZ256F1VAG →
NXP Semiconductors
Package: 64-LQFP (10 mm x 10 mm, 0.5 mm pitch)
Operating Temperature: -40 °C to +85 °C
Core Architecture: HCS12X (16-bit CISC, enhanced S12X)
비교 대상: S912XHZ256F1VAG →
STMicroelectronics
Package: 144-pin PQFP (28 x 28 mm)
Core Architecture: ST10 16-bit CISC with 4-stage pipeline
Program Memory (Flash): 832 Kbytes (832K x 8)
비교 대상: S912XHZ256F1VAG →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

S912XHZ256F1VAGR

✅ 드롭인
📦 144-LQFP (20x20)
Same die/package, Tape and Reel vs Tray packaging - electrical specs identical, 0% deviation in key params

📋 참조 대체품 (카탈로그에 없음)

S912XHZ512F1VAG

✅ 드롭인
📦 144-LQFP (20x20)
Same 144-LQFP, Flash 512 KB (+100%) vs 256 KB, RAM 32 KB vs 12 KB (+167%) - pin-to-pin

📋 참조 대체품 (카탈로그에 없음)

MC9S12XHZ256VAG

✅ 드롭인
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (16-bit) · 80 MHz · 256 KB (256K x 8) · 12 KB · 144-LQFP (20x20 mm) · -40C to +105C (Automotive) · 144 · 4

✓ 재고 있음

$15.2 / 개

데이터시트 보기 →

S912XHZ384F1VAG

✅ 드롭인 ⚠️ 사양 미검증
📦 144-LQFP (20x20)
Same 144-LQFP, Flash 384 KB (+50%) vs 256 KB, same S12X core, same CAN count, pin-to-pin

📋 참조 대체품 (카탈로그에 없음)

S912XEQ384F1VAG

✅ 드롭인 ⚠️ 사양 미검증
📦 144-LQFP (20x20)
Same 144-LQFP footprint, XEQ family has enhanced EEPROM and additional LIN - pin compatible, 5% deviation

📋 참조 대체품 (카탈로그에 없음)

S912XHZ256F1VAG 최대 정격 & 전기적 특성

Core HCS12X (S12X) with XGATE coprocessor
데이터 버스 폭 16-bit
Program Memory Size 256 KB (256K x 8) Flash
RAM Size 12 KB
EEPROM (emulated) 4 KB
Maximum CPU Clock 80 MHz
공급 전압 2.5 V / 5 V
동작 온도 -40C to +105C
패키지 144-LQFP (20x20 mm)
실장 유형 Surface Mount
핀 수 144
Display Capability On-chip TFT driver (up to 6 gauges, color TFT)
CAN Modules Multiple MSCAN channels
AEC-Q100 Automotive qualified
RoHS 상태 Compliant

S912XHZ256F1VAG 핀 구성

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
핀 1 VSS — Ground reference
핀 2 VDDR — Voltage regulator supply
핀 3 VDDX — External supply (5V/3.3V)
핀 4 RESET — External reset input, active low
핀 5 MODC — Mode control
핀 6 BKGD — Background debug mode
핀 7 XTAL — Crystal oscillator input
핀 8 EXTAL — Crystal oscillator output
핀 9 VSS — Ground
핀 10 PAD0 — Port AD bit 0 / ATD input
핀 11 PAD1 — Port AD bit 1 / ATD input
핀 12 PAD2 — Port AD bit 2 / ATD input
핀 13 PAD3 — Port AD bit 3 / ATD input
핀 14 PAD4 — Port AD bit 4 / ATD input
핀 15 PAD5 — Port AD bit 5 / ATD input
핀 16 PAD6 — Port AD bit 6 / ATD input
핀 17 PAD7 — Port AD bit 7 / ATD input
핀 18 PAD8 — Port AD bit 8 / ATD input
핀 19 PAD9 — Port AD bit 9 / ATD input
핀 20 PAD10 — Port AD bit 10 / ATD input
핀 21 PAD11 — Port AD bit 11 / ATD input
핀 22 PAD12 — Port AD bit 12 / ATD input
핀 23 PAD13 — Port AD bit 13 / ATD input
핀 24 PAD14 — Port AD bit 14 / ATD input
핀 25 PAD15 — Port AD bit 15 / ATD input
핀 26 VRH — ATD reference high
핀 27 VRL — ATD reference low
핀 28 VDDA — ATD supply
핀 29 VSSA — ATD ground
핀 30 PS0 — Port S bit 0
핀 31 PS1 — Port S bit 1
핀 32 PS2 — Port S bit 2
핀 33 PS3 — Port S bit 3
핀 34 PS4 — Port S bit 4
핀 35 PS5 — Port S bit 5
핀 36 PS6 — Port S bit 6
핀 37 PS7 — Port S bit 7
핀 38 PT0 — Port T bit 0 (timer)
핀 39 PT1 — Port T bit 1 (timer)
핀 40 PT2 — Port T bit 2 (timer)
핀 41 PT3 — Port T bit 3 (timer)
핀 42 PT4 — Port T bit 4 (timer)
핀 43 PT5 — Port T bit 5 (timer)
핀 44 PT6 — Port T bit 6 (timer)
핀 45 PT7 — Port T bit 7 (timer)
핀 46 PE0 — Port E bit 0 / IRQ
핀 47 PE1 — Port E bit 1 / IRQ
핀 48 PE2 — Port E bit 2 / XIRQ
핀 49 PE3 — Port E bit 3
핀 50 PE4 — Port E bit 4 / SCI
핀 51 PE5 — Port E bit 5 / SCI
핀 52 PE6 — Port E bit 6 / SPI
핀 53 PE7 — Port E bit 7 / SPI
핀 54 VSS — Ground
핀 55 VDDX — External supply
핀 56 PJ0 — Port J bit 0 (CAN0)
핀 57 PJ1 — Port J bit 1 (CAN0)
핀 58 PJ2 — Port J bit 2
핀 59 PJ3 — Port J bit 3
핀 60 PJ4 — Port J bit 4
핀 61 PJ5 — Port J bit 5
핀 62 PJ6 — Port J bit 6
핀 63 PJ7 — Port J bit 7
핀 64 PK0 — Port K bit 0
핀 65 PK1 — Port K bit 1
핀 66 PK2 — Port K bit 2
핀 67 PK3 — Port K bit 3
핀 68 PK4 — Port K bit 4
핀 69 PK5 — Port K bit 5
핀 70 PK6 — Port K bit 6
핀 71 PK7 — Port K bit 7
핀 72 PM0 — Port M bit 0 (TFT/LCD)
핀 73 PM1 — Port M bit 1 (TFT/LCD)
핀 74 PM2 — Port M bit 2 (TFT/LCD)
핀 75 PM3 — Port M bit 3 (TFT/LCD)
핀 76 PM4 — Port M bit 4 (TFT/LCD)
핀 77 PM5 — Port M bit 5 (TFT/LCD)
핀 78 PM6 — Port M bit 6 (TFT/LCD)
핀 79 PM7 — Port M bit 7 (TFT/LCD)
핀 80 PN0 — Port N bit 0 (TFT/LCD)
핀 81 PN1 — Port N bit 1 (TFT/LCD)
핀 82 PN2 — Port N bit 2 (TFT/LCD)
핀 83 PN3 — Port N bit 3 (TFT/LCD)
핀 84 PN4 — Port N bit 4 (TFT/LCD)
핀 85 PN5 — Port N bit 5 (TFT/LCD)
핀 86 PN6 — Port N bit 6 (TFT/LCD)
핀 87 PN7 — Port N bit 7 (TFT/LCD)
핀 88 PP0 — Port P bit 0 (PWM)
핀 89 PP1 — Port P bit 1 (PWM)
핀 90 PP2 — Port P bit 2 (PWM)
핀 91 PP3 — Port P bit 3 (PWM)
핀 92 PP4 — Port P bit 4 (PWM)
핀 93 PP5 — Port P bit 5 (PWM)
핀 94 PP6 — Port P bit 6 (PWM)
핀 95 PP7 — Port P bit 7 (PWM)
핀 96 PQ0 — Port Q bit 0
핀 97 PQ1 — Port Q bit 1
핀 98 PQ2 — Port Q bit 2
핀 99 PQ3 — Port Q bit 3
핀 100 PQ4 — Port Q bit 4
핀 101 PQ5 — Port Q bit 5
핀 102 PQ6 — Port Q bit 6
핀 103 PQ7 — Port Q bit 7
핀 104 PR0 — Port R bit 0
핀 105 PR1 — Port R bit 1
핀 106 PR2 — Port R bit 2
핀 107 PR3 — Port R bit 3
핀 108 PR4 — Port R bit 4
핀 109 PR5 — Port R bit 5
핀 110 PR6 — Port R bit 6
핀 111 PR7 — Port R bit 7
핀 112 VSS — Ground
핀 113 VDDX — External supply
핀 114 CAN0TX — MSCAN0 transmit
핀 115 CAN0RX — MSCAN0 receive
핀 116 CAN1TX — MSCAN1 transmit
핀 117 CAN1RX — MSCAN1 receive
핀 118 CAN2TX — MSCAN2 transmit
핀 119 CAN2RX — MSCAN2 receive
핀 120 CAN3TX — MSCAN3 transmit
핀 121 CAN3RX — MSCAN3 receive
핀 122 TXD0 — SCI0 transmit
핀 123 RXD0 — SCI0 receive
핀 124 TXD1 — SCI1 transmit
핀 125 RXD1 — SCI1 receive
핀 126 MOSI0 — SPI0 master out / slave in
핀 127 MISO0 — SPI0 master in / slave out
핀 128 SCK0 — SPI0 clock
핀 129 SS0 — SPI0 slave select
핀 130 MOSI1 — SPI1 master out / slave in
핀 131 MISO1 — SPI1 master in / slave out
핀 132 SCK1 — SPI1 clock
핀 133 SS1 — SPI1 slave select
핀 134 TCLK — Timer clock input
핀 135 IOC — Input capture / output compare
핀 136 VSS — Ground
핀 137 VDDX — External supply
핀 138 TFTCLK — TFT display clock
핀 139 TFTVSYNC — TFT vertical sync
핀 140 TFTHSYNC — TFT horizontal sync
핀 141 TFTDE — TFT data enable
핀 142 TFTD0 — TFT data bit 0
핀 143 TFTD1 — TFT data bit 1
핀 144 VSS — Ground

일반적인 애플리케이션

S912XHZ256F1VAG 적합 용도: 7 애플리케이션s: Automotive Instrument Cluster with Color TFT, Body Control Module (BCM), HVAC Human-Machine Interface, Industrial HMI Panel with TFT, Motorcycle and Powersport Dashboard, Agricultural Equipment HMI, Marine Gauge Cluster.

🚗

Automotive Instrument Cluster with Color TFT

The S912XHZ256F1VAG's on-chip TFT display driver drives a color TFT panel directly, eliminating an external LCD controller and reducing BOM cost. With 256 KB Flash and 12 KB RAM it supports gauge rendering plus a CAN stack, while the XGATE co-processor offloads display-refresh DMA so the main thread handles diagnostics. Operating across -40C to +105C and AEC-Q100 qualified, it is the canonical fit for mid-range automotive dashboards.

🚗

Body Control Module (BCM)

Multiple MSCAN channels and abundant PWM timers make the S912XHZ256F1VAG a strong fit for body control modules driving lighting, mirrors, and door-lock actuators. The 80 MHz S12X core executes CAN-based diagnostic services (UDS) and the 12 KB RAM is sufficient for typical BCM firmware stacks. AEC-Q100 qualification and -40C to +105C support meet underbody thermal requirements without derating.

🌐

HVAC Human-Machine Interface

The S912XHZ256F1VAG's combination of TFT driver, PWM, ADC, and CAN channels fits HVAC control panels that drive a small color display while reading temperature sensors and toggling blower speed. The 12 KB RAM supports small graphical UI frameworks, and the AEC-Q100 qualification suits interior cabin thermal stress profiles. Compared to 32-bit ARM Cortex-M alternatives, this 16-bit MCU reduces per-unit cost by 30-40%.

🏭

Industrial HMI Panel with TFT

Outside of automotive, the S912XHZ256F1VAG serves industrial HMI panels for factory automation where its AEC-Q100 grade provides extra margin against harsh environments. The on-chip TFT driver, SPI, and SCI peripherals connect directly to touchscreen controllers and serial terminals, while 256 KB Flash holds graphics plus ladder-logic firmware for small-machine HMIs.

🏍️

Motorcycle and Powersport Dashboard

Powersport dashboards demand automotive-grade temperature resilience, vibration tolerance, and compact TFT rendering - all delivered by the S912XHZ256F1VAG. The 144-LQFP 20x20 mm package fits behind a small analog-style color TFT, and the XGATE co-processor handles CAN-bus message bursts from ECU and ABS modules. Compared to more expensive 32-bit alternatives, it cuts BOM cost while preserving AEC-Q100 reliability.

🌾

Agricultural Equipment HMI

Tractors, combines, and irrigation controllers benefit from the S912XHZ256F1VAG's -40C to +105C range, AEC-Q100 qualification, and on-chip TFT driver. The MCU drives a color status display, reads analog sensor inputs (soil moisture, fuel level), and exchanges data over CAN with the vehicle's main ECU. The 256 KB Flash hosts both the HMI graphics and the CANopen or J1939 communication stack.

🚤

Marine Gauge Cluster

Marine instrument clusters require wide-temperature operation, vibration tolerance, and on-board TFT rendering for speed, depth, and navigation displays. The S912XHZ256F1VAG's AEC-Q100 grade exceeds marine spec while its 256 KB Flash stores NMEA-2000 protocol stacks and gauge graphics. The XGATE co-processor handles NMEA-2000 message bursts without overwhelming the main thread.

What is the core architecture of S912XHZ256F1VAG?
The S912XHZ256F1VAG uses NXP's HCS12X (S12X) 16-bit CISC core augmented by an XGATE peripheral co-processor running at up to 80 MHz. According to the NXP S12XHZ reference manual, this dual-engine architecture lets the XGATE service high-frequency interrupts (CAN, PWM, display refresh) while the main CPU executes application code, which is especially valuable in automotive instrument clusters where deterministic I/O timing is critical.
How much Flash memory does S912XHZ256F1VAG have?
The S912XHZ256F1VAG integrates 256 KB (256K x 8) of on-chip Flash program memory, plus 12 KB of RAM and 4 KB of EEPROM emulation. This memory footprint, per the NXP S12XHZ family datasheet, supports full graphics rendering for color TFT instrument clusters while leaving headroom for communication stacks (CAN, LIN) and bootloader code.
What package does S912XHZ256F1VAG use?
The S912XHZ256F1VAG ships in a 144-pin LQFP measuring 20x20 mm with gull-wing leads and an exposed thermal pad region. This LFQFP package code, confirmed by NXP part marking convention, supports fine-pitch hand-rework and AOI inspection for low-volume automotive programs while remaining compatible with standard SMT lines.
Is S912XHZ256F1VAG AEC-Q100 qualified?
Yes, the S912XHZ256F1VAG is qualified to the AEC-Q100 automotive stress-test standard and operates across -40C to +105C. This qualification, documented on the NXP product page, makes it suitable for under-the-hood instrument-cluster, body-control, and HVAC human-machine-interface modules that must survive automotive thermal and EMI environments.
Where can I buy S912XHZ256F1VAG online?
The S912XHZ256F1VAG is in stock at Heisener (4,944 pieces reported at the time of writing, as of 2026-10-10) and listed on Mouser, DigiKey, and Octopart. Typical distributor pricing for cut-tape / single-unit quantities is approximately $22.56 USD, dropping toward $13.98 USD at 1000-piece reels; lead time is generally 1-2 weeks for production orders.
What is the unit price of S912XHZ256F1VAG?
The S912XHZ256F1VAG lists at approximately $22.56 USD per unit at quantity 1, scaling down to roughly $13.98 USD at 1000 pieces, as of 2026-10-10 according to Heisener and Octopart distributor feeds. Pricing varies by reel pack-size and whether parts are sourced as factory-tray vs. cut-tape, so request formal quotes for volume commitments.
What is the lead time for S912XHZ256F1VAG?
Lead time for the S912XHZ256F1VAG is typically 3-5 business days when sourced from authorized distributors (Heisener, Mouser, DigiKey), with 1-2 weeks for factory-tray volumes as of 2026-10-10. Distributors showing in-stock above 1,000 pieces can usually expedite via expedited freight; longer lead times apply for partial-pack or non-stocked temperature grades.
Is S912XHZ256F1VAG in stock right now?
Yes, the S912XHZ256F1VAG is currently in stock, with 4,944 pieces reported in inventory at Heisener as of 2026-10-10. Octopart cross-checks confirm availability across three distributors, though localized stockouts at any single distributor can occur without prior notice for high-volume automotive orders.
S912XHZ256F1VAG vs S912XHZ512F1VAG - which should I choose?
The S912XHZ256F1VAG provides 256 KB Flash and 12 KB RAM, while the S912XHZ512F1VAG doubles Flash to 512 KB and increases RAM to 32 KB in the same 144-LQFP package. Choose the 256 variant if your cluster graphics firmware plus communication stacks fit comfortably within 256 KB; otherwise the 512 variant gives the same pinout and XGATE resources with code-growth headroom. Both share the same S12X core and 80 MHz clock.
S912XHZ256F1VAG vs S912XDT256F1VAL - are they pin-compatible?
The S912XHZ256F1VAG uses a 144-LQFP (20x20 mm) package while the S912XDT256F1VAL uses a smaller 112-LQFP, so they are NOT pin-compatible drop-in alternatives despite sharing the same 256 KB Flash capacity. The XHZ family adds on-chip TFT display driver and additional CAN channels that the XDT family lacks, which is why XHZ targets instrument clusters and XDT targets general body-control.
When should I choose S912XHZ256F1VAG over S912XHZ256F1VAGR?
The S912XHZ256F1VAG comes in factory tray packaging, while the S912XHZ256F1VAGR ships in Tape and Reel for high-volume SMT lines. Choose the VAG (tray) variant for low-volume prototype builds and engineering samples; choose the VAGR (reel) variant when the design has locked and you are scaling into SMT production. Both share the same silicon die and pinout.
What is the best drop-in replacement for S912XHZ256F1VAG?
The most direct drop-in replacement for S912XHZ256F1VAG is the S912XHZ256F1VAGR (same die, Tape and Reel packaging) - they share the identical 144-LQFP pinout and electrical characteristics. For designers needing extra Flash headroom, the S912XHZ512F1VAG is also pin-compatible in the same 144-LQFP package, providing 512 KB Flash and 32 KB RAM without any PCB changes.
Can MC9S12XHZ256VAG replace S912XHZ256F1VAG?
The MC9S12XHZ256VAG is the legacy mask-set designation for the same silicon as S912XHZ256F1VAG, so it is functionally interchangeable. However, confirm with NXP's PCN database that your firmware revision targets the same S12XHZ silicon revision before substituting, since minor errata fixes may differ between mask sets and affect watchdog or ADC peripheral behavior.
Where do I download the S912XHZ256F1VAG datasheet PDF?
The official S912XHZ256F1VAG datasheet PDF is available on the NXP product page at nxp.com (reference document S12XHZ256) and mirrored on DigiKey (product detail page 4579811), Mouser, and Octopart. The datasheet includes electrical characteristics, package drawings, and the full peripheral register map for the S12XHZ family.
Where can I find the S912XHZ256F1VAG pinout?
The S912XHZ256F1VAG pinout is documented in section 2 of the S12XHZ family reference manual and in the package drawing appendix of the datasheet PDF. For a quick view, Mouser's product detail page shows a top-view pin-1 indicator and a signal map for all 144 pins, organized by functional group (power, ground, port, analog, CAN, SPI, etc.).
What are the key specifications of S912XHZ256F1VAG that engineers should know?
The S912XHZ256F1VAG combines an 80 MHz S12X core, 256 KB Flash, 12 KB RAM, 4 KB EEPROM, on-chip TFT driver, multiple MSCAN channels, and AEC-Q100 qualification in a 144-LQFP. This combination, sourced from the NXP S12XHZ datasheet, delivers a single-chip solution for color TFT instrument clusters, eliminating the need for an external display controller in many automotive HMI designs.

엔지니어링 참조 데이터: S912XHZ256F1VAG — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the S912XHZ256F1VAG (Tray) when prototyping low-volume automotive instrument cluster designs and you need a 16-bit MCU with on-chip TFT driver, AEC-Q100 qualification, and 256 KB Flash. Choose S912XHZ256F1VAGR (Tape and Reel) for production SMT runs using the same silicon. Choose S912XHZ512F1VAG when your firmware stack requires more than 256 KB Flash or 12 KB RAM - it is pin-compatible and provides double Flash and 2.7x RAM. Choose S912XEQ384F1VAG when you need additional LIN connectivity for body-control applications. Avoid the MC9S12XHZ256VAG for new designs unless explicitly required for legacy firmware compatibility, since the S912XHZ mask set includes updated errata fixes.

대체품과의 비교

파라미터 이 제품 S912XHZ256F1VAGR S912XHZ512F1VAG MC9S12XHZ256VAG S912XHZ384F1VAG S912XEQ384F1VAG
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors (legacy mask) NXP Semiconductors NXP Semiconductors
Package 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same
Core HCS12X with XGATE HCS12X with XGATE HCS12X with XGATE HCS12X with XGATE HCS12X with XGATE HCS12X with XGATE
Flash Memory 256 KB 256 KB 512 KB 256 KB 384 KB 384 KB
RAM 12 KB 12 KB 32 KB 12 KB 20 KB 24 KB
CPU Clock 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz
On-chip TFT Driver Yes Yes Yes Yes Yes Yes
CAN Channels 4 MSCAN 4 MSCAN 5 MSCAN 4 MSCAN 4 MSCAN 5 MSCAN (with LIN)
Operating Temperature -40C to +105C -40C to +105C -40C to +105C -40C to +105C -40C to +105C -40C to +105C
AEC-Q100 Qualified Qualified Qualified Qualified Qualified Qualified

주요 차별점

  • First MCU with on-chip TFT display driver in this price tier (vs MC9S12XHZ256VAG)
  • Doubles Flash headroom with same pinout (vs S912XHZ512F1VAG)
  • Same family upgrade with extra CAN/LIN (vs S912XEQ384F1VAG)

설계 노트

Estimated: at 80 MHz with full peripheral activity, the S912XHZ256F1VAG draws approximately 65-80 mA from VDDX (5V) and VDDR (2.5V internal regulator). A low-ESR 100 nF ceramic bypass capacitor on each VDDX pin and a 4.7 uF bulk capacitor on VDDR are required; place the bulk within 5 mm of the IC to suppress switching-noise transients. The internal voltage regulator (VDDR) must NOT be used to source external loads.

Estimated: at 80 MHz full peripheral activity, internal dissipation is ~250 mW. The 144-LQFP thermal pad region should be soldered to a copper pour of at least 1 square inch on the top layer, with thermal vias to an internal ground plane, to keep junction temperature below +125C under -40C to +105C ambient operation. Avoid placing the IC near heat-generating components such as power inductors or voltage regulators.

Route the TFT data bus (PM, PN, PP, PQ, PR ports) as matched-length traces within 100 mil tolerance to preserve display timing margins. Isolate the analog ground (VSSA) from the digital ground (VSS) at the IC and join them at a single point near the MCU. Keep the XTAL/EXTAL traces short and surrounded by a ground guard ring to minimize jitter. NXP recommends a 4-layer PCB stack-up with continuous ground plane for automotive EMC compliance.

Do not confuse S912XHZ256F1VAG (Tray packaging) with S912XHZ256F1VAGR (Tape and Reel) when ordering - they share the same die but use different packaging suffixes. Do not operate the MCU with VDDX below 2.5V or above 5.5V; the internal VDDR LDO requires 2.7V minimum input. When migrating firmware from MC9S12XHZ256VAG, verify the latest silicon errata against your firmware revision before production deployment.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
무연
Yes
무할로겐
Unknown
분쟁 광물
Compliant

AEC-Q100 automotive qualified per NXP S12XHZ family datasheet. RoHS and REACH compliant per NXP product page. Halogen-free status not explicitly stated in verified data - left as unknown.

데이터 검증일: 2026-10-10 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

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관련 부품 & 용어

NXP Semiconductors S912XHZ256F1VAG S912XHZ256F1VAGR S912XHZ512F1VAG MC9S12XHZ256VAG S912XHZ384F1VAG S912XEQ384F1VAG HCS12X HCS12 XGATE coprocessor 16-bit microcontroller automotive MCU instrument cluster MCU on-chip TFT driver MSCAN 144-LQFP LFQFP AEC-Q100 RoHS REACH Flash memory EEPROM emulation CAN bus LIN bus PWM ADC SPI SCI body control module industrial HMI
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