SAK-TC222L-16F133N - 32-bit AURIX TriCore MCU 1MB Flash TQFP-80 | Infineon
부품 번호: SAK-TC222L-16F133N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.4 | $164.00 |
| 100 | $13.95 | $1,395.00 |
| 500 | $12.1 | $6,050.00 |
| 1,000 | $10.85 | $10,850.00 |
SAK-TC222L-16F133N 개요
An AURIX microcontroller is a 32-bit TriCore-based MCU that combines an RISC/DSP/MCU instruction set with deterministic real-time control, lockstep cores, and hardware security modules. It belongs to the broader class of automotive microcontrollers -> 32-bit MCUs -> embedded processors -> semiconductors, and serves as the brain for powertrain, chassis, body, ADAS, and gateway ECUs. The TC22xL sub-family is the entry-level node of the AURIX TC2xx family, providing safety, security, and connectivity at minimal pin count.
Key features of the SAK-TC222L-16F133N include 133 MHz TriCore CPU with single lockstep pair for ASIL-D safety, 1 MB embedded Flash with ECC, 96 KB SRAM, a powerful peripheral set (multiple CAN-FD, LIN, QSPI, ASCLIN, GTM timer, ADC), and the embedded Hardware Security Module (HSM). It supports -40 °C to +125 °C (or +150 °C) automotive junction temperature ranges and is qualified per AEC-Q100 / ISO 26262.
The TC222L is implemented in Infineon's 40 nm embedded Flash process with dual-lockstep TriCore cores and a dedicated SRI (Shared Resource Interconnect) crossbar. The lockstep architecture enables software-free fault detection, while the SRI crossbar gives deterministic low-latency access between TriCore, DMA, HSM, and the peripheral bus.
Typical applications include automotive gateway ECUs, body domain controllers, sensor fusion nodes, low-end ADAS sensor ECUs, and industrial safety controllers. The compact TQFP-80 footprint also suits cost-optimized chassis or powertrain sub-modules.
When designing with this device, ensure your toolchain uses a current AURIX iLLD/TC27x BSL package and that the HSM firmware is provisioned before production programming. Use the EVADC and GTM timer for synchronized sampling and PWM generation, and respect the lockstep initialization order.
This page synthesizes distributor pricing, drop-in AURIX TC22xL family alternatives, and practical application notes not found in the manufacturer datasheet, helping sourcing engineers compare variants and select the right TC22xL SKU.
드롭인 대체품: SAK-TC222L-16F133N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
SAK-TC222L-16F133F AC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SAK-TC222L-16F133F AB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SAK-TC223L-16F133N AC
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
SAL-TC222L-16F133F AB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SAK-TC222L-16F133N 최대 정격 & 전기적 특성
| Series | AURIX TC2xx (TC22xL sub-family) |
| Core Architecture | TriCore™ (TC1.6) 32-bit RISC/DSP/MCU |
| Lockstep Cores | 1 lockstep pair |
| Maximum CPU Clock | 133 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| SRAM (incl. Cache) | 96 KB |
| 공급 전압 | 3.3 V / 5 V (typical automotive ECU rails) |
| 패키지 | PG-TQFP-80-7 (TQFP-80) |
| 실장 유형 | Surface Mount |
| 동작 온도 범위 | -40 °C to +125 °C (junction, automotive) |
| Automotive Qualification | AEC-Q100 / ISO 26262 capable |
| HSM (Hardware Security Module) | Yes |
| Communication Interfaces | CAN-FD, LIN, QSPI, ASCLIN |
| Timer / PWM | GTM (Generic Timer Module) |
| ADC | EVADC (Enhanced Versatile ADC) |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 (per JEDEC J-STD-020, typical) |
SAK-TC222L-16F133N pg-tqfp-80-7 (tqfp-80) 핀 구성 가이드
SAK-TC222L-16F133N(pg-tqfp-80-7 (tqfp-80) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: SAK-TC222L-16F133N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
SAK-TC222L-16F133N 적합 용도: 6 애플리케이션s: Automotive Gateway ECU, Body Domain Controller, Sensor Fusion Node (Low-End ADAS), Chassis / Powertrain Sub-Module, Industrial Safety Controller, Battery Management (BMU) Slave.
Automotive Gateway ECU
The SAK-TC222L-16F133N is well suited to central body/gateway ECUs that aggregate multiple CAN-FD and LIN sub-networks into the vehicle backbone. With 133 MHz TriCore compute, 1 MB Flash, 96 KB SRAM and multiple CAN-FD controllers, it can run AUTOSAR R30 plus UDS/NM stack while leaving headroom for OEM network management. Its lockstep pair supports ASIL-D systematic compliance for gateway safety functions.
추천
Body Domain Controller
For body domain controllers (lighting, central locking, wipers, mirrors) the SAK-TC222L-16F133N delivers the right balance of automotive safety and BOM cost. The HSM secures OEM diagnostic sessions, while the GTM timer and EVADC drive LED matrix PWM and current sense. ASIL-D capability through lockstep gives OEMs ISO 26262 headroom at high margins.
추천
Sensor Fusion Node (Low-End ADAS)
The SAK-TC222L-16F133N is suitable for low-end ADAS sensor ECUs that pre-process radar, ultrasonic, or camera data before forwarding to a central ECU. The 133 MHz TriCore plus EVADC handles synchronized sensor sampling, while CAN-FD offloads results at high speed. Lockstep + HSM give ASIL-B(D) headroom for sensor chains.
추천
Chassis / Powertrain Sub-Module
Cost-optimized chassis and powertrain sub-modules (e.g. electric power steering sub-controller, transmission sensor interface) fit the SAK-TC222L-16F133N: 1 MB Flash holds small control loops, GTM delivers deterministic PWM for valve/Solenoid drivers, and lockstep provides ASIL-D systematic capability. PG-TQFP-80-7 keeps the board compact.
추천
Industrial Safety Controller
Beyond automotive, the SAK-TC222L-16F133N serves industrial safety controllers requiring IEC 61508 SIL-3 mapping. Its lockstep TriCore, HSM, and 1 MB Flash handle PLC logic, fieldbus gateway code, and safety diagnostics. The -40 °C to +125 °C range supports outdoor cabinets and motor-drive environments.
추천
Battery Management (BMU) Slave
As a BMU slave in a distributed battery management system, the SAK-TC222L-16F133N aggregates cell voltages and temperatures from daisy-chained monitors. Its EVADC provides synchronized cell sampling, GTM drives balancing PWMs, and the lockstep pair supports ASIL-D for ISO 26262-2018 functional safety. CAN-FD reports to the pack-level BMS.
추천
추천 제품 요약
엔지니어링 참조 데이터: SAK-TC222L-16F133N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | SAK-TC222L-16F133F AC | SAK-TC222L-16F133F AB | SAK-TC223L-16F133N AC | SAL-TC222L-16F133F AB |
|---|---|---|---|---|---|
| Package | PG-TQFP-80-7 | PG-TQFP-80-7 (same) | PG-TQFP-80-7 (same) | PG-TQFP-80-7 (same) | PG-TQFP-80-7 (same) |
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon |
| Max CPU Clock | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 96 KB | 96 KB | 96 KB | 96 KB | 96 KB |
| Flash Loader Variant | N (alternate loader) | F (standard AURIX loader) | F (standard loader, AB packaging) | N (alternate loader) | F (SAL channel, AB packaging) |
| HSM (Hardware Security Module) | Yes | Yes | Yes | Yes | Yes |
| ASIL Capability | ASIL-D (systematic) | ASIL-D (systematic) | ASIL-D (systematic) | ASIL-D (systematic) | ASIL-D (systematic) |
주요 차별점
- Flash-loader flexibility within the same TQFP-80 footprint (vs SAK-TC222L-16F133F AC)
- Scalable peripheral set without changing footprint (vs SAK-TC223L-16F133N AC)
- ASIL-D capability with single lockstep pair - lower cost than TC26xL/TC27xL (vs SAK-TC264L / SAK-TC275L)
설계 노트
Power the SAK-TC222L-16F133N from an AURIX-class PMIC such as TLF35584QVVS1 or TLF30682QVS01. These PMICs deliver the multi-rail (3.3 V I/O, 1.25 V core, ADC analog) sequencing required by the lockstep initialization and the HSM bring-up. Do not back-power the MCU from a generic 3.3 V LDO without confirming voltage-mon reset thresholds against the TC22xL datasheet. Add 100 nF decoupling per supply pin plus bulk 4.7 µF on each rail.
Estimated: at 133 MHz full CPU load with typical 1.5 W internal dissipation and PG-TQFP-80-7 theta_JA around 35–40 C/W (4-layer JEDEC board), junction temperature rises roughly 50–65 °C above ambient. Under automotive ambient up to 85 °C this leaves a comfortable margin to the 125 °C junction limit. Avoid sealing the part under a heatsink on a small board; ensure at least 2 oz copper flood on the exposed center pad region for thermal spreading.
Common pitfalls when bringing up the SAK-TC222L-16F133N: (1) forgetting the HSM provisioning step before production programming - the HSM must be initialized with OEM keys or the part returns a security error on debug access; (2) using a non-current AURIX iLLD/TC27x BSL package, which can cause subtle startup or lockstep check mismatches; (3) mis-routing the TCK/TMS pull-ups on the DAP interface, leading to JTAG lockouts; (4) under-sizing the EVADC reference decoupling, which adds offset drift. Always validate with the official Infineon TC22xL starter kit before tape-out.
PG-TQFP-80-7 PCB layout: keep the TCK/TMS/ASCLIN traces short and length-matched within their bus, route EVADC analog inputs with a guard ring tied to AGND, and keep the HSM oscillator traces away from switching converters. Use a 4-layer stackup with a dedicated ground plane under the package; expose 5 mm × 5 mm of copper flood under the package center pad and stitch vias (0.3 mm hole, 0.5 mm pitch) for thermal relief and ground return. Reserve a no-stencil region under the center pad per Infineon's footprint.
규정 준수 정보
AURIX TC22xL family is AEC-Q100 qualified and ISO 26262 ASIL-D systematic-capable. RoHS and lead-free per Infineon product page. MSL 3 per JEDEC J-STD-020.
