SC8544CPXAQG - NXP/Freescale Microprocessor IC | BGA
부품 번호: SC8544CPXAQG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $149.3 | $149.30 |
| 10 | $135.8 | $1,358.00 |
| 100 | $119.5 | $11,950.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $92.5 | $92,500.00 |
SC8544CPXAQG 개요
A microprocessor (MPU) is the central processing unit of an embedded system, executing firmware instructions, managing peripherals, and handling protocol stacks. Specialized SoCs such as the SC8544CPXAQG extend the basic microprocessor hierarchy into application-specific variants that integrate CPU cores, memory controllers, and interface peripherals on a single die. Such parts sit at the top of the semiconductor taxonomy: SoC -> microprocessor -> microcontroller family -> integrated circuit -> semiconductor device.
Key features of this part include its BGA package (offering high pin density and low parasitic inductance for multi-gigabit signal integrity), surface-mount construction suited to high-volume reflow assembly, and a recent manufacturing date code ensuring long-term supply availability through authorized distributors. Rochester Electronics' listing confirms the part is currently active in NXP's franchise distribution channel, providing a controlled, traceable source for legacy and sustaining programs.
Typical applications for this device class include industrial control, networking infrastructure, and specialized embedded computing platforms where the part's combination of processing capability and I/O integration provides a compact, bill-of-materials-efficient solution. Designers integrating NXP/Freescale SoCs typically pair them with external DDR memory, power management ICs, and high-speed transceivers.
When designing with this device, ensure the PCB footprint uses NSMD land pads with the via-in-pad or dog-bone fanout recommended by JEDEC for the specific BGA ball pitch; improper BGA pad geometry can induce Head-in-Pillow defects during reflow. Consult the manufacturer datasheet for thermal, clock, and reset requirements.
This page synthesizes Rochester Electronics and DigiKey distributor data, package-level packaging notes, and cross-reference availability for legacy NXP/Freescale microprocessor stock not found together on any single distributor page.
드롭인 대체품: SC8544CPXAQG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: SC8544CPXAQG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Mounting Type, Resolution, Conversion Time, Operating Temperature Range.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MAX174BEPI
✅ 드롭인✓ 재고 있음
$8.75 / 개
데이터시트 보기 →MAX162AENG+
✅ 드롭인✓ 재고 있음
$7.65 / 개
데이터시트 보기 →MAX189BEPA+
✅ 드롭인✓ 재고 있음
$9.15 / 개
데이터시트 보기 →MAX157ACUA
✅ 드롭인✓ 재고 있음
$4.15 / 개
데이터시트 보기 →MAX153EAP+
✅ 드롭인✓ 재고 있음
$8.9 / 개
데이터시트 보기 →SC8544CPXAQG 최대 정격 & 전기적 특성
| Manufacturer | NXP USA Inc. (formerly Freescale Semiconductor) |
| Description | IC Microprocessor, specialized IC |
| Product Category | Integrated Circuits (ICs) - Microprocessors / Specialized ICs |
| 패키지 / 케이스 | BGA (surface mount) |
| 실장 유형 | Surface Mount |
| Packaging Type | Bulk |
| Manufacturing Date Code | Newest (current) |
SC8544CPXAQG bga (surface mount) 핀 구성 가이드
SC8544CPXAQG(bga (surface mount) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: SC8544CPXAQG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
SC8544CPXAQG 적합 용도: 7 애플리케이션s: Embedded Industrial Control, Networking Infrastructure Equipment, Specialized Computing Platforms, Communications and Protocol Processing, Automotive Electronics Modules, Test & Measurement Instrumentation, Aerospace and Defense Sustaining Programs.
Embedded Industrial Control
The SC8544CPXAQG's integration of CPU, peripherals, and memory interface on a single NXP/Freescale SoC die makes it well-suited for embedded industrial controllers. Its BGA package accommodates the high pin count required for parallel peripheral buses, ADC interfaces, and multi-protocol industrial connectivity. Designers typically place the part on 4+ layer PCBs with continuous ground planes under the BGA to control impedance and noise. Estimated: at a 1.0 V core supply with surface-mount BGA thermal resistance around 15-25 C/W, junction temperature stays manageable in industrial -40C to +85C ambient deployments. The specialized IC classification suggests application-tuned peripherals, reducing the bill-of-materials compared with a generic MCU plus external glue logic.
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Networking Infrastructure Equipment
NXP/Freescale SoCs in BGA packages are commonly deployed in networking switches, routers, and access points, where high-speed SERDES and integrated packet processing accelerate time-to-market. The SC8544CPXAQG's BGA form factor supports the dense signal routing required for multi-gigabit Ethernet, PCIe, or USB interfaces without costly PCB layer count escalations. Per NXP's networking SoC portfolio heritage, such parts are paired with external DDR memory and PHY transceivers. The current active lifecycle status through Rochester Electronics makes the part a practical choice for sustaining and EOL-extension programs in telecom/datacom infrastructure.
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Specialized Computing Platforms
The 'Specialized ICs' classification in distributor data and the SC prefix suggest the SC8544CPXAQG is tailored for a targeted computing application where off-the-shelf microcontrollers are insufficient. Specialized SoCs of this class balance CPU throughput, memory bandwidth, and application-specific accelerators on one die. The BGA package allows hundreds of signal pins supporting high-bandwidth memory interfaces and parallel sensor or display buses. Integrating a specialized SoC reduces PCB footprint compared with multi-chip designs and lowers BOM cost in volume production, particularly for sustained programs not requiring frequent silicon refresh.
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Communications and Protocol Processing
Communications systems demand deterministic real-time response, low-latency interrupt handling, and integrated protocol offload engines. NXP/Freescale SoCs historically provide industrial-grade reliability with extended temperature operation suitable for outdoor telecom cabinets and industrial environments. The BGA package of the SC8544CPXAQG facilitates integration with high-speed transceivers and DSP coprocessors through controlled-impedance PCB traces. Active lifecycle status as of 2026-10-16 through Rochester Electronics makes this part viable for sustaining communications platforms where redesign risk is undesirable.
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Automotive Electronics Modules
NXP/Freescale Qorivva and Power Architecture derivatives are widely deployed in automotive ECUs, and devices sharing the SC prefix may follow similar qualification flows. BGA packages with proper underfill are AEC-Q100-acceptable for under-hood and cabin modules when exposed to thermal cycling and vibration. The surface-mount BGA form factor of the SC8544CPXAQG supports high-vibration environments when correctly soldered with epoxy reinforcement. Verify automotive grade qualification via the NXP product page before deploying this part in vehicle systems; check the '-Q1' or '-AEC' suffix presence on the variant marking.
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Test & Measurement Instrumentation
Test equipment manufacturers favour NXP/Freescale SoCs for their deterministic real-time performance and rich peripheral mix, supporting instrument front-ends with sub-microsecond timing precision. The SC8544CPXAQG's BGA package lends itself to dense PCB layouts integrating DAC/ADC front-ends, trigger logic, and display interfaces. The Rochester Electronics distribution channel ensures long-term availability for instrumentation vendors whose product lifecycles span 10-20 years, far exceeding typical consumer semiconductor availability windows.
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Aerospace and Defense Sustaining Programs
Defense and aerospace platforms require components with multi-decade support windows, making the Rochester Electronics distribution of the SC8544CPXAQG valuable for legacy system sustainment. NXP/Freescale SoCs in BGA packages support the rigorous environmental screening demanded by military and avionics applications when qualified through the appropriate testing flow. Active lifecycle status combined with controlled, traceable distribution ensures ongoing availability for low-volume defense programs where a redesign cycle would be prohibitively expensive.
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추천 제품 요약
엔지니어링 참조 데이터: SC8544CPXAQG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MAX174BEPI | MAX162AENG+ | MAX189BEPA+ | MAX157ACUA | MAX153EAP+ |
|---|---|---|---|---|---|---|
| Brand | NXP / Freescale | Analog Devices / Maxim | Analog Devices / Maxim | Analog Devices / Maxim | Analog Devices / Maxim | Analog Devices / Maxim |
| Package | BGA (surface mount) | DIP-28 | DIP-24 | DIP-8 | uMAX-8 | SSOP-20 |
| Part Type | Specialized Microprocessor / SoC | Specialized processor | Specialized processor | Specialized processor | Specialized IC | Specialized processor |
| Mounting Type | Surface Mount | Through-Hole | Through-Hole | Through-Hole | Surface Mount | Surface Mount |
| Distribution Channel | Rochester Electronics (NXP franchise), LCSC | Analog Devices authorized | Analog Devices authorized | Analog Devices authorized | Analog Devices authorized | Analog Devices authorized |
| Lifecycle Status | Active | Active | Active | Active | Active | Active |
| Datasheet Availability | Through NXP authenticated channels | Public | Public | Public | Public | Public |
| Packaging Type | Bulk | Tube | Tube / Tape & Reel | Tube | Tape & Reel | Tape & Reel |
주요 차별점
- NXP/Freescale franchise distribution chain (vs MAX174BEPI)
- Specialized SoC classification for embedded integration (vs MAX157ACUA)
- BGA package for high-pin-count integration (vs MAX162AENG+)
- Active lifecycle status through Rochester Electronics (vs MAX189BEPA+)
설계 노트
For the SC8544CPXAQG BGA package, use NSMD (non-solder mask defined) land pads rather than SMD pads to maximize pad-to-pad spacing and reduce solder bridging risk. Per IPC-7351 / IPC-7093 guidelines, dog-bone fanout is acceptable for pitches >= 0.8 mm; via-in-pad with epoxy fill is required for 0.5 mm and below. Stagger via-in-pad (VIP) fills to avoid BGA solder wicking into inner-layer vias during reflow, which causes Head-in-Pillow (HiP) defects. Reference: JEDEC J-STD-020 for the MSL floor-life and reflow profile.
Estimated: a BGA package with this die area typically shows theta_JA between 15-25 C/W on a 4-layer 1oz PCB with 25% copper pour coverage. At 1.0 V core and 1 A active current (estimated), dissipation is ~1.0 W; junction temperature rise is ~25 C above ambient, well within industrial limits. For sustained 2 W+ loads, ensure inner-layer copper pours connect directly to the BGA thermal balls via plated through-hole arrays. Reference board designs in the NXP evaluation kit schematics.
Do not assume BGA ballout parity between SC8544CPXAQG and successor parts without verifying against the pin-compatibility statement in the NXP datasheet. Before substituting the SC8544CPXAQGA suffix variant, confirm ball mapping against the PCB footprint and firmware boot sequence. Stencil aperture design should follow a 1:1 ball-to-aperture ratio with 0.05-0.075 mm reduction for fine-pitch BGAs to limit solder paste slump during reflow.
Place decoupling capacitors on the same PCB layer as the BGA, within 1-2 mm of their respective power and ground balls; vias to inner power planes add parasitic inductance that defeats local decoupling. Use a power-plane stitch via fence around BGA edges to control edge radiation and EMI. Maintain 50 ohm single-ended and 100 ohm differential impedance for high-speed SERDES traces routed between the BGA balls and connector exits, verified through stackup impedance calculators.
규정 준수 정보
RoHS, REACH, AEC-Q100, lead-free, halogen-free, and conflict-mineral compliance statuses not present in the verified distributor data. NXP typically maintains RoHS compliance for current production parts; verify directly with NXP or via the product compliance certificate before volume deployment.
