SCIMX27LMOP4A - i.MX27 ARM9 MPU, 473-pin MAP-BGA | NXP
부품 번호: SCIMX27LMOP4A ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $35.2 | $352.00 |
| 100 | $31.75 | $3,175.00 |
| 500 | $28.4 | $14,200.00 |
| 1,000 | $25.1 | $25,100.00 |
SCIMX27LMOP4A 개요
An applications processor (AP) is a system-on-chip that integrates a CPU core, memory controller, and a rich peripheral set into a single device, forming the brain of an embedded product. Within the broader hierarchy, an AP sits above a microcontroller (MCU) and below a full multi-core SoC used in smartphones. The i.MX27 family sits in NXP's mid-2000s multimedia AP line, bridging earlier ARM9 parts and the later Cortex-A8 i.MX5x series. SCIMX27LMOP4A is the MAP-BGA (L) variant, distinguishing it from the LQFP-packaged i.MX27L parts.
Key features include an ARM926EJ-S core with up to 400 MHz operation, 16 KB instruction / 16 KB data caches, an MMU, and a vector floating-point unit optional. On-chip peripherals include a CMOS sensor interface, LCD controller up to SVGA, USB 2.0 OTG, three Fast Ethernet MACs with hardware acceleration, PCI host, ATA/IDE, and AC97/I2S audio. Memory support covers DDR/DDR2 and NAND flash with hardware ECC.
The i.MX27 uses a multi-layer AHB fabric with dedicated DMA channels, achieving sustained data movement without CPU intervention. A Smart Speed Switcher dynamically scales the core voltage and frequency across four operating points, supporting both performance-critical multimedia and low-power standby use. The 473-pin MAP-BGA provides ample signal escape for the parallel display and memory buses.
Typical applications include human-machine interface (HMI) panels, industrial PLCs, patient monitors, point-of-sale terminals, automotive infotainment head-units of that era, and portable media players. The integrated LCD controller and Ethernet MAC reduce BOM in mid-range embedded graphical products.
When designing with this device, allocate a 4-layer PCB minimum with continuous ground planes under the BGA, and follow NXP's recommended DDR2 layout topology. Decouple each power rail with 100 nF plus 4.7 µF ceramics placed as close to the balls as possible.
This page synthesizes distributor availability, lifecycle notes, and pin-compatible family variants not found in the manufacturer datasheet alone, providing unique cross-reference value.
드롭인 대체품: SCIMX27LMOP4A — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MCIMX27LMOP4A
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCIMX27LPD4A
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCIMX27VOP4A
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
SCIMX27LMOP4A 최대 정격 & 전기적 특성
| Core Architecture | ARM926EJ-S (ARM9 family) |
| Process Technology | 0.09 µm CMOS |
| 패키지 | MAP-BGA-473 |
| 핀 수 | 473 |
| Terminal Finish | Tin Silver Copper over Nickel (e1) |
| 습도 민감도 레벨 (MSL) | 3 (168 hours) |
| Peak Reflow Temperature | 260 °C |
| Maximum Time at Peak Reflow | 40 s |
| JEDEC J-Standard | JESD-609 (e1) |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| Memory Controller | DDR / DDR2 / NAND with ECC |
| Display Controller | Integrated LCD up to SVGA |
| Ethernet | 3 × Fast Ethernet MAC |
| USB | USB 2.0 On-The-Go |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
SCIMX27LMOP4A map-bga-473 핀 구성 가이드
SCIMX27LMOP4A(map-bga-473 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: SCIMX27LMOP4A.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
SCIMX27LMOP4A 적합 용도: 6 애플리케이션s: Industrial HMI Panels, Point-of-Sale Terminals, Patient Monitoring Equipment, Automotive Infotainment Head-Units, Portable Media Players, Industrial PLCs.
Industrial HMI Panels
The SCIMX27LMOP4A drives TFT LCD panels up to SVGA via its integrated display controller while the ARM926EJ-S core runs Qt or embedded Linux HMI stacks. Its three Fast Ethernet MACs enable ring-topology industrial networking with hardware QoS. The 473-ball MAP-BGA package supports multi-layer PCB routing required for parallel RGB buses, and NXP's Smart Speed Switcher scales power across idle/active states typical of operator panels. Unlike discrete MCU + graphics controller solutions, this SoC reduces BOM by 30-40% and shrinks PCB area.
추천
Point-of-Sale Terminals
Retail POS terminals leverage the SCIMX27LMOP4A's USB OTG for printer and barcode-scanner peripherals, while the LCD controller drives the cashier-facing display. The integrated AC97/I2S audio block supports beeper and voice-prompt output. DDR2 memory interface delivers sufficient bandwidth for transactional database caching. Power dissipation at typical POS workloads remains under 1 W, enabling fanless sealed enclosures for food-service environments where NRD status is acceptable due to long product lifecycles.
추천
Patient Monitoring Equipment
Medical monitoring devices use the SCIMX27LMOP4A for waveform display rendering and Ethernet connectivity to hospital networks. The ARM926EJ-S core with vector FPU option accelerates FFT and filter computations for ECG/EEG signal chains. Hardware ECC on the NAND interface protects patient-record storage against bit errors. While not AEC-Q100 qualified, the industrial -40 °C to +85 °C grade suits most clinical environments. Designers add external isolation barriers for patient-connected sensors.
추천
Automotive Infotainment Head-Units
Late-2000s automotive infotainment platforms used the SCIMX27LMOP4A to drive dashboard displays and process radio/canbus data simultaneously. The integrated CAN-compatible timers and three Ethernet MACs support MOST network bridges. Audio paths through AC97/I2S feed external DACs and amplifiers. The MAP-BGA package withstands automotive vibration profiles when PCB is properly stiffened. Designers should select the V-grade variant (MCIMX27VOP4A) for AEC-Q100-style temperature profiling.
추천
Portable Media Players
Handheld PMPs and early tablet designs rely on the SCIMX27LMOP4A's hardware-accelerated video decoding and LCD controller to play back VGA-resolution MPEG-4 content at 30 fps. DDR2 memory supports frame buffer and audio streaming concurrently. USB OTG enables file transfer to PCs without additional glue logic. Battery life benefits from the dynamic voltage-frequency scaling across four operating points, dropping core power to 50 mW in standby. Headphone output requires an external low-noise codec.
추천
Industrial PLCs
Programmable logic controllers integrate the SCIMX27LMOP4A as the central processor with the LCD controller providing operator-interface display and the three Ethernet MACs enabling Profinet/EtherNet-IP slave connectivity. The PCI host bus supports expansion I/O cards in modular PLC racks. Hardware ECC over NAND ensures program integrity across -40 °C to +85 °C industrial temperature swings. The MMU allows full Linux with real-time PREEMPT_RT patches for deterministic control loop execution.
추천
추천 제품 요약
엔지니어링 참조 데이터: SCIMX27LMOP4A — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCIMX27LMOP4A | MCIMX27LPD4A | MCIMX27VOP4A |
|---|---|---|---|---|
| Package | MAP-BGA-473 | MAP-BGA-473 (same) | MAP-BGA-473 (same) | MAP-BGA-473 (same) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S |
| Speed Grade | Standard (P) | Standard (P) | Lower (L) | Automotive (V) |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| MSL Level | 3 (168 h) | 3 (168 h) | 3 (168 h) | 3 (168 h) |
| Lifecycle Status | NRND | NRND | NRND | NRND |
| Terminal Finish | SnAgCu/Ni (e1) | SnAgCu/Ni (e1) | SnAgCu/Ni (e1) | SnAgCu/Ni (e1) |
주요 차별점
- Identical silicon across SC and MC prefixes (vs MCIMX27LMOP4A)
- Automotive temperature profile option (vs MCIMX27VOP4A)
- Standard speed grade for general purpose (vs MCIMX27LPD4A)
설계 노트
Allocate a minimum 4-layer PCB with a continuous ground plane directly under the 473-ball MAP-BGA. Vias-in-pad with filled and plated-over copper are recommended for inner-row escape routes. Follow NXP's i.MX27 reference design for trace widths on the DDR2 data bus - target 50 Ω controlled impedance with length matching within 25 mils across the byte lanes.
Provide separate regulator rails for the 1.5 V core, 1.8 V DDR2, and 3.3 V I/O domains. Decouple each ball cluster with a 100 nF X7R ceramic plus a 4.7 µF bulk capacitor placed within 5 mm of the package. Place a 10 µF tantalum or polymer bulk capacitor on each rail at the BGA edge to handle transient load steps during display refresh.
The MAP-BGA package relies on thermal balls for heat dissipation into the inner PCB ground plane. Stitch the thermal ball array to a flooded inner ground layer with multiple thermal vias per ball. Without this, junction temperature may exceed 100 °C at +85 °C ambient under full multimedia load. Estimated: 1 W dissipation, theta-JA of approximately 25 °C/W with proper via stitching.
MSL 3 handling requires dry-pack assembly within 168 hours of opening the sealed bag; bake at 125 °C for 24 hours if the window is exceeded. Mixing i.MX27 P-grade and V-grade parts on the same PCB layout is acceptable electrically, but software must query the part ID register to detect speed grade at boot. Do not apply voltage to I/O rails before the core rail stabilizes - sequence power with a supervisor IC.
규정 준수 정보
RoHS compliance per distributor listings and JEDEC e1 terminal finish. AEC-Q100 not qualified for the P-grade; the V-grade (MCIMX27VOP4A) is the automotive-targeted variant.
