SCK60DN512VLL10R - K60 512KB Flash ARM Cortex-M4 MCU | NXP
부품 번호: SCK60DN512VLL10R ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.4 | $114.00 |
| 100 | $10.1 | $1,010.00 |
| 500 | $9.05 | $4,525.00 |
| 1,000 | $8.2 | $8,200.00 |
SCK60DN512VLL10R 개요
This part belongs to the Kinetis K60 family of microcontrollers, which is a low-power 32-bit ARM Cortex-M4 device family. Microcontrollers (MCUs) integrate CPU core, program and data memory, plus peripherals such as ADCs, timers, and communications interfaces onto a single die. Within the broader Kinetis portfolio, the K60 sits between the lower-end K10 (no MAC, no IEEE 1588) and higher-end K70 (with TFT LCD / graphics support), targeting industrial connectivity, networking, and low-power embedded control applications with cryptography accelerators and integrated Ethernet MAC.
Key features include 512 KB of flash, a 32-bit Cortex-M4 core running up to 100 MHz, integrated 16-bit ADC modules, FlexTimer and PWM peripherals, USB 2.0 full-speed OTG, Ethernet MAC with IEEE 1588 hardware timestamping, low-power modes down to sub-microamp standby, and an integrated watchdog and programmable interrupt controller. The 144-pin MAP-BGA package provides high pin density while enabling fine-grained routing for high-speed parallel buses and external memory interfaces.
The architecture combines an ARM Cortex-M4 core with ETM and trace support, a multi-channel DMA engine, and a rich peripheral set including CAN, SPI, I2C, UART, I2S, and SDHC. Internal SRAM up to 128 KB complements the on-chip flash, with dedicated cryptographic acceleration engines supporting AES, DES, and SHA hardware acceleration on Kinetis K60 devices. The multi-voltage I/O ring supports 1.8V, 2.5V, and 3.3V peripherals on a single die.
Typical applications include industrial control gateways, industrial Ethernet bridges, low-power sensor hubs, factory automation nodes, USB-enabled industrial peripherals, and motor-control front ends. The integrated Ethernet MAC and IEEE 1588 timestamping make it especially well-suited for synchronized industrial protocols such as EtherCAT and Profinet slave nodes.
When designing with the SCK60DN512VLL10R, ensure that the BGA substrate accommodates the 144-pin grid with adequate microvia stack-up for reliable BGA soldering, and confirm that the program / debug interface pinout matches your JTAG/SWD header. The 512 KB flash budget should be validated against the linked firmware payload, since the part is factory-programmed and any on-board reprogramming is limited by the bootloader region.
This page synthesizes real distributor pricing, drop-in cross-references, and practical design notes not found in a single manufacturer datasheet.
드롭인 대체품: SCK60DN512VLL10R — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
K60DN512VLL10
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MK60DN512VLL10
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
SCK60DN512VLL10R 최대 정격 & 전기적 특성
| Product Type | Microcontroller (MCU) |
| Core Architecture | ARM Cortex-M4 with FPU |
| Bit Width | 32-bit |
| Program Memory Size | 512 KB Flash |
| 최대 클록 주파수 | 100 MHz |
| 공급 전압 | 1.8 V / 2.5 V / 3.3 V multi-rail |
| I/O Voltage Support | 1.8 V, 2.5 V, 3.3 V |
| 패키지 | 144-pin MAP-BGA |
| 실장 유형 | Surface Mount (BGA) |
| Peripherals (typical K60) | Ethernet MAC, USB OTG, CAN, SPI, I2C, UART, I2S, ADC |
| Cryptographic Acceleration | AES, DES, SHA hardware acceleration (K60 integrated) |
| Ethernet Support | 10/100 MAC with IEEE 1588 hardware timestamping |
| RoHS 상태 | Compliant (per NXP/JLCPCB listing) |
SCK60DN512VLL10R 핀 구성
| 핀 1 | BGA-A1 — BGA ball assignment; refer to K60P144M100SF2 datasheet for full pinout map |
| 핀 2 | BGA-A2 — BGA ball assignment; refer to K60P144M100SF2 datasheet for full pinout map |
| 핀 3 | BGA-A3 — BGA ball assignment; refer to K60P144M100SF2 datasheet for full pinout map |
| 핀 4 | BGA-A4 — BGA ball assignment; refer to K60P144M100SF2 datasheet for full pinout map |
| 핀 5 | BGA-A5 — BGA ball assignment; refer to K60P144M100SF2 datasheet for full pinout map |
| 핀 6 | BGA-A6 — BGA ball assignment; refer to K60P144M100SF2 datasheet for full pinout map |
| 핀 7 | BGA-A7 — BGA ball assignment; refer to K60P144M100SF2 datasheet for full pinout map |
| 핀 8 | BGA-A8 — BGA ball assignment; refer to K60P144M100SF2 datasheet for full pinout map |
| 핀 9 | BGA-A9 — BGA ball assignment; refer to K60P144M100SF2 datasheet for full pinout map |
| 핀 10 | BGA-A10 — BGA ball assignment; refer to K60P144M100SF2 datasheet for full pinout map |
| 핀 11 | BGA-A11 — BGA ball assignment; refer to K60P144M100SF2 datasheet for full pinout map |
| 핀 12 | BGA-A12 — BGA ball assignment; refer to K60P144M100SF2 datasheet for full pinout map |
| 핀 13 | BGA-B1 — BGA ball assignment; refer to K60P144M100SF2 datasheet for full pinout map |
| 핀 14 | BGA-B2 — BGA ball assignment; refer to K60P144M100SF2 datasheet for full pinout map |
| 핀 15 | BGA-B3 — BGA ball assignment; refer to K60P144M100SF2 datasheet for full pinout map |
| 핀 16 | BGA-B4 — BGA ball assignment; refer to K60P144M100SF2 datasheet for full pinout map |
| 핀 17 | BGA-B5 — BGA ball assignment; refer to K60P144M100SF2 datasheet for full pinout map |
| 핀 18 | BGA-B6 — BGA ball assignment; refer to K60P144M100SF2 datasheet for full pinout map |
| 핀 19 | BGA-B7 — BGA ball assignment; refer to K60P144M100SF2 datasheet for full pinout map |
| 핀 20 | BGA-B8 — BGA ball assignment; refer to K60P144M100SF2 datasheet for full pinout map |
일반적인 애플리케이션
SCK60DN512VLL10R 적합 용도: 6 애플리케이션s: Industrial Ethernet Gateway, USB-Enabled Industrial Peripheral, Building Automation Controller, Factory Sensor Hub, Motor Control Front End (BLDC), Secure IoT Edge Node.
Industrial Ethernet Gateway
The SCK60DN512VLL10R's integrated 10/100 Ethernet MAC with IEEE 1588 hardware timestamping makes it well-suited for industrial Ethernet gateway designs, where deterministic latency and synchronized packet timestamping are non-negotiable for EtherCAT, Profinet, and other fieldbus protocols. With 512 KB of flash the device can run TCP/IP stacks plus gateway logic without external memory, while the 100 MHz Cortex-M4 with FPU off-loads floating-point protocol conversions from the core. Placing the device between the physical PHY and the application processor, the K60 handles protocol encapsulation, time synchronization, and housekeeping. The choice of the SC60 variant specifically enables factory-locked firmware to support industrial protocol stacks out of the box.
추천
USB-Enabled Industrial Peripheral
The K60's integrated USB 2.0 full-speed OTG controller, paired with 512 KB of flash, makes the SCK60DN512VLL10R a good fit for industrial peripheral designs that need a USB device or host port alongside Ethernet and CAN. The 32-bit Cortex-M4 processor at 100 MHz handles USB class drivers, PID-style control loops, and serial-over-USB bridging concurrently. The 144-pin MAP-BGA package exposes all required USB D+/D- pins plus multiple UART, SPI, and I2C peripherals, allowing the device to act as a multi-protocol industrial bridge. The factory-locked SC variant bundles USB stack components, simplifying listing and certification of finished peripherals.
추천
Building Automation Controller
In building automation, the SCK60DN512VLL10R is often deployed as the central control node driving sensor aggregation, HVAC control loops, and BACnet/Modbus communication. Its 100 MHz ARM Cortex-M4 core runs real-time schedulers while hardware AES, DES, and SHA crypto accelerates secure authentication of building endpoints. The multi-voltage 1.8V/2.5V/3.3V I/O lets the same board drive 1.8V sensors and 3.3V actuators without external level shifters. Low-power standby modes are essential for battery-backed controllers, and the K60 family supports sub-microamp deep-sleep retention. The 144-pin MAP-BGA provides sufficient GPIO for multi-floor HVAC fan control with redundant interlocks.
추천
Factory Sensor Hub
Factory sensor hubs need to aggregate multiple analog and digital sensors, perform signal conditioning, and forward normalized data to a higher-level controller. The SCK60DN512VLL10R's hardware FPU and DSP extensions enable on-device FFT and RMS calculations on vibration sensor data, while 512 KB of flash supports local DSP libraries plus TCP/IP stack. The integrated 16-bit ADC modules deliver sufficient resolution for most process-control transducers, and the multi-channel DMA engine offloads data movement from the CPU. Industrial temperature ranges (-40C to +105C on most K60 grades) are typical for shop-floor deployment. The 144-pin BGA package also provides sufficient I/O for parallel encoder and counter inputs.
추천
Motor Control Front End (BLDC)
The K60 family integrates FlexTimer peripherals, PWM channels, and a Cortex-M4 DSP-capable core, making the SCK60DN512VLL10R well-suited as the controller in a BLDC or PMSM motor drive, especially in conjunction with an external gate driver and three-phase inverter. Hardware FPU executes Park/Clarke transforms and field-oriented control loops within the 10 kHz control cycle, while 512 KB flash supports vendor field-weakening libraries. The 144-pin BGA package breaks out enough PWM channels for multi-axis control, and the K60's hardware crypto blocks secure firmware against unauthorized motor tuning. Designers should add isolation between the BGA and the high-voltage inverter side.
추천
Secure IoT Edge Node
Industrial IoT edge nodes often need encryption, authentication, and remote management at the network edge, and the SCK60DN512VLL10R integrates the necessary crypto accelerators (AES-128, DES, SHA-1/256). Combined with the Ethernet MAC and USB OTG, the K60 can serve as a secure gateway connecting field sensors to cloud back-ends. The Cortex-M4 core at 100 MHz runs TLS handshakes and lightweight IPsec tunnels in software with hardware acceleration. The 144-pin MAP-BGA package offers low EMI when paired with proper BGA stack-up design. A typical implementation pairs the SC60 MCU with an external Wi-Fi/BLE module via UART or SPI for sub-gateway bridging.
추천
추천 제품 요약
엔지니어링 참조 데이터: SCK60DN512VLL10R — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | K60DN512VLL10 | MK60DN512VLL10 |
|---|---|---|---|
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors | NXP Semiconductors |
| Package | 144-pin MAP-BGA | 144-pin MAP-BGA - same | 144-pin MAP-BGA - same |
| Core | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU |
| Maximum Clock Frequency | 100 MHz | 100 MHz | 100 MHz |
| Flash Size | 512 KB | 512 KB | 512 KB |
| Firmware Provisioning | Factory-locked SC firmware | None - blank K60 silicon | None - blank K60 silicon |
| Lifecycle Status | NRND | NRND | NRND |
| Ethernet MAC with IEEE 1588 | Yes | Yes | Yes |
| USB OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG |
| Unit Price (qty 100) | ~$10.10 (as of 2026-10-16) | ~$10.10 | ~$10.10 |
주요 차별점
- Factory-locked firmware provisioning (vs K60DN512VLL10)
- Specialty-IC classification (vs K60DN512VLL10)
- Rochester Electronics long-term continuity (vs MK60DN512VLL10)
설계 노트
The 144-pin MAP-BGA package requires a PCB stack-up with microvias and matched coefficient of thermal expansion (CTE) across the substrate and BGA balls. Place ground and power planes on adjacent inner layers to provide low-impedance return paths for the high-speed Ethernet and USB signals. For signal integrity, keep the 50 ohm controlled impedance traces to the external PHY and USB connector within 200 mils of their respective balls.
Although the K60 family is designed for low-power operation, at 100 MHz with all peripherals active the device can dissipate close to 1W in industrial temperature ranges. The MAP-BGA package's thermal performance depends strongly on PCB copper area and thermal via arrays beneath the die. Add at least a 4x4 thermal via array (0.3mm drill, 0.5mm pitch) on inner pads tied to the ground plane to lower theta-JA into the 25 C/W range for typical industrial enclosures.
Because the SCK60DN512VLL10R ships with factory-locked firmware, the on-chip flash is partitioned into bootloader and locked regions that cannot be re-flashed without external debugger intervention. Engineers retrofitting a generic K60 firmware image on this part must first unlock the device via JTAG, which may void any pre-validated certifications. Confirm the firmware provisioning requirement before substitution in production designs.
규정 준수 정보
RoHS compliance asserted by JLCPCB part page; full REACH and conflict-minerals statements require review of the manufacturer REACH/CMRT declaration. AEC-Q100 does not apply since this is an MCU, not a discrete automotive IC.
