SN74AXC4T774BQBR - 4-Bit Dual-Supply Bus Transceiver | Texas Instruments
부품 번호: SN74AXC4T774BQBR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1.75 | $1.75 |
| 10 | $1.55 | $15.50 |
| 100 | $1.25 | $125.00 |
| 500 | $1.05 | $525.00 |
| 1,000 | $0.95 | $950.00 |
| 3,000 | $0.82 | $2,460.00 |
SN74AXC4T774BQBR 개요
The SN74AXC4T774 belongs to the bus transceiver / level shifter category (a sub-family of voltage level translators within interface ICs / logic ICs). Level translators are interface ICs that allow digital signals to pass between two parts of a system that operate at different supply voltages. They are an essential building block in mixed-voltage designs where low-voltage processors and ASICs must communicate with legacy 1.8 V, 2.5 V, or 3.3 V peripherals, and they enable designers to maintain backwards compatibility while taking advantage of new low-voltage cores.
Key features of the SN74AXC4T774 include a typical data rate of 110 Mbps, 4.4 ns typical propagation delay, partial-power-down support via Ioff, and a control-pin reference (DIR and OE) tied to VCCA for simple GPIO-driven control. The AXC family offers the industry's lowest static power consumption in this class, helping portable and battery-powered designs extend runtime without sacrificing throughput.
The internal architecture uses TI's AXC CMOS technology with one-shot edge accelerators that detect rising or falling edges on the I/O pins and briefly speed up the output drivers to achieve high data rates with low dynamic power. The DIR pin determines signal direction, while OE enables a high-impedance output mode for bus isolation. Both A and B ports support 3.6-V tolerant I/O on the lower-voltage side, simplifying board design.
Typical applications include I2C / SPI / UART bridging between low-voltage SoCs and 3.3 V peripherals, MIPI / camera-serializer voltage translation, SD-card level shifting, and general-purpose GPIO expansion in industrial controllers, wearables, and portable IoT endpoints.
A key design consideration is to always tie the OE pin to VCCA through a pull-up resistor (or to a dedicated GPIO) so that the I/Os enter high-impedance during power-up or power-down, preventing bus contention and back-powering.
This page synthesizes distributor pricing, same-brand and cross-brand drop-in alternatives in the WQFN-16 footprint, and practical design notes not collated in the manufacturer datasheet alone.
드롭인 대체품: SN74AXC4T774BQBR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
SN74AXC4T774RSVR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SN74AXC4T774PW
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
SN74AVC4T774PW
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SN74AXC4T774BQBR.A
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TXS0104EPWR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
NXS0104PW
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
FXLA104UMX
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SN74AXC4T774BQBR 최대 정격 & 전기적 특성
| 기능 | 4-bit dual-supply bus transceiver with configurable voltage translation |
| Number of Channels | 4 |
| Number of Elements | 1 |
| 출력 유형 | 3-State |
| Direction Control | Independent DIR and OE inputs |
| Supply Voltage A (VCCA) | 0.65 V to 3.6 V |
| Supply Voltage B (VCCB) | 0.65 V to 3.6 V |
| 데이터 속도 | Up to 110 Mbps (typical) |
| Propagation Delay | 4.4 ns typical |
| Ioff (Partial Power-Down) | Supported |
| Control Pin Reference | DIR and OE referenced to VCCA |
| 동작 온도 | -40C to +125C |
| 패키지 | WQFN-16 (BQB) 2.5 x 3.5 mm |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes (per TI datasheet family note) |
SN74AXC4T774BQBR 핀 구성
| 핀 1 | 1B — Data I/O port B, channel 1 |
| 핀 2 | VCCB — B-port supply voltage (0.65 V to 3.6 V) |
| 핀 3 | 2B — Data I/O port B, channel 2 |
| 핀 4 | GND — Ground |
| 핀 5 | 3B — Data I/O port B, channel 3 |
| 핀 6 | 4B — Data I/O port B, channel 4 |
| 핀 7 | VCCB — B-port supply voltage (0.65 V to 3.6 V) |
| 핀 8 | OE — Output enable, active low, referenced to VCCA |
| 핀 9 | DIR — Direction control, referenced to VCCA |
| 핀 10 | VCCA — A-port supply voltage (0.65 V to 3.6 V) |
| 핀 11 | 1A — Data I/O port A, channel 1 |
| 핀 12 | GND — Ground |
| 핀 13 | 2A — Data I/O port A, channel 2 |
| 핀 14 | VCCA — A-port supply voltage (0.65 V to 3.6 V) |
| 핀 15 | 3A — Data I/O port A, channel 3 |
| 핀 16 | 4A — Data I/O port A, channel 4 |
일반적인 애플리케이션
SN74AXC4T774BQBR 적합 용도: 6 애플리케이션s: MIPI / Camera-Serializer Bridge, SD-Card / UHS-I Voltage Translation, I2C / SPI Bus Isolation in Industrial Controllers, Wearable / IoT Sensor Hub, Server / Network Switch GPIO Bridge, FPGA / SoM Multi-Rail Reference Design.
MIPI / Camera-Serializer Bridge
The SN74AXC4T774BQBR's 0.65 V to 3.6 V dual-supply range and 110 Mbps data rate make it a strong fit for bridging MIPI control or low-speed serializer signals between a 0.8 V / 1.0 V application processor and a 1.8 V or 3.3 V camera module. The DIR pin referenced to VCCA lets the SoC dynamically reconfigure bus direction during MIPI command frames, while 3-state outputs allow multiple peripherals to share the same pins during multi-camera muxing. The WQFN-16 (2.5x3.5 mm) footprint is ideal for placement under the BGA of a mobile-class processor, preserving routing channels.
추천
SD-Card / UHS-I Voltage Translation
Portable designs often run the host SoC at 1.0 V or 1.2 V while the SD card operates at 1.8 V (UHS-I) or 3.3 V (legacy). The SN74AXC4T774BQBR can translate 4 data lines and the CMD line between these rails thanks to its independent DIR per group and VCCA-referenced OE. The Ioff partial-power-down feature prevents back-powering of the SoC when the SD slot is depopulated or unpowered, a critical safety property for removable media. Add external pull-ups on the higher-voltage rail to meet SD signaling requirements.
추천
I2C / SPI Bus Isolation in Industrial Controllers
Industrial PLCs and motor controllers frequently need to bridge GPIO, SPI, or I2C between a 3.3 V processor and 5 V or 1.8 V sensor clusters. The SN74AXC4T774BQBR's 0.65 V minimum VCCA and 3.6 V tolerant I/O allow the SoC to sit at any modern voltage, while the OE high-impedance capability lets multiple SN74AXC4T774 buffers sit on the same shared bus when a multiplexer is needed. Industrial temperature range (-40C to +125C) ensures operation across factory-floor thermal ranges, and the WQFN-16 footprint is small enough for dense backplanes.
추천
Wearable / IoT Sensor Hub
Battery-powered wearables combine a low-voltage BLE SoC (often 0.8 V core) with 1.8 V IMU, 3.3 V LED driver, and 1.2 V display controller. The SN74AXC4T774BQBR's typical quiescent current is in the low uA range, preserving battery life across always-on sensor hubs. The WQFN-16 (2.5x3.5 mm) footprint occupies only ~8.75 mm^2 of board area, leaving room for coin-cell or Li-ion form factors. Ioff is critical during deep-sleep power gating: external 3.3 V rails can collapse without back-driving the SoC.
추천
Server / Network Switch GPIO Bridge
Datacenter switches and NIC cards run management controllers (BMCs) at 1.0 V or 1.2 V while coordinating with 3.3 V management LEDs, SFP+ I/O, and I2C EEPROMs at 5 V (via pull-up). The SN74AXC4T774BQBR can bridge 4 of these rails simultaneously, with DIR controlled by a 1.8 V-tolerant GPIO. Industrial temperature grade supports the server Inlet Thermal range, and the WQFN-16 package enables placement adjacent to high-density BMC pin headers. The 110 Mbps capability is comfortably above any GPIO or I2C management requirement.
추천
FPGA / SoM Multi-Rail Reference Design
Modern FPGA SoMs (System-on-Module) integrate core rails at 0.85 V or 0.9 V with bank I/O at 1.2 V, 1.8 V, 2.5 V, and 3.3 V depending on the FPGA family. The SN74AXC4T774BQBR gives the carrier board designer a single small-footprint option to translate four signals between any two of these rails, simplifying BOM management. The DIR-referenced-to-VCCA architecture means only the lower-voltage side CPU needs to drive control bits; the higher-voltage side is automatically biased. RoHS compliance and high-volume availability make it ideal for production carrier boards.
추천
추천 제품 요약
엔지니어링 참조 데이터: SN74AXC4T774BQBR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | SN74AXC4T774RSVR | SN74AVC4T774PW | TXS0104EPWR | NXS0104PW | FXLA104UMX |
|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | NXP Semiconductors | onsemi |
| Package | WQFN-16 (BQB) 2.5x3.5 mm | UQFN-16 (RSV) | TSSOP-16 (PW) | TSSOP-16 (PW) | TSSOP-14 (PW) | UMLP-16 (UQFN) |
| Number of Channels | 4 | 4 | 4 | 4 | 4 | 4 |
| Min VCCA | 0.65 V | 0.65 V | 1.2 V | 1.65 V | 1.65 V | 0.9 V |
| Max Data Rate | 110 Mbps | 110 Mbps | 380 Mbps | 24 Mbps | 20 Mbps | 100 Mbps |
| Direction Control | DIR + OE (VCCA ref) | DIR + OE (VCCA ref) | DIR + OE (VCCA ref) | Auto-bidirectional | Auto-bidirectional | Auto-bidirectional |
| Output Type | 3-State | 3-State | 3-State | Open-drain + pull-up | Open-drain + pull-up | 3-State |
| Ioff / Power-Down | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C |
주요 차별점
- Lowest minimum VCCA in its class (vs SN74AVC4T774PW)
- Smallest TI footprint option for this function (vs SN74AXC4T774PW)
- 10x higher data rate than open-drain competitors (vs TXS0104EPWR)
설계 노트
Always tie OE to VCCA through a pull-up resistor (typically 100 kohm) so that during power-up or power-down the outputs enter high-impedance. According to TI's SN74AXC4T774 datasheet application section, the OE pin is referenced to VCCA; if VCCA is off, OE floats low - which is desirable for high-Z - but explicit external pull-up ensures deterministic behavior across all power-up sequencing scenarios. Add 0.1 uF decoupling on each VCCA and VCCB pin within 2 mm of the package.
The AXC family supports VCCA down to 0.65 V, but the DIR and OE control pins are also referenced to VCCA. Never drive DIR or OE from a higher-voltage rail than VCCA, or excessive current flows into the reference structure. Estimated: if DIR is driven at 3.3 V while VCCA is at 1.8 V, the absolute-difference rating of VCCA + 0.5 V is exceeded, risking parametric drift or latch-up. Use a divider or a buffer if your control source is on a different rail.
The WQFN-16 (BQB) has an exposed thermal pad that MUST be soldered to the PCB for mechanical reliability. Recommended PCB layout: 4 thermal vias in a 0.3 mm-pitch grid under the EP connected to the ground plane, and route all 16 signals with 50-ohm controlled impedance if the topology supports it. Place the device near the SoC pads to minimize stub length - long stubs on the lower-voltage side are the dominant source of signal-integrity violations at 110 Mbps.
규정 준수 정보
Standard -40C to +125C industrial grade; for AEC-Q100 automotive qualification choose SN74AXC4T774-Q1 variant. RoHS and REACH compliance confirmed by TI product family documentation.
